Fixing device and machining equipment

Abstract

The utility model belongs to the technical field of circuit board processing, and provides a fixing device and processing equipment, the processing equipment comprises the fixing device, the fixing device comprises an adsorption platform and an adjusting assembly, the adsorption platform is provided with an adsorption surface and a negative pressure interface, and the adsorption surface is provided with a plurality of adsorption subareas; the adjusting assembly is connected with the adsorption platform and used for adjusting the number of the adsorption subareas communicated with the negative pressure interface so as to change the effective adsorption area range of the adsorption surface, and the effective adsorption area can be flexibly adjusted according to the actual coverage conditions of circuit boards of different sizes. The fixing device can stably adsorb circuit boards of different sizes, and the production quality of the circuit boards is improved.

Description

Technical Field

[0001] This application belongs to the field of circuit board processing technology, and more specifically, relates to a fixing device and processing equipment. Background Technology

[0002] In the process of circuit board manufacturing, adsorption platforms are often used to adsorb and fix the circuit boards. However, in related technologies, the adsorption area layout of the adsorption platform is fixed during the design and manufacturing of the platform. When using an adsorption platform with a fixed adsorption area layout to adsorb circuit boards of different sizes, if the circuit board is too small to effectively cover the adsorption area, a serious vacuum leak will occur on the adsorption platform. This will significantly reduce the effective adsorption capacity of the entire adsorption platform, making it difficult to form a sufficient adsorption pressure difference at the bottom of the circuit board. Consequently, the circuit board will not be firmly adsorbed, and it will further cause the circuit board to shift during the processing, reducing the production quality of the circuit board. Utility Model Content

[0003] In order to overcome the problems existing in the prior art, the main objective of this application is to provide a fixing device and processing equipment.

[0004] To achieve the above objectives, this application specifically adopts the following technical solution:

[0005] According to a first aspect of the embodiments of this application, a fixing device is provided, comprising:

[0006] An adsorption platform, wherein the adsorption platform is provided with an adsorption surface and a negative pressure interface, and the adsorption surface has multiple adsorption zones;

[0007] An adjustment component is connected to the adsorption platform and is used to adjust the number of adsorption zones connected to the negative pressure interface to change the effective adsorption area range of the adsorption surface.

[0008] Optionally, the adsorption platform is provided with multiple chambers, and the multiple chambers are connected to the multiple adsorption zones one by one, wherein the negative pressure interface is connected to at least one of the chambers;

[0009] The adjustment component includes a housing and a stop block. The housing is connected to the adsorption platform and cooperates to form an air passage. The air passage connects each of the chambers. The stop block is used to control the opening and closing of the air passage between adjacent chambers to adjust the number of chambers connected to the negative pressure interface, thereby adjusting the number of adsorption zones connected to the negative pressure interface.

[0010] Optionally, the adjustment assembly further includes a drive member connected to the stop block, the drive member being used to move the stop block to block or open the airway between adjacent chambers.

[0011] Optionally, the adsorption platform is provided with a switching hole corresponding to the chamber, the housing is provided with a sliding groove, the sliding groove is connected to the switching hole to cooperate in forming the air passage, and the stop block is movably disposed in the sliding groove to control the opening and closing of the air passage between adjacent chambers.

[0012] Optionally, the fixing device further includes a clamping mechanism for clamping the circuit board placed on the adsorption surface.

[0013] Optionally, there may be multiple clamping mechanisms, which clamp different sides of the circuit board.

[0014] Optionally, the two clamping mechanisms are arranged opposite each other along a preset direction, and at least one of the two clamping mechanisms arranged opposite each other is adjustablely arranged on the adsorption platform along the preset direction, and the plurality of adsorption zones are distributed sequentially along the preset direction.

[0015] Optionally, in the two clamping mechanisms arranged opposite to each other, one clamping mechanism is fixedly arranged on the adsorption platform, and the other clamping mechanism is adjustablely arranged on the adsorption platform;

[0016] In the preset direction, the adsorption partition connected to the negative pressure interface is closer to the fixedly installed clamping mechanism than the other adsorption partitions.

[0017] Optionally, at least one of the clamping mechanisms is position-adjustable on the adsorption platform, and the clamping mechanism includes:

[0018] A rotating shaft, located on the side where the adsorption surface is located;

[0019] A clamping member is disposed on the rotating shaft, and when the rotating shaft rotates, it causes the clamping member to be lifted or pressed down relative to the adsorption surface; wherein...

[0020] In the position-adjustable clamping mechanism, the position of the rotating shaft relative to the adsorption platform is adjustable.

[0021] Optionally, the adsorption platform is provided with an installation groove; wherein, in the position-adjustable clamping mechanism, the driving component is detachably fixed at different positions of the installation groove to achieve position adjustment.

[0022] Optionally, the driving component includes:

[0023] Mounting component, which is movably disposed on the adsorption platform;

[0024] A drive source, wherein the drive source is disposed on the mounting component;

[0025] A slider, which is slidably connected to the mounting component and fixedly connected to the output shaft of the drive source;

[0026] A connecting rod, one end of which is hinged to the slider; and

[0027] A swing element, fixedly connected to the rotating shaft, and hinged to the other end of the connecting rod; wherein...

[0028] When the drive source drives the slider to slide, the slider drives the swinging member to swing around the axis of the rotating shaft through the connecting rod, so that the swinging member drives the rotating shaft to rotate.

[0029] According to a second aspect of the present application, a processing apparatus is provided, including a frame, a processing device, and a fixing device as described in any of the above. The fixing device and the processing device are both disposed on the frame. The adsorption surface of the fixing device is used to place a circuit board, and the processing device is used to process the circuit board placed on the adsorption surface.

