Stripping jig and substrate stripping equipment

Abstract

The utility model provides a stripping jig and substrate stripping equipment, and relates to the technical field of semiconductor processing. The stripping jig comprises a base and a clamping structure; the clamping structure is used for clamping the substrate bonding structure; the at least one clamping structure is movably arranged on the base in the first direction, a groove is formed in the side, facing the other clamping structure in the first direction, of each clamping structure, and a substrate bonding structure can be embedded in the grooves. According to the stripping jig, the groove is formed in the side face of the clamping structure so that the substrate bonding structure can be embedded, the substrate bonding structure can be limited while the substrate bonding structure is clamped, the substrate bonding structure cannot deflect by a large angle, and therefore the substrate bonding structure can keep the original posture, and the stripping efficiency is improved. According to the substrate bonding structure provided by the invention, the substrate bonding structure does not deflect or only deflects in a small amplitude, and the clamping force applied to the substrate bonding structure by the clamping structure is not easy to deviate, so that the product is not easy to have the conditions of edge breakage or corner film damage and scratch, and the product yield is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, especially to a peeling jig and substrate peeling equipment. BACKGROUND

[0002] Laser lift-off technology (LLO) is to irradiate sapphire substrate by pulsed laser, so that gallium nitride is thermally decomposed into nitrogen and low melting point metal gallium in the stable range of 900 DEG C-1000 DEG C, thereby realizing the separation of gallium nitride epitaxial layer and sapphire substrate.

[0003] If the die bonding process is skipped after the LED chip is bonded with the driving chip, and the laser lift-off is directly carried out, the sapphire substrate can only be separated by the clamping piece of the push-pull platform. In the separation process, the edge collapse, or the damage and scratch of the corner film are prone to occur, thereby causing the abnormal lighting of the product. UTILITY MODEL CONTENT

[0004] In order to solve the problems in the prior art, one of the purposes of the utility model is to provide a peeling jig.

[0005] The utility model provides the following technical scheme:

[0006] A peeling jig comprises a base and a clamping structure.

[0007] The clamping structure is used for clamping a substrate bonding structure.

[0008] At least one clamping structure is movably arranged on the base along a first direction, and each of the clamping structures is provided with a groove on one side thereof facing another clamping structure along the first direction, and the groove is capable of embedding the substrate bonding structure.

[0009] The first direction is the direction of the line connecting two adjacent clamping structures.

[0010] As a further optional scheme of the peeling jig, the substrate bonding structure comprises a driving chip arranged in layers, the groove is capable of embedding the edge of the driving chip, and the groove has a first groove wall, a groove bottom and a second groove wall connected in sequence.

[0011] The first groove wall is parallel to the first direction, and the first groove wall is used for supporting the driving chip.

[0012] The groove bottom is used for abutting against the edge of the driving chip to clamp the driving chip.

[0013] The second groove wall is parallel to the first groove wall, and the distance between the second groove wall and the first groove wall is greater than the thickness of the driving chip.

[0014] As a further optional solution to the peeling jig, a distance between the second groove wall and the first groove wall is D, a thickness of the driving chip is H, and 100 μm≤D-H≤300 μm.

[0015] As a further optional solution to the peeling jig, each of the clamping structures is provided with a stepped portion on a side thereof facing the other clamping structure along the first direction, the stepped portion is flush with the first groove wall, and the stepped portion is used for supporting the driving chip.

[0016] As a further optional solution to the peeling jig, the peeling jig further comprises a driving member, the driving member is arranged on the base, and the driving member is used for driving the at least one clamping structure to move along the first direction.

[0017] As a further optional solution to the peeling jig, the driving member comprises a lead screw, the lead screw is arranged along the first direction, the lead screw is rotationally arranged on the base, the lead screw is arranged through the clamping structure, and the lead screw is threadedly matched with the clamping structure.

[0018] As a further optional solution to the peeling jig, the driving member comprises a threaded rod, the threaded rod is arranged along the first direction, the threaded rod is arranged through the base and is threadedly matched with the base, and the threaded rod abuts against a side of the clamping structure away from the other clamping structure along the first direction.

[0019] As a further optional solution to the peeling jig, the base is provided with a guide groove, the guide groove is arranged to extend along the first direction, and the at least one clamping structure is slidingly arranged in the guide groove.

[0020] Another object of the present application is to provide a substrate peeling apparatus.

