Image sensor and electronic device

Abstract

According to the image sensor and the electronic equipment provided by the utility model, through the combination design of the organic filling and leveling layer with a flat surface and the organic glue layer, the surface of an area needing to be contacted by the supporting structure, especially the surface of a welding pad with an uneven surface, is filled and leveled, and the organic filling and leveling layer has a better bonding force with a substrate material than organic glue. Meanwhile, after the surface of the substrate is filled and leveled up by the organic filling and leveling-up layer, the contact surface of the whole supporting structure becomes relatively smooth, the binding force is more uniform, and organic glue used by the organic glue layer is also greatly reduced, so that the packaging firmness of the packaged image sensor is effectively improved, and the packaging reliability is greatly improved; in addition, the used organic glue is reduced, and the problem of seepage of the organic glue can be effectively solved, so that glare generated when light irradiates the seepage organic glue is reduced.

Description

Technical Field

[0001] This utility model relates to the field of image sensors, and in particular to a CMOS image sensor and electronic device. Background Technology

[0002] Image sensors utilize the photoelectric conversion function of optoelectronic devices to convert a light image on a photosensitive surface into an electrical signal proportional to the light image. Based on the different components, they can be divided into two main categories: CCD (Charge-Coupled Device) and CMOS (Metal-Oxide-Semiconductor). With the continuous development of CMOS image sensor (CIS) design and manufacturing processes, CMOS image sensors have gradually replaced CCD image sensors and become the mainstream.

[0003] The CIS structure is mainly divided into the pixel area and the peripheral area. The pixel area corresponds to one or more image pixels, the corresponding pixel circuits and optical components, while the peripheral area corresponds to the signal lines connecting the pixels and external devices, the peripheral circuits connected to the pixels and the pads (PADs).

[0004] In CIS (Computer Integrated Sensor) packaging, a support structure (DAM) is typically used to support the packaging glass, preventing direct contact between the packaging glass and the pixel area. The DAM will contact the surrounding area, including the PAD (Pixel Anode). Organic adhesive is added to the DAM area as a bonding agent to bond the DAM and the image sensor chip together. If the PAD surface is damaged and / or has pits (e.g., damage caused by the chip during pin piercing during CP testing), more organic adhesive is needed to fill these pits during bonding. However, the bonding strength between the organic adhesive used in this type of CIS packaging and the inorganic materials (such as conductive metals, like aluminum) in the PAD area is relatively poor. The more organic adhesive used, especially on an uneven contact surface, the weaker the bonding becomes. Under harsh conditions, this can easily lead to delamination between the DAM and the inorganic materials, causing reliability failure. For example, in automotive applications, automotive products have higher reliability requirements than ordinary consumer products, therefore, the reliability testing conditions are also more stringent. In addition, because more organic glue is needed to fill the pits, there will be a problem of organic glue seeping out when DAM is laminating the glass. When the seeping organic glue is exposed to light, the light will be reflected into the pixel area, causing glare.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an image sensor and electronic device to solve the problems in the prior art where, during the packaging of image sensors, damage and / or pits on the surface of the solder pads, coupled with the poor bonding force between organic adhesives and inorganic materials, easily cause the DAM to delaminate with the inorganic materials, resulting in reliability failure; and the problem that excessive use of organic adhesives causes organic adhesive to seep out during the lamination of DAM with glass, and that the seeped organic adhesive, when exposed to light, causes light to be reflected into the pixel area, resulting in glare.

[0007] To achieve the above and other related objectives, this utility model provides an image sensor, the image sensor comprising:

[0008] The substrate includes a pixel region and a peripheral region. The pixel region includes at least a plurality of photoelectric conversion pixels and corresponding optical components. The peripheral region is disposed on the outer periphery of the pixel region. The peripheral region is formed with a plurality of solder pads, and at least one of the solder pads has an uneven surface.

[0009] An organic leveling layer is applied along the periphery of the substrate over the peripheral area, covering the surface of all the solder pads and leveling any unevenness on the surface of the solder pads.

[0010] An organic adhesive layer is bonded to the surface of the organic filler layer; wherein the organic filler layer has better adhesion to the material in the peripheral area in contact with the organic adhesive layer than the organic adhesive layer.

