Feeding and discharging device and wafer processing equipment thereof

Abstract

The utility model discloses a loading and unloading device and wafer processing equipment thereof, the loading and unloading device comprises a workbench, a material storage mechanism installed on the workbench, a loading mechanism and an unloading mechanism, the material storage mechanism is arranged around the loading mechanism and the unloading mechanism, and the material storage mechanism is provided with a plurality of storage compartments. By means of the mode, when the feeding mechanism takes the wafers out of the storage compartments and the discharging mechanism loads the wafers into the storage compartments, the adjacent storage compartments cannot shake, and the phenomenon that the wafers in the adjacent storage compartments are damaged is avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a loading and unloading device and its wafer processing equipment. Background Technology

[0002] In the semiconductor manufacturing industry, wafers are the key raw material for producing integrated circuits. Various circuit elements are processed on wafers to create IC chips with specific electrical functions. Wafer production lines typically use cassettes or trays for material handling. To save space, cassettes on wafer production lines are usually stacked vertically. The cassettes are positioned by a positioning device. When the picking mechanism grabs a wafer from a cassette, it causes the adjacent cassette at the bottom to shake, potentially damaging the wafers inside. Utility Model Content

[0003] This utility model provides a loading and unloading device to solve the problem that when the picking mechanism grabs a wafer in a material box, it will pull the adjacent material box at its bottom, causing interference to the adjacent material box and resulting in damage to the wafer in the adjacent material box.

[0004] Technical issues.

[0005] This utility model is achieved through the following technical solution:

[0006] This utility model proposes a loading and unloading device, including: a worktable, a storage mechanism, a loading mechanism and an unloading mechanism installed on the worktable, the storage mechanism being arranged around the loading mechanism and the unloading mechanism, the storage mechanism having multiple storage compartments, the storage compartments being used to store wafers.

[0007] Furthermore, the storage mechanism includes a rack and multiple wafer cassettes, the rack being located within the storage compartment and the wafer cassettes being placed on the rack.

[0008] Furthermore, the material rack is provided with a partition, which divides the material rack into an upper material layer and a lower material layer.

[0009] Furthermore, both the upper and lower material layers are equipped with a first sensor, which is used to detect the type of the wafer cassette placed on the material rack.

[0010] Furthermore, the loading and unloading device also includes a second sensor, which is located at the bottom of the material rack and is used to detect the placement position of the wafers in the wafer cassette.

[0011] Furthermore, the feeding mechanism and the unloading mechanism have the same structure, both including: a transfer robot and a fork, one end of the transfer robot is connected to the worktable, the other end of the transfer robot is connected to the fork, and the fork is provided with suction holes.

[0012] Furthermore, the loading and unloading device also includes an edge-finding mechanism, which is installed on the worktable and located on one side of the storage mechanism. The edge-finding mechanism is used to locate the center of the wafer.

[0013] Furthermore, the edge-finding mechanism includes: a support base, a rotary drive component, and an edge-finding detection component. The rotary drive component is connected to the worktable, the bottom of the support base is connected to the rotary drive component, and the edge-finding detection component is located on the side of the support base.

[0014] Furthermore, the loading and unloading device also includes a housing, which covers the storage mechanism, the loading mechanism and the unloading mechanism.

[0015] This utility model also proposes a wafer processing equipment, including: the loading and unloading device as described above.

[0016] The beneficial effects of this utility model are:

[0017] Compared with the prior art, the loading and unloading device proposed in this utility model has a storage mechanism with multiple independent storage compartments. Therefore, when the loading mechanism removes the wafer from the storage compartment and the unloading mechanism loads the wafer into the storage compartment, the adjacent storage compartments will not shake, thus avoiding damage to the wafers in the adjacent storage compartments. At the same time, the storage mechanism is arranged around the loading and unloading mechanisms, which shortens the transfer stroke of the wafer loading and unloading process. Furthermore, the loading and unloading device remains running without stopping during wafer loading or unloading operations, thus improving the wafer processing efficiency.

[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the loading and unloading device proposed in this utility model;

[0020] Figure 2 This is a front view of the overall structure of the loading and unloading device proposed in this utility model, excluding the housing.

[0021] Figure 3This is a side view of the overall structure of the loading and unloading device proposed in this utility model, excluding the housing.

