Radio frequency signal end aggregation type packaging structure

Abstract

The utility model relates to the technical field of circuit elements, in particular to a radio frequency signal end aggregation type packaging structure, which comprises an aggregation type circuit board, and a transparent packaging cover is mounted on the aggregation type circuit board. According to the utility model, key elements such as the interface seat, the radio frequency chip, the integrated circuit, the capacitor and the like are integrated on the aggregation type circuit board, so that the whole radio frequency signal end aggregation type packaging structure is complete in function and high in integration level; the plurality of groups of vent holes which are uniformly arranged at equal intervals are formed in the surface of the polymerization type circuit board, and the supporting foot pads are arranged at the bottom, so that the heat dissipation performance of the circuit board is improved, and the stability and supporting performance of the structure are ensured. Besides, the transparent packaging cover is connected to the aggregation type circuit board through a fixing ring seat, and the heat dissipation effect of the whole packaging structure is further enhanced through a heat dissipation fan installed at a ventilation opening formed in the center of the top face of the transparent packaging cover, so that the radio frequency signal end can keep good stability and reliability under high-intensity work.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit element technical field, concretely is radio frequency signal end polymerization type packaging structure. BACKGROUND

[0002] With the rapid development of wireless communication technology, the performance of radio frequency (RF) signal end is increasingly important for various electronic devices. As a key part of wireless communication systems, the packaging technology of radio frequency signal end directly affects the quality of signals, the stability of systems and the overall performance of devices. In traditional radio frequency signal end packaging technology, due to the limitations of material selection and structure design, the heat dissipation effect is often unsatisfactory. Especially in high-frequency and high-power application occasions, if the heat generated inside cannot be dissipated in time, it will lead to high temperature, affecting the stability and life of the device. Under the trend of miniaturization and multifunctionalization, the traditional packaging technology is difficult to realize the effective integration of multiple functions, limiting the design flexibility and performance improvement space of the device. SUMMARY

[0003] The utility model aims at providing radio frequency signal end polymerization type packaging structure to solve the problem of low packaging integration and unsatisfactory heat dissipation effect in the above background technology.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] Radio frequency signal end polymerization type packaging structure, including polymerization type circuit board, install transparent packaging cover on polymerization type circuit board;

[0006] Install interface seat, radio frequency chip, integrated circuit and electric capacity on polymerization type circuit board, the surface of polymerization type circuit board is equipped with several groups of even equidistance arranged vent hole, the bottom four corners of polymerization type circuit board are all installed with support pad.

[0007] The bottom surface edge of the transparent packaging cover is installed with a fixed ring seat connected to the polymerization type circuit board, a ventilation opening is formed in the center of the top surface of the transparent packaging cover, and a heat dissipation fan is installed at the ventilation opening.

[0008] As a preferred, the polymerization type circuit board includes a substrate, and a heat dissipation coating with a thickness of 0.1-0.3mm is arranged on the top surface of the substrate.

[0009] As a preferred, an anti-collision shell is arranged on the bottom surface of the substrate, and the thickness of the anti-collision shell is 1-2mm.

[0010] As a preferred, the support pad is cylindrical and has a height of 2-5mm.

[0011] As a preferred, a dust screen is installed on the surface of the ventilation opening.

[0012] Preferably, the four top corners of the fixing ring seat are connected to the four top corners of the top surface of the polymer circuit board through fixing bolts.

[0013] Preferably, the top surface edge of the heat dissipation fan is provided with a mounting foot, and the mounting foot is connected to the inner top wall of the transparent packaging cover through locking bolts.

[0014] Compared with the prior art, the present application has the following beneficial effects:

[0015] 1. In the present application, the polymer circuit board is provided with integrated interface seat, RF chip, integrated circuit and capacitor and other key components, so that the entire RF signal end polymer packaging structure is perfect in function and high in integration; at the same time, the plurality of evenly and equidistantly arranged ventilation holes on the surface of the polymer circuit board and the supporting pad foot mounted on the bottom not only improve the heat dissipation performance of the circuit board, but also ensure the stability and supportability of the structure. In addition, the transparent packaging cover is connected to the polymer circuit board through the fixing ring seat, and the heat dissipation fan mounted at the ventilation opening in the center of the top surface of the transparent packaging cover further enhances the heat dissipation effect of the entire packaging structure, so that the RF signal end can maintain good stability and reliability under high intensity work.

