Rotary gluing device for chip packaging equipment

Abstract

The utility model discloses a rotary gluing device for chip packaging equipment, which relates to the technical field of chip gluing and comprises a chip bearing mechanism, a rotary gluing mechanism and a rotary gluing mechanism, the rotary gluing mechanism is used for driving the chip to rotate and gluing; the jacking and discharging mechanism comprises a flow guide inclined plate, a third L-shaped plate, a hydraulic cylinder, a jacking block and a guide inclined surface; the flow guide inclined plate is fixedly arranged on the left side of the workbench, the third L-shaped plate is fixedly arranged at the bottom of the flow guide inclined plate, the hydraulic cylinder is fixedly arranged at the bottom of the third L-shaped plate, and the jacking block is located at the top of the third L-shaped plate and fixedly connected with an output shaft of the hydraulic cylinder. According to the utility model, after the chip is glued, the chip can be conveniently moved out from the inner side of the bearing groove, and the moved-out chip is guided, so that the collection of the chip is facilitated, and the chip gluing device is more convenient in actual use.

Description

Technical Field

[0001] This utility model relates to the field of chip coating technology, and in particular to a rotary coating device for chip packaging equipment. Background Technology

[0002] A chip is the carrier of an integrated circuit. It is the result of the integrated circuit being designed, manufactured, packaged, and tested. It is an independent whole that can be used immediately. Conductive adhesive is usually used to mount the chip in the integrated circuit packaging.

[0003] A search revealed that utility model patent CN218308929U discloses an intelligent rotary coating device for chip packaging equipment, including a base, a rotary coating mechanism on the top of the base, and a rotating ring disposed on the base.

[0004] However, the above-mentioned device still has some drawbacks in actual use. The most obvious one is that after the glue is applied, the operator needs to manually remove the chip from the placement slot and then put the uncoated chip back in, which is quite inconvenient in actual operation.

[0005] Therefore, it is necessary to invent a rotary coating device for chip packaging equipment to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a rotary adhesive applicator for chip packaging equipment. After adhesive application, the chip can be easily removed from the inside of the carrier slot, and the removed chip can be guided to facilitate chip collection. This device is more convenient in actual use and solves the problem mentioned in the background art that after adhesive application, the operator needs to manually remove the chip from the placement slot and then put in the uncoated chip again, which is inconvenient in actual operation.

[0007] According to one aspect of this disclosure, the following technical solution is provided: a rotary coating apparatus for chip packaging equipment, comprising:

[0008] A chip carrier mechanism, which is used to carry a chip;

[0009] A rotary adhesive applicator, wherein the rotary adhesive applicator is used to apply adhesive to a chip that is rotated; and

[0010] The lifting and discharging mechanism includes a guide plate, a third L-shaped plate, a hydraulic cylinder, a lifting block, and a guide slope.

[0011] The guide ramp is fixedly installed on the left side of the workbench, the third L-shaped plate is fixedly installed at the bottom of the guide ramp, the hydraulic cylinder is fixedly installed at the bottom of the third L-shaped plate, the lifting block is located at the top of the third L-shaped plate and is fixedly connected to the output shaft of the hydraulic cylinder, the lifting block is located directly below the adjacent clearance channel, and the guide ramp is opened on the top left side of the lifting block.

[0012] According to at least one embodiment of the present disclosure, a rotary coating apparatus for a chip packaging device includes a chip carrier mechanism comprising a worktable, a carrier ring, and a gear ring. The carrier ring is rotatably disposed on the inner side of the worktable via a bearing, and the gear ring is fixedly disposed on the inner side of the carrier ring.

[0013] According to at least one embodiment of the present disclosure, a rotary coating apparatus for a chip packaging device includes a chip carrier mechanism that further comprises a carrier groove and a clearance channel. Multiple carrier grooves and clearance channels are provided. The multiple carrier grooves are evenly opened at the top of the carrier ring, and the multiple clearance channels are evenly disposed through the bottom of the carrier ring and are respectively connected to the multiple carrier grooves.

[0014] According to at least one embodiment of the present disclosure, a rotary coating apparatus for a chip packaging device includes a first L-shaped plate, a drive motor, and a gear. The first L-shaped plate is fixedly disposed on the rear side of the top of the worktable, the drive motor is fixedly disposed on the top of the first L-shaped plate, and the gear meshes with a gear ring and is fixedly disposed at the bottom end of the output shaft of the drive motor.

