High-integration fingerprint module and structure

Abstract

The utility model provides a high-integration fingerprint module and a structure. The high-integration fingerprint module comprises a black outer conductive rubber ring, a substrate module, a black inner conductive rubber ring, a white light guide ring and the like. An existing semiconductor fingerprint module is low in production efficiency and high in cost. According to the application, a fingerprint sensor is packaged into an integrated module through an SIP packaging technology, a spi interface and a three-color lamp control interface are reserved, and after part of peripheral devices are pasted, the integrated fingerprint module with the three-color lamp is formed. The three-color lamp control is integrated into the sensor design; the SiP process is adopted, so that the PCB and sensor chip mounting process is omitted; the problem of invalidation of the silver paste is solved by fixing through an ultrasonic process; straight edges are added to fix the assembly direction. During production, the pasted and tested sensor large plate is cut firstly, then the components are installed in sequence, and finally the components are assembled and glued. According to the scheme, the production process is simplified, the cost is reduced, and the method can be adapted to various chips meeting requirements.

Description

Technical Field

[0001] This utility model relates to the field of fingerprint modules, and more specifically, to a highly integrated fingerprint module and its structure. Background Technology

[0002] With the advancement of technology, fingerprint recognition technology is increasingly widely used in modern life, from smartphone unlocking to security access control systems. As the core component for realizing fingerprint recognition, the performance and cost of fingerprint modules directly affect the market competitiveness of related products. Although early fingerprint module technology has improved in recognition accuracy and speed over the years, there are still many problems to be solved in terms of manufacturing processes and structural design.

[0003] The existing fingerprint module technology has several shortcomings. First, the current semiconductor fingerprint module manufacturing process requires sourcing sensors and algorithm chips from different suppliers. This decentralized procurement model increases the difficulty and cost of supply chain management, and there are also compatibility issues between components from different suppliers. After procurement, double-sided surface mounting is required. The surface mounting process for circular sensors is highly demanding, requiring strict skill levels from both production equipment and operators. Even slight errors can lead to defective mounting, affecting product quality. The entire production process is multi-step and time-consuming, severely hindering the improvement of production efficiency.

[0004] Traditional fingerprint modules often use silver paste for fixing and conductive connections during assembly. However, silver paste is prone to failure. With increased usage time or the influence of environmental factors (such as changes in temperature and humidity), the conductivity of the silver paste will decrease, and it may even break, leading to unstable module performance, affecting the accuracy and reliability of fingerprint recognition, and increasing after-sales maintenance costs.

[0005] Traditional fingerprint modules require specialized PCBs to house and connect various electronic components. Furthermore, an additional lighting control chip is needed to implement the light indicator function. These extra raw materials increase manufacturing costs, making the product less competitive in the market. Traditional fingerprint modules have their algorithm chips fixed in the design, meaning they can only be used with specific algorithm chips, preventing flexible selection based on different customer needs and application scenarios. If a customer has specific requirements for fingerprint recognition performance or functionality, the module needs to be redesigned and developed, increasing product development time and costs. Traditional fingerprint modules also suffer from limited connectivity and poor compatibility when connecting to external devices. Differences in interface standards and electrical characteristics between different devices prevent fingerprint modules from connecting and communicating properly with certain devices, limiting their application scope.

[0006] Traditional fingerprint modules suffer from insufficient structural stability and loose connections between components, making them susceptible to loosening or damage from external impacts or vibrations, thus affecting normal operation. Furthermore, traditional fingerprint modules lack effective protective measures, failing to adequately resist the intrusion of external factors such as dust and moisture. Prolonged exposure to harsh environments can lead to corrosion and damage to internal components, reducing product lifespan and reliability. Therefore, we have made improvements by proposing a highly integrated fingerprint module and structure. Utility Model Content

[0007] The purpose of this utility model is to address the problems raised in the existing background technology. To achieve the above-mentioned purpose, this utility model provides the following technical solution: a highly integrated fingerprint module, including a black outer conductive rubber ring and a substrate module disposed at the front end of the black outer conductive rubber ring. A black inner conductive rubber ring is embedded in a circular groove inside the substrate module, and a white light guide ring is nested in the connection between the black outer conductive rubber ring and the substrate module. The white light guide ring is made of insulating silicone material.

[0008] As a preferred technical solution of this utility model, a light guide ring is installed on the black outer conductive rubber ring.

