Semiconductor material processing and cleaning equipment

Abstract

The utility model discloses semiconductor material processing and cleaning equipment which comprises a barrel, an upper sealing cover is mounted on the upper side of the barrel, and a stirring mechanism is mounted on the lower side of the upper sealing cover and used for stirring water in the barrel and cleaning a semiconductor material in the barrel; a bottom turning mechanism is mounted at the lower end of the barrel, mounting seats are mounted at the upper end of the bottom turning mechanism at equal angles, and filter screens are rotatably connected to the inner sides of the mounting seats; the bottom turning mechanism comprises a lower sealing cover, the lower sealing cover is detachably connected with the barrel through a bolt, and an air cylinder is installed at the lower end of the lower sealing cover. The bottom turning mechanism at least has the following beneficial effects that the bottom turning mechanism can intermittently turn the semiconductor material at the bottom through cooperation of the air cylinder and the pushing plate, and the situation that the material is accumulated at the bottom for a long time and is difficult to clean is avoided. And the design of the filter screen can effectively filter impurities generated in the cleaning process, pollution to the cleaning liquid is reduced, the replacement frequency of the cleaning liquid is reduced, and the maintenance cost is saved.

Description

Technical Field

[0001] This application relates to the field of semiconductor material processing technology, specifically to a semiconductor material processing and cleaning device. Background Technology

[0002] Cleaning is a crucial step in semiconductor material processing. The surface cleanliness of semiconductor materials directly affects the quality of subsequent processes and product performance. Traditional cleaning methods typically employ static immersion or simple mechanical agitation. While these methods can remove some surface contaminants, they often fall short of achieving ideal cleaning results when handling semiconductor materials with complex shapes or microstructures. Furthermore, traditional cleaning equipment is prone to causing collisions and damage to semiconductor materials during the cleaning process, impacting product yield.

[0003] Existing cleaning equipment often results in impurities and dirt accumulating at the bottom of the device during the stirring and agitation of semiconductor materials, increasing cleaning frequency and maintenance costs. Therefore, there is an urgent need for a new type of cleaning equipment capable of efficiently and uniformly cleaning semiconductor materials. Utility Model Content

[0004] Therefore, this application provides a semiconductor material processing and cleaning device to solve the problems existing in the prior art.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A semiconductor material processing and cleaning device, comprising:

[0007] A cylindrical body, with an upper cover installed on the upper side of the cylindrical body and an agitation mechanism installed on the lower side of the upper cover to agitate the water inside the cylindrical body and clean the semiconductor material inside the cylindrical body;

[0008] The lower end of the cylinder is equipped with a bottom flipping mechanism, and the upper end of the bottom flipping mechanism is equipped with a mounting base at equal angles. A filter screen is rotatably connected to the inner side of the mounting base, and the longitudinal section of the filter screen is arc-shaped and the filter screen is deformable.

[0009] The bottom flipping mechanism includes a lower cover, which is detachably connected to the cylinder by bolts. A cylinder is installed at the lower end of the lower cover, and a push plate is installed at the upper end of the cylinder.

[0010] Optionally, the agitation mechanism includes a mounting rod, the upper end of which is fixedly connected to a drive motor mounted on the upper side of the cylinder. The drive motor drives the mounting rod to rotate. An agitation frame is mounted on one side of the mounting rod, and an agitation plate is mounted on the side of the mounting rod away from the agitation frame. The agitation plate and the agitation frame are arranged opposite to each other, and the width of the agitation plate is greater than the width of the agitation frame.

[0011] Optionally, a water-guiding spiral blade is also fixed to the lower end of the mounting rod.

[0012] Optionally, a blocking net is installed at the lower end of the upper cover, located outside the stirring mechanism.

[0013] Optionally, a first drain outlet is also installed on one side of the lower cover, and a second drain outlet located on one side of the cylinder is also installed at the lower end of the lower cover.

[0014] Optionally, the inner wall of the cylinder is also equipped with several blocking rods at equal angles.

[0015] Optionally, the lower end of the blocking rod is provided with a buffer ring installed inside the cylinder, and the outer side of the buffer ring is inclined.

[0016] Optionally, a limiting ring that fits against the inner wall of the blocking rod is provided on the lower side of the upper cover.

[0017] Compared with the prior art, this application has at least the following beneficial effects:

[0018] 1. The bottom-flipping mechanism, through the cooperation of a cylinder and a push plate, intermittently flips the semiconductor material at the bottom, preventing the material from accumulating at the bottom for extended periods and becoming difficult to clean. The filter design also effectively filters impurities generated during the cleaning process, reducing contamination of the cleaning solution, lowering the frequency of cleaning solution replacement, and saving maintenance costs.

