Chip temperature detection device
By using a thermistor as a temperature acquisition module on the chip, combined with a control module and a heat dissipation module, the problem of low detection accuracy caused by the large size of the temperature sensing element is solved, realizing high-precision and high-sensitivity chip temperature detection, and supporting the miniaturization of chip structure and circuit board integration.
Patent Information
- Application Number
- CN202423268801.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2034-12-27
AI Technical Summary
In existing technologies, temperature sensing elements are too large to be placed close to the chip, resulting in low chip temperature sensing accuracy and hindering circuit board integration and miniaturization.
A thermistor is used as the temperature acquisition module, with a thickness between 5nm and 5μm. It is connected to the chip through thermally conductive adhesive, thermally conductive pillars or solder to achieve the bonding or embedding of the temperature acquisition module. Combined with the control module and heat dissipation module, the detection accuracy and sensitivity are improved.
It achieves high-precision and high-sensitivity detection of chip temperature, and contributes to the miniaturization of chip structure and the integration of circuit boards, and has over-temperature protection function.
Smart Images
Figure CN223925867U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing technology, and in particular to a chip temperature detection device. Background Technology
[0002] With the development of mobile and integrated devices, the use of chips is increasing. As devices are used frequently or operate for extended periods, chips will generate significant heat after prolonged operation. This heat generation can shorten the lifespan of the chip, reduce its performance, slow down its response speed, and consequently reduce the overall reliability of the chip.
[0003] Currently, copper ingots or cavities are typically placed on the chip carrier to conduct heat or cool the chip, allowing it to be used within a normal temperature range; or corresponding temperature sensing elements are placed on the circuit board containing the chip to monitor the chip temperature in real time. When the chip temperature exceeds the set value, the chip needs to be treated accordingly, thereby achieving over-temperature protection for the chip.
[0004] However, using copper ingots or cavities cannot accurately monitor the chip temperature, and the temperature sensing element is too large to be close enough to the chip. It can only monitor the chip temperature by detecting the thermal conductive element, which is also not conducive to the integration and miniaturization of the circuit board. Alternatively, the slightly smaller surface-mount temperature sensing element can be closer to the chip and detect the chip temperature more accurately, but it can only be placed near the chip and still cannot meet the application requirements. Moreover, the temperature sensing element is thick, and its detection accuracy and sensitivity are still difficult to meet the current application requirements. Utility Model Content
[0005] This invention provides a chip temperature detection device to improve the accuracy and sensitivity of chip temperature detection.
[0006] According to one aspect of the present invention, an embodiment of the present invention provides a chip temperature detection device, comprising:
[0007] At least one temperature acquisition module is provided, which is used to detect the temperature of the chip.
[0008] Optionally, the temperature acquisition module is attached to the surface of the chip, or the temperature acquisition module is embedded in the chip carrier board, or the temperature acquisition module is embedded in the circuit board.
[0009] Optionally, the temperature acquisition module is a thermistor with an average thickness greater than or equal to 5 nm and less than or equal to 5 μm.
[0010] Optionally, the temperature acquisition module is connected to the chip via thermally conductive adhesive, or via thermally conductive pillars; or via solder; or directly attached to the chip surface; or via wires.
[0011] Optionally, at least two temperature acquisition modules may be connected in series or in parallel.
[0012] Optionally, at least two temperature acquisition modules may be arranged in a uniform manner, or at least two temperature acquisition modules may be arranged in a group.
[0013] Optionally, the chip temperature detection device also includes:
[0014] The control module and the heat dissipation module are used to dissipate heat from the chip. The control module is used to collect the voltage of the temperature acquisition module. The control module is also used to control the operation of the heat dissipation module when the chip temperature is greater than or equal to a first temperature threshold, and to control the chip to adopt a low power mode when the chip temperature is greater than or equal to a second temperature threshold.
[0015] Alternatively, the control module is used to detect the resistance of the temperature acquisition module, and the control module is also used to control the operation of the heat dissipation module when the chip temperature is greater than or equal to the first temperature threshold; when the chip temperature is higher than the second temperature threshold, the control chip adopts a low power mode.
