Compact induction cooker structure

Abstract

The utility model discloses a compact induction cooker structure which comprises a cooker body, the cooker body comprises an upper shell, a lower shell, a coil panel, a circuit board, a fan and radiating fins, the upper shell is matched with the lower shell to form a mounting cavity, the coil panel, the circuit board, the fan and the radiating fins are all arranged in the mounting cavity, the circuit board, the fan and the radiating fins are all located below the coil panel, and the circuit board is located below the coil panel. The cooling fins are fixed on the circuit board, and the fan is located on one side of the circuit board. The circuit board, the fan and the radiating fins are all mounted below the coil panel, so that the conventional circuit board and other structures and the coil panel side tiling structure are replaced, the size of the whole induction cooker body is favorably reduced, the miniaturization of the whole induction cooker is realized, and the structure in the whole mounting cavity is compact; through the arrangement of the cooling fins and the fan, heat on the circuit board can be conducted to the cooling fins in time, air flow can be accelerated through the fan, heat can be conveniently taken away, heat dissipation is accelerated, temperature rise of the circuit board is effectively prevented from being too high, the temperature of the circuit board is effectively prevented from being reduced, and the service life of the circuit board is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model belongs to a kind of induction cooker, and particularly to a compact induction cooker structure. BACKGROUND

[0002] In the design of existing induction cooker, to avoid PCBA (Printed Circuit Board+Assembly) from causing temperature rise exceeding standard due to coil disc heating, while meeting EMC (Electromagnetic Compatibility) test requirements, PCBA and coil disc are usually placed separately, such as the induction cooker disclosed in application No.201822185386.4, which installs power board and control board on the side of coil disc, and fan on the side of coil disc. This layout results in large volume of induction cooker, making it difficult to realize miniaturization.

[0003] Some existing technologies attempt to place PCBA directly below coil disc to reduce volume, but due to insufficient heat dissipation, PCBA elements have excessively high temperature rise, and EMC interference is serious, so that the rated power can only be reduced, which is only 600W. Therefore, how to reduce volume while improving power and solving temperature rise and EMC problems has become a technical difficulty in the industry. UTILITY MODEL CONTENTS

[0004] The utility model aims to provide a compact induction cooker structure that can solve at least one of the above problems.

[0005] According to one aspect of the utility model, a compact induction cooker structure is provided, which includes a furnace body, the furnace body includes an upper shell, a lower shell, a coil disc, a circuit board, a fan and a heat sink, the upper shell cooperates with the lower shell to form a mounting cavity, the coil disc, the circuit board, the fan and the heat sink are all arranged in the mounting cavity, the circuit board, the fan and the heat sink are all located below the coil disc, the heat sink is fixed on the circuit board, and the fan is located on one side of the circuit board.

[0006] The utility model has the beneficial effects that: by arranging the circuit board, the fan and the heat sink below the coil disc, the existing circuit board structure and the coil disc side flat structure are replaced, which is beneficial to reducing the volume of the entire furnace body, realizing miniaturization of the entire induction cooker, and making the structure in the entire mounting cavity compact; by arranging the heat sink and the fan, heat on the circuit board can be conducted to the heat sink in time, air flow can be accelerated by the fan, which is beneficial to taking away heat, accelerating heat dissipation, effectively preventing the circuit board from having excessively high temperature rise, reducing the temperature of the circuit board, and ensuring the service life of the circuit board.

[0007] In some embodiments, the bottom of the lower shell is provided with an air inlet, the side of the lower shell is provided with an air outlet, the air inlet is located directly below the fan, and the air inlet is in communication with the air outlet. Thus, external air enters through the air inlet, is acted on the circuit board and the heat sink under the driving of the fan, and is then discharged through the air outlet, so that the heat in the mounting cavity can be discharged in time to prevent the temperature of the circuit board from being too high.

