Packaging circuit board and led lamp

Abstract

The utility model relates to the technical field of circuit boards, in particular to a packaging circuit board and an LED lamp. The packaged circuit board comprises a circuit board main body and a package, the circuit board main body comprises a base material layer, a circuit layer and an ink layer which are arranged in sequence; a first groove is formed in the circuit board main body; the package is embedded in the first slot; a conductive layer is arranged in the first groove and is connected with the circuit layer; and the pins of the package are connected with the conductive layer. The base material layer provides bearing and insulation effects, the circuit layer provides conduction effects, and the ink layer provides protection and insulation effects. The substrate layer is provided with a first groove, and then the circuit layer and the ink layer are arranged on the substrate layer. The conductive layer arranged in the first groove is conducted with the circuit layer, so that the package in the first groove can be conducted with the circuit layer through the conductive layer. According to the design, the package can be arranged on the circuit board without bonding wires, the package can be arranged in a high-density mode, and miniaturization of the circuit board is better facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially is a kind of encapsulation circuit board and led lamps and lanterns. BACKGROUND

[0002] Some encapsulation (Packaging, PKG) on the market is arranged in the groove of circuit board, then is welded on circuit board by the mode of bonding wire, this kind of design is not conducive to high-density encapsulation, and is not conducive to the miniaturization of circuit board.

[0003] For example, Chinese patent application number: CN202210440627.3 encapsulation structure and method of micro-LED device and display device. Specifically disclosed "the driving chip is arranged in the recess, and the chip soldering point on the upper surface of the driving chip is electrically connected with the circuit board soldering point on the upper surface of the circuit board around the recess". "The chip soldering point on the upper surface of the driving chip is electrically connected with the circuit board soldering point on the upper surface of the circuit board around the recess, which includes: the chip soldering point and the circuit board soldering point are electrically connected by bonding wire". This kind of design is welded on circuit board by the mode of bonding wire, this kind of design is not conducive to high-density encapsulation, and is not conducive to the miniaturization of circuit board. SUMMARY

[0004] Therefore, the utility model provides a kind of encapsulation circuit board in view of the lack of prior art, its main purpose is to provide a kind of encapsulation circuit board, which can be high-density encapsulation, conducive to the miniaturization of circuit board, to overcome the deficiency of prior art.

[0005] To achieve the above object, the utility model adopts the following technical scheme:

[0006] The application provides an encapsulation circuit board, which comprises a circuit board body and an encapsulation. The circuit board body comprises a substrate layer, a circuit layer and an ink layer arranged in sequence. A first groove is arranged on the circuit board body. The encapsulation is embedded in the first groove. A conductive layer is arranged in the first groove and connected with the circuit layer. The pins of the encapsulation are connected with the conductive layer.

[0007] Preferably, the pins of the encapsulation and the conductive layer are connected together by reflow soldering or conductive glue.

[0008] Preferably, the conductive layer is formed in the first groove by electroplating or chemical plating process.

[0009] Preferably, a gap T is left between the inner wall of the first groove and the encapsulation. The depth of the first groove is greater than or equal to the thickness of the encapsulation.

[0010] Preferably, the gap T is filled with insulating heat-conducting glue.

[0011] Preferably, the package is covered with a light-guiding package shell; the package shell is provided with mounting feet, which are attached to the substrate layer.

[0012] Preferably, the encapsulation shell includes a first light guide portion and a second light guide portion; the first light guide portion and the second light guide portion are connected, and their cross-sectional areas gradually decrease along the light direction.

[0013] Preferably, a screen printing layer is also provided on the ink layer; and a plurality of heat dissipation holes are provided through the main body of the circuit board.

[0014] Preferably, the substrate layer includes an insulating layer and a thermally conductive layer disposed alternately, wherein the top and bottom layers are both insulating layers.

[0015] This application provides an LED lamp, including a packaged circuit board, wherein the package is an LED light-emitting chip; the packaged circuit board is disposed inside a lampshade, and a transparent lamp cover is disposed on the lampshade.

[0016] This invention has significant advantages and beneficial effects compared with existing technologies. Specifically, as shown in the above technical solution, the substrate layer provides load-bearing and insulation, the circuit layer provides conductivity, and the ink layer provides protection and insulation. A first groove is formed on the substrate layer, and then the circuit layer and ink layer are formed on the substrate layer. The conductive layer in the first groove is conductive to the circuit layer, so the package in the first groove can be conductive to the circuit layer through the conductive layer. This design allows the package to be placed on the circuit board without wire bonding, and the package can be placed at high density, which is more conducive to the miniaturization of the circuit board. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the layered structure of an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the layered structure of an embodiment of the present invention.