[0015] According to at least one embodiment of the present disclosure, a rotary coating apparatus for a chip packaging device further includes a second L-shaped plate and a coating gun. The second L-shaped plate is fixedly disposed on the top right side of the worktable, and the coating gun is fixedly disposed through the top of the second L-shaped plate. The output end of the coating gun is located directly above an adjacent support groove.

[0016] The technical effects and advantages of this utility model are as follows:

[0017] This invention features a lifting and discharging mechanism. When the supporting ring moves the coated chip directly above the lifting block, the hydraulic cylinder raises its output shaft, causing the lifting block to pass through the adjacent clearance channel and enter the adjacent supporting groove. As the lifting block continues to rise, it pushes the chip, causing it to move out of the supporting groove. Subsequently, as the lifting block continues to rise, the guide slope guides the chip, causing it to fall into the guide plate and be output. Compared to existing similar devices, this invention allows for more convenient chip removal from the supporting groove after coating and provides guidance for chip collection, making it more convenient in actual use. Attached Figure Description

[0018] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0019] Figure 1 This is a schematic diagram of the overall structure of a spin coating apparatus for chip packaging equipment according to one embodiment of the present disclosure.

[0020] Figure 2 This is a schematic diagram of the chip carrier mechanism and the spin coating mechanism of a spin coating apparatus for chip packaging equipment according to one embodiment of the present disclosure.

[0021] Figure 3 This is a schematic diagram of the lifting and discharging mechanism of a rotary coating apparatus for chip packaging equipment according to one embodiment of the present disclosure.

[0022] The specific labels in the attached figures are as follows:

[0023] 1. Chip carrier mechanism; 11. Worktable; 12. Carrier ring; 13. Gear ring; 14. Carrier groove; 15. Clearance channel;

[0024] 2. Rotary glue application mechanism; 21. First L-shaped plate; 22. Drive motor; 23. Gear; 24. Second L-shaped plate; 25. Glue application gun;

[0025] 3. Lifting and discharging mechanism; 31. Guide ramp; 32. Third L-shaped plate; 33. Hydraulic cylinder; 34. Lifting block; 35. Guide ramp. Detailed Implementation

[0026] For descriptive purposes, this disclosure may use spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side (e.g., in a “sidewall”)” to describe the relationship between one component and another component as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are also intended to encompass different orientations of the device during use, operation, and / or manufacture. For example, if the device in the drawings is flipped, a component described as “below” or “under” other components or features would subsequently be positioned “above” said other components or features. Thus, the exemplary term “below” can encompass both “above” and “below” orientations. Furthermore, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), thus interpreting the spatial relative descriptive terms used herein accordingly.

[0027] Figure 1This is a schematic diagram of the overall structure of a spin coating apparatus for chip packaging equipment according to one embodiment of the present disclosure.

[0028] Figure 2 This is a schematic diagram of the chip carrier mechanism 1 and the rotary coating mechanism 2 of a rotary coating apparatus for chip packaging equipment according to one embodiment of the present disclosure.

[0029] Figure 3 This is a schematic diagram of the lifting and discharging mechanism 3 of a rotary coating apparatus for chip packaging equipment according to one embodiment of the present disclosure.

[0030] like Figures 1-3 As shown, the rotary coating apparatus for chip packaging equipment disclosed herein may include components such as a chip carrier mechanism 1, a rotary coating mechanism 2, and a lifting and discharging mechanism 3.

[0031] like Figure 2 As shown in this disclosure, the chip carrier mechanism 1 includes a worktable 11, a carrier ring 12, a gear ring 13, a carrier groove 14, and a clearance channel 15. The carrier ring 12 is rotatably mounted on the inner side of the worktable 11 via a bearing, and the gear ring 13 is fixedly mounted on the inner side of the carrier ring 12. Multiple carrier grooves 14 and clearance channels 15 are provided. Multiple carrier grooves 14 are evenly opened on the top of the carrier ring 12, and multiple clearance channels 15 are evenly disposed through the bottom of the carrier ring 12 and are respectively connected to multiple carrier grooves 14.

[0032] like Figure 2 As shown, in a preferred embodiment, the rotary glue application mechanism 2 includes a first L-shaped plate 21, a drive motor 22, a gear 23, a second L-shaped plate 24, and a glue application gun 25. The first L-shaped plate 21 is fixedly disposed on the rear side of the top of the workbench 11, the drive motor 22 is fixedly disposed on the top of the first L-shaped plate 21, the gear 23 meshes with the gear ring 13 and is fixedly disposed at the bottom end of the output shaft of the drive motor 22, the second L-shaped plate 24 is fixedly disposed on the right side of the top of the workbench 11, and the glue application gun 25 is fixedly disposed through the top of the second L-shaped plate 24. The output end of the glue application gun 25 is located directly above the adjacent bearing groove 14.

