Device for reducing grounding resistance

Abstract

The utility model discloses a device for reducing grounding resistance, and belongs to the technical field of grounding resistance reduction, and the key points of the technical scheme are that the device comprises a grounding plate and a plurality of ground pole pins, the grounding plate is connected with electrical equipment through a copper strip, the two ends of the grounding plate are bent upwards, the plurality of ground pole pins are vertically arranged, and the grounding plate is connected with the electrical equipment through the copper strip. And the plurality of ground electrode pins are uniformly distributed on the grounding plate, so that the effect of stably and reliably reducing the grounding resistance can be achieved.

Description

Technical Field

[0001] This application relates to the field of grounding resistance reduction technology, and in particular to an apparatus for reducing grounding resistance. Background Technology

[0002] High-frequency grounding technology is an indispensable part of modern electronic equipment and power systems, especially important in broadcast transmitter applications. High-frequency grounding not only effectively suppresses external interference signals, ensuring stable system operation, but also improves electromagnetic compatibility and reduces the impact of electromagnetic radiation. Furthermore, good high-frequency grounding can protect personnel safety, preventing electric shock accidents caused by contact with equipment casings. To achieve this goal, various high-frequency grounding technologies and devices are constantly emerging, dedicated to improving the performance and reliability of grounding systems.

[0003] Among existing methods for reducing grounding resistance, a common approach is to use metal grounding rods. These rods are typically made of copper or copper-plated materials, and their resistance is reduced by increasing the contact area when inserted into the soil.

[0004] However, the grounding effect of traditional metal grounding rods is unstable under different soil conditions, especially in dry or high resistivity soils. Therefore, there is an urgent need for a device that can reliably and stably reduce grounding resistance. Utility Model Content

[0005] In order to reliably and stably reduce grounding resistance, this invention provides a device for reducing grounding resistance.

[0006] The present invention provides a device for reducing grounding resistance, which adopts the following technical solution:

[0007] A device for reducing grounding resistance includes a grounding plate and grounding pins. The grounding plate is connected to an electrical device via a copper strip. Both ends of the grounding plate are bent upwards. Multiple grounding pins are vertically arranged and connected to the grounding plate. The multiple grounding pins are evenly distributed on the grounding plate.

[0008] By adopting the above technical solution, the grounding plate is connected to the electrical equipment via copper strips, ensuring good conductivity. Simultaneously, the upward bending design at both ends of the grounding plate strengthens its structural strength and effectively expands the grounding area without increasing the footprint, enhancing the grounding effect, improving the upward electromagnetic compatibility performance of the device, reducing electromagnetic interference, and improving the stability and reliability of the electrical equipment, while also reducing maintenance and repair costs. Multiple grounding pins are evenly distributed on the grounding plate, allowing the current to be more evenly distributed into the soil, effectively expanding the longitudinal conductivity of the device, thereby improving the grounding effect. In summary, this device not only effectively reduces grounding resistance but also improves the connection stability and reliability of electrical equipment.

[0009] Preferably, the ground plane is made of copper.

[0010] By adopting the above technical solution, the grounding plate is made of copper, which has conductive properties and reduces contact resistance, thereby effectively reducing the resistance value of the entire grounding system.

[0011] Preferably, the ground electrode pin is made of hot-dip galvanized angle steel.

[0012] By adopting the above technical solution, this design improves the corrosion resistance and mechanical strength of the grounding electrode pin, thereby extending the service life of the grounding electrode pin and ensuring the long-term stable operation of the grounding system.

[0013] Preferably, the bottom tip of the ground electrode pin is provided.

[0014] By adopting the above technical solution, the pointed tip design at the bottom of the grounding electrode pin makes it easier to insert the pin into the soil, thereby improving installation efficiency and reducing construction difficulty. At the same time, the pointed tip design helps reduce the contact resistance between the grounding electrode pin and the soil, further improving grounding performance.

[0015] Preferably, a connecting plate is provided between the ground electrode pin and the grounding plate. The connecting plate is bent, one end of the connecting plate is fixedly connected to the ground electrode pin, and the other end is fixedly connected to the grounding plate through multiple first bolts. The connecting plate is a conductor.

[0016] By adopting the above technical solution, the connection plate increases the contact area and stability between the ground electrode pin and the grounding plate, ensuring good electrical connection performance. The bent design of the connection plate improves the overall structural strength of the device. The fixed connection between the connection plate and the ground electrode pin and grounding plate is simple and reliable, facilitating installation and maintenance.