[0009] As a preferred technical solution of this utility model, a sensor board is provided between the black outer conductive rubber ring and the substrate module, and a substrate is installed on the tail plate of the sensor board, while external devices are connected to the front plate.

[0010] As a preferred technical solution of this utility model, a sensor component is electrically mounted on the outer plate of the substrate, and a gold wire fixing pad is provided between the substrate module and the substrate, with gold wires connected to the gold wire fixing pad.

[0011] As a preferred technical solution of this utility model, a test point is provided below the external device, and a tri-color lamp is connected to one side of the test point. The external device, the test point, and the tri-color lamp are all located on the front panel of the sensor board.

[0012] As a preferred technical solution of this utility model, an external connection socket is electrically installed at the center end of the sensor board, and the external connection socket is located below the test point.

[0013] As a preferred technical solution of this utility model, conductive silicone contact points are provided on the outer edge of the sensor plate, and there are three conductive silicone contact points arranged in a ring array.

[0014] As a preferred technical solution of this utility model, the outer plate of the light guide ring is provided with a square slot, and the external connector is inserted into the square slot.

[0015] Compared with existing technologies, the advantages of this invention are as follows: This invention adopts SiP packaging technology, directly using the sensor substrate as the main body of the fingerprint module, eliminating the need for a PCB required by traditional modules, reducing the use of raw materials, and effectively lowering material costs. Simultaneously, the integration of tri-color LED control into the sensor design eliminates the need for subsequent LED control chips, further reducing material costs.

[0016] This invention reduces production costs by eliminating the sensor mounting process and associated costs, simplifying the production flow, and lowering labor and equipment operating costs. Traditional semiconductor fingerprint modules require sourcing sensors and algorithm chips from different suppliers, followed by double-sided mounting before assembly and testing can begin. This solution, however, uses SiP packaging technology to encapsulate the bare sensor die on the front side of a substrate using gold wire bonding. Customers only need to mount the relevant components on the back side, significantly reducing production costs.

[0017] Traditional circular sensor surface mount technology (SMT) requires advanced technology and has low production efficiency. This solution, however, uses SiP (System-in-Package) technology to integrate multiple functional modules onto a single substrate, avoiding complex SMT processes and making the production process simpler and more efficient.

[0018] This invention adds a straight edge to the structural shape, fixing the assembly direction of the module, reducing debugging time and error rate during assembly, and improving production efficiency. Simultaneously, it uses an ultrasonic process to fix the attached sensor portion with decorative and conductive rubber rings, replacing the traditional silver paste application process. This solves the problem of silver paste failure, further improving production efficiency and product quality stability.

[0019] This invention integrates tri-color light control directly into the sensor design, giving the fingerprint module a light indication function without the need for an additional light control chip. This saves costs, achieves functional integration, and improves the overall performance and usability of the module. A test point is located below the external device, with a tri-color light connected to one side. The tri-color light can display different colors according to different working states or test results, providing intuitive status indications for production testing and user use, facilitating troubleshooting and performance testing.

[0020] Because this invention does not have a fixed algorithm chip, the fingerprint module can be adapted to various chips that meet the requirements, allowing customers to choose the right model based on their needs and application scenarios. Customers can select the most suitable algorithm chip to match the fingerprint module according to different performance requirements and cost budgets, improving product flexibility and market adaptability. The external connection sockets and conductive silicone contacts on the sensor board enable good electrical connection and signal transmission with external devices, ensuring compatibility between the fingerprint module and different devices and expanding the product's application range.

[0021] The substrate module, the attached sensor board, and the conductive rubber ring are fixed together using an ultrasonic process, ensuring a tight fit between the module components and a more stable structure. This effectively resists external impacts and vibrations, improving product reliability and durability. A black inner conductive rubber ring is embedded in a circular groove inside the substrate module, and a white light guide ring is nested between the outer panel and the substrate module. These designs provide excellent protection, preventing collisions from external objects, dust, and moisture intrusion, protecting internal components from damage, and extending the product's lifespan. Attached Figure Description

[0022] Figure 1 This is a structural schematic diagram of the present invention;

[0023] Figure 2 This is a partial structural schematic diagram of the present invention;

[0024] Figure 3 This is a partial structural schematic diagram of the present invention;

[0025] Figure 4 A schematic diagram of the external connection seat structure provided by this utility model;

[0026] Figure 5 This is a structural schematic diagram of the present invention;

[0027] Figure 6 This is a top view of the structure provided for this utility model.

