Chip cleaning mechanism

Abstract

The utility model discloses a chip cleaning mechanism, which relates to the technical field of cleaning, and adopts the technical scheme that the chip cleaning mechanism comprises a loading and unloading unit, a driving unit and a driving unit, the first transfer unit comprises a first carrying table corresponding to the chip to be cleaned, and the first carrying table can be conveyed by the first transfer unit; the first cleaning unit can clean the upper surface of the chip; the second transfer unit can grab the chip on the first carrying table and convey the chip; and the second cleaning unit can clean the lower surface of the chip. The chip cleaning mechanism disclosed by the utility model has the beneficial effects that the chip cleaning mechanism can realize automation of chip cleaning. By means of cooperative work of the first transfer unit and the second transfer unit, the chip can be efficiently and accurately transferred among the different cleaning units, meanwhile, the first cleaning unit and the second cleaning unit are adopted to clean the upper surface and the lower surface of the chip in the transfer process, and the requirement for cleanliness during high-precision chip manufacturing is met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of cleaning, specifically to a chip cleaning mechanism. BACKGROUND

[0002] As the core component of modern electronic equipment, the cleanliness of chips has a crucial impact on the performance, stability and life of the equipment. During the production, packaging and testing of chips, they are often attacked by various pollutants such as organic residues, particles and oil films. If these pollutants are not effectively removed, they will seriously affect the electrical performance and reliability of the chips.

[0003] At present, there are various applications of chip cleaning mechanisms in the market, but there are some common problems. First of all, the existing chip cleaning methods often rely on manual operation, which not only is inefficient, but also the uncertainty brought by manual operation may lead to unstable cleaning quality.

[0004] Secondly, although some automated cleaning devices improve cleaning efficiency, they have deficiencies in clamping and protecting chips during the cleaning process, which may cause scratches or damage to the surface of the chips and affect the performance of the chips. In addition, some cleaning devices also have certain problems in terms of power consumption, structural complexity and stability, which increases the maintenance cost and use difficulty of the devices. Moreover, such devices are often designed for chips with a board-like overall structure, and it is difficult to clean chips with wires. SUMMARY

[0005] In view of one of the deficiencies of the prior art, the utility model provides a chip cleaning mechanism to solve the problem of automatic cleaning of chips with wires.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a chip cleaning mechanism, comprising:

[0007] A feeding and discharging unit comprising a feeding mechanical arm and a discharging mechanical arm;

[0008] A first transfer unit comprising a first loading platform corresponding to the chip to be cleaned, the first transfer unit being capable of conveying the first loading platform;

[0009] A first cleaning unit arranged above the conveying path of the first loading platform, capable of cleaning the upper surface of the chip;

[0010] A second transfer unit capable of grabbing the chip on the first loading platform and conveying it;

[0011] A second cleaning unit arranged below the conveying path of the second transfer unit, capable of cleaning the lower surface of the chip;

[0012] A grabbing assembly is arranged on the movable end of the feeding mechanical arm, the discharging mechanical arm and the second transfer unit respectively, and can grab the chip to be cleaned.

[0013] Preferably, the first carrier is a block-shaped body, and the first carrier is provided with a placing position corresponding to the chip to be cleaned.

[0014] The first recess is a groove opened on the upper surface of the first carrier, and the first recess corresponds to the hard structure part of the chip.

[0015] The boss is arranged on one side of the first recess, and the boss protrudes towards the upper side of the first carrier, and the boss corresponds to the wire arrangement structure part of the chip.

[0016] The second recess is a groove opened on the side of the boss away from the first recess, and the second recess corresponds to the end structure of the wire.

[0017] Preferably, a plurality of through holes are opened on the first carrier.

[0018] Preferably, the first transfer unit further comprises:

[0019] The first conveying track is a straight conveying track.

[0020] The first sliding seat is arranged on the first conveying track and can slide along the first conveying track; and the first carrier is fixedly arranged on the first sliding seat.

[0021] Preferably, the first cleaning unit comprises:

[0022] The first support frame is arranged above the moving path of the first carrier.