[0011] A supporting structure is bonded to the surface of the organic adhesive layer;

[0012] An encapsulation structure is disposed above the substrate and the space between the substrate and the encapsulation structure is sealed by the support structure.

[0013] Optionally, the number of rings of the organic filler layer, the organic adhesive layer, and the support structure corresponds one-to-one; and / or, at least two rings of the organic filler layer are sequentially nested on the peripheral region along the periphery of the substrate; and / or, the support structure is one ring, and when at least two rings of the organic filler layer are provided, the support structure is continuously provided on each of the organic filler layers; and / or, the organic filler layer is a smooth organic filler layer; and / or, the peripheral region surrounds the periphery of the pixel region.

[0014] Optionally, when at least two nested organic filler layers are provided on the peripheral area, the pad is located below the second or outermost organic filler layer in the direction outward from the pixel area.

[0015] Optionally, the material of the organic filler layer is a light-absorbing organic material.

[0016] Optionally, the width of the organic filler layer disposed in at least one region is greater than the width of the support structure at the corresponding location.

[0017] Furthermore, the width of the organic filler layer disposed on at least one side is greater than the width of the organic filler layer on the other sides.

[0018] Furthermore, the width of the organic filler layer in at least one region near the pixel region is greater than the width of the support structure at the corresponding location.

[0019] Furthermore, the material of the organic filler layer is selected from the material of the filter.

[0020] Furthermore, the height of the upper surface of the organic filler layer is between 1 / 3 of the height of the upper surface of the microlens in the optical component and the height of the upper surface of the microlens.

[0021] Furthermore, when the color temperature in the application scenario of the image sensor is less than or equal to 2000K, the material of the organic filler layer is selected from the material of the blue filter; when the color temperature in the application scenario of the image sensor is greater than or equal to 5500K, the material of the organic filler layer is selected from the material of the red filter.

[0022] Furthermore, when the image sensor is used in a scenario where the most light enters from the first side, the width of the organic filler layer on the second side is greater than the width of the organic filler layer on the other sides; wherein the first side is opposite to the second side.

[0023] Optionally, the sidewalls of the organic filler layer in at least a portion of the area are configured as toothed sidewalls.

[0024] Optionally, when the sidewalls of the organic filler layer in at least a portion of the region are configured as toothed sidewalls, the sidewalls of the organic filler layer in at least a portion of the region near the pixel region are configured as toothed sidewalls.

[0025] Optionally, the material of the organic filler layer is a light-transmitting material.

[0026] Optionally, when the material of the organic filler layer is a light-transmitting material, the light-transmitting material is a microlens material.

[0027] This invention also provides an electronic device, including an image sensor as described in any of the above embodiments.

[0028] As described above, the image sensor and electronic device of this utility model have the following beneficial effects: The image sensor, through the combined design of a smooth organic filler layer and an organic adhesive layer, fills the surface of the area that the support structure needs to contact, especially the surface of the uneven solder pads. Moreover, the organic filler layer has better adhesion to the substrate material than the organic adhesive. At the same time, after the organic filler layer fills the substrate surface, the entire contact surface of the support structure becomes smoother, and the bonding force is more uniform. The amount of organic adhesive used in the organic adhesive layer is also greatly reduced, thereby effectively improving the encapsulation firmness of the image sensor after encapsulation and greatly increasing the encapsulation reliability. In addition, the reduction in the amount of organic adhesive used can also effectively reduce the problem of organic adhesive seepage, thereby reducing the glare caused by light shining on the seeping organic adhesive. Attached Figure Description

[0029] Figure 1 The diagram shown is a cross-sectional view of an image sensor packaged as an example of the prior art.

[0030] Figure 2 The diagram shows a cross-sectional structure of a solder pad with pits on its surface.

[0031] Figure 3 Displayed as Figure 2 A schematic diagram of the cross-sectional structure of the solder pads after they are bonded together with organic adhesive.

[0032] Figure 4 The image sensor shown is a plan view after the support structure is formed during the packaging process of this utility model.

[0033] Figure 5 Displayed as along Figure 4 A sectional view taken from AA.

[0034] Figure 6 and Figure 7 The diagram shows a cross-sectional view of each step in the fabrication method of the image sensor of this invention.

