Radiator assembly and circuit board assembly
By splicing multiple heat sinks to form a heat-conducting surface, the problem of poor heat dissipation under complex circuit board layout is solved, achieving better heat dissipation effect and lower cost.
Patent Information
- Application Number
- CN202520308802.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-02-25
AI Technical Summary
In the existing technology, heat sinks cannot effectively cover certain areas on circuit boards with complex layouts, resulting in poor heat dissipation and high customization costs.
Multiple heat sinks are spliced together with connectors to form a heat-conducting surface, increasing the heat dissipation area. Existing heat sinks are flexibly spliced to adapt to the circuit board layout, forming a conductive plane that matches the heat dissipation plane of the circuit board.
It improves heat dissipation, reduces footprint, has a compact structure, lowers costs, and enhances flexibility and practicality.
Smart Images
Figure CN223928669U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The embodiment of the utility model relates to the technical field of circuit board heat dissipation, and particularly relates to a radiator assembly and a circuit board assembly. BACKGROUND
[0002] When there are devices with large heat generation on the circuit board, such as power transistors, high-power resistors and integrated circuits, a radiator can be installed at the position of these devices or nearby to dissipate heat, so as to ensure that the heat can be quickly transferred to the radiator to dissipate heat for the circuit board. The components on the circuit board are various, the layout of the components is different, and the positions and heights of the components after welding are also different. Although the radiators are also various, for some complex layout circuit boards, the problem that a single radiator cannot cover the heat dissipation surface at a certain position on the circuit board still exists, resulting in poor heat dissipation effect. In the prior art, the heat dissipation plate can be customized according to the position and height of the heat generating device on the circuit board, but the heat dissipation plate is large in size and high in customization cost, and has low practicability. CONTENT OF THE UTILITY MODEL
[0003] In view of the above problems, the embodiment of the utility model provides a radiator assembly and a circuit board assembly.
[0004] According to an aspect of the embodiment of the utility model, a radiator assembly is provided, which is applied to a circuit board, and the radiator assembly comprises a first radiator, at least one second radiator and a radiator connecting piece;
[0005] The first radiator and the second radiator each comprise a heat dissipation main body, at least one side of the first side of the heat dissipation main body is a heat conduction surface, at least one side of the first side of the heat dissipation main body of the first radiator is a non-heat conduction surface, and the non-heat conduction surface and the heat conduction surface are at different horizontal heights.
[0006] The heat dissipation main body of at least one second radiator is connected to the non-heat conduction surface of the first radiator through the radiator connecting piece, and the heat conduction surface of the second radiator and the heat conduction surface of the first radiator are connected to form a connection plane.
[0007] In an optional mode, the types, sizes and / or shapes of the first radiator and the second radiator are different.
[0008] In an optional mode, the first radiator and the second radiator each comprise a heat dissipation fin connected to the heat dissipation main body, the heat dissipation fin is arranged on the second side of the heat dissipation main body, and the second side is a side opposite to the first side.
[0009] In an optional mode, the radiator connecting piece is a screw.
[0010] According to another aspect of the embodiment of the present application, a circuit board assembly is provided, which comprises a circuit board, a circuit board connecting piece and the heat sink assembly as described above.
[0011] The circuit board is provided with a heat dissipation plane;
[0012] The shape and size of the guide plane of the heat sink assembly and the heat dissipation plane are matched;
[0013] The circuit board connecting piece is used to connect the heat sink assembly and the circuit board, and the guide plane and the heat dissipation plane are attached.
[0014] In an alternative way, a heat conducting piece is further included, which is arranged between the guide plane and the heat dissipation plane, and the heat conducting piece is attached to the guide plane and the heat dissipation plane, and the heat conducting piece is an insulator.
[0015] In an alternative way, the circuit board connecting piece is a screw.
[0016] The embodiment of the present application connects at least one second heat sink on the non-heat conducting surface of the first heat sink, and the heat conducting surface of the second heat sink is connected with the heat conducting surface of the first heat sink to form a guide plane, which increases the area of the heat sink for heat conduction, and the heat dissipation effect is better than that of a single heat sink, the occupied area is smaller, the structure is more compact, the heat sink assembly is obtained by splicing the existing heat sink, which is flexible, low in cost and high in practicability.