[0016] Alternatively, the control module is used to detect the current of the temperature acquisition module, and the control module is also used to control the operation of the heat dissipation module when the chip temperature is greater than or equal to the first temperature threshold; when the chip temperature is higher than the second temperature threshold, the control chip adopts a low power mode.
[0017] The second temperature threshold is greater than the first temperature threshold.
[0018] Optionally, the chip temperature detection device also includes:
[0019] The analog-to-digital converter (ADC) is connected to the temperature acquisition module as its input terminal, and its output terminal is connected to the control module. The ADC is used to convert the temperature signal acquired by the temperature acquisition module into a digital signal.
[0020] Optionally, the chip temperature detection device also includes:
[0021] A fixed resistor, together with the temperature acquisition module, forms a voltage divider, which is connected to the input of the analog-to-digital converter (ADC). The output of the ADC is connected to the control module.
[0022] Optionally, the heat dissipation module includes at least one of a fan, heat pipe, fins, and liquid cooler.
[0023] In this embodiment of the novel surface novel technology, the temperature acquisition module can be attached to the surface of the chip, embedded in the chip carrier, or embedded in the circuit board. The temperature acquisition module can directly detect the temperature of the chip surface, solving the problem of low chip temperature detection accuracy caused by the large size of the temperature detection element in traditional technical solutions. The temperature acquisition module in this embodiment has high detection accuracy and sensitive response, and can accurately detect the chip temperature, thus improving the detection accuracy and sensitivity of chip temperature.
[0024] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the structure of a chip temperature detection device provided in an embodiment of the present invention;
[0027] Figure 2 This is a schematic diagram of the structure of another chip temperature detection device provided in this embodiment of the utility model;
[0028] Figure 3 This is a schematic diagram of the structure of another chip temperature detection device provided in this embodiment of the utility model;
[0029] Figure 4 This is a schematic diagram of the structure of another chip temperature detection device provided in this embodiment of the utility model;
[0030] Figure 5 This is a flowchart of the chip temperature detection device provided in this embodiment of the utility model. Detailed Implementation
[0031] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.
[0032] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, any variations of the terms "comprising" and "having" are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0033] Figure 1 This is a schematic diagram of the structure of a chip temperature detection device provided in an embodiment of the present invention;
[0034] Figure 2 This is a schematic diagram of the structure of another chip temperature detection device provided in this embodiment of the utility model.
[0035] Figure 3 This is a schematic diagram of the structure of another chip temperature detection device provided in this embodiment of the present invention; see also Figures 1-3 The chip temperature detection device includes at least one temperature acquisition module 1, which is used to detect the temperature of the chip 3.
[0036] Among them, temperature acquisition module 1 is a thermistor, and temperature acquisition module 1 can be attached to the surface of chip 3 (see...). Figure 1 The temperature acquisition module 1 can also be embedded in the chip carrier board 4 (see...). Figure 2 ), or the temperature acquisition module 1 is embedded in the circuit board 2 (see Figure 3 The average thickness of temperature acquisition module 1 is greater than or equal to 5nm and less than or equal to 5μm.
[0037] In this embodiment of the novel surface treatment, the temperature acquisition module 1 can be attached to the surface of the chip 3, embedded in the chip carrier 4, or embedded in the circuit board 2. The temperature acquisition module 1 can directly detect the temperature of the chip 3 surface, solving the problem of low temperature detection accuracy in traditional solutions due to the large size of the temperature sensing element preventing it from being placed close to the chip 3. In this embodiment, the temperature acquisition module 1 has high detection accuracy and sensitive response, accurately detecting the temperature of the chip 3, thus improving the accuracy and sensitivity of temperature detection. Compared to conventional thermistors such as thick-film thermistors, thick-film thermistors, and thin-film thermistors, it has a smaller volume, which is beneficial for the miniaturization of the overall chip structure.