[0028] The image shows:

[0029] 1. Black outer conductive rubber ring; 2. Substrate module; 3. Black inner conductive rubber ring; 4. White light guide ring; 5. Light guide ring; 6. Sensor board; 7. Substrate; 8. Sensor components; 9. Gold wire fixing pad; 10. Gold wire; 11. External components; 12. Test point; 13. Tri-color lamp; 14. External connector; 15. Conductive silicone contact point; 16. Square slot. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0031] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely illustrates some embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. It should be noted that, in the absence of conflict, the embodiments and features and technical solutions in the embodiments of this utility model can be combined with each other. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] Example 1: A highly integrated fingerprint module includes a black outer conductive ring 1 and a substrate module 2 disposed at the front end of the black outer conductive ring 1. A black inner conductive ring 3 is embedded in a circular groove inside the substrate module 2, and a white light guide ring 4 is nested in the connection between the black outer conductive ring 1 and the substrate module 2. A light guide ring 5 is mounted on the black outer conductive ring 1. A sensor board 6 is disposed between the black outer conductive ring 1 and the substrate module 2, and a substrate 7 is mounted on the tail plate of the sensor board 6, while an external device 11 is connected to the front plate. A sensor component 8 is electrically mounted on the outer plate of the substrate 7. A gold wire fixing pad 9 is disposed between the substrate module 2 and the substrate 7, and a gold wire 10 is connected to the gold wire fixing pad 9. A test point 12 is disposed below the external device 11, and a tri-color LED 13 is connected to one side of the test point 12. The external device 11, the test point 12, and the tri-color LED 13 are all located on the front plate of the sensor board 6. The sensor board 6 has an external connector 14 electrically mounted at its center, and the external connector 14 is located below the test point 12.

[0033] Conductive silicone contact points 15 are provided on the outer edge of the sensor board 6, and there are three conductive silicone contact points 15 arranged in a ring array. A square slot 16 is provided on the outer plate of the light guide ring 5, and the external connector 14 is inserted into the square slot 16. The highly integrated fingerprint module and structure utilizes SiP packaging technology to encapsulate the fingerprint sensor into an integrated module, solving the problems of low production efficiency and high cost of traditional semiconductor fingerprint modules. Its working principle mainly involves multiple aspects such as structural design, packaging technology, production process, and functional implementation, aiming to simplify the production process, reduce costs, and improve production efficiency.

[0034] Black outer conductive rubber ring 1 and substrate module 2: The black outer conductive rubber ring 1 serves as the main support structure of the entire module, with the substrate module 2 installed at its front end, serving both decorative and protective functions. The white light guide ring 4 nested in the connection between the two serves both as a buffer and shock absorber, protecting internal components, and as a conductor, used for electrostatic discharge or signal transmission, etc.

[0035] Black inner conductive rubber ring 3: Embedded in the inner circular groove of the substrate module 2, it further enhances the protection of internal components and prevents collisions with external objects and the intrusion of dust, moisture, etc.

[0036] Sensor board 6 and substrate 7: Sensor board 6 is positioned between the black outer conductive rubber ring 1 and the substrate module 2, and substrate 7 is mounted on the tail plate of sensor board 6. Sensor components 8 electrically mounted on the outer plate of substrate 7 are used to sense fingerprint information and convert the physical features of fingerprints, such as ridges and depressions, into electrical signals.

[0037] Gold wire fixing pad 9 and gold wire 10: The gold wire fixing pad 9 and the connected gold wire 10 between the substrate module 2 and the substrate 7 play the role of signal transmission, transmitting the fingerprint electrical signal sensed by the sensor component 8 to other related processing components.

[0038] External component 11, test point 12, and tri-color LED 13: External component 11 is connected to the front panel of sensor board 6. Test point 12 is located below external component 11 and is used to perform performance testing on the module during production to check whether the fingerprint recognition function is normal. Tri-color LED 13 is connected to one side of test point 12 and displays different colors of light according to different working states or test results, serving as an indicator.

[0039] External connector 14: The external connector 14, electrically mounted at the center of the sensor board 6, is located below the test point 12 and inserts into the square slot 16 on the outer plate of the light guide ring 5. The external connector 14 is used to connect the fingerprint module to external devices (such as mobile phone motherboards) to realize the transmission of fingerprint signals and communication with external devices.

[0040] Conductive silicone contact points 15: Three conductive silicone contact points 15 arranged in a ring array on the outer edge of the sensor board 6 are used for electrical connection with other components to realize functions such as signal transmission or grounding.