[0016] 2. In the present application, the heat dissipation coating on the substrate can effectively dissipate the heat generated during the work of the polymer circuit board, reduce the temperature of the circuit board, improve the overall stability and prolong the service life. The anti-collision shell provided on the bottom surface of the substrate provides additional protection for the circuit board, prevents damage caused by impact during transportation or installation, and enhances the durability and reliability of the product.

[0017] 3. In the present application, the four top corners of the fixing ring seat are connected to the four top corners of the top surface of the polymer circuit board through fixing bolts, which facilitates installation or disassembly, and at the same time ensures the firm connection between the transparent packaging cover and the circuit board, improves the overall stability and safety of the packaging structure. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to make a further detailed explanation together with embodiments of the present application, but do not constitute a limitation of the present application.

[0019] Fig. 1 is a structural schematic view of the present application;

[0020] Fig. 2 is a sectional structural schematic view of the present application;

[0021] Fig. 3The utility model discloses a cross section structure schematic drawing of polymerization type circuit board.

[0022] 10, polymerization type circuit board;101, base plate;102, heat dissipation coating;103, anti-collision shell;11, interface seat;12, air hole;13, support pad;14, radio frequency chip;15, integrated circuit;16, electric capacity;

[0023] 20, transparent package cover;21, fixed ring seat;22, air vent;23, dust screen;

[0024] 30, fixed bolt;

[0025] 40, heat dissipation fan;41, mounting foot. DETAILED DESCRIPTION

[0026] The technical scheme in the utility model embodiments will be described clearly and completely below in conjunction with the utility model embodiments and the drawings of the specification, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor are within the protection scope of the utility model.

[0027] In the description of the utility model, it is understood that the orientation or position relation indicated by the terms "center", "vertical", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" are based on the orientation or position relation shown in the drawings, and only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it can not be understood as the limitation of the utility model.

[0028] The radio frequency signal end polymerization type package structure, such as Figs. 1-3As shown, the device includes a polymer circuit board 10, on which a transparent encapsulation cover 20 is mounted. The polymer circuit board 10 is equipped with an interface socket 11, an RF chip 14, an integrated circuit 15, and a capacitor 16. Several sets of evenly spaced ventilation holes 12 are formed on the surface of the polymer circuit board 10. Support feet 13 are installed at the four corners of the bottom of the polymer circuit board 10. A fixing ring seat 21 connected to the polymer circuit board 10 is installed on the bottom edge of the transparent encapsulation cover 20. A ventilation opening 22 is formed at the center of the top surface of the transparent encapsulation cover 20, and a cooling fan 40 is installed at the ventilation opening 22. Through the configuration of the polymer circuit board 10, key components such as the interface socket 11, RF chip 14, integrated circuit 15, and capacitor 16 are integrated, making the entire RF signal terminal polymer encapsulation structure functionally complete and highly integrated. Simultaneously, the several sets of evenly spaced ventilation holes 12 on the surface of the polymer circuit board 10, and the support feet 13 at the bottom, not only improve the heat dissipation performance of the circuit board but also ensure the stability and support of the structure. In addition, the transparent encapsulation cover 20 is connected to the polymer circuit board 10 through the fixing ring seat 21, and the cooling fan 40 installed at the ventilation opening 22 in the center of its top surface further enhances the heat dissipation effect of the entire encapsulation structure, so that the radio frequency signal end can maintain good stability and reliability under high-intensity operation.

[0029] Furthermore, the polymeric circuit board 10 includes a substrate 101. The top surface of the substrate 101 is provided with a heat dissipation coating 102 with a thickness of 0.1-0.3mm, and the bottom surface of the substrate 101 is provided with an anti-collision shell 103 with a thickness of 1-2mm. Through the heat dissipation coating 102 on the substrate 101, the polymeric circuit board 10 can more effectively dissipate the generated heat during operation, reduce the circuit board temperature, improve overall stability and extend service life. Through the anti-collision shell 103 provided on the bottom surface of the substrate 101, the circuit board is provided with additional protection to prevent damage from impacts during transportation or installation, thereby enhancing the durability and reliability of the product.

[0030] It is worth noting that the support foot 13 is cylindrical and 2-5mm high, providing stable support for the circuit board and ensuring an appropriate gap between the circuit board and the mounting surface, which is beneficial for heat dissipation and preventing short circuits.