[0030] The advantages of the fixing device and processing equipment provided in this application are as follows: Compared with the prior art, the fixing device of this application can change the effective adsorption area of ​​the adsorption platform by adjusting the number of adsorption zones connected to the negative pressure interface through the adjustment component. This allows the effective adsorption area to be flexibly adjusted according to the actual coverage of circuit boards of different sizes, which is conducive to the stable adsorption of circuit boards of different sizes by the adsorption platform and improves the production quality of circuit boards. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A three-dimensional structural diagram of the fixing device provided in one embodiment of this application. Figure 1 ;

[0033] Figure 2 A three-dimensional structural diagram of the fixing device provided in one embodiment of this application. Figure 2 ;

[0034] Figure 3 This is a three-dimensional structural diagram of an adsorption platform provided in one embodiment of this application. The dashed lines in the figure are the boundaries of adjacent adsorption zones.

[0035] Figure 4 A partial structural diagram of the adsorption platform provided in one embodiment of this application. Figure 1 ;

[0036] Figure 5 for Figure 4 Enlarged structural diagram at point A in the diagram;

[0037] Figure 6 A partial structural diagram of the adsorption platform provided in one embodiment of this application. Figure 2 ;

[0038] Figure 7 This is a front view schematic diagram of the adjustment component provided in one embodiment of this application;

[0039] Figure 8 This is a three-dimensional structural schematic diagram of an adjustment component provided in one embodiment of this application;

[0040] Figure 9 This is a top view of the adsorption platform provided in one embodiment of this application;

[0041] Figure 10 A three-dimensional structural diagram of the clamping mechanism provided in one embodiment of this application. Figure 1 ;

[0042] Figure 11 for Figure 10 Enlarged structural diagram at point B in the diagram;

[0043] Figure 12 A three-dimensional structural diagram of the clamping mechanism provided in one embodiment of this application. Figure 2 .

[0044] Explanation of key figure labels:

[0045] 10. Adsorption platform; 11. Adsorption surface; 12. Adsorption zone; 121. First adsorption zone; 122. Second adsorption zone; 123. Third adsorption zone; 13. Adsorption hole; 14. Chamber; 141. First chamber; 142. Second chamber; 143. Third chamber; 15. Negative pressure interface; 16. Air passage; 161. First air passage; 162. Second air passage; 17. Switching hole; 171. First switching hole; 172. Second switching hole; 173. Third switching hole; 174. Fourth switching hole; 18. Installation 20. Groove; 21. Adjustment component; 22. Stop block; 23. First stop block; 24. Second stop block; 25. Drive component; 26. First drive component; 27. Second drive component; 28. Housing; 29. ​​Slide groove; 20. First slide groove; 21. Second slide groove; 22. Clamping mechanism; 30. Rotating shaft; 31. Clamping component; 32. Drive component; 33. Mounting component; 34. Drive source; 35. Slider; 36. Connecting rod; 37. Swing component; 38. Fixed seat; F1. First direction; F2. Second direction. Detailed Implementation

[0046] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0047] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0048] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0050] It should be noted that the circuit boards in this application include, but are not limited to, printed circuit boards (PCBs), flexible printed circuit boards (FPCs), rigid-flex boards, high-density interconnect boards (HDIs), integrated circuit substrates (IC substrates), metal substrates, glass substrates, and ceramic substrates. The circuit boards in this application can be classified into single-layer boards and multi-layer boards according to their functions and structures.

[0051] Please refer to the following: Figures 1 to 12 The fixing device provided in the embodiments of this application will now be described.

[0052] Please see Figure 1 , Figure 2 and Figure 3 The fixing device includes an adsorption platform 10 and an adjustment component 20.

[0053] The adsorption platform 10 is provided with an adsorption surface 11 and a negative pressure interface 15. The adsorption surface 11 has multiple adsorption zones 12. An adjustment component 20 is connected to the adsorption platform 10. The adjustment component 20 is used to adjust the number of adsorption zones 12 connected to the negative pressure interface 15, thereby changing the effective adsorption area range in which the adsorption surface 11 can generate adsorption force. In other words, the adjustment component 20 can control the on / off state of the adsorption force of each adsorption zone 12 to adjust the range of the effective adsorption area.

[0054] The negative pressure interface 15 is used to connect to a negative pressure source, which evacuates the adsorption platform 10, causing the adsorption surface 11 to generate adsorption force. The effective adsorption area refers to the area where the adsorption surface 11 generates adsorption force when the negative pressure source evacuates the adsorption platform 10. It should be noted that the effective adsorption area consists of at least one adsorption partition 12 capable of generating adsorption force.

[0055] For example, when the fixing device needs to fix the circuit board to be processed, firstly, the circuit board to be processed is placed on the adsorption surface 11 of the adsorption platform 10, such as... Figure 1 Subsequently, based on the range of the adsorption surface 11 covered by the circuit board, the adjustment component 20 adjusts the connection between the adsorption partition 12 where the circuit board is located and the negative pressure interface, thereby changing the effective adsorption area range where the adsorption surface 11 can generate adsorption force, so that the effective adsorption area range matches the range of the adsorption surface 11 covered by the circuit board. Finally, a vacuum is drawn into the adsorption platform 10 by a negative pressure source, so that the effective adsorption area generates adsorption force to adsorb the circuit board.

[0056] Compared with the prior art, the fixing device provided in this application, by setting multiple adsorption zones 12 and adjusting the number of adsorption zones 12 connected to the negative pressure interface 15 using the adjusting component 20, controls the on / off state of the adsorption force of the adsorption zones 12, thereby changing the effective adsorption area range where the adsorption surface 11 can generate adsorption force. This allows the effective adsorption area to be flexibly adjusted according to the actual coverage of circuit boards of different sizes. For example, for small-sized circuit boards, the adsorption zones 12 covered by the circuit board generate adsorption force, while the remaining adsorption zones 12 do not generate adsorption force. This ensures that the adsorption force is concentrated and uniformly applied to the area actually covered by the circuit board, thereby effectively avoiding the dispersion of adsorption force by ineffective adsorption areas. This ensures that the adsorption force acts concentrated and uniformly on the circuit board, improving the stability and reliability of the circuit board being adsorbed and fixed.

