Film wafer cutting device

Abstract

The utility model discloses a film wafer cutting device which comprises a box body, a fixing frame is fixed to the top of the box body, a left-right adjusting screw rod is rotationally connected to the interior of the fixing frame, and a left-right moving block is connected to the outer side wall of the left-right adjusting screw rod in a threaded mode. And the top of the left-right moving block is slidably connected with the upper surface of the interior of the fixing frame, a left-right adjusting motor is fixed to the right side of the fixing frame, an output shaft of the left-right adjusting motor penetrates through the fixing frame to be fixedly connected with the left-right adjusting screw rod, and a moving frame is fixed to the bottom of the left-right moving block. According to the thin film wafer cutting device, the discharging mechanism is arranged, a thin film wafer is placed in the containing table, a laser head is started to cut the thin film wafer, before cutting is completed, a rotating motor is started, the rotating motor drives the laser head and the containing table to rotate, and the cut wafer located in the containing table falls downwards, so that discharging is completed; simplicity and convenience are realized.

Description

Technical Field

[0001] This utility model relates to the field of wafer cutting technology, specifically a thin film wafer cutting device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon crystal ingot is formed into a silicon wafer, or crystal.

[0003] A search revealed an existing patent (publication number: CN116810185B) that discloses a laser wafer dicing device, including a CNC machine tool. The CNC machine tool has a laser dicing chamber, and the chamber is equipped with a transverse movement mechanism, a longitudinal movement mechanism, a liftable laser emitter, and a wafer fixing platform. The wafer fixing platform includes a gas control ring, a filter device, a multi-axis control component, and a sliding concave folding plate. The gas control ring collects the fumes generated during laser dicing. One side of the gas control ring is connected to a filter device for purifying the fumes, absorbing and purifying the fumes from their source, thereby avoiding pollution problems caused by the fumes spreading. A circular airflow surface is generated in the middle of the gas control ring, which covers the upper surface of the wafer. Thus, when the wafer is diced by laser, the fumes generated are controlled and transferred by the airflow surface, thereby achieving clean laser dicing.

[0004] It can absorb the fumes from laser cutting, but it has its drawbacks. Its wafer fixing platform can only move horizontally, so after the wafers inside are cut, they need to be manually picked out from the front. Because there are many wafers to be cut, manual picking is very time-consuming, which will affect the subsequent wafer cutting and reduce the overall wafer cutting efficiency. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a thin-film wafer dicing device that solves the problems mentioned in the background section.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a thin film wafer dicing device, comprising a housing, a fixed frame fixed to the top of the housing, a left-right adjusting screw rotatably connected inside the fixed frame, a left-right moving block screwed to the outer wall of the left-right adjusting screw, the top of the left-right moving block slidably connected to the inner upper surface of the fixed frame, a left-right adjusting motor fixed to the right side of the fixed frame, the output shaft of the left-right adjusting motor passing through the fixed frame and fixedly connected to the left-right adjusting screw, a moving frame fixed to the bottom of the left-right moving block, a front-back adjusting screw rotatably connected inside the moving frame, a front-back moving block screwed to the outer wall of the front-back adjusting screw, the top of the front-back moving block slidably connected to the inner upper surface of the moving frame;

[0007] A laser head is fixed to the right side of the front and rear moving blocks. A front and rear adjusting motor is fixed to the rear of the moving frame. The output shaft of the front and rear adjusting motor passes through the moving frame and is fixedly connected to the front and rear adjusting screw. A movable slot is provided on the top of the box. A feeding mechanism is provided inside the movable slot. The feeding mechanism includes a rotating plate. Two rotating rods are rotatably connected inside the box. The two rotating rods are fixedly connected to the rotating plate. A placement platform is fixed on the top of the rotating plate. A rotating motor is fixed to the right side of the box. The output shaft of the rotating motor passes through the box and is fixedly connected to the rotating rod on the right side.

[0008] Preferably, the interior of the box is equipped with drawers.

[0009] Preferably, a handle is fixed to the front surface of the drawer.

[0010] Preferably, the placement platform is provided with a clamping mechanism inside, the clamping mechanism including multiple clamping blocks, the placement platform inside...

[0011] Preferably, the outer wall of the clamping block and the inner wall of the sliding hole are slidably connected, a plurality of clamping screws are rotatably connected inside the placement platform, and a threaded hole is opened inside the clamping block, and the threaded hole and the clamping screws are screwed together.

[0012] Preferably, a rotating gear ring is rotatably connected to the outer wall of the placement platform, and a bevel gear is fixed at the end of the clamping screw away from the clamping block, and the bevel gear and the rotating gear ring are meshed together.

