Semiconductor diamond grinding disc with self-cleaning function

Abstract

The utility model provides a semiconductor diamond grinding disc with a self-cleaning function, and relates to the technical field of diamond grinding discs, the semiconductor diamond grinding disc comprises a diamond grinding disc main body, a mounting box is fixedly mounted at the top of the diamond grinding disc main body, and a storage battery is fixedly mounted on one side of the mounting box; a connecting sleeve is fixedly mounted at the top of the mounting box, and a first rotating shaft is rotationally mounted on the inner wall of the top of the mounting box; after the rotating disc rotates, the limited limiting sliding frame can be driven to move through a plurality of connecting rockers, after the limiting sliding frame moves, a second rotating shaft above the limiting sliding frame can rotate through cooperation of a transmission gear and a rack, and the second rotating shaft can drive a swing frame to turn over after rotating. At the moment, the air pump can be controlled to supply air to the air outlet nozzle through the air transmission hose, and the air outlet nozzle can achieve self-cleaning on the outer surface of the diamond grinding disc body through high-pressure air.

Description

Technical Field

[0001] This utility model relates to the field of diamond grinding disc technology, and in particular to a semiconductor diamond grinding disc with self-cleaning function. Background Technology

[0002] Grinding is a crucial step in semiconductor processing, aiming to precisely machine the surface of semiconductor materials to meet the stringent requirements for surface flatness and smoothness in chip manufacturing and other processes. However, existing semiconductor diamond grinding discs present numerous problems in practical use.

[0003] Traditional grinding discs generate a large amount of grinding debris during the grinding process. This debris easily adheres to the surface of the grinding disc and the semiconductor material. If it is not removed in time, it will not only affect the grinding effect of the grinding disc, leading to increased surface roughness and reduced grinding precision, but may also embed into the surface of the semiconductor material, causing scratches and damage, and affecting the quality of semiconductor products. Currently, most methods for cleaning grinding debris rely on manual labor or external cleaning equipment, which are cumbersome and inefficient. This leads to a shortened lifespan of the grinding disc and increases production costs. Therefore, we propose a semiconductor diamond grinding disc with a self-cleaning function. Utility Model Content

[0004] In view of this, this application provides a semiconductor diamond grinding disc with self-cleaning function, which solves the above technical problems to a certain extent.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor diamond grinding disc with self-cleaning function includes a diamond grinding disc body, an installation box fixedly installed on the top of the diamond grinding disc body, a battery fixedly installed on one side of the installation box, a connecting sleeve fixedly installed on the top of the installation box, and a first rotating shaft rotatably installed on the inner wall of the top of the installation box.

[0007] A turntable is fixedly installed at the bottom of the first rotating shaft, and multiple connecting rockers are rotatably installed at the bottom of the turntable. Multiple limiting sliding frames are slidably installed on the inner side of the mounting box. One end of the connecting rocker is rotatably installed on one side of the limiting sliding frame. A fixing frame is fixedly installed on one side of the limiting sliding frame. A second rotating shaft is rotatably installed on the inner side of the fixing frame. A swing frame is fixedly installed on the outer side of the second rotating shaft. An air nozzle is fixedly installed on one side of the swing frame.

[0008] Preferably, an air pump is fixedly installed on the bottom inner wall of the mounting box, and a gas transmission hose is fixedly installed at the output end of the air pump. The output end of the gas transmission hose is fixedly installed on one side of the swing frame.

[0009] Preferably, a gas flow groove is provided on the inner side of the swing frame, the gas outlet nozzle is connected to the gas flow groove, and the output end of the gas transmission hose is fixedly installed on the inner side of the gas connection groove.

[0010] Preferably, a transmission gear is fixedly installed on the outer side of the second rotating shaft, and a rack is fixedly installed on one side of the mounting box, wherein the transmission gear meshes with an adjacent rack.

[0011] Preferably, a motor is fixedly installed on one side of the mounting box, a worm is fixedly installed at the output end of the motor, and a worm wheel is fixedly installed on the outer side of the first rotating shaft, with the worm and the worm wheel meshing together.

[0012] Preferably, the outer side of the mounting box is provided with multiple limiting grooves, and the limiting sliding frame is slidably installed on the inner side of the limiting grooves.

[0013] Preferably, the motor and air pump are electrically connected to the battery.