[0035] Component designation explanation

[0036] 20 base

[0037] 200 pixel area

[0038] 201 Outer Area

[0039] 202 solder pad

[0040] 203 pit

[0041] 21 Supporting Structure

[0042] 22-pack glass

[0043] 23 Organic glue

[0044] 10 base

[0045] 100 pixel area

[0046] 101 Outer Area

[0047] 102 Optical component pricing

[0048] 103 solder pad

[0049] 11 Organic filler layer

[0050] 12 Organic adhesive layer

[0051] 13 Supporting Structure Detailed Implementation

[0052] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. For ease of explanation, when detailing the embodiments of this utility model, the cross-sectional views showing the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0053] For ease of description, spatial relation terms such as "below," "below," "lower than," "below," "above," and "upper" may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for the device in use or operation. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there may be one or more layers in between. Additionally, "between" as used in this invention includes both endpoint values. In the context of this application, the described structure of a first feature "above" a second feature may include embodiments where the first and second features are formed in direct contact, or embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0054] Please see Figures 1 to 7It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0055] Example 1

[0056] like Figure 1 The diagram shows a cross-sectional view of an example image sensor after encapsulation. In this encapsulation structure, a support structure 21 bonded to the outer region 201 of the substrate 20 serves as a support layer between the encapsulation glass 22 and the substrate 20, preventing the encapsulation glass 22 from directly contacting the pixel region 200 on the substrate 20. However, the support structure 21 will contact the solder pads 202 on the outer region 201. Furthermore, the support structure 21 is bonded to both the encapsulation glass 22 and the substrate 20 using organic adhesive. In this case, if the surface of the solder pads 202 is damaged—for example, the substrate 20 typically requires a CP test before encapsulation, but the CP test's pin punctures can damage the solder pads 202—it is problematic. Figure 2 As shown, this causes damage such as pits 203 on the surface of the solder pad 202. Therefore, during bonding, if... Figure 3 As shown, more organic adhesive 23 will be needed to fill the pits 203 on the surface of the solder pad 202. However, the bonding force between the organic adhesive 23 used in the image sensor packaging and the inorganic materials on the surface of the substrate 10, such as the conductive metal used in the solder pad 202, is inherently poor. Therefore, when the surface of the solder pad 202 is uneven, more organic adhesive needs to be used to fill it, which will further reduce the bonding force between the organic adhesive and the solder pad. Under more severe conditions, this can easily lead to delamination between the support structure and the substrate, causing the reliability of the packaging structure to fail. In addition, since more organic adhesive is needed to fill the pits, there will be a problem of flowing organic adhesive seeping out when the support structure 21 is pressed into the packaging glass 22. When the seeped organic adhesive is exposed to light, it will cause the light to be reflected into the pixel area, resulting in glare.

[0057] Based on this, this embodiment provides a graphics sensor. This encapsulation structure can effectively reduce the risk of delamination between the support structure and the substrate due to poor adhesion between the organic adhesive and the substrate, and reduce glare in the pixel area. Figure 4 and Figure 5 As shown, the graphics sensor includes:

[0058] The substrate 10 includes a pixel region 100 and a peripheral region 101. The pixel region 100 includes at least a plurality of photoelectric conversion pixels (not shown in the figure) and corresponding optical components 102. The peripheral region 101 is disposed around the outer periphery of the pixel region 100. The peripheral region 101 is formed with a plurality of solder pads 103, and at least one of the solder pads 103 has an uneven surface.

[0059] An organic filler layer 11 extends along the periphery of the substrate 10 onto the peripheral region 101, covering the surfaces of all the solder pads 103 and filling in the surface irregularities of the solder pads 103. Filling in the surface irregularities of the solder pads 103 can refer to filling in the recessed areas of the solder pads. Alternatively, the organic filler layer 11 can be a smooth organic filler layer, meaning that the organic filler layer fills the recessed areas of the solder pads and extends beyond the upper surface of the solder pads, having a thickness on the solder pads. For example, a smooth organic filler layer can be obtained through deposition and chemical mechanical polishing processes. It should be noted that "smooth surface" here refers to filling the recesses of the solder pads to make them relatively smooth, thus facilitating the achievement of the effective effects of this invention.