[0021] The present application provides the following technical solutions:

[0022] A substrate peeling apparatus comprises the peeling jig.

[0023] As a further optional solution to the substrate peeling apparatus, the substrate peeling apparatus further comprises at least one of a dispensing mechanism, a curing mechanism, a transfer mechanism, and a clamping mechanism.

[0024] The embodiments of the present application have the following beneficial effects:

[0025] In the process of separating the substrate layer of the LED chip, the auxiliary separation piece is first fixedly attached to the substrate layer of the LED chip to form a substrate bonding structure together with the driving chip bonded to the LED chip. Then, the substrate bonding structure is placed between any two clamping structures by using the peeling jig. At least one clamping structure is moved towards the other clamping structure along the first direction until the substrate bonding structure is embedded in the groove on the clamping structure and clamped by the two clamping structures. Subsequently, the auxiliary separation piece is clamped to separate the substrate layer from the LED chip. During the separation process, the entire substrate bonding structure has a tendency to deflect under the action of an external force, but cannot deflect by a large angle due to the limitation of the groove. Therefore, the substrate bonding structure can maintain the original posture or only deflect by a small amplitude, and the clamping force applied by the clamping structure to the substrate bonding structure is not easy to deviate, so that the product is not easy to have the edge collapse or the damage and smearing of the film at the corner, thereby improving the yield of the product.

[0026] In order to make the above-mentioned purposes, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0028] Figure 1 A schematic diagram of clamping and separating the substrate layer by the push-pull force platform is shown.

[0029] Figure 2 A schematic diagram of the overall structure of the peeling jig is shown.

[0030] Figure 3 A schematic diagram of the local structure of the peeling jig is shown.

[0031] Explanation of main element symbols:

[0032] 10-driving chip; 20-LED chip; 21-substrate layer; 30-auxiliary separation piece; 100-base; 110-guide groove; 200-clamping structure; 210-groove; 211-first groove wall; 212-groove bottom; 213-second groove wall; 220-step portion; 300-driving piece; X-first direction. DETAILED DESCRIPTION

[0033] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used only for the purpose of explaining the present application, and should not be understood as limiting the present application.

[0034] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "overlying," "atop," "on," "against" and the like, as used herein, can mean that the first element is present on the second element or against the second element, and can mean that the first element is present directly on the second element or directly against the second element. As used herein, the term "vertical" refers to a direction that is perpendicular to the plane of the drawing sheet, and the term "horizontal" refers to a direction that is parallel to the plane of the drawing sheet.

[0035] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the template herein is only for the purpose of describing specific embodiments and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0038] Please refer to Figure 1 After the laser stripping is completed, the driving chip 10 is clamped and fixed as a bottom plate in the process of clamping and separating the substrate layer 21 of sapphire material, which is easy to crack, causing edge cracking, or easy to cause edge film damage and scratches, and further causing product lighting abnormalities.

[0039] The inventor of the present application finds that this is due to the uneven distribution of external force T acting on the substrate layer 21 along the normal direction of the plane where the substrate layer 21 is located, deviating from the center of the substrate layer 21. When the external force T is transmitted to the driving chip 10, it is easy to make the driving chip 10 deflect, and then cause the clamping force F acting on both sides of the driving chip 10 to be misaligned. And after the driving chip 10 deflects, the clamping force F cannot act on the driving chip 10 along the plane where the driving chip 10 is located. Therefore, the driving chip 10 is easy to collapse, or easy to appear the situation of edge film damage and smearing.

[0040] In view of the above problems, please refer to Figure 2 and Figure 3 The embodiment provides a peeling jig, which comprises a base 100 and a clamping structure 200.

[0041] Specifically, the clamping structure 200 is used for clamping a substrate bonding structure.

[0042] The number of clamping structures 200 can be two, or three, four or more. When the number of clamping structures 200 is greater than two, it can be that every two clamping structures 200 form a group to clamp the same substrate bonding structure, or one clamping structure 200 can cooperate with multiple clamping structures 200 to clamp multiple substrate bonding structures respectively.

[0043] Hereinafter, two clamping structures 200 are taken as an example for description.

[0044] In addition, at least one clamping structure 200 is movably arranged on the base 100 along a first direction X. The side of the clamping structure 200 facing the other clamping structure 200 along the first direction X is provided with a groove 210, which can accommodate the substrate bonding structure.

