Novel wafer box

Abstract

The utility model discloses a novel wafer box which comprises a box body and a box cover, two rows of first clamping grooves are arranged on the box cover, the box body comprises a wafer inner box used for placing wafers and two rows of second clamping grooves respectively corresponding to the two rows of first clamping grooves, and the two rows of second clamping grooves are respectively arranged on the inner walls of two sides of the wafer inner box. The inner surface of the box cover is provided with two elastic blocks corresponding to the two rows of second clamping grooves respectively, the two rows of first clamping grooves are formed in the two elastic blocks respectively, the inner surface of the box cover is provided with a positioning plate corresponding to a wafer in the box body, the outer surface of the box cover is provided with a pressing plate corresponding to the positioning plate, and the positioning plate is connected with a pressing rod and a spring. A movable hole movably connected with the pressing rod is formed in the box cover, the pressing rod penetrates through the movable hole to be connected with the pressing plate, and the spring is connected with the inner surface of the box cover. The beneficial effects of the utility model are that the box cover is prevented from easily clamping the wafer, so that the risk that the wafer is damaged because the wafer is clamped by the box cover is greatly reduced, and the economic loss is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor production, more particularly, it relates to a novel wafer box. BACKGROUND

[0002] The wafer box mainly plays the role of placing and conveying wafers in semiconductor production, in order to simplify transportation and reduce the risk of being contaminated as much as possible, the chip manufacturer utilizes the wafer box to carry and store wafers, generally adopts translucent plastic material with temperature resistance, wear resistance and anti-static addition, the wafer box includes a box body and a box cover, the existing box cover has two rows of symmetrical clamping grooves, the original function of the clamping groove is to fix the wafers in the wafer box to prevent collision, but it is found that the wafers are often clamped in the clamping groove during use, which may cause the wafers to be broken in the box body, and the wafers are taken together with the box cover and then dropped on the ground and broken. SUMMARY

[0003] In view of the defects in the prior art, the utility model aims at providing a novel wafer box.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0005] A novel wafer box, including box body and box cover, be equipped with two rows of first clamping groove on the box cover, the box body includes the wafer inner box for placing wafer and two rows of second clamping groove corresponding with two rows of first clamping groove respectively, two rows of second clamping groove are arranged on the two side inner walls of wafer inner box respectively, the inner surface of box cover is equipped with two elastic blocks corresponding with two rows of second clamping groove respectively, two rows of first clamping groove are arranged on two elastic blocks respectively, the inner surface of box cover is equipped with the positioning plate corresponding with wafer in the box body, the outer surface of box cover is equipped with the pressing plate corresponding with the positioning plate, the positioning plate is connected with pressing rod and spring, the box cover is opened with the movable hole of the movable connection with pressing rod, the pressing rod passes through movable hole and is connected with pressing plate, the positioning plate is arc-shaped and cooperates with wafer, and the spring is connected with the inner surface of box cover.

[0006] Further setting is that the first clamping groove inner wall of the elastic block is coated with a low-friction coating.

[0007] Further setting is that the wafer inner box is composed of a material with low friction coefficient characteristics.

[0008] Further setting is that the surface of the positioning plate is connected with an elastic pad.

[0009] Further setting is that the pressing rod is in the shape of a circular truncated cone, and the pressing rod is connected with the movable hole.

[0010] By adopting the technical scheme, the wafer is not easily stuck by the box cover, the risk of wafer damage caused by the wafer being stuck by the box cover is greatly reduced, and economic loss is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0011] Fig. 1 It is a structural schematic view of the utility model embodiment.

[0012] Fig. 2 It is a structural schematic view of the second clamping groove and the wafer inner box.

[0013] Fig. 3 It is a structural schematic view of the positioning plate and the pressing rod.

[0014] In the drawing: box body 100, box cover 200, wafer 300, first clamping groove 2001, second clamping groove 1001, wafer inner box 1002, elastic block 1, positioning plate 2, pressing plate 3, pressing rod 4, spring 5, movable hole 6, elastic pad 7. DETAILED DESCRIPTION

[0015] Refer to Figs. 1 to 3 Further illustrate the utility model embodiment.

[0016] A novel wafer 300 box, comprising a box body 100 and a box cover 200, the box cover 200 is equipped with two rows of first clamping grooves 2001, the box body 100 includes wafer inner box 1002 for placing wafer 300 and two rows of second clamping grooves 1001 corresponding with two rows of first clamping grooves 2001 respectively, two rows of second clamping grooves 1001 are arranged on the two side inner walls of wafer inner box 1002 respectively, the inner surface of box cover 200 is equipped with two elastic blocks 1 corresponding with two rows of second clamping grooves 1001 respectively, the elastic block 1 is composed of silicone rubber material, two rows of first clamping grooves 2001 are arranged on two elastic blocks 1 respectively, the inner surface of box cover 200 is equipped with positioning plate 2 corresponding with wafer 300 in box body 100, the outer surface of box cover 200 is equipped with pressing plate 3 corresponding with positioning plate 2, the positioning plate 2 is connected with pressing rod 4 and spring 5, the box cover 200 is opened with movable hole 6 movably connected with pressing rod 4, the pressing rod 4 is connected with pressing plate 3 by passing through movable hole 6, the positioning plate 2 is arc-shaped and cooperates with wafer 300, and the spring 5 is connected with the inner surface of box cover 200.

