External wafer separation auxiliary mechanism

By designing an eccentric rotation and lifting module for an external wafer separation auxiliary mechanism, the problem of low wafer separation efficiency in existing equipment is solved, achieving efficient and low-cost wafer separation, improving the success rate and simplifying the operation process.

CN223912848UActive Publication Date: 2026-02-13SUZHOU DELPHI LASER
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Patent Information

Application Number
CN202520341947.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-28
Publication Date
2026-02-13
Estimated Expiration
2035-02-28

AI Technical Summary

Technical Problem

Existing ultrasonic-assisted wafer cleaving equipment is inefficient and prone to failure when separating wafers, especially when there is large-area adhesion, which requires long-term hand-holding or suspension fixation, resulting in low separation efficiency.

Method used

An external wafer separation auxiliary mechanism was designed, comprising a rotation module and a lifting module. Through eccentric rotation and lifting motion, the oscillator is ensured to be fully covered by the wafer. Combined with electric slip rings to optimize motor wiring, semi-automatic operation is achieved.

Benefits of technology

It improves the success rate and efficiency of wafer separation, shortens the dicing time, reduces costs, facilitates observation of dicing effects, and prevents problems such as wire winding and loosening of connectors during the rotation process.

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Abstract

The utility model relates to an external wafer separation auxiliary mechanism which comprises an ultrasonic cleaning water tank, and an auxiliary mechanism is installed on one side of the ultrasonic cleaning water tank. The auxiliary mechanism comprises a rotating module and a lifting module matched with the rotating module. The rotating module sequentially comprises a first motor, a motor mounting plate, a second motor, a first adapter plate, a second adapter plate and a suction cup from top to bottom; the lifting module comprises a lifting module and a sliding plate driven by the lifting module to move in the vertical direction. According to the utility model, the problems of long time and easy failure of wafer ultrasonic wave splitting are solved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing related technical field especially, it relates to a kind of external wafer separation auxiliary mechanism. BACKGROUND

[0002] With the rise of semiconductor industry, the importance of chip has been well known. Chip manufacturing process also needs to be improved. Among them, thin wafer is separated from a whole ingot. This process is generally divided into two process categories: line cutting and laser stealth cutting. Laser stealth cutting cannot completely separate the wafer from the ingot due to various reasons. The solution is generally to use ultrasonic wave to crack and then separate the wafer by external force. The existing ultrasonic wave cracking equipment generally puts the wafer into the ultrasonic wave tank after fixing it, and relies on the vibrator arranged under the tank to produce vibration to drive the solution in the tank to vibrate slightly, so as to realize wafer separation.

[0003] At present, there are few ultrasonic wave assisted cracking on the market, which uses suction cup to adsorb ingot and sink into ultrasonic cleaning tank for vibration cracking. The suction cup fixing method is generally handheld or suspended. Since the size and position of the wafer and ingot adhesion area after laser stealth cutting are not fixed, the success rate of separation can be achieved by hand holding for a few minutes when the adhesion area is small. However, when the adhesion area is large and the adhesion is firm, it takes tens of minutes of continuous ultrasonic vibration to separate some pieces, which is not practical to hold by hand. The suspended fixing efficiency is also low.

[0004] At present, the ultrasonic wave assisted cracking separation machine generally uses existing ultrasonic cleaning machine. The ultrasonic vibration plate or vibrator is placed under the water tank, and the vibrator is controlled by ultrasonic generator to produce vibration. The solution is transmitted to the ingot to achieve cracking. However, there is a gap between the vibrator distribution, and the minimum gap is more than 10mm. When efficiency is pursued, the product will be close to the bottom of the tank. The wafer is large, and the vibration received by the local part is not uniform, which may lead to low wafer separation efficiency or even failure.

[0005] In view of the above defects, the designer actively researches and innovates to create an external wafer separation auxiliary mechanism, which has more industrial utilization value. CONTENT OF THE UTILITY MODEL

[0006] To solve any of the above technical problems, the purpose of the utility model is to provide an external wafer separation auxiliary mechanism.

[0007] To achieve the above purpose, the utility model adopts the following technical solutions:

[0008] The external wafer separation auxiliary mechanism comprises an ultrasonic cleaning tank, and an auxiliary mechanism is installed on one side of the ultrasonic cleaning tank.

