Wafer water vapor removing device

Abstract

The utility model provides a wafer water vapor removing device which comprises a device body, the device body is arranged in a transmission cavity of a wafer transmission platform, one side of the transmission cavity is provided with a transmission inlet allowing a wafer to enter, and the device body comprises a baking lamp assembly, a baking cavity assembly, a light blocking mechanism and a temperature control mechanism; the baking cavity assembly is fixed to the transmission cavity, and the baking cavity is provided with a bearing seat for bearing a wafer; the temperature control mechanism is arranged on the side, away from the transmission inlet, in the transmission cavity and comprises a temperature sensor, a probe of the temperature sensor is fixed to the bearing seat to measure the temperature of the wafer, and the light blocking mechanism is arranged on the side, provided with the transmission inlet, of the transmission cavity and shields the transmission inlet when the wafer is transmitted to the bearing seat; the baking lamp assembly is arranged at the top of the baking cavity assembly and electrically connected with the temperature sensor, and the baking lamp assembly bakes the wafer according to the temperature detected by the temperature sensor to remove water vapor.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a wafer moisture removal device. Background Technology

[0002] In semiconductor technology, thin-film sputtering is a primary process for metal interconnects. During metal sputtering deposition, moisture on the wafer surface can severely affect the coating quality, necessitating its removal before deposition. Currently, wafer moisture removal devices are typically externally mounted on the wafer transport platform's interface. However, with the increasing number of external continuous process equipment in wafer vacuum deposition, the wafer transport platform's external interface may become completely occupied, making it impossible to mount an external moisture removal device. Furthermore, existing external devices are bulky, occupy significant space, and have poor integration, failing to meet the high-efficiency and compact requirements of modern semiconductor manufacturing equipment.

[0003] Therefore, there is an urgent need for a moisture removal device that can be built into a wafer transport platform to solve the problems of large size and poor integration performance of existing moisture removal devices. Utility Model Content

[0004] This invention provides a wafer moisture removal device with an optimized structure, integrating the moisture removal device into the transmission cavity of the wafer transport platform. Moisture removal is performed when the wafer is transported into the transmission cavity, avoiding the occupation of the external interface of the wafer transport platform and improving integration performance.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A wafer moisture removal device includes a device body disposed in a transfer cavity of a wafer transport platform. The transfer cavity has a transfer inlet on one side allowing the wafer to enter. The device body includes a baking lamp assembly, a baking cavity assembly, a light-blocking mechanism, and a temperature control mechanism. The baking cavity assembly is fixed to the transfer cavity, and the baking cavity has a support for the wafer. The temperature control mechanism is disposed in the transfer cavity on the side away from the transfer inlet, and includes a temperature sensor. The probe of the temperature sensor is fixed to the support to measure the temperature of the wafer. The light-blocking mechanism is disposed on the side of the transfer cavity with the transfer inlet and blocks the transfer inlet when the wafer is transferred to the support. The baking lamp assembly is disposed on the top of the baking cavity assembly and electrically connected to the temperature sensor. The baking lamp assembly bakes the wafer to remove moisture based on the temperature detected by the temperature sensor.

[0007] Preferably, the baking lamp assembly includes a mounting base, a lamp cover, a cooling substrate, and a lamp holder arranged sequentially from bottom to top. Multiple baking lamps are installed on the lamp holder in an inverted and spaced manner along the circumference. The lamp cover and the cooling substrate are provided with holes that allow the baking lamps to pass through. The lamp holder is covered with a protective shell, and the protective shell is connected to the mounting base.

[0008] Preferably, the baking cavity assembly includes a mounting flange, a light guide isolation ring, a cavity body, and a support seat. The light guide isolation ring is disposed on the mounting step on the inner wall of the cavity body and located on the bottom surface of the mounting flange. The support seat is fixed to the bottom of the cavity body. The cavity body is fixed to the transmission cavity.

[0009] Preferably, the carrier is an annular structure with a notch, the notch being provided corresponding to the transmission inlet, and the inner wall of the carrier is provided with a bearing surface for supporting the wafer.

[0010] Preferably, cooling blocks for cooling the cavity body are provided on both sides of the cavity body.