[0008] In some embodiments, the compact electromagnetic oven structure further comprises a baffle, and the baffle is located on one side of the fan. Thus, by providing the baffle, the air flow formed by the operation of the fan can be guided, which helps to guide the air entering through the air inlet to the heat sink and the circuit board, thereby improving the heat dissipation effect.

[0009] In some embodiments, the heat sink is a plurality of heat sinks, and the heat sinks are located between the fan and the air outlet. Thus, the fan can act on the heat sink to accelerate the heat dissipation of the heat sink, thereby accelerating the cooling of the circuit board.

[0010] In some embodiments, the coil disc adopts three layers of winding. Thus, the winding of the coil disc is optimized, and the surface temperature of the coil can be reduced through the circulation of the air flow in the lower air duct.

[0011] In some embodiments, when the size of the oven body is 192*192*70mm and the power is 1200W, the power to volume ratio is 0.47W / cm 3 . Thus, the volume of the entire oven body is reduced, and the power to volume ratio is greatly improved compared with existing electromagnetic ovens.

[0012] In some embodiments, the oven body further comprises a microcrystalline panel, the microcrystalline panel is fixed to the upper shell, and the microcrystalline panel is located above the coil disc. Thus, the microcrystalline panel can meet the use requirements of the oven body. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a top view structural schematic diagram of the compact electromagnetic oven structure of the utility model;

[0014] Figure 2 is a sectional view structural schematic diagram of the compact electromagnetic oven structure of the utility model;

[0015] Figure 3 is an internal partial structure schematic diagram of the compact electromagnetic oven structure of the utility model;

[0016] Figure 4 is a top view structural schematic diagram of the internal part of the oven body in the compact electromagnetic oven structure of the utility model.

[0017] Figure 5 is a top view structural schematic diagram of each structure on the lower shell in the compact electromagnetic oven structure of the utility model. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings.

[0019] Reference Figures 1-5 The compact induction cooker structure includes a cooker body 10, which includes an upper shell 1, a lower shell 2, a coil 3, a circuit board 4, a fan 5, and a heat sink 6. The upper shell 1 and the lower shell 2 cooperate to form a mounting cavity 101. The coil 3, circuit board 4, fan 5, and heat sink 6 are all located in the mounting cavity. The circuit board 4, fan 5, and heat sink 6 are all located below the coil 3. The heat sink 6 is fixed on the circuit board 4, and the fan 5 is located on one side of the circuit board 4.

[0020] During assembly, the fan 5 and circuit board 4 are fixed inside the lower shell 2, and the heat sink 6 is fixed on the circuit board 4. The coil 3 is wound around the wire frame on the upper shell 1, and then the upper shell 1 and the lower shell 2 are fixed together to complete the assembly of the entire furnace body 10.

[0021] By mounting the circuit board 4 and fan 5 below the coil 3, the overall volume of the furnace body 10 can be reduced, resulting in a more compact structure and facilitating the miniaturization of the induction cooker. The heat generated by the circuit board 4 during operation can be conducted to the heat sink 6, which accelerates heat dissipation. Furthermore, the fan 5 accelerates airflow, further reducing the temperature of the circuit board 4 and preventing overheating, thus protecting it.

[0022] The bottom of the lower shell 2 is provided with an air inlet 21, and the side of the lower shell 2 is provided with an air outlet 22. The air inlet 21 is located directly below the fan 5, and the air inlet 21 and the air outlet 22 are connected.

[0023] Therefore, under the action of fan 5, outside air enters the furnace body 10 through air inlet 21, forming an air duct between air inlet 21 and air outlet 22; the air inside the furnace body 10 flows towards the heat sink 6 and circuit board 4 under the drive of fan 5, and is finally discharged through air outlet 22. Figure 5 (The arrows in the diagram indicate the airflow direction within the duct.) Therefore, the duct design facilitates airflow onto the heat sink 6 and circuit board 4, effectively removing heat from these surfaces and lowering the temperature of the circuit board 4, preventing overheating. Simultaneously, because the duct is located below the coil 3, when the fan 5 operates, the cooler air entering from the outside acts on the coil 3, carrying away heat from its surface and reducing its temperature by 10-15°C.