[0019] 2. The semiconductor material processing and cleaning equipment provided in this application, through the synergistic action of the agitation mechanism and the bottom tumbling mechanism, can generate turbulence during the cleaning process, ensuring uniform distribution of semiconductor materials in the cleaning solution, preventing material accumulation, and thus improving cleaning efficiency. The design of the agitation plate and water-guiding spiral blades in the agitation mechanism can effectively agitate the water, generate eddies, and accelerate the removal of dirt.

[0020] 3. The barrier mesh and buffer ring design in the equipment can effectively isolate and buffer semiconductor materials, preventing them from colliding with the agitation mechanism or other materials during the cleaning process, reducing material damage and improving product yield. Attached Figure Description

[0021] To more intuitively illustrate the prior art and this application, exemplary drawings are provided below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary drawings, those skilled in the art are capable of making conventional adjustments or further optimizations to the addition / reduction / classification of certain units, their specific shapes, positional relationships, connection methods, size ratios, etc.

[0022] Figure 1This application provides an exploded structural diagram of a semiconductor material processing and cleaning equipment.

[0023] Figure 2 This application provides an overall structural schematic diagram of a semiconductor material processing and cleaning equipment.

[0024] Figure 3 A schematic diagram of the overall structure of the agitation mechanism and the upper cover of a semiconductor material processing and cleaning equipment provided in this application;

[0025] Figure 4 This application provides an overall structural schematic diagram of the bottom flipping mechanism of a semiconductor material processing and cleaning equipment;

[0026] Figure 5 This is a front cross-sectional view of a semiconductor material processing and cleaning equipment provided in this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Cylinder body; 2. Upper cover; 3. Baffle screen; 4. Drive motor; 5. Mounting base; 6. Bottom flipping mechanism; 601. Lower cover; 602. First drain outlet; 603. Second drain outlet; 604. Cylinder; 605. Push plate; 7. Agitation mechanism; 701. Mounting rod; 702. Agitator frame; 703. Agitator plate; 704. Water guide spiral blade; 8. Baffle rod; 9. Buffer ring; 10. Limiting ring; 11. Filter screen. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-5 The present application will be further described in detail through specific embodiments.

[0030] This utility model provides a semiconductor material processing and cleaning device, including a cylinder 1, an upper cover 2 installed on the upper side of the cylinder 1, and an agitation mechanism 7 installed on the lower side of the upper cover 2. The agitation mechanism 7 stirs the water in the cylinder 1 to clean the semiconductor material inside the cylinder 1. The agitation mechanism 7 includes a mounting rod 701, the upper end of which is fixedly connected to a drive motor 4 installed on the upper side of the cylinder 1. The drive motor 4 drives the mounting rod 701 to rotate. An agitation frame 702 is installed on one side of the mounting rod 701, and an agitation plate 703 is installed on the side of the mounting rod 701 away from the agitation frame 702. The agitation plate 703 and the agitation frame 702 are arranged opposite to each other, and the width of the agitation plate 703 is larger than the width of the agitation frame 702. This allows the mounting rod 701 to cause turbulence in the water inside the cylinder 1 in the initial stirring state, causing the semiconductor material to move randomly. Compared with a steady water flow, it is easier to clean the dirt on the surface of the semiconductor material.

[0031] The lower end of the mounting rod 701 is also fixed with a water-guiding spiral blade 704, so that when the mounting rod 701 rotates, it can drive the water-guiding spiral blade 704 to rotate, thereby causing the water around the water-guiding spiral blade 704 to flow downward, thereby preventing the spiral water flow from driving the semiconductor material upward, and thus preventing the semiconductor material from colliding with the stirring mechanism 7 and being damaged.

[0032] A baffle net 3 is installed at the lower end of the upper cover 2, which is located outside the agitation mechanism 7 to isolate semiconductor materials that may float to the agitation mechanism 7 during the cleaning process.

[0033] A bottom flipping mechanism 6 is installed at the lower end of the cylinder 1. A mounting base 5 is installed at an equal angle at the upper end of the bottom flipping mechanism 6. A filter screen 11 is rotatably connected to the inner side of the mounting base 5. The longitudinal section of the filter screen 11 is arc-shaped and the filter screen 11 is deformable. After the bottom flipping mechanism 6 is activated, it drives the semiconductor material accumulated on the upper side of the filter screen 11 to move, thereby preventing the semiconductor material at the bottom from always being at the bottom and difficult to clean.

