Lithium niobate film electro-optical modulator

Abstract

The utility model relates to the technical field of modulators, in particular to a lithium niobate film electro-optical modulator, which comprises a modulator chip and a tube shell, the modulator chip is packaged in the tube shell, the modulator chip is a chip developed based on film lithium niobate materials, a heat dissipation fixing seat is supported outside the modulator chip, and the heat dissipation fixing seat is fixed on the tube shell. A first RF connector and a second RF connector are symmetrically assembled outside the tube shell, the inner end of the first RF connector and the inner end of the second RF connector are connected with a modulator chip through a transmission line plate, the two ends of the modulator chip are connected with external optical fibers through FA optical fiber array assemblies, and contact pins are symmetrically assembled on the side edges of the modulator chip in an inserted mode. And an inner joint is arranged at the inner end of the pin. According to the utility model, stable packaging and multi-selectivity matching use can be carried out conveniently during assembly and use, and the use and assembly efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to modulator technical field, concretely is a lithium niobate thin film electro -optic modulator. BACKGROUND

[0002] Lithium niobate thin film acts as the core medium of electro -optic effect by its remarkable electro -optic property. When external electric field is applied to lithium niobate thin film, the dielectric tensor of its crystal structure will change, and then the refractive index of the thin film changes. The change of the refractive index changes the phase, amplitude and other characteristics of the light signal passing through the thin film, and finally realizes the effective modulation of the light signal. The efficient use of this electro -optic effect ensures that the modulator can quickly and accurately convert the electrical signal into the optical signal, meets the demand of high-speed optical communication. With the rapid development of modern communication technology, data traffic grows explosively, and high requirements are put forward for the data transmission capacity of data center. In the optical communication system, the electro -optic modulator plays a key role, which is responsible for converting the electrical signal into the modulation form of optical signal to realize the efficient transmission of information. Its performance directly affects the key indicators such as data transmission rate, bandwidth, power consumption and integration of optical communication system.

[0003] For this, China application patent number: CN202420420771.5 discloses a kind of thin film lithium niobate electro -optic modulator, including lithium niobate modulator body, the dust screen is arranged in lithium niobate modulator body top end near one side, dismounting mechanism is arranged between the dust screen and lithium niobate modulator body;The dismounting mechanism includes installation slot, contraction slot, the installation slot is opened in lithium niobate modulator body top end, heat dissipation opening is opened in the inner wall bottom end of installation slot;

[0004] However, the existing electro -optic modulator is not convenient to stably package and multi-selective matching use when assembling and using, which affects the assembly efficiency of use;

[0005] Therefore, in order to solve the above problems, a kind of lithium niobate thin film electro -optic modulator is provided. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a kind of lithium niobate thin film electro -optic modulator, to solve the problem that the existing electro -optic modulator is not convenient to stably package and multi-selective matching use when assembling and using in the above background art, affects the assembly efficiency of use.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a lithium niobate thin-film electro-optic modulator, comprising a modulator chip and a housing, wherein the modulator chip is encapsulated inside the housing and is a chip developed based on thin-film lithium niobate material; a heat dissipation mounting base is externally supported on the modulator chip; RF connector one and RF connector two are symmetrically assembled on the outside of the housing, and the inner ends of RF connector one and RF connector two are connected to the modulator chip through a transmission line board; external optical fibers are assembled and connected to both ends of the modulator chip through an FA optical fiber array; pins are symmetrically inserted and assembled on the side of the modulator chip, and an inner connector is provided at the inner end of the pin.

[0008] As a further step of this solution, the inner connector is also electrically connected to the modulator chip through the transmission line board, and the inner connector has a screw hole corresponding to the pin.

[0009] As a further step of this solution, the outer wall of the inner connector is supported by a limiting support plate, and the outer wall of the inner connector is provided with a limiting groove corresponding to the limiting support plate. The limiting support plate is supported and assembled inside the tube shell.

[0010] As a further step in this solution, the transmission line board is an alumina ceramic plate with metal coplanar waveguide electrodes, and the electrode width of the transmission line board is consistent with the electrode width of the modulator chip area.