[0019] Explanation of reference numerals in the attached diagram:

[0020] 10. Circuit board body; 11. Circuit layer; 12. Ink layer; 13. First groove; 14. Conductive layer; 15. Gap T; 16. Silk screen layer; 17. Heat dissipation hole; 110. Substrate layer; 111. Insulating layer; 112. Thermally conductive layer; 20. Encapsulation shell; 21. First light guide; 22. Second light guide; 23. Mounting pin; 24. Encapsulation. Detailed Implementation

[0021] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0022] Example 1

[0023] Please refer to Figure 1 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, which is a packaged circuit board.

[0024] The conductive layer 14 in the first slot 13 is connected to the circuit layer 11. Therefore, the package 24 in the first slot 13 can be connected to the circuit layer 11 through the conductive layer 14. This design allows the package 24 to be set at a high density, which is more conducive to the miniaturization of the circuit board.

[0025] This application provides a packaged circuit board, including a circuit board body 10 and a package 24. The circuit board body 10 includes a substrate layer 110, a circuit layer 11, and an ink layer 12 arranged sequentially. A first groove 13 is provided on the circuit board body 10. The package 24 is embedded in the first groove 13. A conductive layer 14 is provided in the first groove 13 and is connected to the circuit layer 11. The pins of the package 24 are connected to the conductive layer 14. The circuit layer 11 is disposed on the substrate layer 110 by electroplating or printing, and the ink layer 12 is sprayed on the circuit layer 11. The substrate layer 110 is the foundation of the PCB and is usually made of insulating materials, such as a composite material of fiberglass cloth and epoxy resin. This layer provides physical support for the PCB and ensures electrical isolation between layers. The choice of substrate layer 110 directly affects the mechanical strength, thermal stability, and electrical performance of the PCB. The circuit layer 11 is a metal layer on the PCB used to arrange circuit wires and is usually made of copper foil. The number and arrangement of conductive layers 14 will vary depending on the type of PCB (such as single-layer board, double-layer board, or multi-layer board). The main function of the conductive layer 14 is to conduct current, connect various electronic components, and realize circuit functions. The ink layer 12 can form a protective film on the surface of the circuit board to prevent the surface of the circuit board from being oxidized or chemically corroded. The conductive layer 14 is connected to the circuit layer 11, and the package 24 is embedded in the first slot 13. The pins of the package 24 are connected to the conductive layer 14. This design eliminates the need for extra solder wires or pins, saving more space. The packages 24 can be arranged in a high density, which is more conducive to the miniaturization of the circuit board.

[0026] Preferably, the pins of the package 24 are connected to the conductive layer 14 by reflow soldering or conductive adhesive. In this embodiment, reflow soldering is preferred. During production, multiple packages 24 can be placed into different first slots 13 and then mass-produced using reflow soldering equipment. This structural design helps to improve production efficiency.

[0027] Preferably, the conductive layer 14 is formed in the first tank 13 by electroplating or chemical plating. Electroplating and chemical plating processes are mature, low-cost, and can accurately place the conductive layer 14 in the first tank 13. In this embodiment, electroplating is preferably used to place the conductive layer 14 in the first tank 13. The conductive layer 14 and the circuit layer 11 are electrically connected.

[0028] Preferably, a gap T15 is provided between the inner wall of the first groove 13 and the package 24; the depth of the first groove 13 is greater than or equal to the thickness of the package 24. The gap T15 is very small, between 1mm and 0.1mm. Filling the gap T15 with thermally conductive adhesive can increase the contact area between the package 24 and the first groove 13, allowing heat to be transferred to the circuit board body 10 for heat dissipation more quickly. Preferably, the gap T15 is filled with insulating thermally conductive adhesive. The insulating thermally conductive adhesive can be one of red glue, yellow glue, thermally conductive silicone, epoxy thermally conductive adhesive, or thermally conductive silicone gel.

[0029] Preferably, the package 24 is covered with a light-guiding package shell 20; the package shell 20 is provided with mounting feet 23, which are adhered to the substrate layer 110. The package shell 20 is made of a light-guiding material, such as plastic or glass. In this embodiment, the package shell 20 is made of light-guiding acrylic. The package shell 20 is adhered to the substrate layer 110 with insulating adhesive. The insulating adhesive can be epoxy resin, acrylic resin, etc. The mounting feet 23 provide support, allowing the package shell 20 to be precisely placed on the package 24.

[0030] Preferably, the encapsulation shell 20 includes a first light guide portion 21 and a second light guide portion 22; the first light guide portion 21 and the second light guide portion 22 are connected, and their cross-sectional area gradually decreases along the light direction. In this embodiment, the encapsulation 24 is an LED light-emitting chip. The structure of the encapsulation shell 20 can increase the brightness of the LED chip and avoid shadows in the LED lamp.