[0034] Specifically, the bottom flipping mechanism 6 includes a lower cover 601, which is detachably connected to the cylinder 1 by bolts. A cylinder 604 is installed at the lower end of the lower cover 601, and a push plate 605 is installed at the upper end of the cylinder 604. After the cylinder 604 is started, the push plate 605 moves upward intermittently, thereby making the originally concave filter screen 11 bulge upward, causing the semiconductor material accumulated at the bottom to move to the outside of the filter screen 11 and flip it. At the same time, the downward vortex generated by the water guide spiral blade 704 during rotation prevents the semiconductor material from floating upward when the filter screen 11 is bulging.

[0035] A first drain port 602 is also installed on one side of the lower cover 601, so that the water in the cylinder 1 can be discharged quickly. A second drain port 603 is also installed at the lower end of the lower cover 601, located on the side of the cylinder 604, so that the impurities filtered by the filter screen 11 and settled at the bottom of the lower cover 601 can be discharged from the second drain port 603, reducing the frequency of water replacement in the cylinder 1.

[0036] The inner wall of the cylinder 1 is also equipped with several baffle rods 8 at equal angles, so that the water flow can be blocked to a certain extent during the flow process, thereby generating small vortices to agitate the water flow, so as to achieve the functions of accelerating cleaning and increasing cleaning effect.

[0037] The lower end of the blocking rod 8 is provided with a buffer ring 9 installed inside the cylinder 1, and the outer side of the buffer ring 9 is inclined, which can guide the semiconductor material to move downward to the upper side of the filter screen 11, and at the same time can act as a buffer to prevent the semiconductor material from colliding with the cylinder 1 and being damaged when it sinks downward when stirring stops.

[0038] A limiting ring 10 is provided on the lower side of the upper cover 2, which fits against the inner wall of the blocking rod 8 to position the upper cover 2 and prevent it from moving at will.

[0039] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

Claims

1. A semiconductor material processing cleaning apparatus, characterized by, Include: The upper side of the barrel (1) is provided with an upper cover (2), the lower side of the upper cover (2) is provided with an agitating mechanism (7), the water in the stirring barrel (1) is stirred, and the semiconductor material in the barrel (1) is cleaned; The lower end of the barrel (1) is provided with a bottom turnover mechanism (6), the upper end of the bottom turnover mechanism (6) is provided with a mounting seat (5) at equal angles, the inner side of the mounting seat (5) is rotatably connected with a filter screen (11), the longitudinal section of the filter screen (11) is arc-shaped, and the filter screen (11) is deformable; The bottom turnover mechanism (6) comprises a lower cover (601), the lower cover (601) is detachably connected with the barrel (1) through bolts, the lower end of the lower cover (601) is provided with a pneumatic cylinder (604), and the upper end of the pneumatic cylinder (604) is provided with a pushing plate (605).

2. The semiconductor material processing cleaning apparatus of claim 1, wherein The agitating mechanism (7) comprises a mounting rod (701), the upper end of the mounting rod (701) is fixedly connected with a driving motor (4) mounted on the upper side of the barrel (1), the driving motor (4) drives the mounting rod (701) to rotate, one side of the mounting rod (701) is provided with an agitating frame (702), and the side of the mounting rod (701) away from the agitating frame (702) is provided with an agitating plate (703), the agitating plate (703) is arranged opposite to and staggered with the agitating frame (702), and the width dimension of the agitating plate (703) is greater than that of the agitating frame (702).

3. The semiconductor material processing cleaning apparatus of claim 2, wherein The lower end of the mounting rod (701) is also fixed with a water guide spiral blade (704).

4. The semiconductor material processing cleaning apparatus of claim 2, wherein The lower end of the upper cover (2) is provided with a blocking screen (3) arranged outside the agitating mechanism (7).

5. The semiconductor material processing cleaning apparatus of claim 1, wherein One side of the lower cover (601) is also provided with a first drain port (602), and the lower end of the lower cover (601) is also provided with a second drain port (603) located on one side of the pneumatic cylinder (604).

6. The semiconductor material processing cleaning apparatus of claim 1, wherein The inner wall of the barrel (1) is also provided with a plurality of blocking rods (8) at equal angles.

7. The semiconductor material processing cleaning apparatus of claim 6, wherein The lower end of the blocking rod (8) is provided with a buffer ring (9) mounted in the barrel (1), and the outer side of the buffer ring (9) is inclined.

8. The semiconductor material processing cleaning apparatus of claim 6, wherein The lower side of the upper cover (2) is provided with a limiting ring (10) abutting the inner wall of the blocking rod (8).

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