[0017] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the specific embodiments of the present application can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS
[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Furthermore, the same reference numerals are used throughout the several drawings to refer to same or like parts. In the drawings:
[0019] Figure 1 The structure schematic diagram of the heat sink assembly embodiment of the present application is shown;
[0020] Figure 2 The structure schematic diagram of the first heat sink in the heat sink assembly embodiment of the present application is shown;
[0021] Figure 3The utility model discloses radiator assembly embodiment second radiator's structure diagram shows,
[0022] Figure 4 The utility model discloses radiator assembly embodiment first radiator and second radiator connect before structure diagram shows,
[0023] Figure 5 The utility model discloses circuit board assembly embodiment circuit board's structure diagram shows,
[0024] Figure 6 The utility model discloses circuit board assembly embodiment one angle structure diagram shows,
[0025] Figure 7 The utility model discloses circuit board assembly embodiment another angle structure diagram shows. DETAILED DESCRIPTION
[0026] The utility model discloses technical scheme's embodiment will be described in detail below with the drawings. The following embodiment is only for more clearly explaining the technical scheme of the utility model, therefore only as example, and can not be used to limit the protection scope of the utility model.
[0027] Please combine and see Figures 1-4 , Figure 1 The utility model discloses radiator assembly embodiment structure diagram shows, Figure 2 The utility model discloses radiator assembly embodiment first radiator's structure diagram shows, Figure 3 The utility model discloses radiator assembly embodiment second radiator's structure diagram shows, Figure 4 The utility model discloses radiator assembly embodiment first radiator and second radiator connect before structure diagram shows, as shown in the figure, the utility model embodiment, circuit board radiating radiator assembly 100 including a first radiator 10, at least one second radiator 20 and radiator connecting piece 30.
[0028] First radiator 10 and second radiator 20 both respectively include the heat dissipation main part, and the first side of heat dissipation main part is at least one side and is the heat conduction surface. As Figure 2 Shown, first radiator 10 includes heat dissipation main part 101, and the first side of heat dissipation main part 101 has one side and is heat conduction surface 102. As Figure 3 Shown, second radiator 20 includes heat dissipation main part 201, and the first side of heat dissipation main part 201 has one side and is heat conduction surface 202. The first side of heat dissipation main part 101 of first radiator 10 in this embodiment is at least one side and is non-heat conduction surface 103, and non-heat conduction surface 103 is at different horizontal height with heat conduction surface 102, and heat conduction surface is used to directly contact heat source and heat conduction, and non-heat conduction surface does not contact heat source. In Figure 2In the embodiment, the non-heat-conducting surfaces 103 are three in number and are at different levels from the heat-conducting surfaces 102, and the non-heat-conducting surfaces 103 are parallel to the heat-conducting surfaces 102. The side surface of the first side of the heat-dissipating main body 201 of the second heat sink 20 can include one or more side surfaces, wherein if there is only one side surface, the side surface is a heat-conducting surface, i.e., there is no non-heat-conducting surface; if there are two or more side surfaces, at least one side surface is a heat-conducting surface, and the remaining side surfaces can be non-heat-conducting surfaces.
[0029] The heat-dissipating main body 201 of the second heat sink 20 is connected to the non-heat-conducting surfaces 103 of the first heat sink 10 through the heat sink connecting member 30, and the heat-conducting surfaces 202 of the second heat sink 20 are connected to the heat-conducting surfaces 102 of the first heat sink 10 to form the heat-conducting connection plane 600.
[0030] In the embodiment, the first heat sink 10 and the second heat sink 20 can be heat sinks for dissipating heat from a circuit board in the prior art. One or more second heat sinks 20 can be connected to the non-heat-conducting surfaces 103 of the first heat sink 10 to form the heat-conducting connection plane 600, thereby increasing the area for heat conduction.