[0023] The first cleaning assembly is fixedly connected with the first support frame, and the first cleaning assembly is a dry ultrasonic cleaning assembly; and the air outlet of the first cleaning assembly is vertically downwardly opened.

[0024] Preferably, the first support frame comprises:

[0025] The bottom end of the first fixed frame is fixedly arranged on both sides of the first transfer unit.

[0026] The first movable frame is vertically slidably connected with the first fixed frame, and the first cleaning assembly is fixedly arranged on the first movable frame; and the first movable frame can drive the first cleaning assembly to approach or move away from the first transfer unit.

[0027] Preferably, the second transfer unit is arranged at one end of the moving path of the first carrier; and the second transfer unit comprises:

[0028] The second conveying track is a straight conveying track.

[0029] The second sliding seat is arranged on the second conveying track and can slide along the second conveying track. The grabbing assembly is arranged on the sliding seat, and the grabbing assembly on the sliding seat can grab the chip on the first carrier;

[0030] The second cleaning unit is located below the moving path of the second sliding seat.

[0031] Preferably, the second cleaning unit comprises:

[0032] The second support frame is an adjustable lifting frame, and the movable end of the second support frame can be lifted or lowered in the vertical direction.

[0033] The second cleaning assembly is fixedly arranged on the movable end of the second support frame. The second cleaning assembly is a dry ultrasonic cleaning assembly, and the air outlet of the second cleaning assembly is vertically upwardly arranged.

[0034] Preferably, the second transfer unit further comprises:

[0035] The second carrier is fixedly arranged at the end of the moving path of the second sliding seat. The second carrier has the same structure as the first carrier.

[0036] The cleaning mechanism further comprises:

[0037] The image acquisition unit is arranged in the moving range of the unloading mechanical arm and is used to acquire information of the cleaned chip. The image acquisition unit comprises:

[0038] The camera can shoot upward.

[0039] The light source is arranged around the camera, and the irradiation direction of the light source is upward.

[0040] Preferably, the grabbing assembly comprises:

[0041] The first grabbing part is used to grab the hard structure part of the chip.

[0042] The second grabbing part is arranged on one side of the first grabbing part and is used to grab the wire arrangement part of the chip.

[0043] The third grabbing part is arranged on one side of the second grabbing part and is used to grab the end structure of the wire arrangement.

[0044] Compared with the prior art, the following beneficial effects are achieved:

[0045] The chip cleaning mechanism of the scheme can realize the automation of chip cleaning. With the cooperative work of the first transfer unit and the second transfer unit, the chip can be efficiently and accurately transferred between different cleaning units, and the upper and lower surfaces of the chip are cleaned by the first cleaning unit and the second cleaning unit respectively in the process of transfer, meeting the requirement of cleanliness in high-precision chip manufacturing.

[0046] The grabbing assembly mechanism of the scheme can flexibly grab the chip with the flat cable. Different grabbing structures are set according to different structural characteristics of the chip, so that the stability of chip grabbing is realized. BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 The chip structure of the embodiment of the application is shown in the figure;

[0048] Figure 2 The overall structure of the embodiment of the application is shown in the figure Figure 1 ;

[0049] Figure 3 The A partial enlarged view of Figure 2 ;

[0050] Figure 4 The overall structure of the embodiment of the application is shown in the figure Figure 2 ;

[0051] Figure 5 The A partial enlarged view of Figure 4 ;

[0052] Figure 6 The first loading table structure of the embodiment of the application is shown in the figure;

[0053] Figure 7 The grabbing assembly structure of the embodiment of the application is shown in the figure.