[0045] Among them, the first direction X is the direction of the line connecting the two adjacent clamping structures 200.

[0046] When the substrate layer 21 of the LED chip 20 is separated, the auxiliary separation piece 30 is first fixedly attached to the substrate layer 21 of the LED chip 20, together with the driving chip 10 bonded to the LED chip 20 to form a substrate bonding structure. Then the above-mentioned peeling jig is used to place the substrate bonding structure between any two clamping structures 200. At least one clamping structure 200 is moved along the first direction X towards the other clamping structure 200 until the substrate bonding structure is embedded in the groove 210 on the clamping structure 200 and clamped by the two clamping structures 200. Then the auxiliary separation piece 30 is clamped, which can drive the substrate layer 21 to peel off from the LED chip 20.

[0047] During the peeling process, the whole substrate bonding structure has a tendency to deflect under the action of external force, but due to the limitation of the groove 210, it cannot deflect by a large angle, so the substrate bonding structure can maintain its original posture, or only a small deflection occurs, and the clamping force applied by the clamping structure 200 to the substrate bonding structure is not easy to deviate, thereby preventing the product from being prone to edge collapse or edge film damage, and improving the product yield.

[0048] In the present embodiment, one of the clamping structures 200 is movably arranged in the base 100 along the first direction X, and the other clamping structure 200 is fixedly connected with the base 100. During use, the movable clamping structure 200 moves relative to the base 100 along the first direction X, and approaches or moves away from the other clamping structure 200.

[0049] In another embodiment of the present application, both clamping structures 200 can be movably arranged in the base 100 along the first direction X. During use, both clamping structures 200 move relative to the base 100 along the first direction X, and the moving directions of the two clamping structures 200 are opposite, and the two clamping structures 200 simultaneously approach or move away from each other.

[0050] In some embodiments, the peeling jig described above further comprises a driving member 300. The driving member 300 is arranged in the base 100, and the driving member 300 is used to drive at least one clamping structure 200 to move along the first direction X.

[0051] Specifically, the driving member 300 comprises a lead screw. The lead screw is arranged along the first direction X, and the lead screw is rotatably arranged in the base 100. In addition, the lead screw is arranged through the clamping structure 200 and threadedly cooperates with the clamping structure 200.

[0052] During use, the lead screw rotates relative to the base 100, while the clamping structure 200 remains stationary. The clamping structure 200 is equivalent to a nut seat, and moves along the length direction of the lead screw (i.e. the first direction X).

[0053] It can be understood that a motor can be arranged on the base 100. The output shaft of the motor is connected with the lead screw to drive the lead screw to rotate.

[0054] In particular, when both clamping structures 200 are movably arranged in the base 100 along the first direction X, the lead screw is arranged through both clamping structures 200, and one end of the lead screw is provided with a left-hand thread, and the other end is provided with a right-hand thread. The lead screw threadedly cooperates with one of the clamping structures 200 through the left-hand thread, and threadedly cooperates with the other clamping structure 200 through the right-hand thread. At this time, the motor only needs to drive one lead screw to rotate, which can drive both clamping structures 200 to approach or move away from each other.

[0055] Alternatively, the driving member 300 can also include a threaded rod. The threaded rod is arranged along the first direction X, and is arranged through the base 100 and threadedly cooperates with the base 100. In addition, the threaded rod abuts against one side of the clamping structure 200 away from the other clamping structure 200 along the first direction X.

[0056] In use, after the substrate bonding structure is placed between the two clamping structures 200, the operator can manually rotate the threaded rod to push the clamping structure 200 to move towards the other clamping structure 200 until the substrate bonding structure is clamped.

[0057] Further, the base 100 is provided with a guide groove 110. The guide groove 110 is arranged along the first direction X, and the at least one clamping structure 200 is slidingly arranged in the guide groove 110.

[0058] During the movement of the clamping structure 200 along the first direction X, the guide groove 110 can guide and limit the clamping structure 200, so that the clamping structure 200 moves stably and avoids deviation, thereby ensuring that the clamping structure 200 can stably clamp the substrate bonding structure.

[0059] It should be noted that the substrate bonding structure includes the driving chip 10, the LED chip 20 and the auxiliary separation piece 30 arranged in layers, the driving chip 10 is bonded with the LED chip 20, and the substrate layer 21 of the LED chip 20 is connected with the auxiliary separation piece 30.

