Micro-etching liquid treatment equipment convenient for copper recovery

By designing automated copper recycling equipment, using a cylinder-driven lifting plate and an electric guide rail system, the automatic extraction and recycling of copper frames is achieved, solving the problem of copper separation in traditional electrolysis methods, improving copper recovery rate and extending equipment life.

CN223921588UActive Publication Date: 2026-02-17野运平
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Patent Information

Application Number
CN202422690590.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-05
Publication Date
2026-02-17
Estimated Expiration
2034-11-05

AI Technical Summary

Technical Problem

In the traditional electrolysis process for copper recovery, the precipitated copper is difficult to separate efficiently, resulting in low copper recovery rate and easy damage to electrolytic rods. Existing equipment is cumbersome to operate and inefficient.

Method used

Design a micro-etching solution treatment device for easy copper recycling. It adopts a cylinder-driven lifting plate and electric guide rail system to realize the automated precipitation and recycling of copper frame. Copper is precipitated on the copper frame through electrolysis and automatically collected.

Benefits of technology

It improves copper recovery rate, simplifies operation process, reduces damage to electrolytic rods, and extends equipment lifespan and efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of treatment equipment, in particular to micro-etching liquid treatment equipment convenient for copper recovery, which comprises an electrolytic tank, the side surface of the electrolytic tank is fixedly connected with an extension frame, and the front side and the rear side of the electrolytic tank are fixedly provided with electric guide rails through bolts. The device has the advantages that the power supply equipment is started to supply power to the anode bar and the cathode plate, at the moment, reduction reaction can occur on the outer surface of the copper frame, copper can be separated out on the copper frame, and after more metal copper is accumulated on the copper frame, the air cylinder is started to drive the lifting plate to move upwards until the copper frame ascends to a proper height; the support is conveyed to the position above the extension frame through the electric guide rail, at the moment, the collecting box can collect micro-etching liquid dripping on the copper frame, bolts for locking the copper frame are detached, the copper frame can be recycled, the copper frame and separated copper can be recycled, manual cleaning through physical means is not needed, and the cost is reduced. And the copper recovery rate can be improved.
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Description

Technical Field

[0001] This utility model relates to the field of processing equipment technology, and in particular to a micro-etching solution processing device that facilitates copper recovery. Background Technology

[0002] In the production of printed circuit boards (PCBs), micro-etching is an indispensable step. It is used to remove unwanted copper layers from copper foil to form the desired circuit patterns. However, this process generates a large amount of copper-containing waste liquid. This waste liquid not only contains high concentrations of copper but may also contain other harmful chemicals, posing a potential threat to the environment and human health.

[0003] Electrolysis is a widely used traditional method for treating copper-containing wastewater due to its mature technology and simple operation. Electrolysis uses an electric current to reduce copper ions in the wastewater at the cathode, thus precipitating elemental copper. However, during electrolysis, the precipitated copper adheres tightly to the electrolytic rod at the cathode, forming a thick copper layer. Although electrolysis can effectively recover copper, separating the precipitated copper from the cathode electrolytic rod is a rather tedious and time-consuming process in practice. Traditional separation methods usually require manual cleaning using physical means (such as scrapers and brushes), which is not only inefficient but also easily damages the electrolytic rod, reducing its lifespan. Furthermore, because the copper layer on the electrolytic rod is unevenly distributed, manual cleaning is often incomplete, resulting in low copper recovery rates. Therefore, a micro-etching solution treatment device that facilitates copper recovery is needed to solve these problems. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to provide a micro-etching solution treatment device that facilitates copper recovery, so as to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides a micro-etching solution treatment device for easy copper recovery, comprising an electrolytic cell, an extension frame fixedly connected to the side of the electrolytic cell, electric guide rails fixedly installed on both the front and rear sides of the electrolytic cell by bolts, a bracket fixedly connected to the output ends of the two electric guide rails, a cylinder fixedly connected to the top of the bracket, a lifting plate fixedly connected to the output end of the cylinder, a cathode plate fixedly connected to the bottom surface of the lifting plate, a copper frame slidably connected to the outer surface of the cathode plate, the top of the copper frame fixedly connected to the lifting plate by bolts, a power supply device fixedly connected to the front of the electrolytic cell, an anode rod fixedly connected to the inner wall of the electrolytic cell, and the anode rod and cathode plate connected to the positive and negative terminals of the power supply device respectively by wires.

[0007] Preferably, in any of the above embodiments, a partition is fixedly connected to the inner wall of the electrolytic cell, and the anode rod and cathode plate are located on both sides of the partition.

[0008] Preferably, in any of the above embodiments, a support plate is fixedly connected to the side of the electrolytic cell, an assembly frame is fixedly connected to the top surface of the support plate, and a collection box is slidably connected to the inner wall of the assembly frame, the collection box corresponding to the extension frame.