[0011] Preferably, a first sealing ring is provided at the contact point between the light guide isolation ring and the mounting step; a second sealing ring is provided at the contact point between the cavity body and the transmission cavity.

[0012] Preferably, the light-blocking mechanism includes a lifting cylinder and a light-blocking ring. The lifting cylinder is connected to the mounting flange seat via a mounting plate. The telescopic end of the lifting cylinder is fixedly connected to the connecting plate. Both ends of the connecting plate are connected to the light-blocking ring via connecting rods. The connecting rods pass through the cavity body and connect to the light-blocking ring.

[0013] Preferably, the cavity body is provided with a through hole that allows the connecting rod to pass through, and a guide seal is provided in the through hole. The connecting rod passes through the guide seal and connects to the light-blocking ring. A threaded tube is sleeved on the connecting rod, and the threaded tube is located between the connecting plate and the cavity body.

[0014] Preferably, the temperature control mechanism further includes a first fixed flange and a second fixed flange. The second fixed flange is disposed on the inner wall of the transmission cavity and connected to the fixing seat of the temperature sensor. The first fixed flange is disposed on the outer wall of the transmission cavity and is connected to the second fixed flange by bolts to fix the temperature sensor. A third sealing ring is provided at the connection between the first fixed flange and the outer wall of the transmission cavity.

[0015] Preferably, it further includes a reflective heat insulation mechanism, which is disposed at the bottom of the transmission cavity and includes a reflective heat insulation plate and a support base supporting the reflective heat insulation plate.

[0016] Compared with the prior art, the technical solution of this utility model has beneficial effects.

[0017] For example, this wafer moisture removal device includes a device body disposed within the transfer cavity of a wafer transport platform. The transfer cavity has a transfer inlet on one side allowing the wafer to enter. The device body includes a baking lamp assembly, a baking cavity assembly, a light-blocking mechanism, and a temperature control mechanism. The baking cavity assembly is fixed to the transfer cavity, which has a support for the wafer. The temperature control mechanism is located on the side of the transfer cavity away from the transfer inlet and includes a temperature sensor. The temperature sensor probe is fixed to the support to measure the wafer temperature. The light-blocking mechanism is located on the side of the transfer cavity with the transfer inlet and blocks the transfer inlet when the wafer is transferred to the support. The baking lamp assembly is located on top of the baking cavity assembly and electrically connected to the temperature sensor. The baking lamp assembly bakes the wafer to remove moisture based on the temperature detected by the temperature sensor. This optimized structure integrates the moisture removal device into the transfer cavity of the wafer transport platform, removing moisture as the wafer is transferred into the cavity, avoiding the use of external interfaces on the wafer transport platform and improving integration performance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the wafer moisture removal device and wafer transport platform structure in an embodiment of this utility model;

[0019] Figure 2 This is an exploded view of the baking lamp assembly in an embodiment of this utility model;

[0020] Figure 3 This is an exploded view of the baking cavity assembly in an embodiment of this utility model;

[0021] Figure 4 This is a schematic diagram of the light-blocking mechanism in an embodiment of this utility model;

[0022] Figure 5 This is an exploded view of the temperature control mechanism in an embodiment of this utility model;

[0023] Figure 6 This is a schematic diagram of the reflective heat insulation mechanism in an embodiment of this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1-Wafer transfer platform; 11-Transfer cavity; 12-Transfer inlet;

[0026] 2-Baking lamp assembly; 21-Mounting base; 22-Lamp cover; 23-Cooling substrate; 24-Lamp holder; 25-Baking lamp; 26-Protective shell; 27-Photoelectric sensor;

[0027] 3-Baking cavity assembly; 31-Mounting flange seat; 32-Light guide isolation ring; 33-Cavity body; 331-Guide seal; 332-Cooling block; 333-Second sealing ring; 334-First sealing ring; 34-Bearing seat; 341-Bearing surface;

[0028] 4-Light blocking mechanism; 41-Lifting cylinder; 42-Mounting plate; 43-Light blocking ring; 44-Connecting plate; 45-Connecting rod; 46-Threaded tube;

[0029] 5-Temperature control mechanism; 51-Temperature sensor; 52-First fixed flange; 53-Second fixed flange; 54-Third sealing ring;