[0017] In use, open the box cover 200, place a plurality of wafers 300 in the wafer inner box 1002 of the box body 100, and the two rows of second clamping grooves 1001 in the wafer inner box 1002 clamp the bottom of the plurality of wafers 300, cover the box cover 200, and the two rows of first clamping grooves 2001 on the box cover 200 fix the upper part of the wafer 300 and the positioning plate 2 and the upper part of the wafer 300 are in contact to fix the wafer 300, so that the wafer 300 is fixed in the wafer 300 box, at this time the spring 5 is in a compressed state, and the first clamping groove 2001 is arranged on the elastic block 1, the elastic block 1 is made of silicone rubber material, and the elastic block 1 can provide protection when contacting the wafer 300 to prevent the wafer 300 from being damaged;

[0018] When the wafer 300 needs to be taken out, open the box cover 200 to move the box cover 200 upward by a distance, at this time the spring 5 returns to the original state so that the positioning plate 2 does not contact the upper part of the wafer 300, then press the pressing plate 3 downward, the spring 5 is elongated, the positioning plate 2 moves in the direction of the wafer inner box 1002 to push the wafer 300 clamped in the first clamping groove 2001 out to leave the wafer 300 in the wafer inner box 1002, avoiding the risk that the wafer 300 is taken up together with the box cover 200 and then falls to the ground and is broken, the elongated spring 5 returns to the original state, so that the positioning plate 2 returns to the original state under the action of the spring 5, and then the box cover 200 is completely opened to facilitate taking out the wafer 300 from the wafer inner box 1002, and the elastic block 1 has elasticity, so that the wafer 300 is more easily removed from the first clamping groove 2001 under the action of the positioning plate 2, avoiding the problem that the box cover 200 is easily clamped with the wafer 300, so as to greatly reduce the risk that the wafer 300 is damaged due to being clamped by the box cover 200, and reduce economic loss.

[0019] The inner wall of the first clamping groove 2001 of the elastic block 1 is coated with a low-friction coating, which can be fluororesin or molybdenum disulfide, so as to reduce the friction coefficient of the inner wall of the first clamping groove 2001, thereby reducing the friction between the inner wall of the first clamping groove 2001 and the wafer 300, facilitating the wafer 300 to be more smoothly removed from the first clamping groove 2001 when the box cover 200 is opened, and reducing the risk that the wafer 300 is damaged due to the problem that the box cover 200 is easily clamped with the wafer 300.

[0020] The wafer inner box 1002 is made of a material with low friction coefficient characteristics, and the wafer inner box 1002 is made of a polyphenylene sulfide material with characteristics of high temperature resistance, chemical corrosion resistance, good mechanical properties, low friction coefficient and the like, so as to reduce the friction between the inner wall of the second clamping groove 1001 and the wafer 300, facilitate taking out the wafer 300 from the second clamping groove 1001, and reduce the risk of damage to the wafer 300 when the wafer 300 is taken out from the second clamping groove 1001. At the same time, the wafer inner box 1002 made of the polyphenylene sulfide material ensures the durability of the wafer inner box 1002.

[0021] The positioning plate 2 is connected with an elastic pad 7 on the surface, so as to prevent the wafer 300 from being damaged when the positioning plate 2 is in contact with the wafer 300.

[0022] The pressing rod 4 is in the shape of a circular truncated cone, and the pressing rod 4 is connected with the movable hole 6. When the pressing plate 3 is pressed, the pressing rod 4 in the shape of a circular truncated cone facilitates smooth downward pressing. At the same time, when the positioning plate 2 is in contact with the wafer 300, the pressing rod 4 is connected with the movable hole 6, so that the pressing rod 4 seals the movable hole 6, thereby avoiding foreign matters from entering the box body 100.

[0023] The above is only the preferred embodiment of the present application, and is not used to limit the present application. The skilled in the art can make common changes and replacements within the technical scheme of the present application, which should be included in the protection scope of the present application.

Claims

1. A novel wafer cassette, comprising a cassette body (100) and a cassette cover (200), wherein the cassette cover (200) is provided with two rows of first slots (2001), the cassette body (100) includes a wafer inner cassette (1002) for placing wafers (300) and two rows of second slots (1001) respectively corresponding to the two rows of first slots (2001), the two rows of second slots (1001) being respectively disposed on the inner walls of both sides of the wafer inner cassette (1002), characterized in that, The inner surface of the box cover (200) is provided with two elastic blocks (1) corresponding to the two rows of second slots (1001), and the two rows of first slots (2001) are respectively set on the two elastic blocks (1). The inner surface of the lid (200) is provided with a positioning plate (2) corresponding to the wafer (300) inside the box body (100). The outer surface of the lid (200) is provided with a pressing plate (3) corresponding to the positioning plate (2). The positioning plate (2) is connected with a pressing rod (4) and a spring (5). The lid (200) has an active hole (6) that is movably connected to the pressing rod (4). The pressing rod (4) passes through the active hole (6) and is connected to the pressing plate (3). The positioning plate (2) is in the shape of an arc that matches the wafer (300). The spring (5) is connected to the inner surface of the lid (200).

2. The novel wafer cassette according to claim 1, characterized in that, The inner wall of the first slot (2001) of the elastic block (1) is coated with a low-friction coating.

3. A novel wafer cassette according to claim 2, characterized in that, The wafer inner box (1002) is made of a material with a low coefficient of friction.

4. A novel wafer cassette according to claim 3, characterized in that, An elastic pad (7) is connected to the surface of the positioning plate (2).

5. A novel wafer cassette according to claim 4, characterized in that, The pressing rod (4) is frustum shaped and is engaged with the movable hole (6).

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