[0060] An organic adhesive layer 12 is bonded to the surface of the organic filler layer 11; wherein the organic filler layer 11 has better adhesion to the material of the peripheral area in contact with the organic adhesive layer 12 than the organic adhesive layer 12; wherein the material of the organic adhesive layer 12 can be epoxy resin or other adhesive materials commonly used in the encapsulation of image sensors.

[0061] Support structure 13 is bonded to the surface of the organic adhesive layer 12;

[0062] An encapsulation structure (not shown in the figure) is disposed above the substrate 10 and seals the space between the substrate 10 and the encapsulation structure by the support structure 13.

[0063] The image sensor in this embodiment uses a combination of a smooth organic filler layer and an organic adhesive layer to fill the surface of the support structure that needs to be in contact, especially the uneven surface of the solder pads. The organic filler layer has better adhesion to the substrate material than organic adhesive. After the organic filler layer fills the substrate surface, the entire contact surface of the support structure becomes smoother, the bonding force is more uniform, and the amount of organic adhesive used is greatly reduced. This effectively improves the encapsulation strength of the image sensor and greatly increases the encapsulation reliability. In addition, the reduction in the amount of organic adhesive used can also effectively reduce the problem of organic adhesive seepage, thereby reducing glare caused by light shining on the seeping organic adhesive.

[0064] In the structure of the image sensor, the pixel region 100 includes multiple photoelectric conversion pixels and corresponding optical components. Depending on actual needs, it also generally includes pixel circuits corresponding to the photoelectric conversion pixels (e.g., components included in 4T, 5T, 6T or other pixel circuits used to control, read out or otherwise manipulate one or more photoelectric conversion pixels).

[0065] The peripheral area 101 is generally provided with signal lines connecting the photoelectric conversion pixel and external devices, peripheral circuits connected to the photoelectric conversion pixel, solder pads 103, and conductive trenches connecting various circuits.

[0066] In the image sensor of this embodiment, the pads 103 can provide electrical contact with one or more components of the image sensor (e.g., the associated control circuitry of one or more photoelectric conversion pixels, or any other component of an image sensor in the prior art), and can be used for subsequent CP testing or package wiring, etc. In one embodiment, one or more pads 103 of the image sensor can be used to couple the image sensor to one or more microcontrollers or processors (e.g., for operation of the image sensor), memory (e.g., for storing image data), or others.

[0067] As an example, the number of turns of the organic filler layer 11, the organic adhesive layer 12, and the support structure 13 corresponds one-to-one. That is, it can be one turn of organic filler layer 11, one turn of organic adhesive layer 12, and one turn of support structure layer DAM, which is beneficial to improving the packaging stability.

[0068] Furthermore, the arrangement of the organic filler layer 11 in the peripheral region 101 can be selected according to specific process design requirements. For example, it can be arranged along the periphery of the substrate 10 in a nested manner along the circumference of the peripheral region 101. Figure 4 At least two concentric rings of the organic filler layer 11 are sequentially nested along the periphery of 10 in the outer region 101. Figure 4 The image is displayed as two concentric circles, one near pixel region 100 and the other near the edge of the outer region 101 of the base 10. Figure 4 The solder pads 103 described herein are mainly disposed at the edge of the peripheral region 101, and are therefore covered and filled by the outer ring of the organic filler layer 11. However, it is not limited to this, and the organic filler layer 11 may also be disposed on the entire peripheral region 101 of the substrate 10.

[0069] In a further example, a support structure 13 is provided on the at least two rings of organic filler layers 11. That is, the encapsulation structure adopts a single ring of support structure 13 and covers multiple rings of organic filler layers 11. The arrangement of at least two rings of organic filler layers 11 is beneficial for optimizing the encapsulation effect to be achieved in this invention. For example, the space between adjacent organic filler layers 11 further facilitates the release of the organic adhesive layer 12, helping to prevent glare caused by adhesive flow. Furthermore, the single-layer support structure 13 helps improve the stability and airtightness of the encapsulation structure.

[0070] As an example, when at least two nested organic filler layers 11 are provided on the outer region 101, the pad 103 is located below the second or outer organic filler layer 11 in the direction outward from the pixel region 100. For example, when there are two organic filler layers 11, the outer organic filler layer 11 corresponds to the pad 103, which can further reduce the problems caused by the unevenness of the pad 103.