[0030] 6-Reflective heat insulation mechanism; 61-Reflective heat insulation panel; 62-Support base;

[0031] 7-Protective cover. Detailed Implementation

[0032] To make the objectives, features, and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining this utility model and are not intended to limit it. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0033] Figure 1 This is a schematic diagram of the wafer moisture removal device and wafer transport platform structure in an embodiment of this utility model; Figure 2 This is an exploded view of the baking lamp assembly in an embodiment of this utility model; Figure 3 This is an exploded view of the baking cavity assembly in an embodiment of this utility model; Figure 4 This is a schematic diagram of the light-blocking mechanism in an embodiment of this utility model; Figure 5 This is an exploded view of the temperature control mechanism in an embodiment of this utility model; Figure 6 This is a schematic diagram of the reflective heat insulation mechanism in an embodiment of this utility model.

[0034] Reference Figures 1-6 This utility model provides a wafer moisture removal device.

[0035] Specifically, the wafer moisture removal device includes a device body, which is disposed in the transmission cavity 11 of the wafer transmission platform 1. A transmission inlet 12, allowing the wafer to enter, is provided on one side of the transmission cavity 11. The device body includes a baking lamp assembly 2, a baking cavity assembly 3, a light-blocking mechanism 4, and a temperature control mechanism 5. The baking cavity assembly 3 is fixed to the transmission cavity 11 and has a support 34 for carrying the wafer. The temperature control mechanism 5 is located inside the transmission cavity 11 on the side away from the transmission inlet 12. The temperature control mechanism 5 includes a temperature sensor 51, the probe of which is fixed to the support 34 to measure the temperature of the wafer. The light-blocking mechanism 4 is located on the side of the transmission cavity 11 with the transmission inlet 12 and blocks the transmission inlet 12 when the wafer is transferred to the support 34. The baking lamp assembly 2 is disposed on the top of the baking cavity assembly 3 and is electrically connected to the temperature sensor 51. The baking lamp assembly 2 bakes the wafer to remove moisture based on the temperature detected by the temperature sensor 51.

[0036] In some embodiments, the baking lamp assembly 2 includes a mounting base 21, a lamp cover 22, a cooling substrate 23, and a lamp holder 24 arranged sequentially from bottom to top. A plurality of baking lamps 25 are installed on the lamp holder 24 at inverted intervals along the circumference. The lamp cover 22 and the cooling substrate 23 are provided with holes that allow the baking lamps 25 to pass through. The lamp holder 24 is covered with a protective shell 26, which is connected to the mounting base 21 to protect the baking lamp assembly 2.

[0037] Specifically, the baking lamp 25 uses a halogen lamp with a power range of 500W-3600W to provide thermal radiation to remove moisture from the wafer surface; the lamp cover 22 is used to optimize the uniformity of thermal radiation and ensure that the thermal radiation of the baking lamp can be uniformly and directionally diffused; the cooling substrate 23 is used to cool the lamp holder 24 and the lamp cover 22.

[0038] Specifically, the baking lamp assembly 2 is also covered with a protective cover 7, which is the protective shell of the entire wafer moisture removal device. The mounting base 21 is also equipped with a photoelectric sensor 27 for detecting the protective cover 7 to ensure the protection of the entire mechanism.

[0039] In some embodiments, the baking cavity assembly 3 includes a mounting flange 31, a light guide isolation ring 32, a cavity body 33, and a support 34. The light guide isolation ring 32 is disposed on the mounting step on the inner wall of the cavity body 33 and located on the bottom surface of the mounting flange 31. The support 34 is fixed to the bottom of the cavity body 33. The cavity body 33 is fixed to the transmission cavity 11.

[0040] Specifically, the light guide isolation component 32 is made of a high light transmittance and heat resistant material to ensure that heat radiation is efficiently transferred to the cavity body 33.

[0041] In some embodiments, the carrier 34 is an annular structure with a notch, the notch being provided corresponding to the transmission inlet 12, and the inner wall of the carrier 34 is provided with a carrier surface 341 for carrying the wafer.

[0042] In some embodiments, cooling blocks 332 are provided on both sides of the cavity body 33 to cool the cavity body 33 and prevent the temperature of the wafer transfer platform 1 from becoming too high.