[0057] Optionally, each adsorption zone 12 is provided with a plurality of adsorption pores 13, and the plurality of adsorption pores 13 on the adsorption zone 12 are evenly distributed.

[0058] Combined with appendix Figures 3 to 9 It is understood that the adsorption platform 10 has multiple chambers 14, each of which is connected to a corresponding adsorption zone 12. In other words, the number of chambers 14 is equal to the number of adsorption zones 12, and they are arranged in a one-to-one correspondence. Each adsorption zone 12 is provided with an adsorption hole 13, which is connected to the corresponding chamber 14; that is, each chamber 14 is connected to the adsorption hole 13 of the corresponding adsorption zone 12. The negative pressure interface 15 is connected to at least one of the chambers 14.

[0059] The regulating component 20 includes a stop 21 and a housing 23. The housing 23 is connected to the adsorption platform 10 and cooperates to form an air passage 16, which is used to transmit negative pressure. (See attached...) Figure 5 and Figure 6 Airway 16 connects each chamber 14; in other words, adjacent chambers 14 are connected through airway 16. Block 21 is used to control the opening and closing of airway 16 between adjacent chambers 14 to adjust the number of chambers 14 connected to negative pressure interface 15, thereby adjusting the number of adsorption zones 12 connected to negative pressure interface 15.

[0060] For example, the negative pressure port 15 is directly connected to one of the chambers 14, such as Figure 4The chamber 14, which is directly connected to the negative pressure interface 15, is the initial chamber. When the negative pressure source evacuates the initial chamber through the negative pressure interface 15, a negative pressure state is formed in the initial chamber, and the adsorption holes 13 of the corresponding adsorption partition 12 generate adsorption force. Since adjacent chambers 14 are interconnected through the air passage 16, after the negative pressure source evacuates the initial chamber, the negative pressure will be transmitted to other chambers 14 in sequence through the air passage 16. Thus, other chambers 14 are indirectly connected to the negative pressure interface 15 through the initial chamber. In this way, other chambers 14 also gradually form a negative pressure state, and the adsorption holes 13 of other adsorption partitions 12 also generate adsorption force. Since the baffle 21 is used to block or open the corresponding air passage 16, when the baffle 21 blocks the air passage 16, the chamber 14 behind the blocked air passage 16 cannot continue to obtain negative pressure, and the adsorption holes 13 of the corresponding adsorption partition 12 will not generate adsorption force; when the baffle 21 opens the air passage 16, the negative pressure can be transmitted normally, and the adsorption holes 13 of the corresponding adsorption partition 12 will generate adsorption force. Thus, the number of adsorption partitions 12 that can generate adsorption force can be controlled according to the size of the circuit board, thereby adjusting the range of the effective adsorption area. For example, if the circuit board size is small, the adsorption partitions 12 in the area covered by the circuit board generate adsorption force, and the baffle 21 blocks the air passages 16 in other areas; if the circuit board size is large, the corresponding air passages 16 are connected, so that more adsorption partitions 12 generate adsorption force.

[0061] The above technical solution controls the adsorption force of each adsorption zone 12 by blocking or opening the air passage 16 through the baffle 21, thereby controlling the number of adsorption zones 12 that can generate adsorption force through the adsorption holes 13. This allows for flexible adjustment of the effective adsorption area, ensuring that the effective adsorption area is fully compatible with the circuit board and that the adsorption force is concentrated and evenly applied to the area actually covered by the circuit board. Multiple chambers 14 are connected sequentially through the air passage 16, and only one negative pressure interface 15 is needed to connect to the negative pressure source. This eliminates the need to set up a separate negative pressure interface 15 for each chamber 14, greatly simplifying the connection structure between the adsorption platform 10 and the negative pressure source, reducing pipeline layout and sealing requirements, and lowering the manufacturing cost and maintenance difficulty of the fixing device.

[0062] Optionally, the number of baffles 21 is set according to the number of air passages 16, that is, the number of baffles 21 is equal to the number of air passages 16. For example, when there are multiple air passages 16, there are also multiple baffles 21, which are equal to the number of air passages 16, and the multiple baffles 21 are configured in a one-to-one correspondence with the multiple air passages 16. Of course, the number of baffles 21 can also be one, with one baffle 21 controlling the opening and closing of all air passages 16.

[0063] Alternatively, the adsorption surface 11 includes multiple adsorption zones 12, which are distributed sequentially along a set direction, and each adsorption zone 12 is provided with an adsorption hole 13. The adsorption platform 10 is provided with multiple chambers 14 and multiple negative pressure ports 15. The multiple chambers 14 are arranged one-to-one with the multiple adsorption zones 12 and are connected to the adsorption holes 13 of the corresponding adsorption zones 12. The multiple negative pressure ports 15 are connected one-to-one with the multiple chambers 14 and are respectively connected to a negative pressure source through multiple vacuum pipelines. The adjustment component 20 includes multiple solenoid valves, which are respectively arranged on multiple vacuum pipelines. By controlling the opening and closing state of each solenoid valve, the on / off state of each negative pressure port 15 is controlled, thus realizing that the adsorption force of each adsorption zone 12 is independently controllable, thereby changing the range of the effective adsorption area. For example, when the coverage area of ​​the circuit board is smaller than the maximum area formed by the multiple adsorption zones 12, the solenoid valves of the adsorption zones 12 that extend beyond the edge of the circuit board can be closed, so that the adsorption zones 12 extending beyond the edge of the circuit board do not generate adsorption force.

