Bonding device of Dewar supporting structure

Abstract

The utility model relates to a bonding device of a Dewar support structure, which comprises a circular truncated cone, an annular structure is arranged on the periphery of the bottom of the circular truncated cone, the annular structure is used for being matched with a lead ring of the Dewar support structure so as to limit the lead ring, and a sleeve coaxial with the circular truncated cone is arranged on the circular truncated cone. The sleeve penetrates through the circular truncated cone in the axial direction, a plurality of bonding grooves are formed in the sleeve, the circular truncated cone and the annular structure in the respective circumferential direction, and the bonding grooves are used for containing the Dewar supporting structure in the bonding process and limiting the bonding position of the Dewar supporting structure. By designing the bonding groove, the placement range of the supporting structure is limited, deviation of the bonding position is avoided, and therefore the possibility of repeated bonding operation is achieved, and rapid bonding of the supporting structure is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of dewar, especially to a kind of bonding device of dewar support structure. BACKGROUND

[0002] Thin-wall cold finger is the weak link of mechanics in infrared detector assembly, to improve the ability of assembly to adapt to mechanical environment, the cold finger structure needs to be reinforced design. The existing bonding method of dewar support structure is to install dewar cold finger on the profile projector measurement workbench, measure the center of cold finger, adjust the angle knob of projector, make the crosshair of profile projector display screen 45° distribution, after smearing adhesive on both ends of dewar support structure, use tweezers to bond one end of dewar support structure along the crosshair direction of display screen with cold finger, and the other end with lead ring.

[0003] When bonding, the cold finger end and the lead ring bonding place are not in the same plane, so there may be a large deviation in the bonding process, which requires repeated bonding operation, so a kind of bonding device of dewar support structure is proposed. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of bonding device of dewar support structure, to solve at least one technical problem described above.

[0005] The utility model provides a kind of bonding device of dewar support structure, including circular table, the bottom outer periphery of the circular table is equipped with annular structure, the annular structure is used to cooperate with the lead ring of the dewar support structure to limit the lead ring, sleeve is equipped on the circular table with the coaxial line of the circular table, the sleeve is along the axial direction and penetrates the circular table, sleeve, the circular table and the annular structure are all along the respective circumference and are equipped with multiple bonding grooves, the bonding groove is used to place dewar support structure in bonding process, and the bonding position of dewar support structure is limited.

[0006] In one embodiment, the bonding groove includes limiting groove, first connecting groove and second connecting groove, the limiting groove is equidistantly arranged along the circumference of the circular table, the first connecting groove is equidistantly arranged along the circumference of the sleeve, and the second connecting groove is equidistantly arranged along the circumference of the annular structure, one end of the limiting groove is communicated with the first connecting groove, and the other end is communicated with the second connecting groove, and the first connecting groove and the second connecting groove are respectively the opening in the side wall of the sleeve and the opening on the annular structure.

[0007] In one embodiment, the radial cross section of the ring structure is L-shaped, the ring structure comprises a ring-shaped bottom and a ring-shaped outer wall, the outer periphery of the ring-shaped bottom is connected with the bottom of the ring-shaped outer wall, the ring-shaped bottom is arranged around the outer diameter of the bottom of the circular truncated cone, and the top outer periphery of the ring-shaped outer wall is provided with an abutting ring.

[0008] In one embodiment, the height of the sleeve is higher than the height of the ring structure.

[0009] In one embodiment, the outer diameter of the ring-shaped outer wall of the ring structure is consistent with the inner diameter of the lead wire ring.

[0010] In one embodiment, the bottom of the abutting ring is provided with a groove, and the diameter of the groove is consistent with the diameter of the lead wire ring.

[0011] In one embodiment, the number of limiting grooves is consistent with the number of bonding positions on the lead wire ring.

[0012] In one embodiment, the inner diameter of the sleeve is greater than or equal to the outer diameter of the cold finger of the Dewar support structure.

[0013] In one embodiment, the height of the circular truncated cone is less than or equal to the height of the ring structure.

[0014] In one embodiment, the height of the ring structure is less than or equal to the height of the lead wire ring.

[0015] Compared with the prior art, the adhesive device has the advantages that the adhesive device with the bonding groove is designed, the Dewar support structure is limited in the placement range through the bonding groove, deviation of the bonding position is avoided, repeated bonding operation is possible, and rapid bonding of the Dewar support structure is realized. BRIEF DESCRIPTION OF DRAWINGS

[0016] Hereinafter, the utility model will be described in more detail based on the embodiments and with reference to the drawings.