[0031] The surface of the vent 22 is equipped with a dustproof mesh 23, which effectively prevents dust and debris from entering the encapsulation structure, keeps the internal environment clean, and reduces the risk of poor heat dissipation and component damage caused by dust accumulation.

[0032] Specifically, the four corners of the fixing ring seat 21 are connected to the four corners of the top surface of the polymer circuit board 10 by fixing bolts 30, which facilitates installation or disassembly, while ensuring a firm connection between the transparent encapsulation cover 20 and the circuit board, thereby improving the overall stability and safety of the encapsulation structure.

[0033] In addition, the top edge of the cooling fan 40 is equipped with mounting feet 41, which are connected to the inner top wall of the transparent encapsulation cover 20 by locking bolts, so that the cooling fan can be stably installed inside the encapsulation structure, effectively improving heat dissipation efficiency and ensuring the stability and reliability of the RF signal terminal under high-intensity operation.

[0034] The working principle of this RF signal terminal aggregated package structure:

[0035] First, place the polymer circuit board 10 in the predetermined installation position and use the support pads 13 to ensure that the circuit board and the mounting surface maintain an appropriate gap to improve heat dissipation and prevent short circuits. Then, use the fixing bolts 30 to tightly connect the four corners of the fixing ring seat 21 to the four corners of the top surface of the polymer circuit board 10 to prepare for the installation of the transparent encapsulation cover 20.

[0036] Next, align the bottom edge of the transparent enclosure 20 with the fixing ring seat 21 and ensure that it is securely installed. At this time, the ventilation opening 22 at the center of the top surface of the transparent enclosure 20 will be exposed, which facilitates the installation of the cooling fan 40. The cooling fan 40 is connected to the inner top wall of the transparent enclosure 20 through the mounting feet 41 on its top edge using locking bolts to ensure that the fan can work stably.

[0037] After installation, the RF signal terminal aggregated package structure can start working; the interface socket 11 will receive external RF signals, which will be processed by the RF chip 14, and then amplified and filtered by the integrated circuit 15 and capacitor 16 to finally output a stable RF signal; at the same time, the cooling fan 40 will work continuously to dissipate the heat generated by the circuit board through the ventilation holes 12 and ventilation openings 22, ensuring that the entire structure can maintain stable performance in high-temperature environments.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A radio frequency signal terminal aggregated package structure, including an aggregated circuit board (10), characterized in that: A transparent encapsulation cover (20) is installed on the polymer circuit board (10); The polymer circuit board (10) is equipped with an interface socket (11), an RF chip (14), an integrated circuit (15) and a capacitor (16). The surface of the polymer circuit board (10) is provided with several sets of ventilation holes (12) arranged evenly and equidistantly. Support pads (13) are installed at the four top corners of the bottom of the polymer circuit board (10). The bottom edge of the transparent encapsulation cover (20) is fitted with a fixing ring seat (21) connected to the polymer circuit board (10). A ventilation opening (22) is provided at the center of the top surface of the transparent encapsulation cover (20), and a cooling fan (40) is installed at the ventilation opening (22).

2. The RF signal terminal aggregated packaging structure according to claim 1, characterized in that: The polymer circuit board (10) includes a substrate (101), and the top surface of the substrate (101) is provided with a heat dissipation coating (102) with a thickness of 0.1-0.3 mm.

3. The RF signal terminal aggregated packaging structure according to claim 2, characterized in that: The bottom surface of the substrate (101) is provided with an anti-collision shell (103), and the thickness of the anti-collision shell (103) is 1-2 mm.

4. The RF signal terminal aggregated packaging structure according to claim 1, characterized in that: The support pad (13) is cylindrical and has a height of 2-5mm.

5. The RF signal terminal aggregated packaging structure according to claim 1, characterized in that: A dustproof net (23) is installed on the surface of the vent (22).

6. The RF signal terminal aggregated packaging structure according to claim 1, characterized in that: The four corners of the fixed ring seat (21) are connected to the four corners of the top surface of the polymer circuit board (10) by fixing bolts (30).

7. The RF signal terminal aggregated packaging structure according to claim 1, characterized in that: The top edge of the cooling fan (40) is fitted with mounting feet (41), which are connected to the inner top wall of the transparent enclosure (20) by locking bolts.

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