Wafer cleaning device convenient to operate

Abstract

The utility model discloses a wafer cleaning device convenient to operate, which relates to the technical field of wafer cleaning and comprises ultrasonic cleaning equipment, a lifting assembly is mounted on the ultrasonic cleaning equipment, a wafer containing support is placed on the lifting assembly, and the wafer containing support is composed of a supporting plate, a connecting bottom plate, a guide rod and a wafer supporting rod. The number of the supporting plates, the number of the connecting bottom plates and the number of the guide rods are all two, the connecting bottom plates are fixedly installed at the lower ends of the supporting plates, the guide rods are fixedly installed at the lower ends of the connecting bottom plates, the number of the wafer supporting rods is multiple, and the wafer supporting rods are all rotationally installed on the two supporting plates. Therefore, the wafers can be picked and placed in batches, the picking and placing efficiency of the wafers is improved, the problem that the ultrasonic cleaning equipment is occupied for a long time is avoided, finally, the working efficiency of the ultrasonic cleaning equipment can be improved, and the cleaning efficiency of the wafers is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a wafer cleaning device that is easy to operate. Background Technology

[0002] A wafer is a fundamental material in the semiconductor industry, typically made of high-purity silicon or other semiconductor materials, and is a thin, circular sheet. It is a core component in the manufacture of electronic devices such as integrated circuits and microprocessors. During production, wafers undergo multiple precision processing steps, such as photolithography, etching, and ion implantation, to form tiny circuit patterns on their surface. These circuits are extremely complex and dense, containing hundreds of millions of transistors, resistors, capacitors, and other components. Wafer cleaning is a critical process in semiconductor manufacturing, designed to remove contaminants generated during wafer forming and polishing processes from contact with organic matter, particles, and metals.

[0003] The existing patent application with application number CN201920314257.2 proposes a wafer cleaning device. This wafer cleaning device has the problem of inconvenience when cleaning a large number of wafers, that is, it is necessary to pick up and put down the wafers one by one, which reduces the wafer picking and putting efficiency, occupies the wafer cleaning device for a long time, and further reduces the working efficiency of the wafer cleaning device, ultimately reducing the wafer cleaning efficiency. Therefore, it needs to be improved. Utility Model Content

[0004] The main objective of this invention is to provide a wafer cleaning device that is easy to operate and can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A user-friendly wafer cleaning device includes an ultrasonic cleaning unit. The ultrasonic cleaning unit is equipped with a lifting assembly, on which a wafer holding bracket is placed. The wafer holding bracket consists of a support plate, a connecting base plate, guide rods, and wafer support rods. Two support plates, two connecting base plates, and two guide rods are provided. The connecting base plate is fixedly installed at the lower end of the support plate, and the guide rods are fixedly installed at the lower end of the connecting base plate. Several wafer support rods are rotatably mounted on two support plates, with every three wafer support rods arranged in an inverted triangle. Each wafer support rod consists of a base rod, a mounting shaft, and a rotating handle. Two mounting shafts are symmetrically fixed at both ends of the base rod, and two rotating handles are fixedly installed at one end of each of the two mounting shafts. Several cleaning components are fixedly installed on the inner ends of the two support plates. The cleaning components are located outside the inverted triangle wafer support rods. Each cleaning component consists of an L-shaped substrate and cleaning bristles. The cleaning bristles are fixedly installed on the end of the L-shaped substrate closest to the wafer support rod, and the cleaning bristles simultaneously contact the wafer support rod.

[0007] Preferably, the lifting assembly consists of a connecting frame, a support bracket, a lifting cylinder, and support rollers. The connecting frame is fixedly installed on the upper end of the piston rod of the lifting cylinder, the support bracket is fixedly installed on one end of the connecting frame, and the support rollers are installed on the support bracket.

[0008] Preferably, the lifting cylinder on the lifting assembly is fixedly installed on the outer wall of the ultrasonic cleaning equipment, and the support bracket and the lifting cylinder are both movably installed inside the ultrasonic cleaning equipment.

[0009] Preferably, the support plate on the wafer holder has mounting holes, the connecting base plate on the wafer holder is placed on the support roller, and the guide rod is movably engaged in the V-groove on the support roller.

[0010] Preferably, the base rod on the wafer support rod is located between two support plates, the mounting shaft is rotatably mounted in the mounting hole, and the rotating handle is located on the outside of the support plate.