[0054] In the figure:

[0055] 100, chip; 101, first structure part; 102, second structure part; 103, third structure part;

[0056] 1, feeding and discharging unit; 11, feeding mechanical arm; 12, discharging mechanical arm; 2, first transfer unit; 21, first loading table; 211, first recessed part; 212, boss; 213, second recessed part; 22, first conveying track; 23, first sliding seat; 3, first cleaning unit; 31, first support frame; 32, first cleaning assembly; 4, second transfer unit; 41, second conveying track; 42, second sliding seat; 5, second cleaning unit; 51, second support frame; 52, second cleaning assembly; 6, grabbing assembly; 61, first grabbing part; 62, second grabbing part; 63, third grabbing part; 7, image acquisition unit; 71, camera; 72, light source. Detailed Implementation

[0057] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0058] Please see Figures 1-7 This application provides the following technical solutions:

[0059] A chip cleaning mechanism, used for cleaning such as Figure 1 The chip 100 shown is... Figure 1 The chip 100 shown comprises three parts: a first structural part 101 is a rigid plate structure, a second structural part 102 is a flexible ribbon cable, and a third structural part 103 is a connecting structure at the end of the ribbon cable. This type of chip 100 is used in various fields such as smartwatches. The cleaning mechanism includes a loading / unloading unit 1, which includes a loading robotic arm 11 and an unloading robotic arm 12. The loading and unloading robotic arms 11 and 12 can utilize existing technology to achieve chip gripping, loading, and unloading. A first transfer unit 2 is provided on one side of the loading robotic arm 11. The first transfer unit 2 includes a first platform 21 corresponding to the chip to be cleaned, and the first transfer unit 2 can transport the first platform 21. A first cleaning unit 3 is provided above the transport path of the first platform 21, and the first cleaning unit 3 can clean the upper surface of the chip. A second transfer unit 4 is provided on one side of the first transfer unit 2. The second transfer unit 4 can pick up the chip on the first stage 21 and transport it. A second cleaning unit 5 is provided below the transport path of the second transfer unit 4. The second cleaning unit 5 can clean the lower surface of the chip.

[0060] Corresponding to the aforementioned chip 100, this cleaning mechanism is equipped with a gripping component 6, see [link / reference]. Figure 7The grabbing assembly 6 is arranged on the movable end of the feeding mechanical arm 11, the discharging mechanical arm 12 and the second transfer unit 4 respectively, and can grab the chip to be cleaned. The grabbing assembly 6 comprises a first grabbing part 61 which can grab the first structure part 101 of the chip; a second grabbing part 62 is arranged on the side of the first grabbing part 61, and the second grabbing part 62 is used for grabbing the second structure part 102 of the chip 100; a third grabbing part 63 is arranged on the side of the second grabbing part 62, and the third grabbing part 63 is used for grabbing the third structure part 103. The first grabbing part 61, the second grabbing part 62 and the third grabbing part 63 are internally provided with air holes which are communicated with a vacuum pump and are used for sucking by means of negative pressure. The second grabbing part 62 and the third grabbing part 63 adopt a flexible suction disc structure. The lower end surfaces of the first grabbing part 61, the second grabbing part 62 and the third grabbing part 63 are different in height, and are adaptively adjusted to the respective parts of the chip 100.

[0061] By means of the structure, the specially designed grabbing assembly 6 can integrally grab the respective positions of the chip 100, so that the stability of the chip 100 during transfer can be ensured. Then, the first transfer unit 2 and the second transfer unit 4 are used as the transfer structure during cleaning of the chip 100, and the first cleaning unit 3 and the second cleaning unit 5 are used for cleaning the upper and lower sides of the chip 100 during the two times of transfer. By means of the two mechanical arms of the feeding and discharging unit 1, the automatic cleaning of a large number of chips 100 can be realized by means of the docking with other external conveying mechanisms.

[0062] On the basis of the above-mentioned embodiments, referring to Figure 3 and Figure 4 The first transfer unit 2 comprises a first conveying track 22, and the first conveying track 22 is a straight conveying track which can meet the requirement of straight direction conveying. The first conveying track 22 is provided with a first sliding seat 23 which can slide along the first conveying track 22, and the first sliding seat 23 is fixedly arranged on the first conveying track 22.