[0041] In the sensor design, the tri-color LED control is directly integrated, saving the cost of adding a separate LED control chip later. This means that the tri-color LED control function is integrated into the sensor circuit design during the fingerprint module design phase, reducing the use of additional chips and corresponding surface mount technology (SMT) processes.

[0042] By employing SiP (System-in-Package) technology, the sensor substrate directly serves as the main body of the fingerprint module, with the back reserved for peripheral components, tri-color LEDs, and the interface socket for the algorithm chip. This eliminates the need for a PCB section required in traditional modules, as well as the sensor surface mount process and associated costs. This integrated design combines multiple functional modules onto a single substrate, simplifying the module's structure and manufacturing process.

[0043] Using SIP packaging technology, the bare sensor die is packaged with gold wires on the front side of a substrate, while the back side of the substrate provides the sensor SPI signal interface socket, tri-color LEDs, and other peripheral components. When customers need to produce the device, they only need to mount the relevant components on the back side. Compared to traditional solutions, this saves one PCB and eliminates the need for sensor mounting, simplifying the entire production process and reducing production costs.

[0044] Because there is no fixed algorithm chip, the fingerprint module can be adapted to various chips that meet the requirements, allowing customers to choose the right model according to their needs. Customers can select the appropriate algorithm chip to use with the fingerprint module based on different application scenarios and performance requirements.

[0045] 1. Cutting the large sensor board: During production, the large sensor board that has been glued and tested is first cut into individual glued sensor boards 6 to ensure that each sensor board has undergone quality inspection and that its performance meets the requirements.

[0046] 2. Assembly and Fixing: The substrate module 2, the attached sensor board 6, and the conductive rubber ring are assembled in sequence and with a fixed orientation to ensure correct connection and signal transmission between components. After assembly, they are fixed by ultrasonic treatment. Ultrasonic treatment can ensure a tight bond between components, solving the problem of easy failure when applying silver paste to traditional fingerprint modules.

[0047] 3. Final Assembly: Finally, install the fixed parts into the light guide ring 5, apply glue, and after cooling, a complete fingerprint module is formed. Applying glue further fixes the components and enhances the stability and sealing of the module.

[0048] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, the present utility model is not limited to the specific embodiments described above. Therefore, any modifications or equivalent substitutions to the present utility model, and all technical solutions and improvements that do not depart from the spirit and scope of the utility model, are covered within the scope of the claims of the present utility model.

Claims

1. A highly integrated fingerprint module, comprising a black outer conductive rubber ring (1) and a substrate module (2) disposed at the front end of the black outer conductive rubber ring (1), characterized in that, A black inner conductive rubber ring (3) is embedded in the inner circular groove of the substrate module (2), and a white light guide ring (4) is nested between the black outer conductive rubber ring (1) and the connection between the substrate module (2).

2. The highly integrated fingerprint module according to claim 1, characterized in that, A light guide ring (5) is installed on the black outer conductive rubber ring (1).

3. A highly integrated fingerprint module according to claim 2, characterized in that, A sensor board (6) is disposed between the black outer conductive rubber ring (1) and the substrate module (2), and a substrate (7) is mounted on the tail plate of the sensor board (6), while an external device (11) is connected to the front plate.

4. A highly integrated fingerprint module according to claim 3, characterized in that, Sensor components (8) are electrically mounted on the outer plate of the substrate (7). A gold wire fixing pad (9) is provided between the substrate module (2) and the substrate (7), and a gold wire (10) is connected to the gold wire fixing pad (9).

5. A highly integrated fingerprint module according to claim 4, characterized in that, A test point (12) is provided below the external device (11), and a tri-color lamp (13) is connected to one side of the test point (12). The external device (11), the test point (12), and the tri-color lamp (13) are all located on the front panel of the sensor board (6).

6. A highly integrated fingerprint module according to claim 5, characterized in that, The sensor board (6) is electrically mounted with an external connector (14) at its center end, and the external connector (14) is located below the test point (12).

7. A structure of a highly integrated fingerprint module, characterized in that, The sensor board (6) has conductive silicone contact points (15) on its outer edge, and there are three conductive silicone contact points (15) arranged in a ring array.

8. The structure of a highly integrated fingerprint module according to claim 7, characterized in that, The outer plate of the light guide ring (5) is provided with a square slot (16), and the external connector (14) is inserted into the square slot (16).

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