[0009] The auxiliary mechanism comprises a rotating module and a lifting module matched with the rotating module;

[0010] The rotating module comprises, from top to bottom, a first motor, a motor mounting plate, a second motor, a first adapter plate, a second adapter plate and a suction cup.

[0011] The lifting module comprises a lifting module and a sliding plate driven by the lifting module to move in the vertical direction.

[0012] The first motor is mounted on the motor mounting plate, the motor mounting plate is mounted on the sliding plate through a plurality of supporting columns, the motor output shaft of the first motor is connected with the first adapter plate below through an eccentric rotating shaft, the second motor is mounted on the first adapter plate, the motor output shaft of the second motor is connected with the second adapter plate below through a concentric rotating shaft, and the suction cup is mounted on the bottom of the second adapter plate.

[0013] As a further improvement of the utility model, an upper motor shield is mounted on the motor mounting plate outside the first motor, and a cover and an outer cover are mounted on the first adapter plate outside the second motor.

[0014] As a further improvement of the utility model, the motor output shaft of the first motor is connected with the eccentric rotating shaft below through a shaft coupling, a rotating bearing is mounted in the first adapter plate, a bearing pressing plate is mounted above the rotating bearing, an electric slip ring is mounted on the eccentric rotating shaft after passing through the rotating bearing and then passing through a slip ring fixing block, and a shaft ring and a round nut are mounted below the eccentric rotating shaft.

[0015] As a further improvement of the utility model, the motor output shaft of the second motor is connected with the concentric rotating shaft below through a shaft coupling, a rotating bearing is mounted in the bearing mounting plate below the first adapter plate, the bearing mounting plate is connected with the first adapter plate above through a plurality of supporting columns, a bearing pressing plate is mounted above the rotating bearing, a shaft ring and a round nut are mounted on the concentric rotating shaft after passing through the rotating bearing and then connected with the second adapter plate below.

[0016] As a further improvement of the utility model, a hook is mounted on the bottom of the second adapter plate, and the top of the suction cup is mounted on the hook through a suction cup mounting block.

[0017] As a further improvement of the utility model, the lifting module comprises, from top to bottom, a lead screw mounting plate, a sliding plate and a bottom plate, a lifting lead screw is mounted on the lead screw mounting plate, and the lifting lead screw drives the sliding plate to move in the vertical direction.

[0018] As a further improvement of the utility model, a handle is mounted on the lifting lead screw at the top of the lead screw mounting plate through a lead screw support.

[0019] As further improvement of the utility model, guiding rod and hole guiding rod are respectively installed on both sides between the screw rod mounting plate and the bottom plate, the sliding plate moves along the vertical direction on the guiding rod and the hole guiding rod through the linear bearing.

[0020] As further improvement of the utility model, handle fixed ring is installed on the guiding rod and the hole guiding rod near the bottom.

[0021] As further improvement of the utility model, the second rib plate and the first rib plate are installed on the bottom of the sliding plate.

[0022] By the above scheme, the utility model has at least the following advantages:

[0023] The utility model improves the long wafer ultrasonic wafer breaking time and the problem of easy failure.

[0024] The utility model only has autorotation, and the product still has an area that cannot be covered by the vibrator in the radial direction, and the autorotation and eccentric rotation scheme can realize the vibrator coverage of the full width of the product.

[0025] The utility model has low structure cost, and the semi-automatic processing can also facilitate personnel to observe the wafer breaking effect and power off in time.

[0026] The utility model uses the electric slip ring to optimize the motor wiring.

[0027] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, and can be implemented according to the content of the specification, the following will be the preferred embodiment of the utility model and the detailed description of the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment, it should be understood that the following drawings only show some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for the ordinary skilled person in the art, under the premise of not paying the creative labor, other related drawings can also be obtained according to these drawings.

[0029] Figure 1 It is the application scene schematic diagram of the utility model;

[0030] Figure 2 It is the structure schematic diagram of the utility model one kind of external wafer separation auxiliary mechanism;

[0031] Figure 3 It isFigure 2 Structure diagram of the rotating module;

[0032] Figure 4 is Figure 2 Structure diagram of the lifting module.

[0033] In the drawings, the meanings of various reference signs are as follows.