[0064] Alternatively, the adsorption surface 11 is provided with multiple adsorption holes 13, which are spaced apart. The adsorption platform 10 is provided with a chamber 14 and a negative pressure interface 15. The chamber 14 is connected to the multiple adsorption holes 13, and the negative pressure interface 15 is connected to the chamber 14. The adjustment component 20 includes a partition plate, which is movably disposed in the chamber 14. By moving the position of the partition plate, the size of the space connecting the chamber 14 and the negative pressure interface 15 is changed, thereby changing the range of the effective adsorption area.

[0065] Alternatively, the adsorption surface 11 is provided with a plurality of adsorption holes 13, which are spaced apart. The adjustment component 20 includes a baffle plate, which is movably disposed on the adsorption surface 11. By moving the baffle plate to cover or expose the adsorption holes 13 of the adsorption surface 11, the range of the effective adsorption area can be changed.

[0066] Combined with appendix Figure 7 and Figure 8 It is understood that the adjustment assembly 20 also includes a drive member 22, which is connected to the stop block 21. The drive member 22 is used to drive the stop block 21 to move to block or open the airway 16 between adjacent chambers 14.

[0067] The above technical solution automatically drives the stop 21 to move through the drive component 22 to block or open the airway 16 without manual operation. It can also quickly adjust the effective adsorption area, reducing the labor intensity of operators and avoiding errors that may occur during manual operation.

[0068] Optionally, the number of driving members 22 is equal to the number of stops 21. For example, if there are multiple stops 21, there are also multiple driving members 22, which are equal to the number of stops 21, and the multiple driving members 22 are connected to the multiple stops 21 in a one-to-one correspondence.

[0069] Optionally, the drive unit 22 may be, but is not limited to, a motor and a cylinder.

[0070] Combined with appendix Figures 4 to 9 It is understood that the adsorption platform 10 is provided with a switching hole 17 corresponding to the chamber 14, and the housing 23 is provided with a sliding groove 24. The sliding groove 24 communicates with the switching hole 17 to cooperate in forming an air passage 16. The stop block 21 is movably provided in the sliding groove 24 to control the opening and closing of the air passage 16 between adjacent chambers 14.

[0071] Optionally, the stop block 21 is used to block or expose the switching hole 17 to block or open the air passage 16. Specifically, the stop block 21 is driven by the drive member 22 to move within the slide groove 24, so that the stop block 21 blocks or exposes the switching hole 17. When the stop block 21 blocks the switching hole 17, the corresponding air passage 16 is blocked; when the stop block 21 exposes the switching hole 17, the corresponding air passage 16 is opened.

[0072] Alternatively, the drive unit 22 can also be directly connected to the adsorption platform 10, and the stop block 21 can be slidably disposed on the adsorption platform 10.

[0073] The above technical solution integrates the stop 21 onto the housing 23, making the adjustment component 20 a modular structure. This allows the adjustment component 20 to be assembled into independent modular structures before being mounted onto the adsorption platform 10, facilitating assembly and subsequent maintenance. The stop 21 slides within the groove 24 to either block or expose the switching hole 17, effectively improving the stability of its movement.

[0074] Please continue to refer to the appendix. Figure 1 as well as Figure 2 It is understood that, in addition to the adsorption platform 10 and the adjustment assembly 20, the fixing device also includes a clamping mechanism 30. The clamping mechanism 30 is used to clamp the circuit board (not shown in the figure) placed on the adsorption surface.

[0075] The above technical solution uses a clamping mechanism 30 to clamp the circuit board on the adsorption surface, and an adsorption platform 10 with an adjustable effective adsorption area based on the adjustment component 20, so that the circuit board placed on the adsorption surface can be more reliably fixed on the adsorption surface under the combined action of the adsorption force applied by the adsorption platform 10 and the clamping force applied by the clamping mechanism 30.

[0076] Please continue to refer to the appendix. Figure 1 as well as Figure 2It is understood that there are multiple clamping mechanisms 30. These multiple clamping mechanisms 30 clamp different sides of the circuit board. For example, if there are two clamping mechanisms 30, the two clamping mechanisms 30 can clamp opposite sides of the circuit board placed on the adsorption surface, or the two clamping mechanisms 30 can clamp adjacent sides of the circuit board placed on the adsorption surface. Of course, the number of clamping mechanisms 30 can also be three or four, so that any two clamping mechanisms 30 can clamp different sides of the circuit board placed on the adsorption surface.

[0077] It is understandable that among the multiple clamping mechanisms 30, two of them can be clamped along a preset direction (e.g., Figure 1 as well as Figure 2 The first direction F1 shown is arranged opposite to each other, and in the two clamping mechanisms 30 arranged opposite to each other, at least one clamping mechanism 30 is adjustablely arranged on the adsorption platform 10 along a preset direction. Combined with Figure 3 As shown, multiple adsorption zones 12 are distributed sequentially along a preset direction.

[0078] In this scheme, two clamping mechanisms 30 are arranged opposite each other along a preset direction, and the two clamping mechanisms 30 are arranged corresponding to the adsorption surface 11. The two clamping mechanisms 30 are used to jointly clamp the circuit board placed on the adsorption surface 11. At least one of the two clamping mechanisms 30 is adjustablely arranged on the adsorption platform 10 along a preset direction to adjust the distance between the two clamping mechanisms 30 in the preset direction.

[0079] Wherein, at least one of the two clamping mechanisms 30 is adjustablely disposed on the adsorption platform 10 along a preset direction, meaning that one clamping mechanism 30 is fixedly disposed on the adsorption platform 10, and the other clamping mechanism 30 is adjustablely disposed on the adsorption platform 10 along a preset direction. The adjustable clamping mechanism 30 adjusts its position in the preset direction to adjust the distance between the two clamping mechanisms 30 in the preset direction. Alternatively, both clamping mechanisms 30 are adjustablely disposed on the adsorption platform 10 along a preset direction, and the distance between the two clamping mechanisms 30 in the preset direction is adjusted by adjusting the position of one or both clamping mechanisms 30 in the preset direction.