[0017] Figure 1 is a structure schematic view of the adhesive device of the utility model;

[0018] Figure 2 is a schematic view of the Dewar support structure after bonding of the utility model;

[0019] Reference signs:

[0020] 1, circular truncated cone; 2, ring structure; 3, bonding groove; 31, limiting groove; 32, first connecting groove; 33, second connecting groove; 4, sleeve; 5, abutting ring; 6, cold finger; 7, lead wire ring; 8, Dewar support structure. DETAILED DESCRIPTION

[0021] The utility model will be further described below with reference to the drawings.

[0022] Please refer to Figure 1 With Figure 2 The utility model provides a kind of bonding device of dewar support structure, including circular table 1, the bottom outer periphery of circular table 1 is equipped with annular structure 2, annular structure 2 is used to cooperate with the lead ring 7 of dewar support structure to limit lead ring, circular table 1 is equipped with sleeve 4 with the coaxial line of circular table 1, and sleeve 4 is along axial and penetrates circular table 1, sleeve 4, circular table 1 and annular structure 2 are all along the circumferential direction of each even and are equipped with multiple bonding grooves 3, bonding groove 3 is used to place dewar support structure 8 in bonding process, and the bonding position of dewar support structure 8 is limited. The number of bonding groove 3 is consistent with the number of dewar support structure 8 to be bonded. In the embodiment, bonding groove 3 is equipped with four, dewar support structure 8 is centered with cold finger 6, and two two adjacent 90 ° distribution. The side angle of inclination of circular table 1 is consistent with the angle after the bonding of dewar support structure 8.

[0023] To better implement the utility model, refer to Figure 1 In an embodiment, the radial section of annular structure 2 is L-shaped, and annular structure 2 includes a ring-shaped bottom and a ring-shaped outer wall. The outer periphery of the ring-shaped bottom is connected to the bottom of the ring-shaped outer wall. The ring of the ring-shaped bottom is arranged around the bottom of the circular table 1. The top outer periphery of the ring-shaped outer wall is provided with an abutting ring 5. The abutting ring 5 is used to abut against the top of the lead ring 7 during installation to determine the position of the entire bonding device. The outer diameter of the ring-shaped outer wall of the annular structure 2 is consistent with the inner diameter of the lead ring 7. Before bonding the dewar support structure 8, the bonding device needs to be installed with the lead ring 7 and the cold finger 6. The bonding device is placed on the lead ring 7 and the cold finger 6, so that the cold finger 6 is deeply inserted into the sleeve 4. The outer side of the ring-shaped outer wall of the annular structure 2 abuts against the inner side of the lead ring 7 until the top of the lead ring 7 abuts against the abutting ring 5. The preliminary installation of the bonding device is completed.

[0024] To realize the installation process of the bonding device in the early stage of bonding, a groove can also be arranged on the bottom of the abutting ring 5 along the abutting ring 5, and the diameter of the groove is consistent with the diameter of the lead ring 7. At this time, the outer diameter of the ring-shaped outer wall of the annular structure 2 can be equal to or less than the inner diameter of the lead ring 7. When the outer diameter of the ring-shaped outer wall of the annular structure 2 is less than the inner diameter of the lead ring 7, the position of the bonding device can be limited by the groove at the bottom of the abutting ring 5. When the bonding device is installed, the top end of the lead ring 7 can be deeply inserted into the groove to realize the installation of the bonding device with the cold finger 6 and the lead ring 7. After the groove is arranged, the bonding device can be directly installed on the cold finger 6 and the lead ring 7 through the cooperation of the groove and the lead ring 7.

[0025] To better implement the utility model, refer to Figure 1In one embodiment, the bonding groove 3 comprises a limiting groove 31, a first connecting groove 32 and a second connecting groove 33. Since the width of the Dewar support structure 8 is usually 0.25-0.3 mm, the width of the limiting groove 31 can be selected according to the actual width of the Dewar support structure 8. Generally, the width of the limiting groove 31 is 0.4 mm larger than the width of the Dewar support structure 8. The limiting grooves 31 are arranged equidistantly along the circumference of the circular table 1. The limiting grooves 31 are in strip shape and can only accommodate the width of one Dewar support structure 8. The first connecting grooves 32 are arranged equidistantly along the circumference of the sleeve 4. The second connecting grooves 33 are arranged equidistantly along the circumference of the ring structure 2. One end of the limiting groove 31 communicates with the first connecting groove 32 and the other end communicates with the second connecting groove 33. The first connecting groove 32 and the second connecting groove 33 are openings provided on the side wall of the sleeve 4 and the ring structure 2, respectively. The second connecting groove 33 can be provided on the annular bottom and the annular outer wall of the ring structure 2 as shown in FIG. 6B or only on the annular bottom of the ring structure 2. The Dewar support structure 8 is made of zirconia with high hardness. Through the openings at the first connecting groove 32 and the second connecting groove 33, the Dewar support structure 8 can be directly bonded to the outer side wall of the cold finger 6 and the bonding position of the lead ring 7. Figure 1