[0034] 100, ultrasonic cleaning water tank; 200, auxiliary mechanism; 300, rotating module; 400, lifting module;

[0035] eccentric rotating shaft 1; 2, upper motor shield; motor mounting plate 3; 4, rotating bearing; 5, first motor; 6, bearing pressing plate; 7, slip ring fixing block; 8, electric slip ring; 9, round nut; 10, cover; 11, shaft ring; 12, concentric rotating shaft; 13, product; 14, suction cup; 15, suction cup mounting block; 16, bearing mounting plate; 17, hook; 18, second adapter plate; 19, support column; coupling 20; 21, first adapter plate; 22, outer cover; 23, second motor; sliding plate 24; 25, screw rod support; 26, screw rod mounting plate; 27, handle; 28, first rib plate; 29, linear bearing; 30, guide rod; 31, bottom plate; 32, hole guide rod; 33, handle fixing ring; 34, second rib plate; 35, lifting screw rod. DETAILED DESCRIPTION

[0036] The specific embodiments of the present application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the present application, but are not used to limit the scope of the present application.

[0037] In order to enable the personnel in the technical field to better understand the present application scheme, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0038] As Figures 1-4As shown, an external wafer separation auxiliary mechanism includes an ultrasonic cleaning sink 100, and an auxiliary mechanism 200 is installed on one side of the ultrasonic cleaning sink 100. The auxiliary mechanism 200 includes a rotating module 300 and a lifting module 400 matched with the rotating module 300.

[0039] 1. The rotating module 300 includes a first motor 5, a motor mounting plate 3, a second motor 23, a first adapter plate 21, a second adapter plate 18 and a suction cup 14 from top to bottom.

[0040] The first motor 5 is installed on the motor mounting plate 3, and the motor mounting plate 3 is installed on the sliding plate 24 through a plurality of support columns 19. The motor output shaft of the first motor 5 is connected with the first adapter plate 21 below through an eccentric rotating shaft 1. The second motor 23 is installed on the first adapter plate 21, and the motor output shaft of the second motor 23 is connected with the second adapter plate 18 below through a concentric rotating shaft 12. The suction cup 14 is installed at the bottom of the second adapter plate 18.

[0041] The motor output shaft of the first motor 5 is connected with the eccentric rotating shaft 1 below through a shaft coupling 20. A rotating bearing 4 is installed in the first adapter plate 21. A bearing pressing plate 6 is installed above the rotating bearing 4. An electric slip ring 8 is installed through a slip ring fixing block 7 after the eccentric rotating shaft 1 passes through the rotating bearing 4. A shaft ring 11 and a round nut 9 are installed below the eccentric rotating shaft 1.

[0042] The motor output shaft of the second motor 23 is connected with the concentric rotating shaft 12 below through a shaft coupling 20. A rotating bearing 4 is installed in the bearing mounting plate 16 below the first adapter plate 21. The bearing mounting plate 16 is connected with the first adapter plate 21 above through a plurality of support columns 19. A bearing pressing plate 6 is installed above the rotating bearing 4. A shaft ring 11 and a round nut 9 are installed after the concentric rotating shaft 12 passes through the rotating bearing 4 and are connected with the second adapter plate 18 below.

[0043] A hook 17 is installed at the bottom of the second adapter plate 18. The top of the suction cup 14 is installed on the hook 17 through a suction cup mounting block 15.

[0044] 2. The lifting module 400 includes a lifting module and a sliding plate 24 driven to move in the vertical direction by the lifting module.

[0045] The lifting module includes a lead screw mounting plate 26, the sliding plate 24 and a bottom plate 31 from top to bottom. A lifting lead screw 35 is installed on the lead screw mounting plate 26. The lifting lead screw 35 drives the sliding plate 24 to move in the vertical direction.

[0046] A handle 27 is installed on the lifting lead screw 35 at the top of the lead screw mounting plate 26 through a lead screw support 25.

[0047] Two guide rods 30 and a hole guide rod 32 are respectively installed on both sides between the lead screw mounting plate 26 and the bottom plate 31, and the slide plate 24 moves along the vertical direction on the guide rod 30 and the hole guide rod 32 through the linear bearing 29.

[0048] The second rib plate 34 and the first rib plate 28 are installed on the bottom of the slide plate 24.

[0049] The upper motor cover 2 is installed on the motor mounting plate 3 outside the first motor 5, and the cover 10 and the outer cover 22 are installed on the first adapter plate 21 outside the second motor 23.