[0080] For example, please continue to refer to the appendix. Figure 1 as well as Figure 2 When the fixing device needs to fix the circuit board to be processed, first, place the circuit board to be processed on the adsorption surface 11 of the adsorption platform 10, such as... Figure 1 Next, based on the dimensions of the circuit board in the first direction F1, adjust the position of one or two clamping mechanisms 30 in the first direction F1 to adjust the spacing between the two clamping mechanisms 30 in the first direction F1, so that the spacing between the two clamping mechanisms 30 in the first direction F1 matches the dimensions of the circuit board in the first direction F1, such as... Figure 2 Subsequently, the two clamping mechanisms 30 clamp the opposite sides of the circuit board respectively. Then, based on the extent of the circuit board covering the adsorption surface 11, the adjusting component 20 adjusts the effective adsorption area of ​​the adsorption surface 11 to match the extent of the circuit board covering the adsorption surface 11. Finally, a vacuum is drawn into the adsorption platform 10 using a negative pressure source, generating adsorption force in the effective adsorption area to adsorb the circuit board.

[0081] By adjusting at least one clamping mechanism 30 along the first direction F1 on the adsorption platform 10, the distance between the two clamping mechanisms 30 along the first direction F1 can be adaptively adjusted according to the size of the circuit board in the first direction F1, allowing the two clamping mechanisms 30 to precisely clamp the opposite sides of the circuit board. Understandably, by cooperating the adsorption platform 10 with an adjustable effective adsorption area and the two clamping mechanisms 30 with an adjustable clamping distance, the fixing device can adapt to circuit boards of various sizes without frequent component replacement, improving the versatility and practicality of the equipment, thereby increasing the production efficiency of the circuit board and reducing its production cost. Furthermore, the adsorption platform 10 and the two clamping mechanisms 30 work together; the adsorption platform 10 adsorbs and fixes the circuit board, while the two clamping mechanisms 30 clamp and fix the opposite sides of the circuit board. This dual fixing method ensures the stability of the circuit board fixation, effectively preventing movement or vibration during processing and ensuring the smooth progress of the circuit board laser processing.

[0082] Combined with appendix Figure 3 It is understood that multiple adsorption zones 12 are distributed sequentially along a preset direction, or they can be composed of multiple adsorption zones 12 that are continuously distributed along a preset direction and can generate adsorption force.

[0083] In addition, by distributing multiple adsorption partitions 12 along a preset direction and coordinating with the adjustment direction of the distance between the two clamping mechanisms 30, the distance between the two clamping mechanisms 30 and the number of adsorption partitions 12 that can generate adsorption force can be adjusted according to the size changes of different circuit boards in the preset direction, thereby realizing the high adaptability of the fixing device to the size changes of the circuit board in the preset direction.

[0084] For example, when the adjustment component 20 also includes a drive member 22, the distance between the two clamping mechanisms 30 in a preset direction is first adjusted according to the size of the circuit board to be processed. Then, the drive member 22 drives the stop block 21 to move according to the preset parameters, so that the stop block 21 blocks or opens the air passage 16, determines the number of adsorption partitions 12 that can generate adsorption force, and then adjusts the range of the effective adsorption area.

[0085] It should be noted that the number and size of the adsorption partitions 12 and chambers 14 are set according to the actual situation.

[0086] Combined with appendix Figure 3 , Figure 4 and Figure 6 For example, the adsorption platform 10 is placed horizontally, and there are three adsorption zones 12, which are distributed sequentially along the first direction F1, namely the first adsorption zone 121, the second adsorption zone 122, and the third adsorption zone 123. There are three chambers 14, namely the first chamber 141, the second chamber 142, and the third chamber 143. The first chamber 141 is located directly below the first adsorption zone 121, the second chamber 142 is located directly below the second adsorption zone 122, and the third chamber 143 is located directly below the third adsorption zone 123. The negative pressure port 15 is located at the bottom of the first chamber 141.

[0087] Combined with appendix Figure 5 and Figure 6 The adsorption platform 10 is provided with four switching holes 17, namely the first switching hole 171, the second switching hole 172, the third switching hole 173 and the fourth switching hole 174.

[0088] Combined with appendix Figures 5 to 8 The housing 23 has two sliding grooves 24, namely a first sliding groove 241 and a second sliding groove 242. The first sliding groove 241 cooperates with the adsorption platform 10 to form a first air passage 161 and covers the first switching hole 171 and the second switching hole 172. The second sliding groove 242 cooperates with the adsorption platform 10 to form a second air passage 162 and covers the third switching hole 173 and the fourth switching hole 174. There are two stops 21, namely a first stop 211 and a second stop 212. The first stop 211 is slidably disposed in the first sliding groove 241, and the second stop 212 is slidably disposed in the second sliding groove 242. There are two driving components 22, namely a first driving component 221 and a second driving component 222. The first driving component 221 is connected to the first stop 211 and is used to drive the first stop 211 to slide in the first slide groove 241. The second driving component 222 is connected to the second stop 212 and is used to drive the second stop 212 to slide in the second slide groove 242.

[0089] Combined with appendix Figure 3 , Figure 5 and Figure 6When the circuit board to be processed only covers the first adsorption zone 121, the first driving member 221 drives the first stop 211 to move, causing the first stop 211 to block the first switching hole 171, thereby blocking the first air passage 161, that is, the first chamber 141 and the second chamber 142 are not connected. In this state, when the negative pressure source evacuates the first chamber 141 through the negative pressure interface 15, the first chamber 141 generates negative pressure, while the second chamber 142 and the third chamber 143 have no negative pressure, that is, only the adsorption holes 13 of the first adsorption zone 121 generate adsorption force to adsorb the circuit board, while the second adsorption zone 122 and the third adsorption zone 123 have no adsorption force.