[0071] As a preferred example, the organic filler layer 11 is made of an organic material with light-absorbing properties, which can reduce or even prevent light reflection directed toward the peripheral area 101 or re-reflection to the pixel area 100, thereby reducing or even avoiding the generation of glare.

[0072] Based on the selection of light-absorbing organic materials for the organic filler layer 11, further design can be made to improve the light absorption effect of the organic filler layer 11. As a first preferred example, such as Figure 4As shown, the width of the organic filler layer 11 disposed in at least one region is greater than the width of the support structure 13 in that region. For example, the organic filler layer 11 can be disposed on the side near the pixel region 100. The width of the organic filler layer 11 in at least one region is greater than the width of the support structure 13 in that region, so that the organic filler layer 11 has a larger coverage area relative to the support structure 13. Furthermore, the width of the organic filler layer in at least one region near the pixel area can be set to be greater than the width of the support structure at the corresponding position. This helps to improve the glare problem and simplifies the process. In addition, the width of the organic filler layer 11 on at least one side can be greater than the width of the organic filler layer 11 on other sides. That is, the width of the organic filler layer 11 on some sides can be increased so that its edge exceeds the edge of the support structure 13, thereby increasing the light absorption area on these sides and reducing the reflection of light to the pixel area 100. For example, when the image sensor application scenario is such that the most light enters the image sensor from the first side, the width of the organic filler layer on the second side opposite to the first side can be set to the maximum, that is, greater than the width of the organic filler layer on other sides. Since the light enters from the first side, more light will enter the second side than the other sides. Therefore, increasing the width of the organic filler layer on the second side can achieve the absorption of more incident light, thereby reducing the reflection of light to the pixel area 100. Specifically, the width of the organic filler layer 11 disposed on at least one side is greater than the width of the organic filler layer 11 on the other sides. This means that the organic filler layer 11 on the side with the increased width extends beyond the support structure 13 by a larger amount than the organic filler layer 11 on the other sides. It is understood that the amount by which the organic filler layer 11 on the other sides extends beyond the support structure 13 can be relatively smaller or zero, i.e., the sidewalls of the organic filler layer 11 and the support structure 13 are aligned. Furthermore, as a second preferred example, the height of the upper surface of the organic filler layer is between 1 / 3 of the height of the upper surface of the microlens in the optical component and the height of the upper surface of the microlens. For example, the height of the upper surface of the organic filler layer can be half the height of the upper surface of the microlens. In this case, the sidewall of the organic filler layer 11 acts as a light-absorbing sidewall, which can optimize the light absorption effect. Thus, light entering the sidewall of the organic filler layer 11 can be effectively absorbed, thereby reducing light reflection to the pixel region 100.As a third preferred example, the material of the organic filler layer 11 can be selected from the material of a filter. As is known, a filter is an optical component used to selectively control the transmission of light, allowing light of a specific wavelength to pass through while blocking or attenuating light of other wavelengths. Therefore, selecting the material of the organic filler layer 11 as the material used in a filter has a better effect on specific application scenarios of the image sensor. For example, when the color temperature of the image sensor application scenario is less than or equal to 2000K (e.g., in a scenario where it is used in the evening, the color temperature is generally lower, red light is stronger, and blue light is weaker), or when the red light is relatively stronger than blue light in the image sensor application scenario. When the light is strong, the organic filler layer 11 is made of the same material as a blue filter. In this case, the organic filler layer 11 can significantly absorb red light, thereby reducing glare caused by red light reflecting onto the pixel area 100. When the color temperature of the image sensor is greater than or equal to 5500K (for example, in daytime applications, the color temperature is generally higher, red light is weaker, and blue light is stronger), or when blue light is stronger than red light in the image sensor's application scenario, the organic filler layer 11 is made of the same material as a red filter. In this case, the organic filler layer 11 can significantly absorb blue light, thereby reducing glare caused by blue light reflecting onto the pixel area 100. More preferably, any two or three of the above three preferred examples can be used in combination to achieve the best light absorption effect.

[0073] In other implementations, the material of the organic filler layer 11 can be a light-transmitting material, which can be the same material as the microlens material.