[0043] In some embodiments, a first sealing ring 334 is provided at the contact point between the light guide isolation ring 32 and the mounting step; a second sealing ring 333 is provided at the contact point between the cavity body 33 and the transmission cavity 11, and the first sealing ring 334 and the second sealing ring 333 achieve slow filling and sealing.

[0044] In some embodiments, the light-blocking mechanism 4 includes a lifting cylinder 41 and a light-blocking ring 43. The lifting cylinder 41 is connected to the mounting flange seat 31 via a mounting plate 42. The telescopic end of the lifting cylinder 41 is fixedly connected to the connecting plate 44. Both ends of the connecting plate 44 are connected to the light-blocking ring 43 via connecting rods 45. The connecting rods 45 pass through the cavity body 33 and connect to the light-blocking ring 43. The lifting cylinder 41 is used to adjust the position of the light-blocking ring 43, and is used to open or block the transmission entrance 12 for wafer entry and exit. The light-blocking ring 43 blocks the transmission entrance 12 to prevent light leakage and prevent areas outside the cavity body 33 from being affected by heat radiation.

[0045] In some embodiments, the cavity body 3 is provided with a through hole that allows the connecting rod 45 to pass through, and a guide seal 331 is provided in the through hole. The connecting rod 45 passes through the guide seal 331 and connects to the light-blocking ring 43. A threaded tube 46 is sleeved on the connecting rod 45, and the threaded tube 46 is located between the connecting plate 44 and the cavity body 33. The guide seal 331 guides the connecting rod 45 when it moves, and the threaded tube 46 cooperates with the guide seal 331 to seal the connecting rod 45 when it moves.

[0046] In some embodiments, the temperature control mechanism 5 further includes a first fixed flange 52 and a second fixed flange 53. The second fixed flange 53 is disposed on the inner wall of the transmission cavity 11 and connected to the fixing seat of the temperature sensor 51. The first fixed flange 52 is disposed on the outer wall of the transmission cavity 11 and is connected to the second fixed flange 53 by bolts to fix the temperature sensor 51. A third sealing ring 54 is provided at the connection between the first fixed flange 52 and the outer wall of the transmission cavity 11.

[0047] In some embodiments, a reflective heat insulation mechanism 6 is also included. The reflective heat insulation mechanism 6 is disposed at the bottom of the transmission cavity 11 and includes a reflective heat insulation plate 61 and a support base 62 supporting the reflective heat insulation plate 61. The reflective heat insulation plate 61 is used to reflect the heat radiation of the baking lamp, so that the heat radiation is evenly and directionally diffused while preventing heat from being transferred to the wafer transmission platform 1. The support base 62 supports the reflective heat insulation plate 61 and forms a distance between it and the wafer transmission platform 1 to play a heat insulation role.

[0048] In summary, the wafer moisture removal device provided by this utility model includes a device body, which is disposed in the transmission cavity 11 of the wafer transmission platform 1. A transmission inlet 12 is provided on one side of the transmission cavity 11 to allow the wafer to enter. The device body includes a baking lamp assembly 2, a baking cavity assembly 3, a light-blocking mechanism 4, and a temperature control mechanism 5. The baking cavity assembly 3 is fixed to the transmission cavity 11, and the baking cavity 3 is provided with a support 34 for carrying the wafer. The temperature control mechanism 5 is disposed inside the transmission cavity 11 on the side away from the transmission inlet 12. The temperature control mechanism 5 includes a temperature sensor 51, the probe of which is fixed to the support 34 to measure the temperature of the wafer. The light-blocking mechanism... 4 is located on the side of the transmission cavity 11 where the transmission inlet 12 is located, and blocks the transmission inlet 12 when the wafer is transferred to the carrier 34; the baking lamp assembly 2 is located on the top of the baking cavity assembly 3 and is electrically connected to the temperature sensor 51. The baking lamp assembly 2 bakes the wafer to remove moisture according to the temperature detected by the temperature sensor 51; the structure is optimized by integrating the moisture removal device into the transmission cavity 11 of the wafer transmission platform 1, and removing moisture when the wafer is transferred to the transmission cavity 11, avoiding the occupation of the external interface of the wafer transmission platform 1 and improving the integration performance; each part adopts a split design to achieve quick installation and disassembly, and is adaptable to various wafer transmission platforms 1.