[0090] When the circuit board to be processed covers the first adsorption zone 121 and the second adsorption zone 122, the first driving member 221 drives the first stop 211 to move, so that the first stop 211 exposes the first switching hole 171 to open the first air passage 161, that is, the first chamber 141 and the second chamber 142 are connected. The second driving member 222 drives the second stop 212 to move, so that the second stop 212 blocks the third switching hole 173 to block the second air passage 162, that is, the second chamber 142 and the third chamber 143 are not connected. In this state, when the negative pressure source evacuates the first chamber 141 through the negative pressure interface 15, both the first chamber 141 and the second chamber 142 generate negative pressure, while the third chamber 143 has no negative pressure. That is, the adsorption holes 13 of the first adsorption zone 121 and the second adsorption zone 122 generate adsorption force to adsorb the circuit board, while the third adsorption zone 123 has no adsorption force.

[0091] When the circuit board to be processed covers the first adsorption zone 121, the second adsorption zone 122, and the third adsorption zone 123, the first driving member 221 drives the first stop 211 to move, exposing the first switching hole 171 to connect the first air passage 161, i.e., the first chamber 141 and the second chamber 142 are connected. The second driving member 222 drives the second stop 212 to move, exposing the second stop 212 to expose the third switching hole 173 to connect the second air passage 162, i.e., the second chamber 142 and the third chamber 143 are connected. In this state, when the negative pressure source evacuates the first chamber 141 through the negative pressure interface 15, negative pressure is generated in the first chamber 141, the second chamber 142, and the third chamber 143, i.e., the adsorption holes 13 of the first adsorption zone 121, the second adsorption zone 122, and the third adsorption zone 123 all generate adsorption force to adsorb the circuit board.

[0092] Combined with appendix Figure 1 and Figure 4 It is understandable that, among the two clamping mechanisms 30 arranged opposite to each other, one clamping mechanism 30 is fixedly mounted on the adsorption platform 10, and the other clamping mechanism 30 is adjustablely mounted on the adsorption platform 10 in a preset direction ( Figure 1In the first direction F1), the chamber 14 connected by the negative pressure port 15 is closer to the clamping mechanism 30 fixedly mounted on the adsorption platform 10 than the other chambers 14.

[0093] The above technical solution involves fixing one clamping mechanism 30 to the adsorption platform 10 and adjusting the other clamping mechanism 30 to the same platform. When different circuit boards have different dimensions in the first direction F1, the fixed clamping mechanism 30 remains stationary, while the position of the adjustable clamping mechanism 30 in the first direction F1 is changed to adjust the distance between the two clamping mechanisms 30 in the first direction F1. This eliminates the need for synchronous adjustment of the two clamping mechanisms 30, simplifying the operation process, shortening the time for circuit board positioning and fixing, and improving the preparation efficiency before circuit board processing. It also simplifies the overall structure and assembly process of the fixed clamping mechanism 30. By placing the chamber 14, which is directly connected to the negative pressure interface 15, closer to the clamping mechanism 30 fixed to the adsorption platform 10 than the other chambers 14, the effective adsorption area can be adjusted using the fixed clamping mechanism 30 as a reference side. The opening and closing of the air passage 16 can be controlled according to the dimensions of the circuit board extending from the reference side, allowing the adjustment of the effective adsorption area and the clamping distance to work in synergy, simplifying the operation process and improving adjustment efficiency.

[0094] Combined with appendix Figures 10 to 12 It is understood that the clamping mechanism 30 includes a rotating shaft 31 and a clamping member 32. The rotating shaft 31 is located on the side where the adsorption surface 11 is located, and the clamping member 32 is disposed on the rotating shaft 31. When the rotating shaft 31 rotates, it causes the clamping member 32 to be lifted or pressed down relative to the adsorption surface 11. Specifically, when the clamping member 32 rotates with the rotating shaft 31 and approaches the adsorption surface 11, the clamping member 32 presses down to press the circuit board firmly onto the adsorption surface 11, that is, the clamping member 32 cooperates with the adsorption surface 11 to clamp the circuit board, such as... Figure 12 When the clamping member 32 rotates with the rotating shaft 31 and moves away from the adsorption surface 11, the clamping member 32 lifts up, releasing the circuit board, as shown. Figure 10 .

[0095] Furthermore, since the position of the clamping mechanism 30 on the adsorption platform 10 is adjustable, the position of the rotating shaft 31 of the clamping mechanism 30 relative to the adsorption platform 10 is also adjustable. It is understood that the clamping member 32 is also located on the side where the adsorption surface 11 is located.

[0096] For example, taking two clamping mechanisms 30 arranged opposite each other along the first direction F1 as an example, in each clamping mechanism 30, the axis of the rotating shaft 31 is parallel to the second direction F2, and the second direction F2 is perpendicular to the first direction F1.

[0097] Please continue to refer to the appendix. Figures 10 to 12It is understood that the clamping mechanism 30 also includes a drive assembly 33. The drive assembly 33 is connected to the rotating shaft 31, and in the position-adjustable clamping mechanism 30, the drive assembly 33 is adjustablely disposed on the adsorption platform 10.

[0098] The driving assembly 33 drives the rotating shaft 31 to rotate relative to the adsorption platform 10 around its own axis, and the clamping member 32 rotates synchronously with the rotating shaft 31. Specifically, when the driving assembly 33 drives the rotating shaft 31 to rotate relative to the adsorption platform 10 around its own axis, the clamping member 32 rotates synchronously with the rotating shaft 31, causing the clamping member 32 to move closer to or away from the adsorption surface 11. Specifically, when the clamping member 32 rotates with the rotating shaft 31 and moves closer to the adsorption surface 11, the clamping member 32 presses down to press the circuit board firmly onto the adsorption surface 11, that is, the clamping member 32 cooperates with the adsorption surface 11 to clamp the circuit board, such as... Figure 12 When the clamping member 32 rotates with the rotating shaft 31 and moves away from the adsorption surface 11, the clamping member 32 lifts up, releasing the circuit board, as shown. Figure 10 .