[0026] During installation of the Dewar support structure 8, the entire bonding device is first rotated to align the second connecting groove 33 with the bonding position on the lead ring 7. Since the components are small during operation, limiting components can be provided on the lead ring 7 and the bonding device to avoid movement of the bonding device during bonding caused by accidental contact with the bonding device, thereby affecting the bonding effect. The Dewar support structure 8 is clamped into the limiting groove 31 with tweezers. At this time, the bonding position of the Dewar support structure 8 has been limited and will not deviate greatly during bonding. One end of the Dewar support structure 8 at the second connecting groove 33 is first bonded to the bonding position of the lead ring 7 with adhesive, and then one end of the support structure at the first connecting groove 32 is bonded to the outer wall of the cold finger 6 with adhesive, so that the Dewar support structure 8 forms an included angle with the vertical plane of the cold finger 6 in the range of 35°-60° after bonding. In this embodiment, the included angle is preferably 45°. The bonding position of the cold finger 6 and the Dewar support structure 8 is generally close to the top end of the cold finger 6. Therefore, there is a distance between the top of the first connecting groove 32 and the top end of the sleeve 4, which limits the bonding height of the Dewar support structure 8.

[0027] ​To ensure that the Dewar support structure 8 can be smoothly bonded with the cold finger 6, the top of the first connecting groove 32 can be lower than the top of the cold finger 6 after the cold finger 6 is inserted into the sleeve 4, and the bonding of the Dewar support structure 8 near the cold finger 6 is bonded along the top of the first connecting groove 32, so that the bonding height of the end of the Dewar support structure 8 near the cold finger 6 can be kept uniform. If the top of the first connecting groove 32 is higher than the cold finger 6 after the cold finger 6 is inserted into the sleeve 4, although this state can bond the Dewar support structure 8, the height of the bonding end of the Dewar support structure 8 and the cold finger 6 needs to be observed during the bonding process to ensure that all the bonding ends of the Dewar support structure 8 and the cold finger 6 are at the same height. To improve the bonding efficiency under this condition, marks can also be made beside the first connecting groove 32 of the bonding device to indicate the appropriate position of the bonding end of the Dewar support structure 8 and the cold finger 6, so as to further ensure that the position height of the bonding position of the Dewar support structure 8 and the cold finger 6 under this condition is uniform, and further improve the accuracy of the bonding of the Dewar support structure 8 and the bonding efficiency.

[0028] To better implement the utility model, refer to Figure 1 In an embodiment, the height of the sleeve 4 is higher than the height of the ring structure 2, so as to avoid that the cold finger 6 protrudes out of the sleeve 4 and causes inaccurate bonding position.

[0029] To better implement the utility model, refer to Figure 1 In an embodiment, the number of the limiting grooves 31 is consistent with the number of the bonding positions on the lead ring 7, and the positions are uniformly arranged along the circumference of the ring structure 2 and the lead ring 7, so as to ensure that each limiting groove 31 can correspond to one bonding position on the lead ring 7 one by one before the Dewar support structure 8 is bonded.

[0030] To better implement the utility model, refer to Figure 1 In an embodiment, the inner diameter of the sleeve 4 is greater than or equal to the outer diameter of the cold finger 6 of the Dewar support structure 8. In this embodiment, the inner diameter of the sleeve 4 is preferably consistent with the outer diameter of the cold finger 6. The inner diameter of the sleeve 4 relative to the outer diameter of the cold finger 6 should not be too large, and the range of the inner diameter of the sleeve 4 greater than the outer diameter of the cold finger 6 is 1-3 mm.

[0031] To better implement the utility model, refer to Figure 1 In an embodiment, the height of the circular table 1 is less than or equal to the height of the ring structure 2. The width of the circular table 1, that is, the distance from the outer wall of the sleeve 4 to the second connecting groove 33, is consistent with the distance from the outer wall of the cold finger 6 to the bonding position on the lead ring 7.

[0032] To better implement the utility model, refer to Figure 1 In an embodiment, the height of the ring structure 2 is less than or equal to the height of the lead ring 7. In this embodiment, the height of the ring structure 2 is preferably consistent with the height of the lead ring 7.

[0033] To ensure that the cold finger 6 and the lead ring 7 cause heat loss when in contact with the bonding device during the bonding process, heat insulation material can be arranged on the contact surface between the bonding device and the cold finger 6 and the lead ring 7.