[0038] See Figure 1-3 Optionally, based on the above embodiments, the temperature acquisition module 1 is attached to the surface of the chip 3, or the temperature acquisition module 1 is embedded in the chip carrier board 4, or the temperature acquisition module 1 is embedded in the circuit board 2.
[0039] In this embodiment of the utility model, the temperature acquisition module 1 can be attached to the surface of the chip 3, or the temperature acquisition module 1 can be embedded in the chip carrier board 4, or the temperature acquisition module 1 can be embedded in the circuit board 2. Compared with traditional temperature detection elements, the temperature acquisition module 1 is closer to the chip 3 and has better detection accuracy. Since the temperature acquisition module 1 is embedded, it is beneficial to the circuit design of the chip carrier board 4 or the circuit board 2.
[0040] See Figure 1 Optionally, based on the above embodiments, the temperature acquisition module 1 is a thermistor with an average thickness greater than or equal to 5 nm and less than or equal to 5 μm. It should be noted that the average thickness of the thermistor can be 5 nm, 10 nm, 15 nm, 25 nm, 50 nm, 75 nm, 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, 400 nm, 500 nm, 700 nm, 800 nm, 900 nm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, or any range of two values.
[0041] Specifically, when the average thickness of the thermistor is too thick, the thermistor becomes too large, which is not conducive to attaching the thermistor to the surface of chip 3 or embedding it in the carrier plate 4 of chip 3, or embedding it in the circuit board 2, thus affecting the accuracy of temperature detection of chip 3. When the average thickness of the thermistor is too small, it will affect the sheet resistance of the thermistor, making the sheet resistance of the thermistor uneven. Therefore, the average thickness of the thermistor is set to be greater than or equal to 5nm and less than or equal to 5μm, so that the thermistor can be easily attached to the surface of chip 3 or embedded in the chip carrier plate 4, or embedded in the circuit board 2, avoiding the impact on the accuracy of temperature detection of chip 3, and making the sheet resistance of the thermistor uniform.
[0042] Figure 4 This is a schematic diagram of another chip temperature detection device provided in this embodiment of the present invention. See also... Figure 3 and Figure 4 Optionally, based on the above embodiments, the temperature acquisition module 1 is connected to the chip 3 via thermally conductive adhesive 5; or the temperature acquisition module 1 is connected to the chip 3 via thermally conductive pillar 6; or the temperature acquisition module 1 is connected to the chip 3 via solder.
[0043] In this embodiment of the invention, the temperature acquisition module 1 is connected to the chip 3 via thermally conductive adhesive 5, thermally conductive pillars 6, or solder, so that the temperature acquisition module 1 is attached to the chip 3. This allows the temperature acquisition module 1 to directly detect the surface temperature of the chip 3, improving the accuracy and sensitivity of the temperature detection of the chip 3. Alternatively, the temperature acquisition module can be connected to the chip via a wire, the function of which is to transfer the heat from the chip to the temperature acquisition module.
[0044] See Figure 1 Optionally, based on the above embodiments, at least two temperature acquisition modules 1 are connected in series or at least two temperature acquisition modules 1 are connected in parallel.
[0045] Specifically, at least two temperature acquisition modules 1 are set on the surface of the chip 3, and at least two temperature acquisition modules 1 are connected in series or in parallel, so that multiple temperature acquisition modules 1 can acquire the temperature at different locations on the chip 3, thereby realizing the accurate detection of the temperature of the chip 3 by the temperature acquisition modules 1.
[0046] See Figures 1-4 Optionally, based on the above embodiments, at least two temperature acquisition modules 1 are arranged uniformly, or at least two temperature acquisition modules 1 are arranged in a group.
[0047] The uniform arrangement refers to arranging multiple temperature acquisition modules 1 at equal intervals on the surface of chip 3. The cluster arrangement includes uniform, symmetrical, and grid arrangements. The cluster arrangement involves arranging multiple temperature acquisition modules 1 symmetrically or in a grid pattern on the surface of chip 3. This configuration allows the multiple temperature acquisition modules 1 to accurately acquire the temperature on the surface of chip 3, improving the detection accuracy and sensitivity. The temperature acquisition modules 1 can also be arranged on the surface of chip 3 as needed.
