Semiconductor wafer cleaning equipment
By installing a temperature detection device inside the overflow tank, the cleaning fluid is controlled to be discharged when it is below the preset temperature, which solves the problem of water pipe deformation and leakage caused by high temperature liquid discharged from the overflow tank and improves the safety of semiconductor wafer cleaning equipment.
Patent Information
- Application Number
- CN202520031154.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-01-06
AI Technical Summary
In existing technologies, the cleaning fluid discharged from the overflow tank is at a high temperature, which can easily lead to deformation and leakage of water pipes, posing a serious safety hazard.
A temperature detection device is installed in the overflow tank to detect the temperature of the cleaning fluid and control the drain valve to discharge the cleaning fluid when the preset temperature is reached, thus avoiding water pipe deformation and leakage caused by high temperature.
The use of a temperature detection device ensures that the cleaning fluid is discharged when it is below the preset temperature, which solves the problems of water pipe deformation and leakage, and improves the safety and reliability of the equipment.
Smart Images
Figure CN223928764U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor material cleaning technology, specifically to a semiconductor wafer cleaning device. Background Technology
[0002] Currently, milled silicon carbide wafers require cleaning, typically using chemical solutions or deionized water. After cleaning, multiple rinsing steps are necessary, followed by drying. Wet cleaning equipment is generally used to remove particulate impurities and residual chemicals from the wafer surface, resulting in a clean surface. Wet cleaning equipment mainly consists of a spray tank, overflow tank, flow equalization plate, fast exhaust cylinder, and nozzles. Currently, the cleaning solution overflowing from the spray tank enters the overflow tank. This cleaning solution is at a high temperature, generally around 60°C. Directly discharging this 60°C hot water into the field can cause the water pipes to deform under the high temperature, leading to leaks and posing a serious safety hazard. Summary of the Invention
[0003] This application provides a semiconductor wafer cleaning device to solve the problems of high temperature of the cleaning fluid discharged from the existing overflow tank, which can easily lead to deformation and leakage of the water pipe.
[0004] To achieve the above objectives, this application provides the following technical solution:
[0005] A semiconductor wafer cleaning device, comprising:
[0006] A spray tank and an overflow tank, wherein the spray tank is located within the overflow tank;
[0007] The spray pipeline assembly is located above the spray tank and is used to spray cleaning fluid into the spray tank.
[0008] The drain pipeline assembly includes a drain pipeline and a drain control valve. The drain pipeline is connected to the overflow tank and is used to drain the cleaning fluid. The drain control valve is located on the drain pipeline and is used to control the on / off state of the pipeline.
[0009] The system includes a temperature detection device and a main control device. The temperature detection device is located inside the overflow tank and is used to detect the temperature of the cleaning fluid inside the overflow tank. The main control device is used to control the drain control valve to open and discharge the cleaning fluid when the detected cleaning fluid temperature is less than or equal to a preset temperature.
[0010] Optionally, the temperature detection device is in several groups, and each group of temperature detection devices is connected to the main control device.
[0011] The main control device is used to control the drain control valve to open when the temperature of the cleaning fluid detected by all the temperature detection devices in the group is less than or equal to the preset temperature.
[0012] Optionally, the bottom of the overflow tank has a downwardly recessed liquid collection section, and the drain pipe is located on the lower outer side of the overflow tank and is connected to the liquid collection section.
[0013] Optionally, the liquid collection section gradually curves downwards from the circumference of the overflow tank towards the center of the overflow tank via a line segment.
[0014] Optionally, the liquid collecting section is a conical liquid collecting section.
[0015] Optionally, the liquid collection section transitions downwards from the circumference of the overflow tank to the center of the overflow tank via a smooth curve.
[0016] Optionally, the liquid collecting part is an arc-shaped liquid collecting part.
[0017] Optionally, the overflow tank further includes:
[0018] A drainage mechanism is located at the liquid collection section. The drainage mechanism has a number of drainage holes, some of which are set close to the bottom wall of the overflow tank.
[0019] The drainage pipeline is connected to the liquid collection section via the drainage mechanism.
[0020] Optionally, the drainage mechanism includes a plurality of drainage cones, each of which shares a common vertex and is hollow, and the side of each drainage cone is in contact with the conical surface of the conical liquid collection part;
[0021] Each of the drainage cones has several drainage holes on its base surface.