[0034] The working principle of the bonding device based on the above-mentioned Dewar support structure is as follows:

[0035] Before the bonding is performed, the debris and dust on the surface of the bonding device is removed, the bonding device is sleeved from the upper end of the cold finger 6 and the lead ring 7, the cold finger 6 is inserted into the sleeve 4, the upper end of the lead ring 7 is in abutment with the abutment ring 5, the annular outer wall of the annular structure 2 is in abutment with the inner wall of the lead ring 7, the bonding device is rotated, the bonding positions on the lead ring 7 are aligned with the second connecting grooves 33 one by one, the Dewar support structure 8 is picked up by tweezers, the Dewar support structure 8 is placed into the limiting grooves 31, one end of the Dewar support structure 8 extends into the second connecting grooves 33 from the limiting grooves 31, and the bonding position of the Dewar support structure 8 in the second connecting grooves 33 is bonded by using the bonding agent, after the end of the Dewar support structure 8 on one side of the lead ring 7 is bonded, the position of the Dewar support structure 8 can be basically limited, at this time, only the inclination angle of the Dewar support structure 8 needs to be adjusted, so as to adjust the bonding position of one end of the Dewar support structure 8 close to the cold finger 6, the other end of the Dewar support structure 8 extends into the first connecting grooves 32 from the limiting grooves 31, and the outer wall of the cold finger 6 is bonded by using the bonding agent in the first connecting grooves 32, when the Dewar support structure 8 at one end of the first connecting grooves 32 is bonded, to ensure that the inclination angles of all the Dewar support structures 8 after bonding are consistent and the position heights of the bonding ends with the cold finger 6 are consistent, the Dewar support structure 8 at the end can be bonded along the top of the first connecting grooves 32, because the bonding position of the Dewar support structure 8 bonded by using the bonding device is accurate, the bonding agent of the bonding position can be directly cured after the bonding is completed, the position of the Dewar support structure 8 does not need to be repeatedly adjusted, and the bonding device is carefully taken down from the upper end of the cold finger 6 and the lead ring 7 after the curing is completed. When the bonding is performed, it also needs to be ensured that the two ends of the Dewar support structure 8 are in abutment with the bonding positions of the cold finger 6 and the lead ring 7 respectively.

[0036] Although the present application has been described with reference to the preferred embodiments, various modifications can be made to the present application and equivalents can be substituted for elements thereof without departing from the scope of the present application. In particular, those skilled in the art will recognize that elements from different embodiments of the present application can be employed without departing from the scope thereof. Accordingly, the present application is not limited to the specific embodiments described herein but includes all such modifications and equivalents that fall within the scope of the claims.

Claims

1. An adhesive device for a Dewar support structure, characterized in that, The device includes a frustum, with an annular structure on the outer periphery of its bottom. The annular structure is used to cooperate with the lead ring of the Dewar support structure to limit the position of the lead ring. A sleeve coaxial with the frustum is provided on the frustum, and the sleeve passes through the frustum axially. The sleeve, the frustum, and the annular structure are all provided with multiple adhesive grooves along their respective circumferences. The adhesive grooves are used to place the Dewar support structure during the bonding process and to limit the bonding position of the Dewar support structure.

2. The bonding device for the Dewar support structure according to claim 1, characterized in that, The bonding groove includes a limiting groove, a first connecting groove, and a second connecting groove. The limiting groove is equally spaced along the circumference of the frustum. The first connecting groove is equally spaced along the circumference of the sleeve. The second connecting groove is equally spaced along the circumference of the annular structure. One end of the limiting groove is connected to the first connecting groove, and the other end is connected to the second connecting groove. The first connecting groove and the second connecting groove are openings formed on the side wall of the sleeve and the annular structure, respectively.

3. The bonding device for the Dewar support structure according to claim 1, characterized in that, The radial cross-section of the ring structure is L-shaped. The ring structure includes an annular bottom and an annular outer wall. The outer periphery of the annular bottom is connected to the bottom of the annular outer wall. The annular bottom is arranged around the outer diameter of the bottom of the frustum. The top outer periphery of the annular outer wall is provided with an abutment ring.

4. The bonding device for the Dewar support structure according to claim 1, characterized in that, The height of the sleeve is higher than the height of the annular structure.

5. The bonding device for the Dewar support structure according to claim 2, characterized in that, The outer diameter of the annular outer wall of the ring structure is the same as the inner diameter of the lead ring.

6. The bonding device for the Dewar support structure according to claim 1 or 3, characterized in that, The bottom of the abutment ring is provided with a groove, and the diameter of the groove is the same as the diameter of the lead ring.

7. The bonding device for the Dewar support structure according to claim 2, characterized in that, The number of limiting grooves is the same as the number of bonding positions on the lead ring.

8. The bonding device for the Dewar support structure according to claim 1, characterized in that, The inner diameter of the sleeve is greater than or equal to the outer diameter of the cold finger of the Dewar support structure.

9. The bonding device for the Dewar support structure according to claim 1, characterized in that, The height of the frustum is less than or equal to the height of the annular structure.

10. The bonding device for the Dewar support structure according to claim 1, characterized in that, The height of the ring structure is less than or equal to the height of the lead ring.

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