[0017] Preferably, the grounding plate is connected to a plurality of auxiliary plates, and the plurality of auxiliary plates are evenly distributed on the grounding plate.

[0018] By adopting the above technical solution, connecting multiple auxiliary plates to the grounding plate and distributing them evenly on the grounding plate can significantly increase the grounding area, improve the grounding effect, and further reduce the grounding resistance. At the same time, the even distribution of the auxiliary plates helps optimize current distribution, reduce localized overheating, and extend the service life of the device.

[0019] Preferably, the auxiliary plate is made of copper.

[0020] By adopting the above technical solution, the auxiliary plate is made of copper, which can significantly improve the conductivity of the auxiliary plate, thereby further reducing the resistance value of the entire grounding system.

[0021] Preferably, the auxiliary plate is bent upward at the end furthest from the ground plate.

[0022] By adopting the above technical solution, the end of the auxiliary plate furthest from the grounding plate is bent upwards, increasing the contact area between the auxiliary plate and the soil, improving the overall conductivity of the grounding device, and further reducing the grounding resistance. At the same time, the bent structure also enhances the mechanical strength of the auxiliary plate, improving the stability and durability of the device.

[0023] Preferably, the auxiliary plate is connected to the ground plate by a plurality of second bolts, and a pad is provided between the second bolts and the auxiliary plate. The top of the pad abuts against the head of the second bolt and the bottom abuts against the auxiliary plate.

[0024] By adopting the above technical solution, the connection between the auxiliary plate and the grounding plate is more stable and reliable, effectively reducing the problem of loosening due to vibration or soil movement, thereby improving the stability and reliability of the entire grounding system. At the same time, the use of the pad can also distribute the pressure of the second bolt on the auxiliary plate, reducing the possibility of local stress concentration and extending the service life of the device.

[0025] Preferably, a pipe communicating with the atmosphere is provided above the grounding plate, which can fill the area around the device for reducing grounding resistance with a resistance-reducing agent.

[0026] By adopting the above technical solution, the pipeline can be easily filled with resistance-reducing agent around the device, further reducing soil resistance. Furthermore, after prolonged use, the surrounding environment may deteriorate; therefore, it is convenient to replenish the resistance-reducing agent around the device to maintain its conductivity and reduce grounding resistance.

[0027] In summary, this utility model has the following beneficial effects:

[0028] 1. The grounding plate is connected to the electrical equipment via copper strips, ensuring good conductivity. The upward bending design at both ends of the grounding plate strengthens its structural integrity and effectively expands the grounding area without increasing the footprint, enhancing the grounding effect, improving the upward electromagnetic compatibility performance of the device, reducing electromagnetic interference, and improving the stability and reliability of the electrical equipment, while also lowering maintenance and repair costs. Multiple grounding pins are evenly distributed on the grounding plate, allowing current to be more evenly distributed into the soil, effectively expanding the longitudinal conductivity of the device, thereby improving the grounding effect. In summary, this device not only effectively reduces grounding resistance but also improves the connection stability and reliability of electrical equipment.

[0029] 2. Connecting multiple auxiliary plates to the grounding plate and distributing them evenly on the grounding plate can significantly increase the grounding area, improve the grounding effect, and further reduce the grounding resistance. At the same time, the even distribution of the auxiliary plates helps optimize current distribution, reduce localized overheating, and extend the service life of the device.

[0030] 3. A pipe connected to the atmosphere is provided above the grounding plate to facilitate the filling of resistance-reducing agent around the device for reducing grounding resistance, thereby reducing soil resistance. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of a device used to reduce grounding resistance.

[0032] Figure 2 yes Figure 1 An enlarged schematic diagram of part A in the middle.

[0033] Figure 3 This is a diagram showing the location of the pipeline.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Grounding plate; 2. Grounding pin; 3. Connecting plate; 4. First bolt; 5. Auxiliary plate; 6. Second bolt; 7. Washer plate; 8. Pipe. Detailed Implementation

[0036] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0037] In the description of the embodiments of this application, the words "for example" or "for instance" are used to indicate examples, illustrations, or explanations. Any embodiment or design that is described as "for example" or "for instance" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design options. Rather, the use of the words "for example" or "for instance" is intended to present the relevant concepts in a specific manner.

