Wafer cleaning jig
The wafer cleaning fixture with its tilted insert design solves the problem of reagent waste in cleaning wafers of different sizes, and achieves efficient and economical cleaning results in a cleaning tank of the same capacity.
Patent Information
- Application Number
- CN202423099327.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing wafer cleaning fixtures have difficulty precisely controlling the amount of chemical reagents used when cleaning wafers of different sizes, resulting in reagent waste and increased costs.
The wafer cleaning fixture with an inclined insert design can be adapted to the cleaning needs of wafers of different sizes by changing the way the wafers are inserted into the slots at a certain angle, thereby reducing the vertical height and reducing the amount of reagent used.
It can effectively clean wafers of different sizes in a cleaning tank with the same chemical reagent capacity, reducing the amount of reagent used and the cost of recycling. It is also compatible with multi-wafer cleaning and has a simple and convenient structure.
Smart Images
Figure CN223912828U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor material processing, in particular to a wafer cleaning jig. BACKGROUND
[0002] In the field of semiconductor device manufacturing, the composite substrate obtained by bonding operation of homogenous or heterogeneous wafers by means of bonding technology has extremely wide application scenarios. One of the key links of the bonding technology is to implement surface cleaning on the two wafers to be bonded, the purpose of which is to remove impurities on the wafer surface and make the wafer surface clean enough. At present, the common method to achieve this goal is to immerse the wafer in chemical reagent. In this process, the wafer needs to be completely immersed in the chemical reagent.
[0003] With the continuous and vigorous development of the semiconductor industry, the size of the wafer is increasingly showing a trend of diversification. The current existing cleaning jig mostly adopts vertical wafer insertion mode in wafer insertion mode. This insertion mode has a significant disadvantage, that is, when the size of the wafer increases, in order to ensure that the wafer can be completely immersed in the chemical reagent, a larger amount of chemical reagent needs to be injected into the cleaning tank. This not only causes great waste of chemical reagent, but also increases the processing cost of the chemical reagent to some extent. Therefore, how to accurately control the usage amount of chemical reagent when cleaning wafers of different sizes to achieve effective cleaning with the minimum consumption of chemical reagent has become an important problem to be solved in the field of semiconductor device manufacturing. CONTENT OF THE UTILITY MODEL
[0004] The utility model aims at providing a wafer cleaning jig for realizing cleaning of wafers of different sizes in a cleaning tank with the same capacity of chemical reagent.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A wafer cleaning jig comprises a bottom plate, the bottom plate is provided with a second limiting block, the second limiting block is provided with a plurality of clamping grooves;
[0007] Two vertical columns are provided on the two sides of the bottom plate;
[0008] Each vertical column is provided with a first limiting block, and the first limiting block is provided with a plurality of clamping grooves;
[0009] The clamping grooves of the first limiting block and the clamping grooves of the second limiting block are matched to clamp the wafer at an inclined angle.
[0010] A horizontal beam is arranged between the two vertical columns.
[0011] Preferably, the bottom plate, the column, the limiting block and the crossbeam are made of PVDF or PTFE material, which has excellent temperature resistance, corrosion resistance and chemical stability.
[0012] Preferably, the number of the second limiting blocks on the bottom plate is two, and each of the two second limiting blocks is provided with a clamping groove.
[0013] Preferably, the first limiting block and the second limiting block are provided with the same number of clamping grooves.
[0014] Preferably, the number of the clamping grooves on the first limiting block and the second limiting block is 3-10.
[0015] Preferably, the clamping grooves on the first limiting block and the second limiting block are arranged obliquely.
[0016] Preferably, the angle between the clamping grooves on the first limiting block and the second limiting block and the bottom plate is 30-60°, which is used for clamping the wafer at an oblique angle of 30-60°.
[0017] Preferably, the clamping grooves on the first limiting block and the second limiting block are arranged in parallel.
[0018] Preferably, the edge of the clamping groove is treated by chamfering process to avoid scratching the wafer.
[0019] Preferably, the second limiting block and the bottom plate are an integral structure, which can increase the parallelism between the second limiting block and the bottom plate.
[0020] Preferably, the bottom plate is provided with a plurality of through holes, and when the wafer is soaked and cleaned, the chemical liquid can contact the wafer through the through holes.
[0021] Preferably, the column is screwed to the bottom plate.
[0022] The utility model discloses the beneficial effect of:
[0023] The wafer cleaning jig provided by the application changes the wafer insertion mode, inserts the wafer at a certain inclination angle, selects a larger inclination angle for a wafer with a larger size, thereby reduces the height of the wafer in the vertical direction, and reduces the use amount of the chemical agent in the soaking groove. Reduce the cost and the amount of chemical liquid recovery processing, compatible with environmental protection and economy. Can clean multiple wafers at the same time, and has the characteristics of simple structure, convenient taking and placing. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 is the side surface structure schematic view of a wafer cleaning jig of the utility model;
[0025] Figure 2 is the front surface structure schematic view of a wafer cleaning jig of the utility model;
[0026] Fig. 1, post; 2, crossbeam; 3, bottom plate; 4, clamping groove; 5, first limiting block; 6, second limiting block; 7, through hole. DETAILED DESCRIPTION
[0027] The utility model will be described in further detail below in combination with the drawings and examples. It can be understood that the specific examples described herein are merely used to explain the utility model and not limit the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for the convenience of description, not all the structures.
[0028] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0029] In the utility model, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0030] In the description of the embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.
[0031] In the process of cleaning semiconductor wafers, in the case of different sizes of wafers and fixed chemical agent capacity of the cleaning tank, the traditional vertical plug-in type cleaning fixture is difficult to achieve efficient and economic cleaning. The wafer cleaning fixture of the embodiment aims to solve this problem, and through the innovative inclined plug design, the effective cleaning of different size wafers in the same chemical agent capacity cleaning tank is achieved.