[0011] Preferably, the base rod on the wafer support rod has a plurality of slots, and the slots are annular structures.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] By setting up a wafer holding bracket consisting of a support plate, a connecting base plate, guide rods, and wafer support rods, wafers can be pre-placed on the wafer holding bracket during mass wafer cleaning. The wafer holding bracket is then placed onto the lifting assembly of the ultrasonic cleaning equipment for cleaning, enabling batch wafer loading and unloading, improving wafer handling efficiency, and avoiding prolonged occupation of the ultrasonic cleaning equipment. This ultimately improves the working efficiency of the ultrasonic cleaning equipment and, consequently, the wafer cleaning efficiency. Furthermore, the rotatable wafer support rods and cleaning components facilitate easy cleaning of the wafer support rods, preventing dirt on the support rods from contaminating the wafers. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a structural schematic diagram of the lifting assembly, wafer mounting bracket, and cleaning assembly of this utility model;

[0016] Figure 3 This is a schematic diagram of the wafer mounting bracket and cleaning assembly of this utility model.

[0017] Figure 4 This is a schematic diagram of the wafer support rod of this utility model.

[0018] In the diagram: 1. Ultrasonic cleaning equipment; 2. Lifting assembly; 3. Wafer placement bracket; 4. Cleaning assembly; 5. Connecting frame; 6. Support bracket; 7. Lifting cylinder; 8. Support roller; 9. Support plate; 10. Connecting base plate; 11. Guide rod; 12. Wafer support rod; 13. Mounting hole; 14. Base rod; 15. Slot; 16. Mounting shaft; 17. Rotary handle; 18. L-shaped substrate; 19. Cleaning brush bristles. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0020] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, a convenient wafer cleaning device includes an ultrasonic cleaning unit 1. A lifting assembly 2 is installed on the ultrasonic cleaning unit 1, and a wafer holding bracket 3 is placed on the lifting assembly 2. The wafer holding bracket 3 consists of a support plate 9, a connecting base plate 10, guide rods 11, and wafer support rods 12. Two support plates 9, two connecting base plates 10, and two guide rods 11 are provided. The connecting base plate 10 is fixedly installed at the lower end of the support plate 9, and the guide rods 11 are fixedly installed at the lower end of the connecting base plate 10. Several wafer support rods 12 are provided, each rotatably mounted on one of the support plates 9. On each support plate 9, three wafer support rods 12 are arranged in an inverted triangle. Each wafer support rod 12 consists of a base rod 14, a mounting shaft 16, and a rotating handle 17. There are two mounting shafts 16, which are symmetrically fixed at both ends of the base rod 14. There are two rotating handles 17, which are respectively fixed at one end of the two mounting shafts 16. Several cleaning components 4 are fixedly installed on the inner ends of the two support plates 9. The cleaning components 4 are located on the outer side of the inverted triangle wafer support rods 12. Each cleaning component 4 consists of an L-shaped substrate 18 and cleaning bristles 19. The cleaning brush 19 is fixedly installed on one end of the L-shaped substrate 18 near the wafer support rod 12, and the cleaning brush bristles 19 are in contact with the wafer support rod 12 at the same time. When cleaning wafers in large quantities, the wafers can be placed on the wafer holder 3 in advance, and then the wafer holder 3 can be placed on the lifting assembly 2 on the ultrasonic cleaning equipment 1. Then, the lifting assembly 2 is used to immerse the wafer holder 3 into the ultrasonic cleaning equipment 1, and then the ultrasonic cleaning equipment 1 can be started to clean the wafers on the wafer holder 3. After the wafers are cleaned, the cleaning brush bristles 19 are then used to clean the wafers on the wafer holder 3. The lifting assembly 2 removes the wafer holder 3 from the ultrasonic cleaning equipment 1, and then removes the wafer holder 3 from the lifting assembly 2. Then, another wafer holder 3 containing wafers to be cleaned is placed on the lifting assembly 2 and the above steps are repeated for cleaning. When it is necessary to clean the base rod 14 on the wafer support rod 12, the base rod 14 can be rotated by rotating the handle 17. The base rod 14 will then rub against the cleaning bristles 19 on the cleaning assembly 4, and the dirt on the base rod 14 will be cleaned off by the cleaning bristles 19.

[0021] Finally, by setting up a wafer holding bracket 3 consisting of a support plate 9, a connecting base plate 10, a guide rod 11, and a wafer support rod 12, wafers can be picked up and placed in batches, improving wafer picking and placing efficiency and avoiding the problem of occupying the ultrasonic cleaning equipment 1 for a long time. Ultimately, the working efficiency of the ultrasonic cleaning equipment 1 can be improved, thereby improving the wafer cleaning efficiency. By setting up a rotatable wafer support rod 12 and a cleaning component 4, the wafer support rod 12 can be easily cleaned, thereby preventing dirt on the wafer support rod 12 from contaminating the wafer.