[0074] As another better example, such as Figure 4 As shown, at least a portion of the sidewalls of the organic filler layer 11 can be configured as serrated sidewalls, that is, the sidewalls of the organic filler layer 11 can be configured as an uneven surface, thereby scattering the light incident on the sidewalls of the organic filler layer 11 in more directions, thus reducing the probability of reflection toward the pixel region 100 and reducing glare. Further, at least a portion of the sidewalls of the organic filler layer 11 near the pixel region can be configured as serrated sidewalls, or the entire sidewalls of the organic filler layer 11 can be configured as serrated. Of course, the configuration of the serrated sidewalls of the organic filler layer 11 can be used alone or in combination with examples of organic materials with light-absorbing properties selected for the organic filler layer 11, as well as further design examples based on the selection of organic materials, to achieve a better anti-glare effect.

[0075] Example 2

[0076] This embodiment provides a method for fabricating an image sensor, mainly implementing the image sensor packaging process. This fabrication method can realize the fabrication of the image sensor of Embodiment 1, and the fabrication method includes the following steps:

[0077] S1, as Figure 6 As shown, a substrate 10 is provided, the substrate 10 including a pixel region 100 and a peripheral region 101. The pixel region 100 includes at least a plurality of photoelectric conversion pixels (not shown in the figure) and corresponding optical components 102. The peripheral region 101 is disposed around the outer periphery of the pixel region 100, and may be disposed around the outer periphery of the pixel region 100. The peripheral region 101 is formed with a plurality of solder pads 103, and at least one of the solder pads 103 has an uneven surface.

[0078] S2, as Figure 7 As shown, an organic filler layer 11 is deposited on the peripheral region 101 surrounding the substrate 10, and the organic filler layer 11 also covers the surface of all the solder pads 103 and fills the surface unevenness of the solder pads 103.

[0079] S3, as Figure 5 As shown, an organic adhesive layer 12 is used to bond the support structure 13 to the organic filler layer 11; wherein the organic filler layer 11 has better bonding strength to the material of the peripheral area 101 in contact with the organic adhesive layer 12 than the organic adhesive layer 12.

[0080] S4, the encapsulation structure is encapsulated above the substrate 10, and the space between the substrate 10 and the encapsulation structure is sealed by the support structure 13.

[0081] In one implementation, the method for depositing the organic filler layer 11 in step S2 includes:

[0082] S21, a masking layer is formed on the substrate on which optical components are formed in the pixel area, the masking layer exposing the area where the organic filler layer 11 needs to be formed;

[0083] S22, an organic filler material layer is formed on the surface of the structure obtained in step S21 using a spin coating process;

[0084] S23, removing a portion of the organic filler material layer to obtain the organic filler layer 11, wherein the step of removing a portion of the organic filler material layer includes:

[0085] An etching mask is formed on the organic filler material layer, and a portion of the organic filler material layer is removed by an etching process to obtain the organic filler layer 11; or, the organic filler material layer is exposed based on a mask, and the organic filler layer 11 is obtained based on the exposed organic filler material layer.

[0086] S24, Remove the masking layer.

[0087] Specifically, in step S21, the masking layer can be a patterned photoresist layer, that is, a patterned photoresist layer that exposes the area where the organic filler layer needs to be formed after patterning the initial photoresist layer; in addition, in step S22, an organic filler material layer can be formed on the surface of the structure obtained in step S21 using a spin-coating process, for example, an organic filler material layer made of a color filter material or an organic filler material layer made of a microlens material can be formed; in addition, in step S23, for the organic filler material layer made of a microlens material, it can be... An etching mask is formed on the organic filler material layer, and a portion of the organic filler material layer is removed based on an etching process (such as a dry etching process) to obtain the organic filler layer; or, for an organic filler material layer composed of a color filter material, the organic filler material layer can be exposed based on a mask (photomask), and the organic filler layer can be obtained based on the exposed organic filler material layer. For example, it can be directly irradiated through an upper mask (photomask), and the areas irradiated by the light are modified, thereby directly removing the areas irradiated by the light.

[0088] This invention also provides an electronic device, including an image sensor as described in any of the above embodiments. The electronic device can be a security monitoring device, vehicle electronics, a mobile phone camera, a machine vision device, etc., and the image sensor based on this invention can acquire high-quality image information.