[0048] See Figures 1-2 Optionally, based on the above embodiments, the chip temperature detection device further includes: a control module and a heat dissipation module. The heat dissipation module is used to dissipate heat from the chip 3. The control module is used to acquire the voltage of the temperature acquisition module 1, and the control module is also used to control the heat dissipation module to operate when the temperature of the chip 3 is greater than or equal to a first temperature threshold, and to control the chip 3 to adopt a low-power mode when the temperature of the chip 3 is greater than or equal to a second temperature threshold. Alternatively, the control module is used to detect the resistance of the temperature acquisition module 1, and the control module is also used to control the heat dissipation module to operate when the temperature of the chip 3 is greater than or equal to the first temperature threshold, and to control the chip 3 to adopt a low-power mode when the temperature of the chip 3 is greater than or equal to the second temperature threshold. Alternatively, the control module is used to detect the current of the temperature acquisition module 1, and the control module is also used to control the heat dissipation module to operate when the temperature of the chip 3 is greater than or equal to the first temperature threshold, and to control the chip 3 to adopt a low-power mode when the temperature of the chip 3 is higher than the second temperature threshold, wherein the second temperature threshold is greater than the first temperature threshold.
[0049] The control module determines the temperature of the chip 3 based on the voltage change of the acquisition module 1, or it determines the temperature of the chip 3 based on the resistance or current change of the acquisition module 1. The control module can be set on the circuit board 2, or it can be implemented by the chip 3. The control module is used to acquire the voltage of the temperature acquisition module 1, or it can be used to detect the resistance of the temperature acquisition module 1. The heat dissipation module can be on the surface of the chip 3, or it can be off the surface of the chip 3.
[0050] In this embodiment of the utility model, the control module is used to control the heat dissipation module to operate when the temperature of chip 3 is greater than or equal to a first temperature threshold, and to control chip 3 to adopt a low power consumption mode when the temperature of chip 3 is greater than or equal to a second temperature threshold, thereby protecting chip 3 and avoiding damage to chip 3 due to excessive temperature.
[0051] See Figures 1-4Optionally, based on the above embodiments, the chip temperature detection device further includes: an analog-to-digital converter, with the temperature acquisition module 1 connected to the input terminal of the analog-to-digital converter, and the output terminal of the analog-to-digital converter connected to the control module; the analog-to-digital converter is used to convert the temperature signal acquired by the temperature acquisition module 1 into a digital signal.
[0052] Specifically, the temperature signal acquired by the temperature acquisition module 1 is converted into a digital signal by an analog-to-digital converter, and then the digital signal is transmitted to the control module.
[0053] See Figures 1-2 Optionally, based on the above embodiments, the temperature detection device of the chip 3 further includes: a fixed resistor, which together with the temperature acquisition module 1 forms a voltage divider, and the voltage divider is connected to the input terminal of the analog-to-digital converter; the output terminal of the analog-to-digital converter is connected to the control module.
[0054] The fixed resistor serves to limit current and divide voltage. The voltage divider transmits the temperature signal acquired by the temperature acquisition module 1 to the analog-to-digital converter. The analog-to-digital converter converts the temperature signal into a digital signal and then transmits the digital signal to the control module.
[0055] See Figures 1-4 Optionally, based on the above embodiments, the heat dissipation module includes at least one of a fan, a heat pipe, fins, and a liquid cooler.
[0056] The components, including fans, heat pipes, fins, and liquid coolers, dissipate heat from chip 3. Fans dissipate heat from chip 3, heat pipes reduce heat on the surface of chip 3, fins enhance heat dissipation efficiency, and liquid coolers absorb heat from the surface of chip 3. When the temperature of chip 3 is greater than or equal to a first temperature threshold, the control module activates the heat dissipation module to lower the surface temperature of chip 3, preventing overheating and damage to chip 3.