[0031] In the embodiment, the connection of the first heat sink 10 and the second heat sink 20 depends on the layout of the circuit board and the height of the components, and the heat sink assembly 100 obtained after the connection has the heat-conducting connection plane 600 in contact with the heat-conducting surfaces of the circuit board, thereby being flexible in connection according to the circuit board.
[0032] In the embodiment, the heat-dissipating main body of at least one second heat sink 20 is connected to the non-heat-conducting surfaces 103 of the first heat sink 10, and the heat-conducting surfaces 202 of the second heat sink 20 are connected to the heat-conducting surfaces 102 of the first heat sink 10 to form the heat-conducting connection plane 600, thereby increasing the area for heat conduction of the heat sink, improving the heat dissipation effect, occupying a smaller area, and having a more compact structure. The heat sink assembly 100 obtained by connecting the existing heat sinks is flexible, low in cost, and high in practicality.
[0033] In the embodiment, the types of the heat sinks mainly refer to different materials, including aluminum heat sinks, copper heat sinks, alloy heat sinks, and other metal heat sinks, which are not limited herein. In the embodiment, the first heat sink 10 and the second heat sink 20 can be of the same type, size, and / or shape, or can be of different types, sizes, and / or shapes. Heat sinks of the same type, size, and / or shape can be connected together in the manner of the embodiment, and heat sinks of different types, sizes, and / or shapes can also be connected together in the manner of the embodiment, thereby obtaining a heat sink with a larger heat-conducting area, a smaller occupied area, and a more compact structure, and being flexible.
[0034] The first heat sink 10 and the second heat sink 20 both comprise heat dissipation fins connected with a heat dissipation main body, and the heat dissipation fins are arranged on a second side of the heat dissipation main body, which is opposite to the first side. The heat dissipation fins are arranged on the second side of the heat dissipation main body in a spaced manner, and the arrangement of the heat dissipation fins can further increase the heat dissipation area and is beneficial to rapid heat dissipation. Figure 2 As shown in the figure, the first heat sink 10 comprises heat dissipation fins 104 connected with a heat dissipation main body 101, and the heat dissipation fins 104 are arranged on a second side of the heat dissipation main body 101 opposite to the first side. Figure 3 As shown in the figure, the second heat sink 20 comprises heat dissipation fins 203 connected with a heat dissipation main body 201, and the heat dissipation fins 203 are arranged on a second side of the heat dissipation main body 201 opposite to the first side.
[0035] The heat sink connecting member 30 is used for connecting and fixing the heat dissipation main body 201 of the second heat sink 20 to the non-heat conduction surface 103 of the first heat sink 10. The heat sink connecting member 30 can be a material with good heat conduction for pasting, such as heat-conductive silicone rubber or heat-conductive silicone sheet, which is not limited herein, and can also be a buckle structure, which can also connect and fix the first heat sink 10 and the second heat sink 20. Preferably, the heat sink connecting member 30 of the embodiment is a screw, which connects and fixes the heat dissipation main body 101 of the first heat sink 10 and the heat dissipation main body 201 of the second heat sink 20, and is convenient to assemble.
[0036] Please refer to Figures 5-7 In the embodiment of the circuit board assembly of the utility model, the circuit board assembly comprises a circuit board 40, a circuit board connecting member 50 and the heat sink assembly 100. Based on the layout of the circuit board 40 and the height of the components, the corresponding heat dissipation plane can be irregular, or the heat conduction surface of any single heat sink in the prior art cannot be well matched. Therefore, a single heat sink cannot meet the heat dissipation requirements of the circuit board 40, and the heat dissipation effect is poor.
[0037] In the embodiment, the circuit board 40 is provided with a heat dissipation plane (not shown in the figure), and the shapes and sizes of the lead-through plane 600 of the heat sink assembly 100 and the heat dissipation plane are matched. The circuit board connecting member 50 is used for connecting the heat sink assembly 100 and the circuit board 40, and the lead-through plane 600 and the heat dissipation plane are attached.
[0038] The circuit board connecting member 50 can be a buckle structure or a screw. Preferably, the circuit board connecting member 50 is a screw.