[0013] Preferably, a fixed gear ring is fixed to the outer wall of the rotating gear ring, a clamping motor is fixed to the bottom of the rotating plate, the output shaft of the clamping motor passes through the rotating plate, and a spur gear is fixed to the output shaft of the clamping motor through the rotating plate. The spur gear and the fixed gear ring are meshed and connected.

[0014] This invention provides a thin-film wafer dicing apparatus. Compared with the prior art, it has the following advantages:

[0015] 1. This thin film wafer dicing device, by setting up a feeding mechanism, places the thin film wafer inside the placement stage, starts the laser head to cut the thin film wafer, and before the cutting is completed, starts the rotating motor, which rotates the rotating stage and the placement stage. The cut wafer inside the placement stage falls downwards, thus completing the feeding process, which is simple and convenient.

[0016] 2. This thin film wafer dicing device, by setting up a clamping mechanism, starts a clamping motor, which drives a spur gear to rotate, the spur gear drives a fixed gear ring to rotate, the fixed gear ring drives a rotating gear ring to rotate, the rotating gear ring rotates to make a bevel gear rotate, the bevel gear drives a clamping screw to rotate, so that the clamping blocks close and clamp the wafer, preventing the wafer from shifting during dicing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the transfer plate of this utility model;

[0019] Figure 3 This is a bottom view of the transfer plate of this utility model.

[0020] Figure 4 This is a cross-sectional view of the placement platform in this utility model;

[0021] Figure 5 This is a schematic diagram of the clamping block in this utility model;

[0022] Figure 6 This is a schematic diagram of the placement platform in this utility model.

[0023] In the diagram: 1. Left / right adjusting screw; 2. Left / right moving block; 3. Front / back moving block; 4. Front / back adjusting screw; 5. Laser head; 6. Handle; 7. Box body; 8. Drawer; 9. Feeding mechanism; 10. Rotating motor; 11. Fixed frame; 12. Clamping mechanism; 13. Movable slot; 14. Left / right adjusting motor; 15. Moving frame; 16. Front / back adjusting motor; 17. Placement platform; 18. Rotating plate; 19. Clamping motor; 20. Rotating rod; 21. Bevel gear; 22. Clamping block; 23. Fixed gear ring; 24. Clamping screw; 25. Rotating gear ring; 26. Threaded hole; 27. Circular gear; 28. Sliding hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-6 This utility model provides a technical solution: a thin film wafer dicing device, including a housing 7, a fixed frame 11 fixed to the top of the housing 7, a left and right adjusting screw 1 rotatably connected inside the fixed frame 11, a left and right moving block 2 screwed to the outer wall of the left and right adjusting screw 1, the top of the left and right moving block 2 slidably connected to the inner upper surface of the fixed frame 11, a left and right adjusting motor 14 fixed to the right side of the fixed frame 11, the output shaft of the left and right adjusting motor 14 passing through the fixed frame 11 and fixedly connected to the left and right adjusting screw 1, a moving frame 15 fixed to the bottom of the left and right moving block 2, a front and rear adjusting screw 4 rotatably connected inside the moving frame 15, a front and rear moving block 3 screwed to the outer wall of the front and rear adjusting screw 4, the top of the front and rear moving block 3 slidably connected to the inner upper surface of the moving frame 15, and a fixed... A front-to-back adjustment motor 16 is fixed behind the laser head 5 and the moving frame 15. The output shaft of the front-to-back adjustment motor 16 passes through the moving frame 15 and is fixedly connected to the front-to-back adjustment screw 4. The top of the housing 7 has a movable slot 13. The movable slot 13 has a feeding mechanism 9 inside. The feeding mechanism 9 includes a rotating plate 18. Two rotating rods 20 are rotatably connected inside the housing 7. The two rotating rods 20 are fixedly connected to the rotating plate 18. A placement platform 17 is fixed on the top of the rotating plate 18. A rotating motor 10 is fixed on the right side of the housing 7. The output shaft of the rotating motor 10 passes through the housing 7 and is fixedly connected to the right rotating rod 20. This allows the cut wafers to be fed without manual removal. The inside of the housing 7 has a drawer 8 to collect the falling cut wafers. A handle 6 is fixed on the front surface of the drawer 8 for easy removal.

[0026] Furthermore, the placement stage 17 is equipped with a clamping mechanism 12, which includes multiple clamping blocks 22. Multiple sliding holes 28 are formed on the inner sidewall of the placement stage 17. The outer sidewall of the clamping blocks 22 is slidably connected to the inner sidewall of the sliding holes 28. Multiple clamping screws 24 are rotatably connected inside the placement stage 17. Threaded holes 26 are formed inside the clamping blocks 22, and the threaded holes 26 are screwed onto the clamping screws 24. Thus, the clamping blocks 22 close to clamp the wafer. A rotating gear ring 2 is rotatably connected to the outer sidewall of the placement stage 17. 5. A bevel gear 21 is fixed at the end of the clamping screw 24 away from the clamping block 22. The bevel gear 21 is meshed with the rotating gear ring 25, which allows the clamping screw 24 to rotate. A fixed gear ring 23 is fixed on the outer wall of the rotating gear ring 25. A clamping motor 19 is fixed at the bottom of the rotating plate 18. The output shaft of the clamping motor 19 passes through the rotating plate 18. A spur gear 27 is fixed through the output shaft of the clamping motor 19 and passes through the rotating plate 18. The spur gear 27 is meshed with the fixed gear ring 23, which allows the rotating gear ring 25 to rotate.