[0024] The compact electromagnetic oven structure of the utility model further includes a wind deflector 7, and the wind deflector 7 is located at one side of the fan 5. Among them, the wind deflector 7 is integrally injection molded with the lower shell 2, by being provided with the wind deflector 7, the airflow during the working of the fan 5 can be guided, so that the airflow formed by the fan 5 is guided to the side where the heat sink 6 and the circuit board 4 are located, and the heat dissipation in the oven body 10 is accelerated.

[0025] The heat sink 6 is multiple, and the heat sink 6 is located between the fan 5 and the air outlet 22.

[0026] The coil disc 3 adopts three layers of winding, wherein the coil disc magnetic strip in the coil disc 3 close to the circuit board can adopt the existing high magnetic permeability ferrite material for the coil disc magnetic strip, so that the electromagnetic radiation can be effectively reduced, and the electromagnetic radiation 6DB can be reduced.

[0027] The size of the oven body 10 is 192*192*70mm, and when the power is 1200W, the power to volume ratio is 0.47W / cm 3 Therefore, compared with the size 280*350*60mm of the existing common electromagnetic oven, the size of the oven body of the utility model is greatly reduced, and when the power is 1200W, the power to volume ratio of the existing common electromagnetic oven is 0.37W / cm 3 Therefore, the power to volume ratio of the oven body in the utility model is much larger than that of the existing electromagnetic oven, and the power to volume ratio is greatly improved.

[0028] The oven body further includes a microcrystalline panel 8, the microcrystalline panel 8 is fixed on the upper shell 1, and the microcrystalline panel 8 is located above the coil disc 3. By being provided with the microcrystalline panel 8, the pot and the like can be placed on the microcrystalline panel 8, and the use requirement is met.

[0029] The above is only the preferred embodiment of the utility model, and it should be pointed out that for ordinary skilled persons in the art, without departing from the creative concept of the utility model, a number of deformations and improvements can be made, which all belong to the protection range of the utility model.

Claims

1. A compact structure of an electromagnetic oven, characterized by, The application relates to a stove body (10) which comprises an upper shell (1), a lower shell (2), a coil disc (3), a circuit board (4), a fan (5) and a heat sink (6), the upper shell (1) is matched with the lower shell (2) to form a mounting cavity (101), the coil disc (3), the circuit board (4), the fan (5) and the heat sink (6) are arranged in the mounting cavity (101), the circuit board (4), the fan (5) and the heat sink (6) are located below the coil disc (3), the heat sink (6) is fixed on the circuit board (4), and the fan (5) is located on one side of the circuit board (4).

2. The compact electromagnetic oven structure according to claim 1, characterized in that, The bottom of the lower shell (2) is provided with an air inlet (21), the side of the lower shell (2) is provided with an air outlet (22), the air inlet (21) is located directly below the fan (5), and the air inlet (21) is communicated with the air outlet (22).

3. The compact electromagnetic oven structure according to claim 2, characterized in that, The stove body further comprises a wind shield (7) which is located on one side of the fan (5).

4. The compact electromagnetic oven structure according to claim 3, wherein The heat sink (6) is a plurality of heat sinks, and the heat sink (6) is located between the fan (5) and the air outlet (22).

5. The compact electromagnetic structure according to any one of claims 1 to 4, characterized in that, The coil disc (3) adopts three-layer winding.

6. The compact electromagnetic structure according to any one of claims 1 to 4, characterized in that, The size of the furnace body (10) is 192*192*70mm, the power is 1200W, and the power to volume ratio is 0.47W / cm 3 .

7. The compact electromagnetic structure according to claim 1, wherein, The stove body further comprises a microcrystalline panel (8) which is fixed on the upper shell (1) and located above the coil disc (3).

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