[0057] Figure 5 This is a flowchart of the chip temperature detection device provided by this utility model. See also: Figure 5When the chip temperature detection device starts working, the temperature acquisition module collects the chip temperature. The temperature acquisition module and the fixed resistor are connected in series to form a voltage divider. The temperature acquisition module sends the voltage signal to the analog-to-digital converter (ADC). The ADC receives the voltage signal from the temperature acquisition module and converts it into a digital signal. The ADC then transmits the digital signal to the control module. The control module determines the chip temperature collected by the temperature acquisition module based on the digital signal. When the chip temperature is greater than or equal to a first temperature threshold, the control module controls the heat dissipation module to operate. When the chip temperature is greater than or equal to a second temperature threshold, the control module controls the chip to adopt a low-power mode. It should be understood that various forms of the process shown above can be used, with steps rearranged, added, or deleted. For example, the steps described in this utility model can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this utility model can be achieved, and this is not limited herein. The fixed resistor can also be connected in parallel with the temperature acquisition module.
[0058] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. A chip temperature detection device, characterized in that, include: At least one temperature acquisition module is provided, the temperature acquisition module being used to detect the temperature of the chip; The chip temperature detection device also includes: An analog-to-digital converter is provided, wherein the temperature acquisition module is connected to the input terminal of the analog-to-digital converter, and the output terminal of the analog-to-digital converter is connected to the control module. The analog-to-digital converter is used to convert the temperature signal acquired by the temperature acquisition module into a digital signal.
2. The chip temperature detection device according to claim 1, characterized in that, The temperature acquisition module is attached to the surface of the chip, or the temperature acquisition module is embedded in the chip carrier board, or the temperature acquisition module is embedded in the circuit board.
3. The chip temperature detection device as described in claim 2, characterized in that, The temperature acquisition module is a thermistor, and the average thickness of the thermistor is greater than or equal to 5nm and less than or equal to 5μm.
4. The chip temperature detection device according to claim 1, characterized in that, The temperature acquisition module is connected to the chip via thermally conductive adhesive; or the temperature acquisition module is connected to the chip via thermally conductive pillars; or the temperature acquisition module is connected to the chip via solder; or the temperature acquisition module is directly attached to the chip surface; or the temperature acquisition module is connected to the chip via wires.
5. The chip temperature detection device according to claim 2 or 3, characterized in that, At least two of the temperature acquisition modules are connected in series.
6. The chip temperature detection device according to claim 1, characterized in that, At least two of the temperature acquisition modules are arranged uniformly, or at least two of the temperature acquisition modules are arranged in a group.
7. The chip temperature detection device according to claim 1, characterized in that, Also includes: The system includes a control module and a heat dissipation module. The heat dissipation module is used to dissipate heat from the chip. The control module is used to acquire the voltage of the temperature acquisition module. The control module is also used to control the heat dissipation module to operate when the chip temperature is greater than or equal to a first temperature threshold, and to control the chip to adopt a low-power mode when the chip temperature is greater than or equal to a second temperature threshold. Alternatively, the control module may be used to detect the resistance of the temperature acquisition module, and the control module may also be used to control the heat dissipation module to operate when the chip temperature is greater than or equal to a first temperature threshold; and to control the chip to adopt a low-power mode when the chip temperature is higher than a second temperature threshold. Alternatively, the control module may be used to detect the current of the temperature acquisition module, and the control module may also be used to control the heat dissipation module to operate when the chip temperature is greater than or equal to a first temperature threshold; and to control the chip to adopt a low-power mode when the chip temperature is higher than a second temperature threshold. Wherein, the second temperature threshold is greater than the first temperature threshold.
8. The chip temperature detection device according to claim 1, characterized in that, Also includes: A fixed resistor, together with the temperature acquisition module, forms a voltage divider, which is connected to the input terminal of the analog-to-digital converter; the output terminal of the analog-to-digital converter is connected to the control module.
9. The chip temperature detection device according to claim 7, characterized in that, The heat dissipation module includes at least one of a fan, heat pipe, fins, and liquid cooler.