[0009] Preferably, in any of the above embodiments, the top surface of the support plate is fixedly connected to two connecting rods, the assembly frame is located between the two connecting rods, and the top of the connecting rods is fixedly connected to the electrolytic cell.

[0010] Preferably, in any of the above embodiments, the cathode plate is located inside the electrolytic cell, and the top surface of the copper frame is in contact with the bottom surface of the lifting plate.

[0011] Preferably, in any of the above solutions, a guide rod is fixedly connected to the top surface of the lifting plate, and the guide rod is slidably connected to the bracket.

[0012] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0013] When micro-etching solution processing is required, an appropriate amount of micro-etching solution can be injected into the electrolytic cell. Then, the cylinder is activated to move the lifting plate downwards until the copper frame is submerged in the micro-etching solution. At this time, the power supply equipment is turned on to supply power to the anode rod and cathode plate. A reduction reaction will occur on the outer surface of the copper frame, causing copper to precipitate on the copper frame. After a large amount of metallic copper has accumulated on the copper frame, the cylinder is activated to move the lifting plate upwards until the copper frame rises to a suitable height. Then, the bracket is transported to the top of the extension frame via an electric guide rail. At this time, the collection box can collect the micro-etching solution dripping from the copper frame and the bolts locking the copper frame can be removed, realizing the recycling of the copper frame. The copper frame and the precipitated copper can be recycled together without the need for manual cleaning by physical means, which can improve the copper recovery rate. Attached Figure Description

[0014] Figure 1 This is a first-view structural diagram of the assembly of this utility model;

[0015] Figure 2 This is a second-view structural diagram of the assembly of this utility model;

[0016] Figure 3 This is a third-view structural diagram of the assembly of this utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the electrolytic cell of this utility model.

[0018] In the diagram: 1-Electrolytic cell, 2-Extension frame, 3-Electric guide rail, 4-Bracket, 5-Cylinder, 6-Lifting plate, 7-Cathode plate, 8-Copper frame, 9-Power supply equipment, 10-Anode rod, 11-Baffle, 12-Support plate, 13-Assembly frame, 14-Collection box, 15-Connecting rod, 16-Guide rod. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0020] like Figures 1 to 4 As shown, a micro-etching solution treatment device for easy copper recovery includes an electrolytic cell 1. An extension frame 2 is fixedly connected to the side of the electrolytic cell 1. Electric guide rails 3 are fixedly installed on both the front and rear sides of the electrolytic cell 1 by bolts. A bracket 4 is fixedly connected to the output end of the two electric guide rails 3. A cylinder 5 is fixedly connected to the top of the bracket 4. A lifting plate 6 is fixedly connected to the output end of the cylinder 5. A cathode plate 7 is fixedly connected to the bottom surface of the lifting plate 6. A copper frame 8 is slidably connected to the outer surface of the cathode plate 7. The top of the copper frame 8 is fixedly connected to the lifting plate 6 by bolts. A power supply device 9 is fixedly connected to the front of the electrolytic cell 1. An anode rod 10 is fixedly connected to the inner wall of the electrolytic cell 1. The anode rod 10 and the cathode plate 7 are connected to the positive and negative terminals of the power supply device 9 by wires, respectively.

[0021] As an optional technical solution of this utility model, the inner wall of the electrolytic cell 1 is fixedly connected with a partition 11, and the anode rod 10 and the cathode plate are located on both sides of the partition 11 respectively. When the power supply device 9 is turned on, power is supplied to the anode rod 10 and the cathode plate 7. At this time, a reduction reaction will occur on the outer surface of the copper frame 8, which can cause copper to be deposited on the copper frame 8.

[0022] As an optional technical solution of this utility model, a support plate 12 is fixedly connected to the side of the electrolytic cell 1, an assembly frame 13 is fixedly connected to the top surface of the support plate 12, and a collection box 14 is slidably connected to the inner wall of the assembly frame 13. The collection box 14 corresponds to the extension frame 2, and the bracket 4 is transported to the top of the extension frame 2 by the electric guide rail 3. At this time, the collection box 14 can collect the micro-etching liquid dripping from the copper frame 8.

[0023] As an optional technical solution of this utility model, the top surface of the support plate 12 is fixedly connected to two connecting rods 15, the assembly frame 13 is located between the two connecting rods 15, the top of the connecting rods 15 is fixedly connected to the electrolytic cell 1, and the setting of the connecting rods 15 can improve the stability of the support plate 12.

[0024] As an optional technical solution of this utility model, the cathode plate 7 is located inside the electrolytic cell 1, the top surface of the copper frame 8 is attached to the bottom surface of the lifting plate 6, and the bolts locking the copper frame 8 are removed, so that the copper frame 8 can be recycled, and the copper frame 8 and the precipitated copper can be recycled together.