[0089] In summary, the image sensor of this invention, through the combined design of a smooth organic filler layer and an organic adhesive layer, fills the surface of the support structure in contact with the substrate, especially the uneven surface of the solder pads. Furthermore, the organic filler layer has better adhesion to the substrate material than organic adhesive. Simultaneously, after the organic filler layer fills the substrate surface, the entire contact surface of the support structure becomes smoother, resulting in more uniform adhesion. The amount of organic adhesive used is also significantly reduced, effectively improving the encapsulation strength and reliability of the image sensor. In addition, the reduced use of organic adhesive also effectively reduces the problem of adhesive seepage, thereby reducing glare caused by light irradiating the seeping adhesive. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial applicability.

[0090] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An image sensor, characterized by, The image sensor comprises: a substrate comprising a pixel region and a peripheral region, the pixel region comprising at least a plurality of photoelectric conversion pixels and corresponding optical components, and the peripheral region being arranged at the periphery of the pixel region; wherein the peripheral region is formed with a plurality of pads, and the surface of at least one of the pads is uneven; an organic filling layer arranged on the peripheral region along the periphery of the substrate, and covering and filling the uneven surface of all the pads; an organic adhesive layer adhered to the surface of the organic filling layer; wherein the organic filling layer has better bonding force with the material of the peripheral region than the organic adhesive layer; a support structure adhered to the surface of the organic adhesive layer; a packaging structure arranged above the substrate, and sealing the space between the substrate and the packaging structure through the support structure.

2. The image sensor of claim 1, wherein: The number of turns of the organic filling layer, the organic adhesive layer and the support structure corresponds one by one; and / or, at least two turns of the organic filling layer are arranged in sequence and nested on the peripheral region along the periphery of the substrate; and / or, the support structure is one turn, and when at least two turns of the organic filling layer are arranged, the support structure is continuously arranged on each of the organic filling layers; and / or, the organic filling layer is a surface flat organic filling layer; and / or, the peripheral region surrounds the periphery of the pixel region.

3. The image sensor of claim 2, wherein: When at least two turns of the organic filling layer are arranged in sequence and nested on the peripheral region, the pads are located below the organic filling layer of the second turn or beyond the second turn in the outward direction from the pixel region.

4. The image sensor of claim 1, wherein: The material of the organic filling layer is an organic light-absorbing material.

5. The image sensor of claim 4, wherein: The width of the organic filling layer arranged in at least one region is greater than the width of the corresponding support structure.

6. The image sensor of claim 5, wherein: The width of the organic filling layer arranged on at least one side is greater than the width of the organic filling layer on other sides; or, the width of the organic filling layer arranged in at least one region close to the pixel region is greater than the width of the corresponding support structure.

7. The image sensor of claim 4, wherein: The material of the organic filling layer is selected from the material of a filter.

8. The image sensor of claim 4, wherein: The height of the upper surface of the organic filling layer is between 1 / 3 of the height of the upper surface of a microlens in the optical component and the height of the upper surface of the microlens.

9. The image sensor according to any one of claims 5 to 8, characterized in that: When the color temperature in the application scenario of the image sensor is less than or equal to 2000K, the material of the organic filling layer is selected from the material of a blue filter; and when the color temperature in the application scenario of the image sensor is greater than or equal to 5500K, the material of the organic filling layer is selected from the material of a red filter.

10. The image sensor of any one of claims 5 to 8, wherein: When the light entering from the first side is the most in the application scenario of the image sensor, the width of the organic filling layer arranged on the second side is greater than the width of the organic filling layer on other sides; wherein the first side is opposite to the second side.

11. The image sensor of claim 1, wherein: The sidewall of the organic filling layer in at least part of the region is provided in a toothed shape; and / or, the material of the organic filling layer is a light-transmitting material.

12. The image sensor of claim 11, wherein: When the sidewall of at least part of the organic filling layer is provided as a tooth-shaped sidewall, the sidewall of at least part of the organic filling layer close to the side of the pixel region is provided as a tooth-shaped sidewall; when the material of the organic filling layer is a light-transmitting material, the light-transmitting material is the material of the microlens.

13. An electronic device, comprising: An image sensor comprising the image sensor as claimed in any one of claims 1-12.

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