Pressing structure for chip packaging

Abstract

The utility model discloses a lamination structure for chip packaging, and belongs to the technical field of chip packaging. A heating plate is arranged on the bottom surface of the inner wall of the pressing frame; extension plates are arranged at the two ends of the pressing frame; sliding rails are arranged on the extension plates; sliding blocks are in sliding fit with the sliding rails, clamping blocks are arranged on the top surfaces of the sliding blocks, and a frame is arranged on the other side of the top surface of the base; a guide rod is installed at the top end of the frame in a penetrating mode, the bottom end of the guide rod is connected with an installation base, and an installation plate is arranged at the top end of the guide rod. Through the arrangement of the positioning assembly, the temperature is accurately controlled through the heating plate according to the material characteristics, the packaging material can perfectly adapt to the technology, the packaging quality and reliability are improved, the clamping blocks can be rapidly adjusted in a sliding mode through the sliding rails, the clamping openings firmly clamp the edges of the chips, the chips of different sizes are accurately positioned, and it is ensured that the chips do not move in the pressing process.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically a pressing structure for chip packaging. Background Technology

[0002] With the rapid development of electronic information technology, chips, as the core components of various electronic devices, are becoming increasingly critical in terms of performance and quality. Chip packaging, as an important part of the chip manufacturing process, directly affects the reliability, stability, and yield of chips. In the chip packaging process, the lamination structure plays a crucial role.

[0003] Existing lamination devices are difficult to adapt to chips of different sizes quickly, which can easily cause chip displacement and misalignment, thus affecting packaging efficiency and quality. Utility Model Content

[0004] The purpose of this invention is to provide a pressing structure for chip packaging. By setting up a positioning component and using a heating plate to precisely control the temperature according to the material properties, the packaging material can be perfectly adapted to the process, improving the packaging quality and reliability. The clamping block can be quickly adjusted by sliding along the slide rail, and the bayonet firmly holds the chip edge, accurately positioning chips of different sizes, ensuring that the chip does not shift during pressing, and reducing defects caused by chip position deviation.

[0005] This utility model is achieved through the following technical solution:

[0006] This utility model is a pressing structure for chip packaging, including a base and a pressing head. A positioning component is installed on one side of the top surface of the base. The positioning component includes a pressing frame. A heating plate is provided on the bottom surface of the inner wall of the pressing frame. Extension plates are provided at both ends of the pressing frame. Slide rails are provided on the extension plates. A slider is slidably fitted on the slide rails. A clamping block is provided on the top surface of the slider. A frame is provided on the other side of the top surface of the base. A guide rod is installed through the top of the frame. A mounting seat is connected to the bottom end of the guide rod. A mounting plate is provided at the top of the guide rod. A cylinder is installed in the middle of the top of the frame. The bottom end of the cylinder is connected to the pressing head through the mounting seat.

[0007] Furthermore, the frame is vertically mounted on the top surface of the base, and four supporting feet are provided at the four corners of the bottom surface of the base. The frame is a box-shaped frame with an opening on one side.

[0008] Furthermore, a mounting hole is provided at the top of the frame, and the lower part of the cylinder extends through the mounting hole and is set inside the frame. Four through holes are provided around the outside of the mounting hole, and four guide rods are respectively inserted into the through holes.

[0009] Furthermore, a slot is provided at the bottom of the mounting base, and the pressure head is slidably installed in the slot. A connecting hole is provided at the top of the mounting base, and the lower part of the cylinder passes through the mounting hole and the connecting hole to connect the pressure head.

[0010] Further, the pressing frame is arranged in the shape of a Chinese character 'zhong', a groove is formed in the middle of the pressing frame, the heating plate is arranged on the bottom surface of the groove, and the opening area of the groove matches the bottom surface area of the pressing head.