[0022] Optionally, the drain control valve is a pneumatic valve.
[0023] This application provides a semiconductor wafer cleaning device, comprising: a spray tank and an overflow tank, the spray tank being located within the overflow tank; a spray pipeline assembly located above the spray tank for spraying cleaning fluid into the spray tank; a drain pipeline assembly including a drain pipeline and a drain control valve, the drain pipeline being connected to the overflow tank for discharging the cleaning fluid; the drain control valve being located on the drain pipeline for controlling the on / off state of the pipeline; a temperature detection device and a main control device, the temperature detection device being located within the overflow tank for detecting the temperature of the cleaning fluid within the overflow tank; and the main control device controlling the drain control valve to open and discharge the cleaning fluid when the detected cleaning fluid temperature is less than or equal to a preset temperature.
[0024] The semiconductor wafer cleaning equipment provided in this application embodiment has the following technical advantages compared to the prior art:
[0025] In this application, the spray tank is located inside the overflow tank, and the spray pipeline assembly is located above the spray tank to spray cleaning fluid into the spray tank. The drain pipeline assembly includes a drain pipe and a drain control valve. The drain pipe is connected to the overflow tank, and the drain control valve is located on the drain pipe. A temperature detection device is installed inside the overflow tank to detect the temperature of the cleaning fluid inside the overflow tank. When the detected cleaning fluid temperature is less than or equal to a preset temperature, the main control device controls the drain control valve to open and discharge the cleaning fluid. Thus, without replacing the cleaning equipment pipeline, the cleaning fluid temperature can be detected by setting a temperature detection device, and the cleaning fluid can be discharged when the temperature is lower than the preset temperature, solving the problem of water pipe deformation and leakage caused by high temperature and improving equipment safety. Attached Figure Description
[0026] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0027] Figure 1 This is a schematic diagram of the structure of a semiconductor wafer cleaning device provided in an embodiment of this application.
[0028] The following labels are shown in the attached diagram:
[0029] 1. Spray tank body; 2. Overflow tank body; 3. Spray pipeline assembly; 4. Drainage pipeline; 5. Drainage control valve; 6. Temperature detection device.
[0030] Liquid collection section 21, drainage mechanism 22, drainage hole 221. Detailed Implementation
[0031] This invention discloses a semiconductor wafer cleaning device to solve the problems of high temperature of the cleaning fluid discharged from the existing overflow tank, which easily leads to deformation and leakage of water pipes.
[0032] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.
[0033] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a semiconductor wafer cleaning device provided in an embodiment of this application.
[0034] In one specific embodiment, the semiconductor wafer cleaning equipment provided in this application includes a spray tank 1, an overflow tank 2, a spray pipeline assembly 3, a drain pipeline assembly 4, a temperature detection device 6, and a main control device. The spray tank 1 is used to hold the wafers. The spray pipeline assembly 3 is located above the spray tank 1 and sprays cleaning fluid into the spray tank 1. It is understood that a fast exhaust cylinder and a lower spray pipeline are provided at the bottom of the spray tank 1 to achieve rapid drainage of the cleaning fluid in the spray tank 1 and injection of the cleaning fluid from bottom to top into the spray tank 1. The fast exhaust cylinder and lower spray pipeline can be configured according to existing technology, and will not be elaborated further here. The spray tank 1 is located within the overflow tank 2, which is used to receive the cleaning fluid overflowing from the spray tank 1 and discharge it through the drain pipeline assembly 4. The drainage pipeline 4 assembly includes a drainage pipeline 4 and a drainage control valve 5. The drainage control valve 5 is preferably an electrically controlled valve or a pneumatic valve to achieve automated control of the pipeline opening and closing. The drainage pipeline 4 is connected to the bottom of the overflow tank 2 and can be connected through a connector.