[0027] During operation, the thin-film wafer is placed inside the placement stage 17. The clamping motor 19 is started, which drives the spur gear 27 to rotate. The spur gear 27 drives the fixed gear ring 23 to rotate, which in turn drives the rotating gear ring 25 to rotate. The rotating gear ring 25 rotates, causing the bevel gear 21 to rotate. The bevel gear 21 drives the clamping screw 24 to rotate, which in turn moves the clamping block 22. This causes the clamping block 22 to close and clamp the wafer, preventing it from shifting during cutting. After the wafer is cut, the rotating motor 10 is started, which drives the rotating plate 18 to rotate. The rotating plate 18 drives the placement stage 17 to rotate, causing the cut wafer inside the placement stage 17 to fall downwards and into the drawer 8. This completes the unloading and collection process, which is simple and convenient.

[0028] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thin-film wafer dicing apparatus, comprising a housing (7), characterized in that: A fixed frame (11) is fixed to the top of the box (7). A left and right adjusting screw (1) is rotatably connected inside the fixed frame (11). A left and right moving block (2) is screwed to the outer wall of the left and right adjusting screw (1). The top of the left and right moving block (2) is slidably connected to the inner upper surface of the fixed frame (11). A left and right adjusting motor (14) is fixed to the right side of the fixed frame (11). The output shaft of the left and right adjusting motor (14) passes through the fixed frame (11) and is fixedly connected to the left and right adjusting screw (1). A moving frame (15) is fixed to the bottom of the left and right moving block (2). A front and rear adjusting screw (4) is rotatably connected inside the moving frame (15). A front and rear moving block (3) is screwed to the outer wall of the front and rear adjusting screw (4). The top of the front and rear moving block (3) is slidably connected to the inner upper surface of the moving frame (15). A laser head (5) is fixed on the right side of the front and rear moving block (3). A front and rear adjusting motor (16) is fixed at the rear of the moving frame (15). The output shaft of the front and rear adjusting motor (16) passes through the moving frame (15) and is fixedly connected to the front and rear adjusting screw (4). A movable slot (13) is opened on the top of the box (7). A feeding mechanism (9) is provided inside the movable slot (13). The feeding mechanism (9) includes a rotating plate (18). Two rotating rods (20) are rotatably connected inside the box (7). The two rotating rods (20) are fixedly connected to the rotating plate (18). A placement platform (17) is fixed on the top of the rotating plate (18). A rotating motor (10) is fixed on the right side of the box (7). The output shaft of the rotating motor (10) passes through the box (7) and is fixedly connected to the rotating rod (20) on the right side.

2. The thin film wafer dicing apparatus according to claim 1, characterized in that: The box (7) has a drawer (8) inside.

3. The thin film wafer dicing apparatus according to claim 2, characterized in that: A handle (6) is fixed to the front surface of the drawer (8).

4. The thin film wafer dicing apparatus according to claim 3, characterized in that: The placement platform (17) is provided with a clamping mechanism (12) inside. The clamping mechanism (12) includes multiple clamping blocks (22). Multiple sliding holes (28) are provided on the inner sidewall of the placement platform (17). The outer sidewall of the clamping block (22) and the inner sidewall of the sliding hole (28) are slidably connected. Multiple clamping screws (24) are rotatably connected inside the placement platform (17). Threaded holes (26) are provided inside the clamping block (22). The threaded holes (26) and the clamping screws (24) are screwed together.

5. A thin film wafer dicing apparatus according to claim 4, characterized in that: The outer wall of the placement platform (17) is rotatably connected to a rotating gear ring (25), and a bevel gear (21) is fixed at one end of the clamping screw (24) away from the clamping block (22). The bevel gear (21) and the rotating gear ring (25) are meshed together.

6. The thin film wafer dicing apparatus according to claim 5, characterized in that: A fixed gear ring (23) is fixed to the outer wall of the rotating gear ring (25), and a clamping motor (19) is fixed to the bottom of the rotating plate (18). The output shaft of the clamping motor (19) passes through the rotating plate (18), and a spur gear (27) is fixed to the output shaft of the clamping motor (19) through the rotating plate (18). The spur gear (27) and the fixed gear ring (23) are meshed together.

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