[0014] Preferably, the diamond grinding disc body includes a nano-diamond coating, an electrostatic adsorption layer, a micron-sized diamond abrasive layer, and an aluminum alloy base layer. The electrostatic adsorption layer is fixedly connected to one side of the nano-diamond coating, the micron-sized diamond abrasive layer is fixedly connected to one side of the electrostatic adsorption layer, and the aluminum alloy base layer is fixedly connected to one side of the micron-sized diamond abrasive layer.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] (1) A semiconductor diamond grinding disc with self-cleaning function of the present invention, after the turntable rotates, it can drive the limited sliding frame to move through multiple connecting rockers. After the limited sliding frame moves, the second rotating shaft above it can rotate through the cooperation of transmission gear and rack. After the second rotating shaft rotates, it can drive the swing frame to flip. At this time, the air pump can be controlled to supply air to the air nozzle through the gas transmission hose. The air nozzle can achieve self-cleaning of the outer surface of the diamond grinding disc body through high pressure gas.

[0017] (2) The present invention provides a semiconductor diamond grinding disc with self-cleaning function. The aluminum alloy base is made of high-strength aluminum alloy material. The aluminum alloy has the characteristics of light weight, high strength and good thermal conductivity, which can provide stable support for the outer structure and effectively transfer the heat generated during the grinding process to prevent the diamond grinding disc body from being damaged due to overheating. It can improve the overall rigidity and service life of the diamond grinding disc body. The base surface is specially treated and has good adhesion to each outer layer, ensuring that each layer structure is tightly combined and works together.

[0018] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of a semiconductor diamond grinding disc with self-cleaning function proposed in this utility model;

[0020] Figure 2 This diagram shows a three-dimensional view of the bottom section of a semiconductor diamond grinding disc with self-cleaning function according to an embodiment of this application.

[0021] Figure 3 A schematic diagram showing a three-dimensional view of the exploded portion structure of a semiconductor diamond grinding disc with self-cleaning function according to an embodiment of this application is provided;

[0022] Figure 4 This is a schematic diagram of a three-dimensional view of a partial structure of a semiconductor diamond grinding disc with self-cleaning function according to an embodiment of this application.

[0023] Figure label:

[0024] 1. Diamond grinding disc body; 2. Mounting box; 3. Battery; 4. Connecting sleeve; 5. First rotating shaft; 6. Turntable; 7. Limiting sliding frame; 8. Connecting rocker arm; 9. Fixing frame; 10. Second rotating shaft; 11. Swing frame; 12. Air pump; 13. Gas transmission hose; 14. Air nozzle; 15. Transmission gear; 16. Rack; 17. Motor; 18. Worm gear; 19. Worm wheel; 20. Nano diamond coating; 21. Electrostatic adsorption layer; 22. Micron diamond abrasive layer; 23. Aluminum alloy base layer. Detailed Implementation

[0025] To further understand the invention content, features and effects of this utility model, the following embodiments are provided, and detailed descriptions are given below in conjunction with the accompanying drawings;

[0026] The structure of this utility model will now be described in detail with reference to the accompanying drawings.

[0027] refer to Figure 1-4 A semiconductor diamond grinding disc with self-cleaning function includes a diamond grinding disc body 1, an installation box 2 fixedly installed on the top of the diamond grinding disc body 1, a battery 3 fixedly installed on one side of the installation box 2, a connecting sleeve 4 fixedly installed on the top of the installation box 2, and a first rotating shaft 5 rotatably installed on the inner wall of the top of the installation box 2.

[0028] A turntable 6 is fixedly installed at the bottom of the first rotating shaft 5. Multiple connecting rockers 8 are rotatably installed at the bottom of the turntable 6. Multiple limiting sliding frames 7 are slidably installed inside the mounting box 2. One end of the connecting rocker 8 is rotatably installed on one side of the limiting sliding frame 7. A fixing frame 9 is fixedly installed on one side of the limiting sliding frame 7. A second rotating shaft 10 is rotatably installed inside the fixing frame 9. A swing frame 11 is fixedly installed on the outside of the second rotating shaft 10. An air nozzle 14 is fixedly installed on one side of the swing frame 11.

[0029] In this embodiment, an air pump 12 is fixedly installed on the bottom inner wall of the mounting box 2, and a gas transmission hose 13 is fixedly installed at the output end of the air pump 12. The output end of the gas transmission hose 13 is fixedly installed on one side of the swing frame 11.

[0030] In this embodiment, a gas flow groove is provided on the inner side of the swing frame 11, the gas nozzle 14 is connected to the gas flow groove, and the output end of the gas transmission hose 13 is fixedly installed on the inner side of the gas connection groove.

[0031] In this embodiment, a transmission gear 15 is fixedly installed on the outer side of the second rotating shaft 10, and a rack 16 is fixedly installed on one side of the mounting box 2. The transmission gear 15 and the adjacent rack 16 mesh with each other. After the limiting sliding frame 7 moves, it can make the second rotating shaft 10 above it rotate through the cooperation of the transmission gear 15 and the rack 16. After the second rotating shaft 10 rotates, it can drive the swing frame 11 to flip. At this time, the air pump 12 can be controlled to supply air to the air nozzle 14 through the gas transmission hose 13. The air nozzle 14 can achieve self-cleaning of the outer surface of the diamond grinding disc body 1 through high-pressure gas.