[0035] To prevent the cleaning fluid discharged from the overflow tank 2 from being too hot, which could cause deformation or leakage of the water pipes, a temperature detection device 6 is installed inside the overflow tank 2 to detect the temperature of the cleaning fluid. The temperature detection device 6 is connected to the main control device. When the detected cleaning fluid temperature is less than or equal to a preset temperature, the main control device controls the drain control valve 5 to open and discharge the cleaning fluid. This ensures that the discharged cleaning fluid will not cause deformation of the water pipes and thus leakage. The preset temperature is generally between 40-50℃, preferably 45℃. Therefore, without replacing the cleaning equipment piping, by installing the temperature detection device 6 to detect the cleaning fluid temperature and discharging the cleaning fluid when the temperature is below the preset temperature, the problem of water pipe deformation and leakage due to high temperature is solved, improving equipment safety.
[0036] Specifically, the temperature detection devices 6 consist of several groups, and each group of temperature detection devices 6 is connected to the main control device. The main control device is used to control the drain control valve 5 to open when the temperature of the cleaning fluid detected by all groups of temperature detection devices 6 is less than or equal to the preset temperature. This improves control accuracy, prevents misjudgment, and enhances system safety. When all groups of temperature detection devices 6 malfunction or fail simultaneously, an alarm is triggered, and the drain control valve 5 is manually opened to drain the water.
[0037] In one embodiment, the bottom of the overflow tank 2 has a downwardly recessed liquid collection section 21. The drain pipe 4 is located on the lower outer side of the overflow tank 2 and is connected to the liquid collection section 21 to discharge the cleaning liquid at the liquid collection section 21. The liquid collection section 21 is located at the bottom of the overflow tank 2 and is downwardly recessed, thereby increasing the buffer water in the overflow tank 2. Based on the overflow process of hot and cold water intervals in the overflow tank, the cooling time of hot water in the tank is shortened, the normal operating time of the equipment is increased, and costs are reduced and efficiency is improved.
[0038] It is understood that the liquid collection part 21 can be located at the center of the bottom of the overflow tank 2, or it can be located at the entire bottom of the overflow tank 2. Preferably, the liquid collection part 21 is located at the entire bottom of the overflow tank 2, that is, the entire bottom of the tank is recessed downwards to increase the volume of the overflow tank 2 and increase the water buffer in the tank. The drain pipe 4 is located at the lower outer part of the overflow tank 2 and penetrates the bottom of the overflow tank 2 to communicate with the inner cavity, so as to realize the discharge of cleaning liquid. Specifically, the liquid collection part 21 gradually transitions downwards from the circumference of the overflow tank 2 to the center of the overflow tank 2 through a line segment. The line segment is preferably a straight line segment. In other embodiments, the line segment can also be composed of several straight line segments to form a stepped concavity, all of which are within the protection scope of this application.
[0039] Preferably, the liquid collecting part 21 is a conical liquid collecting part 21 and is disposed on the entire bottom of the overflow tank 2.
[0040] In another embodiment, the liquid collecting part 21 transitions downwards from the circumference of the overflow tank 2 to the center of the overflow tank 2 via a smooth curve. Similarly, the liquid collecting part 21 is preferably provided on the entire bottom of the overflow tank 2, that is, the entire bottom of the tank is recessed downwards to increase the volume of the overflow tank 2 and increase the water buffer in the tank. The liquid collecting part 21 is an arc-shaped liquid collecting part 21, which further increases the water buffer in the overflow tank 2, while its structure is simple and easy to manufacture.
[0041] Specifically, the overflow tank 2 also includes a drainage mechanism 22 located at the liquid collection section 21. The drainage mechanism 22 has several drainage holes 221 to discharge the cleaning fluid. Simultaneously, the drainage mechanism 22 is designed to block impurities within the overflow tank 2, preventing particulate impurities from clogging the drain pipe 4. Furthermore, to facilitate rapid drainage of the cleaning fluid from the overflow tank 2, some drainage holes 221 are positioned close to the bottom wall of the overflow tank 2, ensuring complete and rapid drainage of the cleaning fluid. Shorter drainage time results in a higher drainage flow rate, which is beneficial for deionized water to remove particulate impurities from the wafer surface, improving the wafer cleaning effect. The drainage mechanism 22 can be configured as a shell or cavity structure, such as a rectangular shell. Drainage holes 221 are provided at the bottom of the rectangular shell, connecting the inner cavity of the rectangular shell to the inner cavity of the overflow tank 2, facilitating effective drainage of the cleaning fluid at the bottom of the overflow tank 2. It can be understood that the drain pipe 4 is connected to the liquid collection section 21 via the drainage mechanism 22.