[0022] Figure 4 This is a schematic diagram of the material rack structure in the loading and unloading device proposed in this utility model;

[0023] Figure 5 This is a schematic diagram of the edge-finding mechanism in a loading and unloading device proposed in this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Workbench; 2. Feeding mechanism; 21. Transfer robot; 22. Fork; 23. Suction hole; 3. Unloading mechanism; 4. Storage mechanism; 41. Storage compartment; 42. Material rack; 421. Partition; 422. Feeding layer; 423. Unloading layer; 43. Wafer box; 5. Edge finding mechanism; 51. Support base; 52. Rotary drive component; 53. Edge finding detection component; 6. First sensor; 7. Second sensor; 8. Control panel; 9. Housing. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0033] Please see Figures 1 to 5 This utility model proposes a loading and unloading device, including: a workbench 1, a storage mechanism 4, a loading mechanism 2 and a unloading mechanism 3 installed on the workbench 1, the storage mechanism 4 being arranged around the loading mechanism 2 and the unloading mechanism 3, and the storage mechanism 4 having a plurality of storage compartments 41 for storing wafers.

[0034] It should be noted that in this embodiment, the loading and unloading device also includes a control panel 8. The loading mechanism 2, unloading mechanism 3, edge-finding mechanism 5, first sensor 6 and second sensor 7 are all electrically connected to the control panel 8, and the loading mechanism 2, unloading mechanism 3 and edge-finding mechanism 5 are all controlled by the control panel 8.

[0035] In practical applications, storage compartment 41 is used to store wafers. The loading mechanism 2 retrieves wafers from storage compartment 41 and delivers them to the processing station. After wafer processing is completed, the unloading mechanism 3 transports the wafers from the processing station to the empty storage compartment 41 in the storage mechanism 4. Since the storage mechanism 4 has multiple independent storage compartments 41, when the loading mechanism 2 retrieves wafers from storage compartment 41 and the unloading mechanism 3 loads wafers into storage compartment 41, the wafers in adjacent storage compartments 41 will not shake, thus preventing damage to wafers in other storage compartments 41. Furthermore, each storage compartment 41 is independent, facilitating wafer storage and retrieval. Simultaneously, the storage mechanism 4 is arranged around the loading mechanism 2 and the unloading mechanism 3, and is within their operating range, shortening the transfer distance for wafer loading and unloading processes. Moreover, the loading and unloading devices remain operational during wafer loading or unloading operations without needing to stop, improving wafer processing efficiency.

[0036] The loading and unloading device proposed in this embodiment has a storage mechanism 4 with multiple independent storage compartments 41. Therefore, when the loading mechanism 2 removes the wafer from the storage compartment 41 and the unloading mechanism 3 loads the wafer into the storage compartment 41, the adjacent storage compartments 41 will not shake, thus avoiding damage to the wafers in the adjacent storage compartments 41. At the same time, the storage mechanism 4 is arranged around the loading mechanism 2 and the unloading mechanism 3, which shortens the transfer stroke of the wafer loading and unloading process. Furthermore, the loading and unloading device can maintain operation without stopping and waiting when performing wafer loading or unloading operations, thereby improving the wafer processing efficiency.

[0037] Please see Figure 2 The storage mechanism 4 includes a rack 42 and multiple wafer boxes 43. The rack 42 is located in the storage compartment 41, and the wafer boxes 43 are placed on the rack 42.

[0038] Specifically, the rack 42 is connected to the workbench 1 and located within the storage compartment 41. Each wafer cassette 43 is used to store a wafer individually. When the loading mechanism 2 removes a wafer from the wafer cassette 43 and the unloading mechanism 3 loads a wafer into the wafer cassette 43, wafers in adjacent wafer cassettes 43 will not collide, reducing the risk of wafer damage. Because each wafer cassette 43 is used to store a wafer individually, the loading and unloading devices remain operational during wafer loading or unloading operations without needing to stop and wait, thus improving wafer processing efficiency.

[0039] Please see Figure 2 and Figure 4 The material rack 42 is provided with a partition 421, which divides the material rack 42 into an upper material layer 422 and a lower material layer 423.

[0040] Specifically, the loading layer 422 is used to store wafers to be processed, while the unloading layer 423 is used to store wafers that have been processed, making the wafer flow smoother. In addition, the loading and unloading device remains running without stopping to wait when performing wafer loading or unloading operations, which improves the wafer processing efficiency.

[0041] Please see Figure 4 Both the upper material layer 422 and the lower material layer 423 are equipped with a first sensor 6, which is used to detect the type of wafer cassette 43 placed on the material rack 42.

[0042] Specifically, when the wafer cassette 43 is placed on the material rack 42, the first sensor 6 reads the identification information on the wafer cassette 43 and transmits the identification information to the control panel 8. The control panel 8 determines the type of the wafer cassette 43 based on the information fed back by the first sensor 6 and controls the operation of the loading mechanism 2 and the unloading mechanism 3, thereby improving the automation level of the loading and unloading device.