[0063] The present application provides a specific implementation form of the first conveying track 22 and the first sliding seat 23, but is not limited to this form. The first conveying track 22 comprises a horizontal sliding table, the first sliding seat 23 is slidably connected to the upper side of the sliding table, a lead screw is arranged on the lower side of the sliding table, a motor is arranged on the side of the sliding table, the motor and the lead screw are linked, the lead screw is driven to rotate, and the first sliding seat 23 is threadedly connected to the lead screw. By means of the rotation of the lead screw, the first sliding seat 23 is driven to move transversely and reciprocally, and the movement of the first sliding seat 23 is limited by the sliding table to avoid rotation.

[0064] On the basis of the above-mentioned embodiments, referring to Figure 3, the first cleaning unit 3 comprises a first support frame 31 and a first cleaning assembly 32. The first support frame 31 is arranged above the moving path of the first carrier table 21 and is an adjustable lifting frame. The first support frame 31 comprises a first fixed frame and a first movable frame. The first movable frame is vertically slidably connected to the first fixed frame, and the first cleaning assembly 32 is fixedly arranged on the first movable frame. The first movable frame can drive the first cleaning assembly 32 to move close to or away from the first transfer unit 2. The first cleaning assembly 32 is a dry ultrasonic cleaning assembly, and an air outlet of the first cleaning assembly 32 is vertically downwardly arranged.

[0065] The first fixed frame comprises two L-shaped frame structures, and the first movable frame is arranged between the two L-shaped frame structures. An adjusting bolt is rotatably arranged on each side of the first movable frame, and the adjusting bolt is threadedly connected to an adjusting nut on the first fixed frame. The height of the first movable frame can be adjusted by rotating the adjusting bolt. The first cleaning assembly 32 can be realized by using existing dry ultrasonic cleaning technology, and thus will not be described herein.

[0066] The chip 100 is grabbed by the feeding mechanical arm 11 and placed on the first carrier table 21. Then the first conveying track 22 drives the first sliding table 23 to move, and when the first cleaning assembly 32 is passed, the upper surface of the chip 100 is cleaned.

[0067] On the basis of the above-mentioned embodiments, referring to Figure 4 and Figure 5 , the second transfer unit 4 is arranged at one end of the moving path of the first carrier table 21. The second transfer unit 4 comprises a second conveying track 41 and a second sliding seat 42. The second conveying track 41 is also a horizontal straight conveying track, and the conveying path of the second conveying track 41 is perpendicular to the conveying path of the first conveying track 21. The second sliding seat 42 is arranged on the second conveying track 41 and can slide along the second conveying track 41. A grabbing assembly 6 is arranged on the second sliding seat 42, and the grabbing assembly 6 on the second sliding seat 42 can grab the chip on the first carrier table 21. A second carrier table 43 is fixedly arranged below one end of the second conveying track 41 away from the first conveying track 21, and the second carrier table 43 has the same structure as the first carrier table 21. A second cleaning unit 5 is arranged below the moving path of the second sliding seat 42, and the second cleaning unit 5 also adopts a dry ultrasonic cleaning structure. The air outlet of the second cleaning unit 5 is vertically upwardly arranged.

[0068] A cylinder is arranged on the second sliding seat 42, and the grabbing assembly 6 is arranged on the movable end of the cylinder. The grabbing assembly 6 is lifted and lowered by the cylinder to realize the grabbing of the chip 100 on the first carrier table 21 and the placing of the chip 100 on the second carrier table 43.

[0069] With the structure of the present solution, the lower side of the chip 100 is cleaned during the second transfer process of the chip 100, so that the cleaning of the upper and lower sides of the chip 100 is completed. The cleaned chip 100 is placed on the second carrier 43 and is grabbed by the unloading mechanical arm 12.

[0070] On the basis of the above-mentioned embodiments, the second cleaning unit 5 comprises a second support frame 51 and a second cleaning assembly 52. The second support frame 51 is an adjustable lifting frame, which is similar in structure to the first support frame 31 and will not be described here. The movable end of the frame body of the first support frame 31 can also be raised or lowered in the vertical direction. The second cleaning assembly 52 is fixedly arranged on the movable end or movable structure of the second support frame 51. The second cleaning assembly 52 is also a dry ultrasonic cleaning assembly, and the air outlet of the second cleaning assembly 52 is vertically upwardly arranged.