[0025] As an optional technical solution of this utility model, a guide rod 16 is fixedly connected to the top surface of the lifting plate 6. The guide rod 16 is slidably connected to the bracket 4, and the guide rod 16 can limit the lifting of the lifting plate 6.

[0026] A micro-etching solution treatment device for easy copper recovery works on the following principle:

[0027] 1) When micro-etching solution treatment is required, an appropriate amount of micro-etching solution can be injected into the electrolytic cell 1. Then, the cylinder 5 is turned on to drive the lifting plate 6 downward until the copper frame 8 is submerged in the micro-etching solution.

[0028] 2): Power supply equipment 9 is turned on to supply power to anode rod 10 and cathode plate 7. At this time, a reduction reaction will occur on the outer surface of copper frame 8, which can cause copper to precipitate on copper frame 8.

[0029] 3): After a significant amount of copper metal has accumulated on the copper frame 8, the cylinder 5 is activated to drive the lifting plate 6 upwards until the copper frame 8 reaches a suitable height. Then, the bracket 4 is transported to the top of the extension frame 2 via the electric guide rail 3, and the bolts locking the copper frame 8 are removed, allowing the copper frame 8 to be recycled.

[0030] In summary, this micro-etching solution treatment equipment for easy copper recovery allows for the following steps: When micro-etching solution treatment is required, an appropriate amount of micro-etching solution is injected into the electrolytic cell 1. Then, the cylinder 5 is activated to move the lifting plate 6 downwards until the copper frame 8 is submerged in the micro-etching solution. At this point, the power supply device 9 supplies power to the anode rod 10 and the cathode plate 7. A reduction reaction occurs on the outer surface of the copper frame 8, causing copper to precipitate on the copper frame 8. Once a significant amount of metallic copper has accumulated on the copper frame 8, the cylinder 5 is activated to move the lifting plate 6 upwards until the copper frame 8 reaches a suitable height. Then, the support 4 is transported to the top of the extension frame 2 via the electric guide rail 3. At this point, the collection box 14 collects the micro-etching solution dripping from the copper frame 8 and removes the bolts locking the copper frame 8, enabling the recovery of the copper frame 8. The copper frame 8 and the precipitated copper can be recovered together without the need for manual cleaning using physical means, thus improving the copper recovery rate.

Claims

1. A micro-etching solution treatment device for easy copper recovery, characterized in that: The electrolytic cell (1) is provided with an extension frame (2) fixedly connected to its side. Electric guide rails (3) are fixedly installed on both the front and rear sides of the electrolytic cell (1) by bolts. A bracket (4) is fixedly connected to the output end of the two electric guide rails (3). A cylinder (5) is fixedly connected to the top of the bracket (4). A lifting plate (6) is fixedly connected to the output end of the cylinder (5). A cathode plate (7) is fixedly connected to the bottom surface of the lifting plate (6). A copper frame (8) is slidably connected to the outer surface of the cathode plate (7). The top of the copper frame (8) is fixedly connected to the lifting plate (6) by bolts. A power supply device (9) is fixedly connected to the front of the electrolytic cell (1). An anode rod (10) is fixedly connected to the inner wall of the electrolytic cell (1). The anode rod (10) and the cathode plate (7) are connected to the positive and negative terminals of the power supply device (9) by wires, respectively.

2. The micro-etching solution treatment equipment for easy copper recovery according to claim 1, characterized in that: The inner wall of the electrolytic cell (1) is fixedly connected to a partition (11), and the anode rod (10) and cathode plate are located on both sides of the partition (11).

3. The micro-etching solution treatment equipment for easy copper recovery according to claim 2, characterized in that: A support plate (12) is fixedly connected to the side of the electrolytic cell (1), and an assembly frame (13) is fixedly connected to the top surface of the support plate (12). A collection box (14) is slidably connected to the inner wall of the assembly frame (13), and the collection box (14) corresponds to the extension frame (2).

4. The micro-etching solution treatment equipment for easy copper recovery according to claim 3, characterized in that: The top surface of the support plate (12) is fixedly connected to two connecting rods (15), the assembly frame (13) is located between the two connecting rods (15), and the top of the connecting rods (15) is fixedly connected to the electrolytic cell (1).

5. The micro-etching solution treatment equipment for easy copper recovery according to claim 4, characterized in that: The cathode plate (7) is located inside the electrolytic cell (1), and the top surface of the copper frame (8) is in contact with the bottom surface of the lifting plate (6).

6. The micro-etching solution treatment equipment for easy copper recovery according to claim 5, characterized in that: The top surface of the lifting plate (6) is fixedly connected to a guide rod (16), and the guide rod (16) is slidably connected to the bracket (4).