[0032] Referring to Figure 1 Figure 2 In the embodiment, the wafer cleaning jig comprises a base plate 3 made of PVDF or PTFE material, which has excellent temperature resistance, corrosion resistance and chemical stability, and can adapt to various chemical cleaning environments. Two second limiting blocks 6 are arranged on the base plate 3, each of which is provided with a clamping groove 4. The two second limiting blocks 6 are arranged in parallel, and the clamping grooves 4 on them are also arranged in parallel. The two aligned clamping grooves are used to clamp the same wafer. The number of clamping grooves 4 is 3-10, for example, 5 clamping grooves are arranged. The edges of the clamping grooves 4 are chamfered to effectively prevent the wafer from being scratched during clamping. A plurality of through holes are also provided on the base plate, so that the chemical reagent can fully contact the wafer through these through holes when the cleaning jig is placed in the cleaning tank, ensuring that there is no dead angle in cleaning. The second limiting block 6 and the base plate 3 are integrally formed, which ensures that the second limiting block 6 and the base plate 3 have a very high parallelism, providing a solid foundation for the stable clamping of the wafer.
[0033] Two columns 1 are fixed on both sides of the base plate 3 by screwing. Each column 1 is provided with a first limiting block 5, which is also made of PVDF or PTFE material. The number of clamping grooves on the first limiting block is the same as that on the second limiting block, and these clamping grooves are arranged at an angle of 30-60° with the base plate, for example, 45°. The clamping grooves on the first limiting block are parallel to the clamping grooves on the second limiting block. This parallel and inclined design ensures that the wafer can be stably placed at a specific inclined angle when clamped, and the multiple wafers maintain a parallel relationship, which is beneficial to the uniform action of the chemical reagent on the wafer surface during cleaning. In order to achieve this effect, the clamping grooves on the first limiting block and the clamping grooves on the second limiting block are offset in the vertical direction, so that the wafers can be inserted into these clamping grooves at an angle. The cross beam 2 is installed between the two columns 1 and is made of the same PVDF or PTFE material as other components. The main function of the cross beam is to enhance the structural strength and stability of the entire cleaning jig, prevent the jig from deforming or shaking during wafer picking and placing or cleaning, and ensure the smooth progress of the cleaning operation. The cross beam also serves as a handle for transporting the jig.
[0034] In use, according to the size range of the wafer to be cleaned, the position of the clamping slot on the first limiting block 5 and the second limiting block 6 to be used is estimated, and the approximate inclination angle of the wafer is determined. For example, for a smaller size wafer, a relatively small inclination angle, such as 30°, can be selected; for a larger size wafer, a larger inclination angle, such as 60°, can be selected. The wafer is inserted into the clamping slot on the second limiting block 6 from the clamping slot on the first limiting block 5, and the placement of multiple wafers is completed in turn. The cleaning fixture loaded with multiple wafers is carefully placed into the cleaning tank containing chemical agents. Since the wafers are inserted in an inclined manner, compared with the traditional vertical insertion, under the condition that the chemical agent capacity of the cleaning tank is fixed, the height of the wafers in the longitudinal direction is effectively reduced, and the chemical agents can completely soak the wafers.
[0035] It can be seen from the embodiment that the wafer cleaning fixture provided successfully solves the problem of cleaning wafers of different sizes in the same chemical agent capacity cleaning tank through the unique inclined insertion design, effectively reduces the use amount of chemical agents, reduces the cost and the amount of liquid recovery processing, and has the advantages of simultaneously cleaning multiple wafers, simple structure, and convenient taking and placing, and has significant practical value and broad application prospect in the semiconductor wafer cleaning process.
[0036] Obviously, the above embodiments of the present application are only examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present application. Here, it is not necessary and impossible to exhaust all the embodiments. Any modification, equivalent substitution and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.
Claims
1. A wafer cleaning tool, comprising: The utility model relates to a wafer clamping device, including: The bottom plate is equipped with second limit piece, and the second limit piece is equipped with a plurality of clamping slots; The column is two, and two the column opposite is equipped with in bottom plate both sides; Each the column is equipped with first limit piece, and the first limit piece is equipped with a plurality of clamping slots; The clamping slot of first limit piece and the clamping slot of second limit piece are mutually matched for with the inclination angle clamping wafer; Crossbeam, be equipped with between two the column.
2. The wafer cleaning tool of claim 1, wherein: The number of second limit piece on the bottom plate is two, and the two second limit pieces are equipped with clamping slots.
3. The wafer cleaning tool of claim 2, wherein: The first limit piece and the second limit piece are equipped with the same number of clamping slots.
4. The wafer cleaning tool of claim 3, wherein: The number of clamping slot on the first limit piece and the second limit piece is 3-10.
5. The wafer cleaning tool of claim 3, wherein: The clamping slot on the first limit piece and the second limit piece is inclinedly arranged.
6. The wafer cleaning tool of claim 5, wherein: The angle between the clamping slot on the first limit piece and the second limit piece and the bottom plate is 30-60 °, for with the inclination angle of 30-60 ° clamping wafer.
7. The wafer cleaning tool of claim 6, wherein: The clamping slot on the first limit piece and the second limit piece is parallelly arranged.
8. The wafer cleaning tool of claim 1, wherein: The second limit piece and the bottom plate are an integral structure.
9. The wafer cleaning tool of claim 1, wherein: The bottom plate is equipped with a plurality of through holes.
10. The wafer cleaning tool of claim 1, wherein: The column is screwed on the bottom plate.