[0032] In this embodiment, a motor 17 is fixedly installed on one side of the mounting box 2, a worm gear 18 is fixedly installed at the output end of the motor 17, and a worm wheel 19 is fixedly installed on the outer side of the first rotating shaft 5. The worm gear 18 and the worm wheel 19 mesh with each other. After the diamond grinding disc body 1 is ground, the motor 17 can be controlled to drive the worm gear 18 to rotate. The worm gear 18 can drive the first rotating shaft 5 and the turntable 6 to rotate through the worm wheel 19. After the turntable 6 rotates, it can drive the limited sliding frame 7 to move through multiple connecting rockers 8.

[0033] In this embodiment, multiple limiting grooves are provided on the outer side of the mounting box 2, and the limiting sliding frame 7 is slidably installed on the inner side of the limiting groove. Since the limiting sliding frame 7 is limited by the limiting groove, the limiting sliding frame 7 can only slide on the inner side of the limiting groove after being subjected to force, which allows the limiting sliding frame 7 to drive the air nozzle 14 to move. The air nozzle 14 can perform self-cleaning on the diamond grinding disc body 1.

[0034] In this embodiment, the motor 17 and the air pump 12 are electrically connected to the battery 3; the battery 3 can supply power to the motor 17 and the air pump 12. Since the diamond grinding disc body 1 needs to be rotated for grinding, the device does not need to be connected to an additional cable, thus preventing the cable from getting tangled.

[0035] In this embodiment, the diamond grinding disc body 1 includes a nano-diamond coating 20, an electrostatic adsorption layer 21, a micron-sized diamond abrasive layer 22, and an aluminum alloy base layer 23. The electrostatic adsorption layer 21 is fixedly connected to one side of the nano-diamond coating 20, the micron-sized diamond abrasive layer 22 is fixedly connected to one side of the electrostatic adsorption layer 21, and the aluminum alloy base layer 23 is fixedly connected to one side of the micron-sized diamond abrasive layer 22. The nano-diamond coating 20 is deposited on the surface of the diamond grinding disc body 1 using chemical vapor deposition technology. Nano-diamonds have extremely high hardness and wear resistance, and their hardness can reach several times that of natural diamonds. The grain size of the nano-diamond coating is at the nanometer level, making the coating surface smoother and effectively improving the grinding efficiency and surface quality of the grinding disc. During the grinding process, the nano-diamond coating can quickly cut semiconductor materials while reducing damage to the material surface and lowering surface roughness.

[0036] Specifically, after the diamond grinding disc body 1 is ground, the motor 17 can be controlled to drive the worm gear 18 to rotate. The worm gear 18 can drive the first rotating shaft 5 and the turntable 6 to rotate through the worm wheel 19. After the turntable 6 rotates, it can drive the limited sliding frame 7 to move through multiple connecting rockers 8. After the limited sliding frame 7 moves, it can cause the second rotating shaft 10 above it to rotate through the cooperation of the transmission gear 15 and the rack 16. After the second rotating shaft 10 rotates, it can drive the swing frame 11 to flip. At this time, the air pump 12 can be controlled to supply air to the air nozzle 14 through the gas transmission hose 13. The air nozzle 14 can achieve self-cleaning of the outer surface of the diamond grinding disc body 1 through high-pressure gas. After cleaning, the motor 17 can be controlled to rotate in the opposite direction, so that the second rotating shaft 10 can return to the initial position through the cooperation of the transmission gear 15 and the rack 16, so that the diamond grinding disc body 1 will not swing the frame 11 and the air nozzle 14 will not cause interference during the grinding process.

[0037] The nano-diamond coating 20 is deposited on the surface of the diamond grinding disc body 1 using chemical vapor deposition technology. Nano-diamond has extremely high hardness and wear resistance, and its hardness can be several times that of natural diamond. The grain size of the nano-diamond coating is at the nanometer level, which makes the coating surface smoother and can effectively improve the grinding efficiency and surface quality of the grinding disc. During the grinding process, the nano-diamond coating can quickly cut semiconductor materials while reducing damage to the material surface and reducing surface roughness.

[0038] An electrostatic adsorption layer 21 is provided inside the nano-diamond coating. The electrostatic adsorption layer 21 is made of a special polymer material with good insulation properties and electrostatic generation characteristics. During the grinding process, the electrostatic adsorption layer 21 generates static electricity due to the friction between the grinding disc and the semiconductor material. The static electricity can adsorb the debris generated during the grinding process, quickly adsorbing the debris onto the surface of the grinding disc, preventing the debris from flying around in the grinding area or re-adhering to the surface of the semiconductor material.