[0011] Further, the number of the slide rails, the sliders and the clamping blocks is two each. The two slide rails, sliders and clamping blocks are respectively arranged on the extension plates at both ends of the pressing frame. The slide rails are slidably connected to the clamping blocks through the sliders. A bayonet is formed at one end of the clamping block, and the ends of the two clamping blocks where the bayonets are formed are arranged oppositely.

[0012] The utility model has the following beneficial effects:

[0013] By arranging a positioning component, the heating plate precisely controls the temperature according to the material characteristics, enabling the encapsulation material to perfectly adapt to the process, improving the encapsulation quality and reliability. The clamping block can be quickly slid and adjusted through the slide rail, and the bayonet firmly clamps the edge of the chip, precisely positioning chips of different sizes, ensuring that the chip does not displace during pressing, and reducing defective products caused by chip position deviation.

[0014] Certainly, any product implementing the utility model does not necessarily need to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a structural schematic diagram of the pressing structure;

[0016] Figure 2 is an internal structural schematic diagram of the pressing structure;

[0017] Figure 3 is a structural schematic diagram of the positioning component;

[0018] Figure 4 is a structural schematic diagram of the frame, the guide rod, the mounting plate, the cylinder, the mounting seat and the pressing head.

[0019] In the figure: 1, base; 2, frame; 3, positioning component; 301, pressing frame; 302, heating plate; 303, slide rail; 304, slider; 305, clamping block; 4, guide rod; 5, mounting plate; 6, cylinder; 7, mounting seat; 8, pressing head. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figure 1-4, The utility model provides a technical solution: a pressing structure for chip packaging, including a base 1 and a pressing head 8. On one side of the top surface of the base 1, a positioning component 3 is installed. The positioning component 3 includes a pressing frame 301. On the bottom surface of the inner wall of the pressing frame 301, a heating plate 302 is provided. The pressing frame 301 is arranged in a "middle" shape. A groove is formed in the middle of the pressing frame 301, and the heating plate 302 is arranged on the bottom surface of the groove. When chip packaging is carried out, the heating plate 302 can accurately adjust the temperature according to the characteristics of the packaging material and the process requirements, so as to make the packaging material reach the best state. The model of the heating plate 302 is an MCH (Metal Ceramics Heater) ceramic heating plate 302, and the power can be selected according to different packaging requirements. It can accurately heat the small-area chip packaging area. The opening area of the groove matches the bottom surface area of the pressing head 8 to ensure uniform pressing force. Extension plates are provided at both ends of the pressing frame 301, and slide rails 303 are provided on the extension plates. A slider 304 is slidably fitted on the slide rails 303. A clamping block 305 is provided on the top surface of the slider 304. The number of the slide rails 303, sliders 304 and clamping blocks 305 is two. The two slide rails 303, sliders 304 and clamping blocks 305 are respectively arranged on the extension plates at both ends of the pressing frame 301. The slide rails 303 are slidably connected to the clamping blocks 305 through the sliders 304. A bayonet is formed at one end of the clamping block 305. The ends of the two clamping blocks 305 with bayonets are arranged oppositely. The two clamping blocks 305 can slide on the sliders 304 through the slide rails 303, can quickly and accurately adapt to chips of different sizes, and its bayonet can firmly hold the edge of the chip to ensure the stable position of the chip during the packaging process. On the other side of the top surface of the base 1, a frame 2 is provided. The frame 2 is vertically arranged on the top surface of the base 1. Four support feet are provided at the four corners of the bottom surface of the base 1. The four support feet provide stable support for the whole device to ensure that the packaging process is not interfered by external factors such as shaking. The frame 2 is a box-shaped frame with one side open. A guide rod 4 is installed through the top end of the frame 2. The bottom end of the guide rod 4 is connected to a mounting seat 7. The top end of the guide rod 4 is provided with a mounting plate 5. A cylinder 6 is installed in the middle of the top end of the frame 2. A mounting hole is formed in the top end of the frame 2. The lower part of the cylinder 6 penetrates through the mounting hole and extends into the interior of the frame 2. Four through holes are formed around the outside of the mounting hole. The four guide rods 4 are respectively inserted through the through holes. The position deviation of the pressing head 8 is controlled within a very small range through the guide rods 4 to ensure the pressing accuracy. The bottom end of the cylinder 6 penetrates through the mounting seat 7 and is connected to the pressing head 8. When the pressing head 8 is driven by the cylinder 6 to lift and lower, it moves strictly along a straight line, so that the pressing head 8 can smoothly and powerfully perform a pressing action on the chip and the packaging material under the action of the cylinder 6. A notch is formed at the bottom end of the mounting seat 7. The pressing head 8 is slidably installed in the notch. A connection hole is formed at the top end of the mounting seat 7. The lower part of the cylinder 6 penetrates through the mounting hole and the connection hole in sequence and is connected to the pressing head 8.