[0071] On the basis of the above-mentioned embodiments, referring to Figure 6 , in order to ensure the stability of the chip 100 during cleaning, the present solution provides a special carrier structure corresponding to the chip 100. The first carrier 21 and the second carrier 43 both adopt the structure. The first carrier 21 will be taken as an example for description.

[0072] The first carrier 21 is a block-shaped body, and the first carrier 21 is provided with a placing position corresponding to the chip to be cleaned. The placing position comprises a first recess 211, a boss 212 and a second recess 213. The first recess 211 is a groove arranged on the upper surface of the first carrier 21, and the first recess 211 corresponds to the first structure 101 of the chip. The boss 212 is arranged on one side of the first recess 211, and the boss 212 protrudes towards the upper side of the first carrier 21. The boss 212 corresponds to the second structure 102 of the chip 100. The second recess 213 is a groove arranged on the side of the boss 212 away from the first recess 211, and the second recess 213 corresponds to the third structure 103 of the chip 100. A plurality of through holes are arranged on the first recess 211, the boss 212 and the second recess 213.

[0073] Through the structure, the first recess 211 and the second recess 213 are used as the placing positions of the relatively thick parts of the chip 100, and the boss 212 is used as the bearing and supporting position of the second structure 102 of the chip 100, that is, the part of the wire, so as to facilitate the grabbing of the grabbing assembly 6.

[0074] On the basis of the above-mentioned embodiments, referring to Figure 5The cleaning mechanism further comprises an image acquisition unit 7, which is used to acquire information of the cleaned chip 100, and is arranged in the moving range of the unloading mechanical arm 12; the image acquisition unit 7 comprises a camera 71 capable of shooting upwards. A plurality of light sources 72 are arranged around the camera 71, and the irradiation direction of the light sources 72 is towards the upper side of the camera 71.

[0075] The light source 72 is a long strip-shaped lamp, which is arranged in an inclined manner, and is used to provide light for the chip grabbed by the unloading mechanical arm 12. The camera 71 can be selectively arranged according to actual conditions, such as photographing or scanning.

[0076] In the description of the present application and the embodiments thereof, it should be understood that the orientations or positional relationships indicated by the terms "top", "bottom", "height" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0077] In the present application and the embodiments thereof, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "linkage", "fixation" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or can be integrated; can be mechanical connection, can also be electrical connection, or can be communication; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0078] In the present application and the embodiments thereof, unless otherwise explicitly specified and limited, the first feature "above" or "below" the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "underneath" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0079] The foregoing disclosure provides many different embodiments or examples for implementing different structures of the present application. For purposes of simplicity of the present disclosure, the foregoing description has set forth various aspects of the present application in connection with specific examples. It should be apparent to those skilled in the art that certain aspects of the application can be practiced without all of the details of the above-described embodiments. In addition, it should be apparent that certain aspects of the application can be practiced using more advanced structures and techniques. For example, at times, the present application is described in the context of a single processor system. However, one of ordinary skill in the art will recognize that the mechanisms of the present application can advantageously be employed in a multi-processor system. Also, where appropriate, functions described herein can be performed in one or more of: hardware, software, firmware, digital electronic circuitry, or computer software, firmware or hardware, including the structures disclosed in this document and their structural equivalents, or in combinations of them. The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It will be apparent to those skilled in the art that the disclosed techniques can be employed in a variety of other formats, structures, and protocols without departing from the spirit or scope of the present application. In other instances, well-known structures have not been described in detail in order to avoid obscuring aspects of the present application.

[0080] Although preferred embodiments of the application have been described, those skilled in the art will recognize that additional modifications and variations can be made thereto without departing from the spirit and scope of the application. It is therefore intended that the appended claims be interpreted as including all such modifications and variations as fall within the true scope of the application.