[0031] Example 2

[0032] Please refer to Figure 2 As shown, a silkscreen layer 16 is also provided on the ink layer 12; a plurality of heat dissipation holes 17 are provided through the circuit board body 10. The silkscreen layer 16 is a text layer, which is the top layer in the PCB and is generally used for annotation. The heat dissipation holes 17 are used to dissipate heat from the circuit board body 10 and improve the heat dissipation performance of the circuit board.

[0033] Preferably, the substrate layer 110 includes an insulating layer 111 and a thermally conductive layer 112 disposed alternately, wherein both the top and bottom layers are insulating layers 111. The insulating layer 111 can be one of FR-4, FPC board, paper substrate, or fiberglass board. The thermally conductive layer 112 can be one of metal foil, metal mesh, or graphite mesh. After structural optimization, the substrate layer 110 has better thermal conductivity. The insulating layer 111 and the thermally conductive layer 112 are stacked together by adhesive bonding.

[0034] The method for setting up package 24 is as follows: 1. During PCB manufacturing, the first groove 13 is formed using machining or laser cutting technology. 2. Conductive material is deposited in the groove, and a conductive layer 14 is formed through electroplating. 3. During mounting, optical alignment equipment is used to ensure precise alignment between package 24 and the first groove 13. 4. Package 24 is directly embedded into the first groove 13 and fixed by soldering or conductive adhesive. 5. The design of the first groove 13 ensures tight contact between package 24 and the circuit board, reducing mechanical stress. 6. The conductive layer 14 in the first groove 13 forms a reliable electrical connection with the pins or pads of package 24.

[0035] This type of packaged circuit board also has at least the following advantages: 1. Improved mechanical stability between the package 24 and the circuit board, reducing the impact of vibration and shock on the connection. 2. Improved heat dissipation performance, with the recessed design increasing the contact area between the package 24 and the circuit board. 3. Improved electrical connection reliability and reduced signal transmission loss. 4. Suitable for high-density, high-performance electronic devices, meeting the needs of miniaturization and high-frequency applications.

[0036] Example 3

[0037] This application provides an LED lamp fixture, including the aforementioned packaged circuit board, wherein the package 24 is an LED light-emitting chip; the packaged circuit board is disposed inside a lampshade, and a transparent lamp cover is disposed on the lampshade. This type of LED lamp fixture, after incorporating the packaged circuit board, can produce higher brightness and can be made smaller. The package 24 can also be other chips, such as smart chips, CPUs, etc.

[0038] In summary, the key design feature of this invention lies in the first groove 13 formed on the substrate layer 110, upon which the circuit layer 11 and ink layer 12 are disposed. The conductive layer 14 disposed within the first groove 13 is conductive to the circuit layer 11; therefore, the package 24 within the first groove 13 can be conductive to the circuit layer 11 through the conductive layer 14. This design eliminates the need for wire bonding to mount the package 24 on the circuit board, allowing for high-density mounting of the packages 24, which is more conducive to the miniaturization of the circuit board.

[0039] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A packaged circuit board, characterized in that: It includes a circuit board body and a package; the circuit board body includes a substrate layer, a circuit layer, and an ink layer arranged sequentially; a first groove is provided on the circuit board body; the package is embedded in the first groove; A conductive layer is provided in the first slot, and the conductive layer is connected to the circuit layer. The pins of the package are connected to the conductive layer.

2. The packaged circuit board according to claim 1, characterized in that: The pins of the package are connected to the conductive layer by reflow soldering or conductive adhesive.

3. A packaged circuit board according to claim 1 or 2, characterized in that: The conductive layer is formed in the first tank by electroplating or chemical plating.

4. The packaged circuit board according to claim 1, characterized in that: A gap T is left between the inner wall of the first groove and the package; the depth of the first groove is greater than or equal to the thickness of the package.

5. A packaged circuit board according to claim 4, characterized in that: The gap T is filled with insulating and thermally conductive adhesive.

6. A packaged circuit board according to claim 1, characterized in that: The package is covered with a light-guiding encapsulation shell; the encapsulation shell is provided with mounting feet, which are attached to the substrate layer.

7. A packaged circuit board according to claim 6, characterized in that: The encapsulation shell includes a first light guide portion and a second light guide portion; the first light guide portion and the second light guide portion are connected, and their cross-sectional area gradually decreases along the direction of light.

8. A packaged circuit board according to claim 1, characterized in that: A silkscreen layer is also provided on the ink layer; several heat dissipation holes are provided through the main body of the circuit board.

9. A packaged circuit board according to claim 1 or 8, characterized in that: The substrate layer includes an insulating layer and a thermally conductive layer disposed alternately, wherein the top and bottom layers are both insulating layers.

10. An LED lighting fixture, characterized in that: The invention includes a packaged circuit board according to any one of claims 1-9, wherein the package is an LED light-emitting chip; the packaged circuit board is disposed inside a lampshade, and a transparent lamp cover is disposed on the lampshade.

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