[0022] During operation, the chip is first placed in the pressing frame 301. By sliding the two clamps 305, the chip edge is locked in place, and the chip position is precisely fixed. The temperature of the heating plate 302 is set according to the characteristics of the packaging material to regulate the state of the packaging material. Then, the cylinder 6 is started, and the cylinder 6 pushes the pressing head 8 to descend linearly along the guide rod 4. The pressing head 8 presses the chip and packaging material smoothly and powerfully. After pressing is completed, the cylinder 6 drives the pressing head 8 to rise back, completing one chip packaging operation.

[0023] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A pressing structure for chip packaging, comprising a base (1) and a pressing head (8), characterized in that: On one side of the top surface of the base (1), a positioning component (3) is installed. The positioning component (3) includes a pressing frame (301). On the bottom surface of the inner wall of the pressing frame (301), a heating plate (302) is provided. At both ends of the pressing frame (301), extension plates are provided, and slide rails (303) are provided on the extension plates. A slider (304) is slidably fitted on the slide rail (303). On the top surface of the slider (304), a clamping block (305) is provided. On the other side of the top surface of the base (1), a frame (2) is provided. A guide rod (4) is installed through the top end of the frame (2). The bottom end of the guide rod (4) is connected to a mounting seat (7). The top end of the guide rod (4) is provided with a mounting plate (5). In the middle of the top end of the frame (2), a cylinder (6) is installed. The bottom end of the cylinder (6) passes through the mounting seat (7) and is connected to a pressing head (8).

2. The chip packaging lamination structure according to claim 1, characterized in that... , The frame (2) is vertically arranged on the top surface of the base (1). Four supporting feet are provided at the four corners of the bottom surface of the base (1). The frame (2) is a box-shaped frame with one side open.

3. The chip packaging lamination structure according to claim 2, characterized in that... , An installation hole is provided at the top end of the frame (2). The lower part of the cylinder (6) passes through the installation hole and extends into the interior of the frame (2). Four through holes are circumferentially provided outside the installation hole. The four guide rods (4) are respectively inserted through the through holes.

4. The chip packaging lamination structure according to claim 3, characterized in that... , A notch is provided at the bottom end of the mounting seat (7). The pressing head (8) is slidably installed in the notch. A connection hole is provided at the top end of the mounting seat (7). The lower part of the cylinder (6) passes through the installation hole and the connection hole in sequence and is connected to the pressing head (8).

5. The chip packaging lamination structure according to claim 1, characterized in that... , The pressing frame (301) is arranged in a "middle" shape. A groove is provided in the middle of the pressing frame (301). The heating plate (302) is provided on the bottom surface of the groove. The opening area of the groove matches the bottom surface area of the pressing head (8).

6. The chip packaging lamination structure according to claim 5, characterized in that... , The number of the slide rails (303), sliders (304) and clamping blocks (305) is two. The two slide rails (303), sliders (304) and clamping blocks (305) are respectively provided on the extension plates at both ends of the pressing frame (301). The slide rail (303) is slidably connected to the clamping block (305) through the slider (304). A bayonet is provided at one end of the clamping block (305). The ends of the two clamping blocks (305) provided with bayonets are arranged opposite to each other.

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