[0011] As a further step in this solution, the FA fiber array and the external fiber are connected by a cover plate and a slot, and both the cover plate and the slot are made of Schott high borosilicate glass.

[0012] As a further step in this solution, the FA fiber array and the modulator chip are electrically connected and then fixed with a curing adhesive.

[0013] As a further improvement to this solution, the heat dissipation mounting base is supported vertically on the inner wall of the tube housing, and then a full encapsulation operation is performed on the inside of the tube housing.

[0014] Compared with the prior art, the beneficial effects of this utility model are: this utility model facilitates stable packaging and multi-selective matching during assembly and use, which helps to improve assembly and use efficiency;

[0015] 1. This utility model, by providing a heat dissipation mounting base and an internal connector, facilitates the support of the modulator chip and pins on the inner wall of the housing during assembly, and then facilitates stable support and full encapsulation, making operation more convenient and efficient. This design improves the stability and practicality of the lithium niobate thin-film electro-optic modulator.

[0016] 2. This utility model, by providing RF connector one and RF connector two, facilitates the connection between its internal components and the modulator chip through the assembly and docking of external optical fiber and pins. This allows for easy switching between the two sides as needed during subsequent use. Furthermore, if one side is damaged during use, the other side can be replaced. This enhances the versatility and adaptability of subsequent use. Through this design, the stability and practicality of the lithium niobate thin-film electro-optic modulator are improved. Attached Figure Description

[0017] Figure 1 This is a three-dimensional sectional view of the structure of this utility model.

[0018] Figure 2 This is a side perspective three-dimensional schematic diagram of the overall structure of this utility model;

[0019] Figure 3 This is a bottom-view perspective view of the overall structure of this utility model;

[0020] Figure 4 This is an exploded three-dimensional view of a portion of the pin structure of this utility model.

[0021] In the diagram: 100, modulator chip; 101, heat sink mounting base; 110, housing; 120, pin; 121, internal connector; 122, insertion screw hole; 123, limiting support plate; 124, limiting groove; 130, RF connector one; 131, RF connector two; 140, transmission line board; 150, FA fiber array; 160, external fiber optic cable. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-4 One embodiment provided by this utility model:

[0024] A lithium niobate thin-film electro-optic modulator includes a modulator chip 100 and a housing 110. The modulator chip 100 is encapsulated inside the housing 110 and is a chip fabricated based on thin-film lithium niobate material. The modulator chip 100 is externally supported by a heat dissipation mounting base 101. The housing 110 is symmetrically equipped with an RF connector 130 and an RF connector 131. The inner ends of the RF connectors 130 and 131 are connected to the modulator chip 100 through a transmission line board 140. External optical fibers 160 are connected to both ends of the modulator chip 100 through an FA fiber array 150. Pins 120 are symmetrically inserted on the side of the modulator chip 100, and the inner end of the pins 120 is provided with an inner connector 121 to facilitate stable support and packaging and enhance compatibility.

[0025] As a more detailed embodiment, the inner connector 121 is also electrically connected to the modulator chip 100 through the transmission line board 140, and the inner connector 121 has a screw hole 122 corresponding to the pin 120 inside, so as to facilitate auxiliary electrical connection and assembly.

[0026] As more detailed in this embodiment, the outer wall of the inner connector 121 is supported by a limiting support plate 123, and the outer wall of the inner connector 121 is provided with a limiting groove 124 corresponding to the limiting support plate 123. The limiting support plate 123 is supported and assembled inside the tube shell 110. In this way, during assembly and use, it is convenient to provide limiting support according to the use needs, making the subsequent encapsulation more stable.

[0027] As described in more detail in this embodiment, the transmission line board 140 is an alumina ceramic plate with metal coplanar waveguide electrodes, and the electrode width of the transmission line board 140 is consistent with the electrode width of the modulator chip 100 area, so as to facilitate the transition during assembly and connection, and at the same time, the electrode width can be appropriately widened to improve the impedance at the docking point.