[0038] In the description of the embodiments of this application, the term "multiple" means two or more. For example, multiple systems means two or more systems, and multiple screen terminals means two or more screen terminals. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0039] Example 1

[0040] A device for reducing grounding resistance, as described above. Figure 1 It includes a ground plane 1 and ground pins 2. The ground plane 1 is connected to the electrical equipment via a copper strip. Both ends of the ground plane 1 are bent upwards at a 90-degree angle. Multiple ground pins 2 are vertically arranged and fixedly connected to the ground plane 1. The multiple ground pins 2 are evenly distributed on the ground plane 1.

[0041] The grounding plate 1 is connected to the electrical equipment via copper strips, ensuring good conductivity. The upward bending design at both ends of the grounding plate 1 strengthens its structural integrity and effectively expands the grounding area without increasing the footprint, thus enhancing the grounding effect, improving the upward electromagnetic compatibility of the device, reducing electromagnetic interference, and increasing the stability and reliability of the electrical equipment, while also lowering maintenance and repair costs. Multiple grounding pins 2 are evenly distributed on the grounding plate 1, allowing the current to be more evenly distributed into the soil, effectively expanding the longitudinal conductivity of the device, thereby improving the grounding effect.

[0042] Reference Figure 1 The ground plane 1 can be made of various conductive materials, such as copper and aluminum. In this embodiment, copper is selected, and preferably red copper. Red copper has excellent conductivity and corrosion resistance, and can maintain stable performance in various environments.

[0043] Reference Figure 1The grounding plate 1 is U-shaped, consisting of a horizontal section and two vertical sections. Four grounding pins 2 are provided, located at the four corners of the horizontal section of the grounding plate 1. The grounding pins 2 are made of hot-dip galvanized angle steel, with pointed ends.

[0044] Hot-dip galvanizing enhances the corrosion resistance of angle steel and extends its service life. The pointed tip design reduces insertion resistance and improves construction efficiency.

[0045] Reference Figure 1 and Figure 2 A connecting plate 3 is provided between the ground electrode pin 2 and the grounding plate 1. The connecting plate 3 is bent at a 90-degree angle. The connecting plate 3 is a conductor and is made of flat iron. The side wall of the vertical section of the connecting plate 3 is fixedly connected to the side wall of the ground electrode pin 2, and the side wall of the horizontal section of the connecting plate 3 is fixed to the grounding plate 1 by multiple first bolts 4. Specifically, both the connecting plate 3 and the grounding plate 1 are threadedly connected to the first bolts 4.

[0046] The connection plate 3 increases the contact area and stability between the ground pin 2 and the grounding plate 1, ensuring good electrical connection performance.

[0047] Reference Figure 1 The grounding plate 1 is connected to multiple auxiliary plates 5, which are evenly distributed on the grounding plate 1. In this embodiment, four auxiliary plates 5 are provided, and the four auxiliary plates 5 are respectively located at the four corners of the horizontal part of the grounding plate 1. The auxiliary plates 5 can further increase the contact area with the soil and improve the grounding effect. The auxiliary plates 5 are made of copper, preferably red copper, which has excellent conductivity and corrosion resistance.

[0048] Reference Figure 1 and Figure 2 The auxiliary plate 5 is fixed to the ground plate 1 by multiple second bolts 6. Specifically, both the auxiliary plate 5 and the ground plate 1 are threadedly connected to the second bolts 6. A washer 7 is provided between the second bolts 6 and the auxiliary plate 5. The washer 7 is elongated and multiple in number. The washer 7 is parallel to each other and arranged at intervals. Multiple second bolts 6 pass through each washer 7. The top of the washer 7 abuts against the head of the second bolt 6, and the bottom abuts against the auxiliary plate 5. The second bolts 6 are threadedly connected to the washer 7. The washer 7 is made of copper.

[0049] The pad 7 increases the stability and conductivity of the connection, preventing poor contact caused by a loose bolt. At the same time, it disperses the pressure of the second bolt 6 on the auxiliary plate 5, reducing the possibility of localized stress concentration and extending the service life of the device.

[0050] Reference Figure 1 The auxiliary plate 5 is bent upwards at the end furthest from the grounding plate 1, with a bending angle of 90 degrees. This increases the number of contact points with the soil and improves the grounding effect.