[0033] Therefore, after the drive motor 22 starts, it drives the gear 23 to rotate. When the gear 23 rotates, it drives the bearing ring 12 to rotate through the gear ring 13. In turn, the gear ring 13 drives multiple chips to rotate through multiple bearing grooves 14. When the chips rotate, they pass through the glue application station directly below the glue gun 25 and the material discharge station directly above the lifting block 34, thereby completing the glue application and material discharge work.

[0034] like Figure 3As shown in this disclosure, the lifting and discharging mechanism 3 includes a guide plate 31, a third L-shaped plate 32, a hydraulic cylinder 33, a lifting block 34, and a guide slope 35. The guide plate 31 is fixedly disposed on the left side of the workbench 11, the third L-shaped plate 32 is fixedly disposed at the bottom of the guide plate 31, the hydraulic cylinder 33 is fixedly disposed at the bottom of the third L-shaped plate 32, the lifting block 34 is located at the top of the third L-shaped plate 32 and is fixedly connected to the output shaft of the hydraulic cylinder 33, the lifting block 34 is located directly below the adjacent clearance channel 15, and the guide slope 35 is opened on the top left side of the lifting block 34.

[0035] Therefore, when the support ring 12 moves the coated chip directly above the lifting block 34, the hydraulic cylinder 33 drives its output shaft to rise, causing the lifting block 34 to pass through the adjacent clearance channel 15 and enter the inner side of the adjacent support groove 14. As the lifting block 34 continues to move upward, it pushes the chip, causing the chip to move out of the inner side of the support groove 14. Subsequently, as the lifting block 34 continues to move upward, the guide slope 35 guides the chip, causing it to fall into the inner side of the guide slope 31 and be output. Compared with existing similar devices, this method allows the chip to be moved out of the inner side of the support groove 14 more conveniently after the chip is coated, and guides the removed chip to facilitate chip collection, making it more convenient in actual use.

[0036] It should also be noted that any content not described in detail in this specification is prior art known to those skilled in the art.

[0037] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A rotary coating apparatus for chip packaging equipment, characterized in that, The utility model relates to a chip production line, which comprises: a chip bearing mechanism for bearing a chip; a rotary glue coating mechanism for rotating and coating the chip; and a jacking and discharging mechanism comprising a guide inclined plate, a third L-shaped plate, a hydraulic cylinder, a jacking block and a guide inclined surface. The guide inclined plate is fixedly arranged on the left side of the workbench, the third L-shaped plate is fixedly arranged at the bottom of the guide inclined plate, the hydraulic cylinder is fixedly arranged at the bottom of the third L-shaped plate, the jacking block is located at the top of the third L-shaped plate and is fixedly connected with the output shaft of the hydraulic cylinder, the jacking block is located directly below the adjacent avoiding passage, and the guide inclined surface is arranged on the left side of the top of the jacking block. The chip bearing mechanism comprises a workbench, a bearing ring and a gear ring, the bearing ring is rotatably arranged on the inner side of the workbench through a bearing, and the gear ring is fixedly arranged on the inner side of the bearing ring.

2. The spin coater for a chip packaging apparatus according to claim 1, wherein: The chip bearing mechanism further comprises bearing grooves and avoiding passages, a plurality of the bearing grooves are uniformly arranged on the top of the bearing ring, and a plurality of the avoiding passages are uniformly and respectively arranged on the bottom of the bearing ring and communicated with the plurality of bearing grooves.

3. The spin coater for a chip packaging apparatus according to claim 2, wherein: The rotary glue coating mechanism comprises a first L-shaped plate, a driving motor and a gear, the first L-shaped plate is fixedly arranged on the top of the workbench, the driving motor is fixedly arranged on the top of the first L-shaped plate, and the gear is engaged with the gear ring and fixedly arranged on the bottom end of the output shaft of the driving motor.

4. The spin coater for a chip packaging apparatus according to claim 3, wherein: The rotary glue coating mechanism further comprises a second L-shaped plate and a glue coating gun, the second L-shaped plate is fixedly arranged on the right side of the top of the workbench, the glue coating gun is fixedly and penetratingly arranged on the top of the second L-shaped plate, and the output end of the glue coating gun is located directly above the adjacent bearing groove.

5. The spin coater for a chip packaging apparatus according to claim 4, wherein: ​

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