[0028] As described in more detail in this embodiment, the FA fiber array 150 and the external fiber 160 are connected by a cover plate and a slot, and both the plate and the slot are made of Schott high borosilicate glass. This facilitates auxiliary and stable docking according to the needs of use during assembly and use. After the FA fiber array 150 and the modulator chip 100 are electrically connected, they are fixed by a curing adhesive, so as to provide auxiliary limiting support and stability between them.

[0029] As described in more detail in this embodiment, the heat dissipation mounting base 101 is supported on the inner wall of the tube shell 110, and then the inside of the tube shell 110 is fully encapsulated to facilitate maintaining relative internal stability during assembly and use.

[0030] Working principle: During assembly and use, the modulator chip 100 is supported and assembled inside the housing 110 by the heat dissipation mounting base 101. During assembly, the FA fiber array 150 is electrically connected to the modulator chip 100 by the curing adhesive for auxiliary fixation. Then, with the cooperation of the corresponding slots and cover plates, the FA fiber array 150 and the external fiber 160 are connected and assembled. The external fiber 160 is then inserted and assembled on the outer wall of the housing 110. Furthermore, with the cooperation of the limiting support plate 123 and the inner connector 121, the pin 120 is stably supported and assembled. Then, the RF connector 130, RF connector 2 131 and the inner connector 121 are electrically connected to the modulator chip 100 through the transmission line board 140, which facilitates stable support and assembly, and assists in the subsequent stable and efficient fully sealed encapsulation of the housing 110, making subsequent operation more convenient and efficient. Thus, during use, it is convenient to selectively assemble according to the needs of use, making the compatibility higher. The operation ends here.

[0031] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or equivalent variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are considered equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. A lithium niobate thin-film electro-optic modulator, comprising a modulator chip (100) and a housing (110), wherein the modulator chip (100) is encapsulated inside the housing (110), and the modulator chip (100) is a chip fabricated based on thin-film lithium niobate material, characterized in that: The modulator chip (100) is externally supported by a heat dissipation mounting base (101). The outer casing (110) is symmetrically equipped with an RF connector one (130) and an RF connector two (131). The inner ends of the RF connector one (130) and the RF connector two (131) are connected to the modulator chip (100) through a transmission line board (140). The two ends of the modulator chip (100) are connected to external optical fibers (160) through an FA fiber array (150). Pins (120) are symmetrically inserted on the side of the modulator chip (100), and an inner connector (121) is provided at the inner end of the pin (120).

2. The lithium niobate thin-film electro-optic modulator according to claim 1, characterized in that: The inner connector (121) is also electrically connected to the modulator chip (100) through the transmission line board (140), and the inner connector (121) has a screw hole (122) corresponding to the pin (120) inside.

3. The lithium niobate thin-film electro-optic modulator according to claim 2, characterized in that: The outer wall of the inner connector (121) is supported by a limiting support plate (123), and the outer wall of the inner connector (121) is provided with a limiting groove (124) corresponding to the limiting support plate (123). The limiting support plate (123) is supported and assembled inside the tube shell (110).

4. The lithium niobate thin-film electro-optic modulator according to claim 1, characterized in that: The transmission line board (140) is an alumina ceramic plate with metal coplanar waveguide electrodes, and the electrode width of the transmission line board (140) is consistent with the electrode width of the modulator chip (100) region.

5. A lithium niobate thin-film electro-optic modulator according to claim 1, characterized in that: The FA fiber array (150) and the external fiber (160) are connected by a cover plate and a slot, and both the cover plate and the slot are made of Schott high borosilicate glass.

6. The lithium niobate thin-film electro-optic modulator according to claim 1, characterized in that: The FA fiber array (150) and the modulator chip (100) are electrically connected and then fixed with a curing adhesive.

7. The lithium niobate thin-film electro-optic modulator according to claim 1, characterized in that: The heat dissipation mounting base (101) is supported on the inner wall of the tube shell (110) from top to bottom, and then the tube shell (110) is fully encapsulated.

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