[0039] A micron-sized diamond abrasive layer 22 is disposed inside the electrostatic adsorption layer 21. The micron-sized diamond abrasive has a moderate particle size, which can provide strong grinding force. The micron-sized diamond abrasive is uniformly fixed on the base layer of the grinding disc by a special binder, forming a dense abrasive layer. During the grinding process, the micron-sized diamond abrasive is in full contact with the surface of the semiconductor material, and the material is ground. Due to the high hardness and good wear resistance of the micron-sized diamond abrasive, the grinding performance of the grinding disc is stable during long-term use, effectively extending the service life of the grinding disc.

[0040] The aluminum alloy base layer 23 is made of high-strength aluminum alloy material. Aluminum alloy has the characteristics of light weight, high strength and good thermal conductivity, which can provide stable support for the outer structure and effectively transfer the heat generated during the grinding process, preventing the diamond grinding disc body 1 from being damaged due to overheating. It can improve the overall rigidity and service life of the diamond grinding disc body 1. The surface of the base layer is specially treated and has good adhesion to the outer layers, ensuring that the structure of each layer is tightly combined and works together.

[0041] It should be noted that although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor diamond polishing disc having a self-cleaning function, characterized by comprising: a diamond layer; a semiconductor layer; and a semiconductor diamond junction layer between the diamond layer and the semiconductor layer. Include: Diamond grinding disc body (1), the top of diamond grinding disc body (1) is fixedly installed with installation box (2), one side of installation box (2) is fixedly installed with battery (3), the top of installation box (2) is fixedly installed with connecting sleeve (4), the inner wall of the top of installation box (2) is rotatably installed with first rotating shaft (5); The bottom of first rotating shaft (5) is fixedly installed with rotating disc (6), a plurality of connecting rocker arms (8) are rotatably installed at the bottom of rotating disc (6), a plurality of limiting sliding frames (7) are slidably installed on the inner side of installation box (2), one end of connecting rocker arm (8) is rotatably installed on one side of limiting sliding frame (7), one side of limiting sliding frame (7) is fixedly installed with fixed frame (9), the inner side of fixed frame (9) is rotatably installed with second rotating shaft (10), the outer side of second rotating shaft (10) is fixedly installed with swing frame (11), one side of swing frame (11) is fixedly installed with air outlet nozzle (14).

2. The semiconductor diamond grinding disc with self-cleaning function according to claim 1, characterized in that, The bottom inner wall of installation box (2) is fixedly installed with air pump (12), the output end of air pump (12) is fixedly installed with gas transmission hose (13), the output end of gas transmission hose (13) is fixedly installed on one side of swing frame (11).

3. The semiconductor diamond grinding disc with self-cleaning function according to claim 2, characterized in that, The inner side of swing frame (11) is provided with gas flow channel, the air outlet nozzle (14) is communicated with the gas flow channel, and the output end of the gas transmission hose (13) is fixedly installed in the gas connection groove.

4. The semiconductor diamond grinding disc with self-cleaning function according to claim 1, characterized in that, The outer side of second rotating shaft (10) is fixedly installed with transmission gear (15), one side of installation box (2) is fixedly installed with rack (16), transmission gear (15) and adjacent rack (16) are engaged.

5. The semiconductor diamond grinding disc with self-cleaning function according to claim 1, characterized in that, One side of installation box (2) is fixedly installed with motor (17), the output end of motor (17) is fixedly installed with worm (18), the outer side of first rotating shaft (5) is fixedly installed with worm wheel (19), and worm (18) and worm wheel (19) are engaged.

6. The semiconductor diamond grinding disc with self-cleaning function according to claim 1, characterized in that, The outer side of installation box (2) is provided with a plurality of limiting sliding grooves, and the limiting sliding frame (7) is slidably installed in the limiting sliding groove.

7. The semiconductor diamond grinding disc with self-cleaning function according to claim 5, characterized in that, The motor (17) and air pump (12) are electrically connected with the battery (3).

8. The semiconductor diamond grinding disc with self-cleaning function according to claim 1, characterized in that, The diamond grinding disc body (1) comprises a nano diamond coating (20), an electrostatic adsorption layer (21), a micron diamond abrasive layer (22) and an aluminum alloy base layer (23), the electrostatic adsorption layer (21) is fixedly connected on one side of the nano diamond coating (20), the micron diamond abrasive layer (22) is fixedly connected on one side of the electrostatic adsorption layer (21), and the aluminum alloy base layer (23) is fixedly connected on one side of the micron diamond abrasive layer (22).

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