[0042] Based on the conical structure of the liquid collection part 21, the drainage mechanism 22 includes several drainage cones, each with a common vertex and a hollow structure. The side of each drainage cone is in contact with the conical surface of the cylindrical liquid collection part 21. Several drainage holes 221 are provided on the base surface of each drainage cone. Preferably, the drainage pipe 4 is connected to the vertex of each drainage cone to realize the discharge of cleaning liquid.
[0043] It is understood that each drainage cone is placed upside down on the conical surface of the cylindrical liquid collection part 21, with the base surface of the drainage cone facing upwards. Each base surface is provided with a plurality of drainage holes 221. The drainage cones near the conical surface of the cylindrical liquid collection part 21 have drainage holes 221 that are close to the conical surface, so that the cleaning liquid in the overflow tank 2 can be completely and quickly discharged. In other embodiments, the drainage mechanism 22 can be configured as a conical shell to simplify the structure and facilitate installation.
[0044] The aforementioned semiconductor wafer cleaning equipment improves efficiency and reduces costs by modifying the structure of the drain pipe 4, adding valves to it, changing the structure of the overflow tank 2 and the layout of the drain hole 221, increasing buffer water, reducing cooling time, and improving normal operating time. It effectively meets process requirements, ensures product safety, and reduces equipment safety hazards by modifying the machine in a low-cost manner.
[0045] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.
[0046] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
Claims
1. A semiconductor wafer cleaning apparatus characterized by comprising: The application relates to a cleaning device for a semiconductor manufacturing process, comprising: a spray tank and an overflow tank, the spray tank being located in the overflow tank; a spray pipeline assembly located above the spray tank and used for spraying cleaning liquid into the spray tank; a drainage pipeline assembly comprising a drainage pipeline and a drainage control valve, the drainage pipeline being in communication with the overflow tank and used for draining cleaning liquid, and the drainage control valve being located on the drainage pipeline and used for controlling pipeline opening and closing; a temperature detection device located in the overflow tank and used for detecting the temperature of cleaning liquid in the overflow tank, and a main control device used for controlling the drainage control valve to be opened to drain cleaning liquid when the detected temperature of cleaning liquid is less than or equal to a preset temperature.
2. The semiconductor wafer cleaning apparatus according to claim 1, wherein The temperature detection device is in several groups, and any group of the temperature detection device is connected with the main control device respectively. The main control device is used for controlling the drainage control valve to be opened when the detected temperatures of cleaning liquid of all groups of the temperature detection device are less than or equal to the preset temperature.
3. The semiconductor wafer cleaning apparatus according to claim 1, wherein The tank bottom of the overflow tank has a downwardly recessed liquid collecting part, the drainage pipeline is located below the outer side of the overflow tank and is in communication with the liquid collecting part.
4. The semiconductor wafer cleaning apparatus according to claim 3, wherein The liquid collecting part gradually transitions from the circumferential direction of the overflow tank to the center of the overflow tank through a linear segment.
5. The semiconductor wafer cleaning apparatus according to claim 4, wherein The liquid collecting part is a conical liquid collecting part.
6. The semiconductor wafer cleaning apparatus according to claim 3, wherein The liquid collecting part gradually transitions from the circumferential direction of the overflow tank to the center of the overflow tank through a smooth curve.
7. The semiconductor wafer cleaning apparatus according to claim 6, wherein The liquid collecting part is a circular-arc-shaped liquid collecting part.
8. The semiconductor wafer cleaning apparatus according to claim 5, wherein The overflow tank further comprises: a drainage mechanism located at the liquid collecting part, the drainage mechanism having a plurality of drainage holes, and part of the drainage holes being arranged close to the tank bottom wall of the overflow tank; the drainage pipeline is in communication with the liquid collecting part through the drainage mechanism.
9. The semiconductor wafer cleaning apparatus according to claim 8, wherein The drainage mechanism comprises a plurality of drainage cones, each of the drainage cones has a common apex and is a hollow structure, and the side surface of each of the drainage cones is attached to the conical surface of the conical liquid collecting part. A plurality of drainage holes are arranged on the base surface of each of the drainage cones.
10. The semiconductor wafer cleaning apparatus according to claim 1, wherein The drainage control valve is a pneumatic valve.