[0050] The position relationship and connection relationship between the components of the utility model are as follows:

[0051] The first motor 5 is locked on the motor mounting plate 3 by screws, two support columns 19 are locked below the motor mounting plate 3, the motor output shaft is locked with the coupling 20, the upper is clamped into the rotating bearing 4, the bearing is pressed by the bearing pressing plate 6 above by screws, and the eccentric rotating shaft 1 is inserted. The motor mounting plate 3 and the two support columns 19 are installed on the slide plate 24, and at this time, the first motor 5 and the eccentric rotating shaft 1 are connected firmly by the coupling 20. The shaft ring 11 is sleeved below the eccentric rotating shaft 1, and the round nut 9 is screwed. The slip ring fixing block 7 is locked on the electric slip ring 8, is sleeved on the eccentric rotating shaft 1, and is fixed on the eccentric rotating shaft 1 by M3 screws. The second motor 23 is locked to the first adapter plate 21, and is further fixed to the lower end surface of the eccentric rotating shaft 1. Another set of coupling 20, support column 19, rotating bearing 4, round nut 9, bearing pressing plate 6, second adapter plate 18 and concentric rotating shaft 12 are fixed in the same way. The first adapter plate 21 is locked below the concentric rotating shaft 12, and the hook 17 is further locked. The rotating module is installed.

[0052] The first rib plate 28 and the second rib plate 34 are locked to the slide plate 24, and the two linear bearings 29 and the screw nut of the lifting lead screw 35 are sleeved and locked in the slide plate 24, and the guide rod 30 and the hole guide rod 32 are respectively inserted into the linear bearing. The hole guide rod 32 needs to be paid attention to the angle of insertion, and the hole gap needs to avoid the internal ball of the linear bearing. Then, a handle fixing ring 33 is sleeved above one side of the guide rod to serve as an upper limit, the two guide shaft end surfaces are locked with the lead screw mounting plate 26, and then the lead screw support 25 and the handle 27 are locked in turn. One handle fixing ring 33 is further sleeved below each of the two guide shafts to serve as a lower limit. The lower end surface is further locked with the bottom plate 31. After the motor slip ring wiring is completed, the upper motor cover 2, the cover 10 and the outer cover 22 are packaged. The suction cup 14 and the suction cup mounting block 15 are connected and fastened by nuts, and the suction cup mounting block 15 is clamped into the hook 17 for work after manually adsorbing the product.

[0053] The utility model discloses a work principle: the lifting module is driven by handle to control the lifting of whole rotary module with screw rod.

[0054] The utility model discloses a work process: the rotary module is moved to the upper limit position with handle 27, and the hexagonal wrench is inserted into the hole guide rod 32 to limit, and the suction cup 14 is fastened as a whole with the suction cup mounting block 15 and hangs on the suction cup, and the thick wafer of the crystal ingot is manually adsorbed downwards, and hangs on the hook 17, and the limiting hexagonal wrench is pulled out, and is shaken to the rotary module to the lower limit position, and the product 13 sinks into the ultrasonic water tank at this time, and the equipment is powered on to begin to rotate and crack. After the crack is finished, power off, and shake to the rotary module to the upper limit position, and insert the limiting hexagonal wrench. The suction cup is manually taken down and discharged. Reciprocate like this.

[0055] Through a set of auxiliary rotating mechanism, ensure that the crystal ingot is fully covered in the water tank. With the up-down motion structure, realize the semi-automatic ultrasonic auxiliary crack. Workers only need to control the structure to rise to the material taking position or drop to the working position, and manually feed and discharge after the crack is finished. No need to hold continuously. Efficiency and success rate are improved.

[0056] The utility model discloses improve the problem that wafer ultrasonic crack time is long and easy to fail. Only when self-rotating, the product still has the area that the vibrator cannot cover in the radial direction, and the self-rotation plus eccentric rotation scheme of the structure can realize the vibrator coverage of the whole width of the product, and it is verified that the wafer ultrasonic crack time of originally needing more than twenty minutes, after replacing the structure, the average crack time is about 15 minutes, and the crack success rate also has obvious improvement. The structure cost is very low, and the semi-automatic processing can also facilitate personnel to observe the crack effect, and power off in time. Use the electric slip ring to optimize the motor wiring. Prevent the problem of wire winding and joint loosening in the rotating process.

[0057] In the description of the utility model, need understanding is, the term "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "internal", "external" and so on indicate the orientation or positional relation based on the orientation or positional relation shown in the drawing, just for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, construct and operate in a particular orientation, therefore can not be understood as the limitation of the utility model. In addition, the term "first", "second" and so on are only for the purpose of description, and can not be understood as indicating or implying relative importance or implying the number of the indicated technical features. Therefore, the features limited by "first", "second" and so on can be explicitly or implicitly included one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0058] In the description of the utility model, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected, can be mechanically connected, can be electrically connected, can be directly connected, can be indirectly connected through an intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood through specific circumstances.