[0049] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of this utility model disclosure, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this utility model disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

[0050] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer water vapor removal apparatus, characterized by comprising: The device body is arranged in a transmission cavity of a wafer transmission platform, one side of the transmission cavity is provided with a transmission inlet allowing the wafer to enter, the device body comprises a baking lamp assembly, a baking cavity assembly, a light shielding mechanism and a temperature control mechanism; the baking cavity assembly is fixed to the transmission cavity, and the baking cavity is provided with a bearing seat bearing the wafer; The temperature control mechanism is arranged on the side of the transmission cavity away from the transmission inlet, the temperature control mechanism comprises a temperature sensor, the probe of the temperature sensor is fixed to the bearing seat to measure the temperature of the wafer, the light shielding mechanism is arranged on the side of the transmission cavity provided with the transmission inlet, and the light shielding mechanism shields the transmission inlet when the wafer is transmitted to the bearing seat; the baking lamp assembly is arranged on the top of the baking cavity assembly and is electrically connected with the temperature sensor, and the baking lamp assembly bakes the wafer according to the temperature detected by the temperature sensor to remove water vapor.

2. The wafer water vapor removal apparatus of claim 1, wherein The baking lamp assembly comprises a mounting base, a lampshade, a cooling substrate and a lamp holder arranged in sequence from bottom to top, a plurality of baking lamps are inversely and spacedly arranged on the lamp holder in a circumferential direction, the lampshade and the cooling substrate are provided with holes allowing the baking lamps to pass through, and the lamp holder is covered with a protective shell connected to the mounting base.

3. The wafer water vapor removal apparatus of claim 1, wherein The baking cavity assembly comprises a mounting flange seat, a light guide isolation ring, a cavity main body and a bearing seat, the light guide isolation ring is arranged on the mounting step of the inner wall of the cavity main body and located on the bottom surface of the mounting flange seat, and the bearing seat is fixed to the bottom of the cavity main body; the cavity main body is fixed to the transmission cavity.

4. The wafer water vapor removal apparatus of claim 3, wherein The bearing seat is an annular structure with a notch, the notch corresponds to the transmission inlet, and the inner wall of the bearing seat is provided with a bearing surface for bearing the wafer.

5. The wafer water vapor removal apparatus of claim 3, wherein Cooling blocks are arranged on both sides of the cavity main body for cooling the cavity main body.

6. The wafer water vapor removal apparatus of claim 3, wherein A first sealing ring is arranged at the contact position between the light guide isolation ring and the mounting step; and a second sealing ring is arranged at the contact position between the cavity main body and the transmission cavity.

7. The wafer water vapor removal apparatus of claim 3, wherein The light shielding mechanism comprises a lifting cylinder and a light shielding ring, the lifting cylinder is connected to the mounting flange seat through a mounting plate, the telescopic end of the lifting cylinder is fixedly connected with a connecting plate, the two ends of the connecting plate are connected with the light shielding ring through connecting rods, and the connecting rods pass through the cavity main body to connect the light shielding ring.

8. The wafer water vapor removal apparatus of claim 7, wherein The cavity main body is provided with a through hole allowing the connecting rods to pass through, a guide sealing element is arranged in the through hole, and the connecting rods pass through the guide sealing element to connect the light shielding ring; a threaded tube is sleeved on the connecting rod and located between the connecting plate and the cavity main body.

9. The wafer water vapor removal apparatus of claim 1, wherein The temperature control mechanism further comprises a first fixing flange and a second fixing flange, the second fixing flange is arranged on the inner wall of the transmission cavity and connected with the fixing seat of the temperature sensor, the first fixing flange is arranged on the outer wall of the transmission cavity and connected with the second fixing flange through bolts to fix the temperature sensor, and a third sealing ring is arranged at the connection position between the first fixing flange and the outer wall of the transmission cavity.

10. The wafer water vapor removal apparatus of claim 1, wherein The heat insulation mechanism is arranged on the bottom of the transmission cavity and comprises a heat insulation plate and a support seat for supporting the heat insulation plate.

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