[0081] Obviously, many modifications and variations of the present application are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A chip cleaning mechanism, characterized by, The application relates to a chip cleaning mechanism. The chip cleaning mechanism comprises: a feeding and discharging unit, which comprises a feeding mechanical arm and a discharging mechanical arm; a first transfer unit, which comprises a first carrier corresponding to a chip to be cleaned, and the first transfer unit can transport the first carrier; a first cleaning unit, which is arranged above a transport path of the first carrier and can clean the upper surface of the chip; a second transfer unit, which can grab the chip on the first carrier and transport the chip; a second cleaning unit, which is arranged below a transport path of the second transfer unit and can clean the lower surface of the chip; 2. The chip cleaning mechanism of claim 1, wherein, a grabbing assembly, which is arranged at the movable end of the feeding mechanical arm, the discharging mechanical arm and the second transfer unit respectively and can grab the chip to be cleaned. The first carrier is a block-shaped body, and the first carrier is provided with a placing position corresponding to the chip to be cleaned, wherein the placing position comprises: a first recess, which is a groove arranged on the upper surface of the first carrier, and the first recess corresponds to a hard structure part of the chip; a boss, which is arranged on one side of the first recess and protrudes towards the upper side of the first carrier, and the boss corresponds to a wire arrangement structure part of the chip; 3. The chip cleaning mechanism of claim 2, wherein, a second recess, which is a groove arranged on the side of the boss away from the first recess, and the second recess corresponds to the end structure of the wire arrangement.

4. The chip cleaning mechanism of claim 2, wherein, A plurality of through holes penetrating through the first carrier are arranged on the first recess, the boss and the second recess. The first transfer unit further comprises: a first conveying track, which is a straight conveying track; 5. The chip cleaning mechanism of claim 1, wherein, a first sliding seat, which is arranged on the first conveying track and can slide along the first conveying track; and the first carrier is fixedly arranged on the first sliding seat. The first cleaning unit comprises: a first support frame, which is arranged above the moving path of the first carrier; 6. The chip cleaning mechanism of claim 5, wherein, a first cleaning assembly, which is fixedly connected with the first support frame and is a dry ultrasonic cleaning assembly; and an air outlet of the first cleaning assembly is vertically downwardly arranged. The first support frame comprises: a first fixed frame, which is fixedly arranged at the bottom end of the two sides of the first transfer unit; 7. The chip cleaning mechanism of claim 1, wherein, a first movable frame, which is vertically slidably connected with the first fixed frame, and the first cleaning assembly is fixedly arranged on the first movable frame; and the first movable frame can drive the first cleaning assembly to approach or move away from the first transfer unit. The second transfer unit is arranged at one end of the moving path of the first carrier; and the second transfer unit comprises: a second conveying track, which is a straight conveying track; a second sliding seat, which is arranged on the second conveying track and can slide along the second conveying track, and the grabbing assembly is arranged on the second sliding seat and can grab the chip on the first carrier; 8. The chip cleaning mechanism of claim 1, wherein, The second cleaning unit is located below the moving path of the second sliding seat. The second cleaning unit comprises: a second support frame, which is an adjustable lifting frame and can be lifted or lowered in the vertical direction; 9. The chip cleaning mechanism of claim 7, wherein, a second cleaning assembly, which is fixedly arranged at the movable end of the second support frame; the second cleaning assembly is a dry ultrasonic cleaning assembly, and an air outlet of the second cleaning assembly is vertically upwardly arranged. The second transfer unit further comprises: a second carrier, which is fixedly arranged at the end of the moving path of the second sliding seat; and the second carrier is identical in structure to the first carrier. The chip cleaning mechanism further comprises: An image acquisition unit is arranged in the moving range of the unloading mechanical arm, and is configured to acquire information of the cleaned chip. A camera is configured to capture images upward. A plurality of light sources are arranged around the camera, and the illumination direction of the light sources is toward the camera.

10. The chip cleaning mechanism of any of claims 1-9, wherein, The grabbing assembly comprises: A first grabbing part configured to grab the hard structure part of the chip; A second grabbing part arranged on one side of the first grabbing part and configured to grab the flat cable part of the chip; A third grabbing part arranged on one side of the second grabbing part and configured to grab the end structure of the flat cable.

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