[0059] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model, it should be pointed out that, for ordinary skilled in the art, on the premise of not departing from the technical principles of the utility model, can make several improvements and variations, these improvements and variations also should be regarded as the protection scope of the utility model.

Claims

1. A wafer separation auxiliary mechanism, comprising an ultrasonic cleaning tank (100), an auxiliary mechanism (200) is installed on one side of the ultrasonic cleaning tank (100); characterized in that: The auxiliary mechanism (200) comprises a rotating module (300) and a lifting module (400) matched with the rotating module (300); The rotating module (300) comprises a first motor (5), a motor mounting plate (3), a second motor (23), a first adapter plate (21), a second adapter plate (18) and a suction cup (14) from top to bottom. The lifting module (400) comprises a lifting module and a sliding plate (24) driven by the lifting module to move in the vertical direction. The first motor (5) is mounted on the motor mounting plate (3), the motor mounting plate (3) is mounted on the sliding plate (24) through a plurality of support columns (19), the motor output shaft of the first motor (5) is connected with the first adapter plate (21) below through an eccentric rotating shaft (1), the second motor (23) is mounted on the first adapter plate (21), the motor output shaft of the second motor (23) is connected with the second adapter plate (18) below through a concentric rotating shaft (12), and the suction cup (14) is mounted at the bottom of the second adapter plate (18).

2. The external wafer separation assisting mechanism according to claim 1, wherein An upper motor cover (2) is mounted on the motor mounting plate (3) outside the first motor (5), and a cover shell (10) and an outer cover (22) are mounted on the first adapter plate (21) outside the second motor (23).

3. The external wafer separation assisting mechanism according to Claim 1, wherein The motor output shaft of the first motor (5) is connected with the eccentric rotating shaft (1) below through a shaft coupling (20), a rotating bearing (4) is mounted in the first adapter plate (21), a bearing pressing plate (6) is mounted above the rotating bearing (4), the eccentric rotating shaft (1) passes through the rotating bearing (4) and is then mounted with an electric slip ring (8) through a slip ring fixing block (7), and a shaft ring (11) and a circular nut (9) are mounted below the eccentric rotating shaft (1).

4. The external wafer separation assisting mechanism according to Claim 1, wherein The motor output shaft of the second motor (23) is connected with the concentric rotating shaft (12) below through a shaft coupling (20), a rotating bearing (4) is mounted in the bearing mounting plate (16) below the first adapter plate (21), the bearing mounting plate (16) is connected with the first adapter plate (21) above through a plurality of support columns (19), a bearing pressing plate (6) is mounted above the rotating bearing (4), and the concentric rotating shaft (12) is connected with the second adapter plate (18) below after passing through the rotating bearing (4) and being mounted with a shaft ring (11) and a circular nut (9).

5. The external wafer separation assist mechanism of claim 1, wherein A hook (17) is mounted at the bottom of the second adapter plate (18), and the top of the suction cup (14) is mounted on the hook (17) through a suction cup mounting block (15).

6. The external wafer separation assist mechanism of claim 1, wherein The lifting module comprises a screw rod mounting plate (26), a sliding plate (24) and a bottom plate (31) from top to bottom, a lifting screw rod (35) is mounted on the screw rod mounting plate (26), and the lifting screw rod (35) drives the sliding plate (24) to move in the vertical direction.

7. The external wafer separation assist mechanism of claim 6, wherein A handle (27) is mounted on the lifting screw rod (35) at the top of the screw rod mounting plate (26) through a screw rod support (25).

8. The external wafer separation assist mechanism of claim 6, wherein Between the screw rod mounting plate (26) and the bottom plate (31), guiding rods (30) and hole guiding rods (32) are respectively installed on both sides, and the slide plate (24) moves along the vertical direction on the guiding rods (30) and the hole guiding rods (32) through linear bearings (29).

9. The external wafer separation assist mechanism of claim 8, wherein Handle fixing rings (33) are installed on the guiding rods (30) and the hole guiding rods (32) near the bottom.

10. The external wafer separation assist mechanism of claim 6, wherein Second rib plates (34) and first rib plates (28) are installed on the bottom of the slide plate (24).