[0099] The above technical solution uses a drive component 33 to drive the rotating shaft 31 to rotate relative to the adsorption platform 10. The clamping member 32 lifts or presses down as the rotating shaft 31 rotates. The structure is simple and the action is stable. It can accurately act on the edge of the circuit board. When released, the clamping member 32 can completely detach from the circuit board without interfering with the picking and putting of the circuit board. Moreover, the drive component 33 drives the rotating shaft 31 and the clamping member 32 to rotate automatically without manual operation, which helps to reduce the intensity of manual labor and avoids problems such as uneven clamping force and lag caused by manual operation. In addition, by adjusting the drive component 33 of at least one clamping mechanism 30 along the first direction F1 on the adsorption platform 10, the drive component 33 of at least one clamping mechanism 30 can change its position in the first direction F1, thereby adjusting the distance between the two rotating shafts 31 in the first direction F1.

[0100] Alternatively, the rotating shaft 31 can be manually rotated to lift or press down the clamping member 32.

[0101] Combined with appendix Figure 10 and Figure 12 The clamping mechanism 30 also includes two fixing seats 36, which are arranged on opposite sides of the adsorption platform 10 along the second direction F2. In the position-adjustable clamping mechanism 30, the fixing seats 36 are detachably mounted on the adsorption platform 10, for example, the fixing seats 36 are screwed to the adsorption platform 10.

[0102] One end of the rotating shaft 31 is rotatably connected to one of the two fixed seats 36, and the other end of the rotating shaft 31 is rotatably connected to the other of the two fixed seats 36. The two fixed seats 36 support the rotating shaft 31, effectively ensuring the stability of the rotating shaft 31 during rotation.

[0103] Combined with appendix Figure 3 , Figure 4 and Figure 10 It is understood that the adsorption platform 10 is provided with a mounting slot 18. In the position-adjustable clamping mechanism 30, the drive assembly 33 is detachably fixed at different positions in the mounting slot 18 to achieve position adjustment.

[0104] For example, in conjunction with the appendix Figures 1 to 3 When the position-adjustable clamping mechanism 30 is specifically adjustable along the first direction F1, the length direction of the mounting groove 18 is parallel to the first direction F1.

[0105] Optionally, the drive component 33 in the position-adjustable clamping mechanism 30 is detachably fixed in the mounting groove 18 using fasteners, such as bolts or screws. For example, if the fastener is a bolt, and it is necessary to adjust the distance between the two clamping mechanisms 30 positioned opposite each other along the first direction F1, the bolt is loosened, and the drive component 33 is moved along the first direction F1 or in a direction opposite to the first direction F1 to change its position in the mounting groove 18. After moving the drive component 33 to a preset position, the bolt is tightened to fix the drive component 33 in the preset position in the mounting groove 18.

[0106] Alternatively, the drive assembly 33 of the position-adjustable clamping mechanism 30 can be detachably fixed to the adsorption platform 10 by means of snap-fit ​​or magnetic attraction.

[0107] Alternatively, a guide rail can be installed on the adsorption platform 10, with its length parallel to the first direction F1. The drive component 33 slides along the guide rail, allowing its position in the first direction F1 to be adjusted, thereby adjusting the distance between the two clamping mechanisms 30 in the first direction F1. Alternatively, a power component can be installed on the adsorption platform 10, connected to the drive component 33. The power component drives the drive component 33 to reciprocate along the first direction F1, automatically adjusting its position and thus automatically adjusting the distance between the two clamping mechanisms 30 in the first direction F1.

[0108] Combined with appendix Figure 10 and Figure 11It is understood that the drive assembly 33 includes a mounting component 331, a drive source 332, a slider 333, a connecting rod 334, and a swing component 335. The mounting component 331 is movably mounted on the adsorption platform 10, the drive source 332 is mounted on the mounting component 331, the slider 333 is slidably connected to the mounting component 331, and the slider 333 is fixedly connected to the output shaft of the drive source 332. One end of the connecting rod 334 is hinged to the slider 333, and the other end of the connecting rod 334 is hinged to the swing component 335. The swing component 335 is fixedly connected to the rotating shaft 31.

[0109] Specifically, one end of the connecting rod 334 is hinged to the slider 333 via a pin, and the other end of the connecting rod 334 is hinged to one end of the swing member 335 via a pin. The other end of the swing member 335 is fixedly sleeved on one end of the rotating shaft 31.

[0110] If the drive assembly 33 is adjustablely mounted on the adsorption platform 10, the mounting member 331 is detachably or movably connected to the adsorption platform 10. For example, the mounting member 331 is fixed to different positions in the mounting groove 18 by bolts, or the mounting member 331 slides into the mounting groove 18. If the drive assembly 33 is fixedly mounted on the adsorption platform 10, the mounting member 331 is detachably or fixedly connected to the adsorption platform 10. For example, the mounting member 331 is fixed to the adsorption platform 10 by bolts.

[0111] When the drive source 332 drives the slider 333 to slide, the slider 333 drives the swing member 335 to swing around the axis of the rotating shaft 31 through the connecting rod 334. In turn, the swing member 335 drives the rotating shaft 31 to rotate synchronously around the axis of the rotating shaft 31, thereby realizing the lifting or pressing action of the clamping member 32.