[0022] Specifically, the lifting assembly 2 consists of a connecting frame 5, a support bracket 6, a lifting cylinder 7, and support rollers 8. The connecting frame 5 is fixedly installed on the upper end of the piston rod of the lifting cylinder 7, the support bracket 6 is fixedly installed on one end of the connecting frame 5, and the support rollers 8 are installed on the support bracket 6. The lifting cylinder 7 on the lifting assembly 2 is fixedly installed on the outer wall of the ultrasonic cleaning equipment 1. Both the support bracket 6 and the lifting cylinder 7 are movably installed inside the ultrasonic cleaning equipment 1. During operation, the wafer holding bracket 3 needs to be placed on the support rollers 8, and the wafer needs to be placed... When the support 3 is immersed in the ultrasonic cleaning equipment 1, the lifting cylinder 7 can be activated, thereby using the piston rod of the lifting cylinder 7 to move the connecting frame 5 and the support bracket 6 downward, so that the wafer holding support 3 on the support roller 8 is completely inserted into the cleaning tank of the ultrasonic cleaning equipment 1. When it is necessary to remove the wafer holding support 3 from the ultrasonic cleaning equipment 1, the piston rod of the lifting cylinder 7 can be used to move the connecting frame 5 and the support bracket 6 upward, so that the wafer holding support 3 on the support roller 8 is completely removed from the ultrasonic cleaning equipment 1.

[0023] Specifically, the support plate 9 on the wafer holder 3 has mounting holes 13. The connecting base plate 10 on the wafer holder 3 is placed on the support roller 8. The guide rod 11 is movably engaged in the V-groove on the support roller 8. The base rod 14 on the wafer support rod 12 is located between the two support plates 9. The mounting shaft 16 is rotatably mounted in the mounting hole 13. The rotating handle 17 is located on the outside of the support plate 9. The base rod 14 on the wafer support rod 12 has several slots 15, and the slots 15 are annular structures. When placing the wafer into the wafer holder 3, it can be moved as follows: Figure 1 , Figure 2 The wafer is placed in a slot 15 on the base rod 14 of the three wafer support rods 12.

[0024] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A convenient wafer cleaning device, comprising an ultrasonic cleaning device (1), a lifting assembly (2) is installed on the ultrasonic cleaning device (1), characterized in that: The lifting assembly (2) is provided with a wafer containing support (3), the wafer containing support (3) is composed of support plates (9), connecting bottom plates (10), guide rods (11) and wafer support rods (12), the support plates (9), the connecting bottom plates (10) and the guide rods (11) are provided with two, the connecting bottom plates (10) are fixedly installed at the lower ends of the support plates (9), the guide rods (11) are fixedly installed at the lower ends of the connecting bottom plates (10), the wafer support rods (12) are rotatably installed on the two support plates (9), every three wafer support rods (12) are distributed in inverted triangular shape, the wafer support rods (12) are composed of base rods (14), mounting shafts (16) and rotating handles (17), the mounting shafts (16) are symmetrically fixedly installed at the two ends of the base rods (14), the rotating handles (17) are fixedly installed at one end of the two mounting shafts (16), the inner ends of the two support plates (9) are fixedly installed with a plurality of cleaning assemblies (4), the cleaning assemblies (4) are located outside the wafer support rods (12) distributed in inverted triangular shape, the cleaning assemblies (4) are composed of L-shaped base plates (18) and cleaning bristles (19), the cleaning bristles (19) are fixedly installed at one end of the L-shaped base plates (18) close to the wafer support rods (12), and the cleaning bristles (19) are in contact with the wafer support rods (12) at the same time.

2. The wafer cleaning device of claim 1, wherein: The lifting assembly (2) is composed of connecting frames (5), support brackets (6), lifting cylinders (7) and support rollers (8), the connecting frames (5) are fixedly installed at the upper ends of the piston rods of the lifting cylinders (7), the support brackets (6) are fixedly installed at one end of the connecting frames (5), and the support rollers (8) are installed on the support brackets (6).

3. The wafer cleaning device of claim 2, wherein: The lifting cylinder (7) of the lifting assembly (2) is fixedly installed on the outer wall of the ultrasonic cleaning equipment (1), and the support bracket (6) and the lifting cylinder (7) are movably installed in the ultrasonic cleaning equipment (1).

4. The wafer cleaning device of claim 3, wherein: The support plate (9) of the wafer containing support (3) is provided with a mounting hole (13), the connecting bottom plate (10) of the wafer containing support (3) is placed on the support roller (8), and the guide rod (11) is movably clamped in the V-shaped groove on the support roller (8).

5. The wafer cleaning device of claim 4, wherein: The base rod (14) of the wafer support rod (12) is located between the two support plates (9), the mounting shaft (16) is rotatably installed in the mounting hole (13), and the rotating handle (17) is located outside the support plate (9).

6. The wafer cleaning device of claim 5, wherein: The base rod (14) of the wafer support rod (12) is provided with a plurality of clamping grooves (15), and the clamping grooves (15) are annular structures.

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