[0060] In some embodiments, the groove 210 can accommodate the edge of the driving chip 10, and the groove 210 has a first groove wall 211, a groove bottom 212 and a second groove wall 213 connected in sequence.

[0061] The first groove wall 211 is parallel to the first direction X, and the first groove wall 211 is used to support the driving chip 10, specifically to support the side of the driving chip 10 away from the LED chip 20.

[0062] The groove bottom 212 is used to abut against the edge of the driving chip 10 to clamp the driving chip 10.

[0063] The second groove wall 213 is parallel to the first groove wall 211, and the distance between the second groove wall 213 and the first groove wall 211 is greater than the thickness of the driving chip 10.

[0064] As the two clamping structures 200 approach each other, the edge of the driver chip 10 gradually embeds into the groove 210. The first groove wall 211 of the groove 210 first contacts the side of the driver chip 10 away from the LED chip 20, providing support for the entire substrate bonding structure. After the clamping structure 200 moves into place, the bottom 212 of one groove 210 abuts against one side of the edge of the driver chip 10, and the bottom 212 of the other groove 210 abuts against the opposite side of the edge of the driver chip 10, thereby clamping the driver chip 10.

[0065] The distance between the second groove wall 213 and the first groove wall 211 is greater than the thickness of the driver chip 10, ensuring that the edge of the driver chip 10 can be smoothly embedded between the second groove wall 213 and the first groove wall 211.

[0066] Specifically, the first direction X is horizontal, and both the plane containing the first trench wall 211 and the plane containing the second trench wall 213 are horizontal. Before the driver chip 10 is clamped, the substrate bonding structure can be stably placed on the first trench wall 211 under its own gravity.

[0067] Furthermore, the distance between the second trench wall 213 and the first trench wall 211 is D, and the thickness of the driving chip 10 is H, 100μm≤DH≤300μm.

[0068] Understandably, the distance between the second groove wall 213 and the first groove wall 211 is equal to the groove width of the groove 210. This ensures that the difference between the groove width of the groove 210 and the thickness of the driver chip 10 is not less than 100 μm, which facilitates the smooth embedding of the edge of the driver chip 10 between the second groove wall 213 and the first groove wall 211. Conversely, ensuring that the difference between the groove width of the groove 210 and the thickness of the driver chip 10 is not greater than 300 μm prevents a significant deflection of the edge of the driver chip 10 within the groove 210, ensuring that the driver chip 10 is subjected to uniform force.

[0069] For example, the distance between the second groove wall 213 and the first groove wall 211 is 300±50μm, and the thickness of the driver chip 10 is 500±50μm.

[0070] Furthermore, each clamping structure 200 has a stepped portion 220 on one side along the first direction X toward the other clamping structure 200. The stepped portion 220 is flush with the first groove wall 211 and is used to support the driver chip 10, specifically supporting the side of the driver chip 10 away from the LED chip 20.

[0071] Before the edges of the driving chip 10 are gradually embedded into the grooves 210, the stepped portions 220 can support the entire substrate bonding structure without the need for other structures to position the substrate bonding structure. As the two clamping structures 200 are brought together, the edges of the driving chip 10 can be smoothly embedded into the grooves 210 until the driving chip 10 is clamped.

[0072] In summary, the above-described peeling jig, by providing the grooves 210 on the sides of the clamping structure 200 for the edges of the driving chip 10 to be embedded, can limit the driving chip 10 while clamping the driving chip 10, so that the driving chip 10 cannot be deflected by a large angle, so that the substrate bonding structure can maintain its original posture or only be deflected by a small amplitude, and it is not easy for the clamping force applied by the clamping structure 200 to the driving chip 10 to be offset, so that the driving chip 10 is not easy to have the edge collapse or the corner film breakage and scuffing, and the product yield is improved.

[0073] In addition, when the LED chip 20 is bound with the driving chip 10 and the die bonding process is skipped, there is no FPC (Flexible Printed Circuit) as a substrate, and the stress area is small. In contrast, the above-described peeling jig can fully utilize the size difference between the driving chip 10 and other structures, protect the driving chip 10 and the LED chip 20 through the groove 210 design, clamp and fix the substrate bonding structure without FPC, and perform the wafer separation action on this basis.