[0051] The bending design of auxiliary plate 5 increases the contact area between auxiliary plate 5 and soil, improves the overall conductivity of the grounding device, and further reduces the grounding resistance.

[0052] The implementation principle of this embodiment is as follows: Through the combined design of the grounding plate 1, auxiliary plate 5, and grounding pins 2, not only can the grounding resistance be effectively reduced, but the connection stability and reliability of electrical equipment can also be improved. Specifically, the upward bending of both ends of the grounding plate 1 strengthens its structural strength and effectively expands the grounding area without increasing the footprint, thereby enhancing the grounding effect, improving the upward electromagnetic compatibility performance of the device, reducing electromagnetic interference, and improving the stability and reliability of the electrical equipment. The auxiliary plate 5 can further increase the contact area with the soil, improving the grounding effect. Multiple grounding pins 2 are evenly distributed on the grounding plate 1, allowing the current to be more evenly distributed into the soil, effectively expanding the longitudinal conductivity of the device, thereby improving the grounding effect.

[0053] Example 2

[0054] The difference between this embodiment and Embodiment 1 above is that, referring to... Figure 3 A pipe 8 is provided above the grounding plate 1. The top end of the pipe 8 passes through the ground surface and is connected to the atmosphere, allowing resistance-reducing agent to be filled around the device for reducing grounding resistance. The resistance-reducing agent can be a salt or electrolyte solution, such as sodium chloride solution or copper sulfate solution.

[0055] Reference Figure 3 The material of pipe 8 can be PVC or PE plastic, which has good corrosion resistance and flexibility. The diameter and length of pipe 8 should be adjusted according to actual needs. A valve is installed at the top of pipe 8 to control the injection amount of drag-reducing agent. The valve can be a manual or electric valve, depending on the actual application scenario.

[0056] By installing pipe 8 above grounding plate 1, resistance-reducing agent can be easily filled around the device, further reducing soil resistance. Furthermore, after prolonged use, the surrounding environment may deteriorate; the device's ability to easily replenish resistance-reducing agent maintains conductivity and reduces grounding resistance. The valve design makes the injection of resistance-reducing agent more controllable, resulting in a more stable grounding effect.

[0057] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A device for reducing ground resistance, characterized by: The utility model provides a kind of device for reducing ground resistance, including ground plate (1) and ground electrode pin (2), the ground plate (1) is connected with electrical equipment by copper band, two ends of the ground plate (1) are bent upwards, and multiple ground electrode pins (2) are vertically arranged and are connected with the ground plate (1), and multiple ground electrode pins (2) are evenly distributed on the ground plate (1).

2. A device for reducing ground resistance according to claim 1, characterized in that: The ground plate (1) is made of copper.

3. The device for reducing ground resistance according to claim 1, characterized in that: The ground electrode pin (2) is made of hot-dip galvanized angle steel.

4. The device for reducing ground resistance according to claim 1, characterized in that: The ground electrode pin (2) is provided with a sharp tip at the bottom end.

5. The device for reducing ground resistance according to claim 1, characterized in that: A connecting plate (3) is arranged between the ground electrode pin (2) and the ground plate (1), one end of the connecting plate (3) is fixedly connected with the ground electrode pin (2), the other end is fixedly connected with the ground plate (1) through multiple first bolts (4), and the connecting plate (3) is a conductor.

6. The device for reducing ground resistance according to claim 1, characterized in that: Multiple auxiliary plates (5) are connected with the ground plate (1), and the multiple auxiliary plates (5) are evenly distributed on the ground plate (1).

7. A device for reducing ground resistance according to claim 6, characterized in that: The auxiliary plate (5) is made of copper.

8. The device for reducing ground resistance according to claim 6, characterized in that: The end of the auxiliary plate (5) away from the ground plate (1) is bent upwards.

9. The device for reducing ground resistance according to claim 6, characterized in that: The auxiliary plate (5) is connected with the ground plate (1) through multiple second bolts (6), a spacer plate (7) is arranged between the second bolt (6) and the auxiliary plate (5), the top of the spacer plate (7) abuts against the head of the second bolt (6), and the bottom abuts against the auxiliary plate (5).

10. A device for reducing ground resistance according to any one of claims 1-9, characterized in that: A pipeline (8) in communication with the atmosphere is arranged above the ground plate (1), and a resistance-reducing agent can be filled around the device for reducing ground resistance.

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