[0112] In the above technical solution, when the drive source 332 drives the slider 333 to slide, the sliding motion is converted into the swing motion of the swing member 335 through the connecting rod 334, and then the swing motion is converted into the rotational motion of the rotating shaft 31 through the swing member 335, thereby realizing the lifting or pressing action of the clamping member 32. The transmission efficiency is high and there is no risk of slippage. It can ensure that the power of the drive source 332 is stably transmitted to the rotating shaft 31, and avoid the clamping action from being delayed or failing.

[0113] Optionally, the drive source 332 may be, but is not limited to, a cylinder and an electric push rod.

[0114] This application also provides a processing device, which includes a frame, a processing device, and a fixing device according to any of the above embodiments. Both the fixing device and the processing device are mounted on the frame. The adsorption surface of the adsorption platform of the fixing device is used to place the circuit board, and the processing device is used to process the circuit board placed on the adsorption surface.

[0115] The processing equipment provided in this application adopts the above-mentioned fixing device. The fixing device adjusts the effective adsorption area range of the adsorption surface 11 of the adsorption platform 10 to generate adsorption force through the adjustment component 20, so that the effective adsorption area can be flexibly adjusted according to the actual coverage of circuit boards of different sizes.

[0116] Furthermore, by setting the clamping mechanism 30 on the adsorption platform 10, the fixing device can apply a clamping force to the circuit board placed on the adsorption surface, so that the circuit board placed on the adsorption surface can be more reliably fixed on the adsorption surface under the combined action of the adsorption force applied by the adsorption platform 10 and the clamping force applied by the clamping mechanism 30.

[0117] Furthermore, the processing equipment can be, but is not limited to, laser drilling equipment, laser cutting equipment, automated optical inspection (AOI) equipment, laser direct imaging (LDI) equipment, inkjet printing equipment, etc.

[0118] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A fixture, characterized in that The fixing device comprises: an adsorption platform provided with an adsorption surface and a negative pressure interface, the adsorption surface being provided with a plurality of adsorption sub-zones; an adjusting assembly connected to the adsorption platform, the adjusting assembly being configured to adjust the number of the adsorption sub-zones communicated with the negative pressure interface, so as to change the effective adsorption area range of the adsorption surface.

2. The fixing device according to claim 1, wherein: the adsorption platform is provided with a plurality of chambers, the plurality of chambers being communicated with the plurality of adsorption sub-zones one by one, wherein the negative pressure interface is communicated with at least one of the chambers; the adjusting assembly comprises a housing and a block, the housing being connected to the adsorption platform and cooperating to form an air passage, the air passage being communicated with each of the chambers, the block being configured to control the on-off of the air passage between adjacent chambers, so as to adjust the number of the chambers communicated with the negative pressure interface, thereby adjusting the number of the adsorption sub-zones communicated with the negative pressure interface.

3. The fixture of claim 2, wherein: The adjusting assembly further comprises a driving member connected to the block, the driving member being configured to drive the block to move so as to block or open the air passage between adjacent chambers.

4. The fixing device according to claim 2, wherein: the adsorption platform is provided with a switching hole corresponding to the chambers, the housing is provided with a sliding groove, the sliding groove being communicated with the switching hole to cooperate to form the air passage, and the block is movably arranged in the sliding groove to control the on-off of the air passage between adjacent chambers.

5. The fixture of any one of claims 1 to 4, wherein: The fixing device further comprises a clamping mechanism configured to clamp a circuit board placed on the adsorption surface.

6. The fixture of claim 5, wherein: The number of the clamping mechanisms is plural, and the plural clamping mechanisms clamp different sides of the circuit board.

7. The fixture of claim 6, wherein: Two of the clamping mechanisms are oppositely arranged along a preset direction, and at least one of the clamping mechanisms is adjustably arranged on the adsorption platform along the preset direction, and the plural adsorption sub-zones are sequentially distributed along the preset direction.

8. The fixture of claim 7, wherein: In the oppositely arranged two clamping mechanisms, one of the clamping mechanisms is fixedly arranged on the adsorption platform, and the other clamping mechanism is adjustably arranged on the adsorption platform. In the preset direction, the adsorption sub-zone communicated with the negative pressure interface is closer to the fixedly arranged clamping mechanism than the other adsorption sub-zones.

9. The fixture of claim 5, wherein, The position of at least one of the clamping mechanisms on the adsorption platform is adjustable, and the clamping mechanism comprises: a rotating shaft located on one side of the adsorption surface; a clamping member arranged on the rotating shaft, the rotating shaft driving the clamping member to lift or press relative to the adsorption surface when the rotating shaft rotates; wherein in the clamping mechanism with adjustable position, the rotating shaft is adjustably arranged relative to the adsorption platform.

10. The fixture of claim 9, wherein: The clamping mechanism further comprises a driving assembly connected to the rotating shaft, the driving assembly being configured to drive the rotating shaft to rotate relative to the adsorption platform; wherein in the clamping mechanism with adjustable position, the driving assembly is adjustably arranged on the adsorption platform.

11. The fixture of claim 10, wherein: The adsorption platform is provided with a mounting groove; wherein, In the position-adjustable clamping mechanism, the driving assembly is detachably fixed at different positions of the mounting slot to achieve position adjustment.

12. The fixture of claim 10, wherein, The driving assembly comprises: a mounting member movably arranged on the adsorption platform; a driving source arranged on the mounting member; a sliding block in sliding connection with the mounting member and fixedly connected with an output shaft of the driving source; a connecting rod having one end hingedly connected with the sliding block; and a swing member fixedly connected with the rotating shaft and hingedly connected with the other end of the connecting rod; wherein when the driving source drives the sliding block to slide, the sliding block drives the swing member to swing around the axis of the rotating shaft through the connecting rod, so that the swing member drives the rotating shaft to rotate.

13. A processing apparatus, characterized by comprising: The fixing device and the processing device are arranged on the rack, the adsorption surface of the fixing device is used for placing a circuit board, and the processing device is used for processing the circuit board placed on the adsorption surface.

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