[0074] Furthermore, when the wafer separation is performed by the push-pull force platform, the personnel operation is not convenient, and the peeling success rate is low. In contrast, with the aid of the above-described peeling jig, the substrate bonding structure can be uniformly stressed during the peeling process, the driving chip 10 breakage rate is basically reduced to 0%, and the peeling effect is perfect, greatly improving the peeling success rate; at the same time, the production smoothness can be improved, and the overall production rhythm is improved by more than 250s.

[0075] The embodiment also provides a substrate peeling device, which includes the above-described peeling jig.

[0076] In some embodiments, the substrate peeling device further includes at least one of a dispensing mechanism, a curing mechanism, a transfer mechanism, and a buckle mechanism.

[0077] After the LED chip 20 is bonded with the driving chip 10, the dispensing mechanism is used to dispense glue on the substrate layer 21 of the LED chip 20, and the auxiliary separation piece 30 is attached, and then it is transferred to the curing mechanism. After the glue layer is cured, the auxiliary separation piece 30 is fixedly connected with the substrate layer 21 to form a substrate bonding structure. Subsequently, the substrate bonding structure is transferred to the peeling jig using the transfer mechanism, and the substrate bonding structure is clamped and fixed by the peeling jig. On this basis, the buckle mechanism clamps the auxiliary separation piece 30, that is, the substrate layer 21 and the LED chip 20 are separated, and the peeling operation is completed. Finally, the peeled product is taken off using the transfer mechanism.

[0078] Exemplarily, the dispensing mechanism adopts a dispensing valve, the curing mechanism adopts a UV lamp, and the transfer mechanism adopts a mechanical arm.

[0079] In all the examples shown and described herein, any specific values should be interpreted as merely exemplary and not as a limitation, and thus other examples of the exemplary embodiments can have different values.

[0080] It should be noted that similar reference numbers and letters represent similar items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0081] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application.

Claims

1. A peeling jig characterized by comprising: The base and the clamping structure are included; The clamping structure is used for clamping the substrate bonding structure; At least one of the clamping structures is movably arranged on the base along a first direction, and each of the clamping structures is provided with a groove on a side facing another clamping structure along the first direction, and the groove is used for embedding the substrate bonding structure. The first direction is the direction of the line connecting two adjacent clamping structures.

2. The peeling jig according to claim 1, characterized by The substrate bonding structure includes a driving chip arranged in a stack, the groove is used for embedding the edge of the driving chip, and the groove has a first groove wall, a groove bottom and a second groove wall connected in sequence; The first groove wall is parallel to the first direction, and the first groove wall is used for supporting the driving chip; The groove bottom is used for abutting against the edge of the driving chip to clamp the driving chip; The second groove wall is parallel to the first groove wall, and the distance between the second groove wall and the first groove wall is greater than the thickness of the driving chip.

3. The peeling jig according to claim 2, characterized by The distance between the second groove wall and the first groove wall is D, and the thickness of the driving chip is H, and 100 μm≤D-H≤300 μm.

4. The peeling jig according to claim 2, characterized by Each of the clamping structures is provided with a step portion on a side facing another clamping structure along the first direction, the step portion is flush with the first groove wall, and the step portion is used for supporting the driving chip.

5. The peeling jig according to any one of claims 1 to 4, characterized by, The peeling jig further includes a driving member arranged on the base, and the driving member is used for driving at least one of the clamping structures to move along a first direction.

6. The peeling jig according to claim 5, characterized by The driving member includes a lead screw arranged along the first direction, the lead screw is rotatably arranged on the base, the lead screw is arranged through the clamping structure and threadedly cooperates with the clamping structure.

7. The peeling jig according to claim 5, characterized by The driving member includes a threaded rod arranged along the first direction, the threaded rod is arranged through the base and threadedly cooperates with the base, and the threaded rod abuts against a side of the clamping structure facing away from another clamping structure along the first direction.

8. The peeling jig according to any one of claims 1 to 4, characterized by, The base is provided with a guide groove extending along the first direction, and at least one of the clamping structures is slidingly arranged in the guide groove.

9. A substrate peeling apparatus characterized by comprising: The substrate peeling apparatus includes the peeling jig according to any one of claims 1-8.

10. The substrate peeling apparatus according to claim 9, wherein The substrate peeling apparatus further includes at least one of a dispensing mechanism, a curing mechanism, a transfer mechanism and a clamping mechanism.

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