[0039] In addition, the structure of the heat sink assembly 100 is described above with reference to the description of the embodiment of the heat sink assembly 100, which will not be repeated here. Figures 1 to 4
[0040] The heat sink assembly 100 obtained by splicing the heat sinks is used in the embodiment, the lead connection plane 600 of the heat sink assembly 100 is matched with the heat dissipation plane of the circuit board, and the heat dissipation effect is better than that of a single heat sink due to the increase of the area of the heat sink for heat conduction, the occupied area is smaller, and the overall structure is more compact; the heat sink assembly 100 is obtained by splicing the existing heat sink, and is high in flexibility and practicality.
[0041] In an embodiment, the circuit board assembly further comprises a heat conduction piece 60 arranged between the lead connection plane 600 and the heat dissipation plane, the heat conduction piece 60 is matched with the lead connection plane 600 and the heat dissipation plane, the heat conduction piece 60 is in a sheet structure, and the heat conduction piece 60 is an insulator. The heat conduction piece 60 effectively conducts the heat on the circuit board 40 to the heat sink assembly 100, so that the circuit board 40 is prevented from being damaged due to overheating; the heat conduction pad is made of a flexible material, so that the heat conduction piece 60 is matched with the lead connection plane 600 and the heat dissipation plane, air between the lead connection plane 600 and the heat dissipation plane can be discharged, sufficient contact is achieved, the thermal resistance is reduced, and the heat dissipation effect is improved; in addition, the heat conduction pad 60 has good heat conductivity and insulation, current leakage or short circuit problems can be effectively prevented during heat dissipation, and the safety of the circuit board 40 is ensured.
[0042] Preferably, the heat conduction piece 60 is a heat conduction pad made of a silica gel base material, or a sheet structure formed by heat conduction silica grease.
[0043] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the embodiments of the present application should be understood as the usual meanings understood by the technical personnel in the field to which the embodiments of the present application belong.
[0044] In the description of the embodiments of the present application, the directions or positional relationships indicated by the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular direction, be constructed and operated in a particular direction, and therefore cannot be understood as limiting the embodiments of the present application.
[0045] In addition, the technical terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.
[0046] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0047] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.
[0048] Finally, it should be pointed out that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the description of the present application. Especially, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.
Claims
1. A heat sink assembly applied to a circuit board, characterized in that, The radiator assembly includes a first radiator, at least one second radiator, and a radiator connector. Both the first radiator and the second radiator include a heat dissipation body. At least one side of the first side of the heat dissipation body is a heat-conducting surface, and at least one side of the first side of the heat dissipation body of the first radiator is a non-heat-conducting surface. The non-heat-conducting surface and the heat-conducting surface are at different horizontal heights. At least one heat dissipation body of the second heat sink is connected to the non-heat-conducting surface of the first heat sink through the heat sink connector, and the heat-conducting surface of the second heat sink is connected to the heat-conducting surface of the first heat sink to form a conductive plane.
2. The heat sink assembly according to claim 1, characterized in that, The first radiator is different in type, size and / or shape from the second radiator.
3. The heat sink assembly according to claim 1, characterized in that, Both the first radiator and the second radiator include heat sinks connected to the heat dissipation body. The heat sinks are located on the second side of the heat dissipation body, which is the side opposite to the first side.
4. The heat sink assembly according to claim 1, characterized in that, The radiator connector is a screw.
5. A circuit board assembly, characterized in that, The circuit board assembly includes a circuit board, a circuit board connector, and a heat sink assembly as described in any one of claims 1-4; The circuit board has a heat dissipation surface; The shape and size of the conductive plane of the heat sink assembly are matched with those of the heat dissipation plane; The circuit board connector is used to connect the heat sink assembly to the circuit board, and the conductive plane is in contact with the heat dissipation plane.
6. The circuit board assembly according to claim 5, characterized in that, It also includes a heat-conducting component, which is disposed between the conductive plane and the heat dissipation plane. The heat-conducting component is in contact with both the conductive plane and the heat dissipation plane, and the heat-conducting component is an insulator.
7. The circuit board assembly according to claim 5, characterized in that, The circuit board connector is a screw.