[0043] Please refer to it again. Figure 4 The loading and unloading device also includes a second sensor 7, which is located on the worktable 1 and is used to detect the placement position of the wafers in the wafer box 43.

[0044] Specifically, when the wafer cassette 43 is placed on the rack 42, the second sensor 7 scans the wafer position within the wafer cassette 43 and sends the detection result to the control panel 8. If a wafer position deviation is detected, the control panel 8 issues an alarm to notify the operator to adjust the wafer position.

[0045] See again Figure 3 The feeding mechanism 2 and the unloading mechanism 3 have the same structure, both including: a transfer robot 21 and a fork 22. One end of the transfer robot 21 is connected to the worktable 1, and the other end of the transfer robot 21 is connected to the fork 22. The fork 22 is provided with a suction hole 23.

[0046] Specifically, when loading wafers from wafer cassette 43 to the processing station, the transfer robot 21 of the loading mechanism 2 moves to the opening of wafer cassette 43. The transfer robot 21 of the loading mechanism 2 drives the fork 22 to enter the wafer cassette 43 through the opening. The suction hole 23 aligns with the wafer and fixes the wafer on the fork 22. The transfer robot 21 of the loading mechanism 2 drives the fork 22 to exit the wafer cassette 43, loading the wafer to the processing station. When unloading wafers from the processing station into wafer cassette 43, the transfer robot of the unloading mechanism 3 moves to the processing station. The suction hole on the fork of the unloading mechanism 3 attracts the wafer to the fork. The transfer robot of the unloading mechanism 3 moves the fork into wafer cassette 43, placing the processed wafer into wafer cassette 43.

[0047] Please see Figures 2 to 3 The loading and unloading device also includes an edge-finding mechanism 5, which is installed on the workbench 1 and located on one side of the storage mechanism 4. The edge-finding mechanism 5 is used to locate the center of the wafer.

[0048] Specifically, the wafer is taken out of the wafer cassette 43 in the storage mechanism 4 by the loading mechanism 2 and placed on the edge-finding mechanism 5, which performs edge detection on the wafer. Based on the detection results, the center position of the wafer is calculated. The control panel 8 adjusts the position of the chip fork 22 according to the received center position data, so that the center of the chip fork 22 is aligned with the center of the wafer.

[0049] Please see Figure 5 The edge-finding mechanism 5 includes a support base 51, a rotary drive component 52, and an edge-finding detection component 53. The rotary drive component 52 is connected to the worktable 1, the bottom of the support base 51 is connected to the rotary drive component 52, and the edge-finding detection component 53 is located on the side of the support base 51.

[0050] Specifically, the wafer is taken out of the storage mechanism 4 by the loading mechanism 2 and placed on the support base 51. The rotation drive 52 is started, which drives the support base 51 and the wafer to rotate together. The edge detection unit 53 detects the position of the wafer edge and transmits the data to the control panel 8. The control panel 8 calculates the center position of the wafer based on the edge position data and controls the wafer position to align its center with the coordinate system required for processing.

[0051] Please see Figure 1 The loading and unloading device also includes a housing 9, which covers the material storage mechanism 4, the loading mechanism 2 and the unloading mechanism 3.

[0052] Specifically, the outer shell 9 covers the material storage mechanism 4, the loading mechanism 2, and the unloading mechanism 3, so that the material storage mechanism 4, the loading mechanism 2, and the unloading mechanism 3 operate in a closed environment, which improves the cleanliness of wafer processing.

[0053] This utility model also proposes a wafer processing equipment, including: the loading and unloading device as described above.

[0054] Specifically, the loading and unloading device is used in wafer processing equipment, so the beneficial effects of the wafer processing equipment are the same as those of the loading and unloading device.

[0055] Compared with the prior art, the loading and unloading device proposed in this utility model has a storage mechanism 4 with multiple independent storage compartments 41. Therefore, when the loading mechanism 2 takes the wafer out of the storage compartment 41 and the unloading mechanism 3 loads the wafer into the storage compartment 41, the adjacent storage compartments 41 will not shake, thus avoiding damage to the wafers in the adjacent storage compartments 41. At the same time, the storage mechanism 4 is arranged around the loading mechanism 2 and the unloading mechanism 3, which shortens the transfer stroke of the wafer loading and unloading process. Furthermore, the loading and unloading device can maintain operation without stopping and waiting when performing wafer loading or unloading operations, thereby improving the wafer processing efficiency.

[0056] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A loading and unloading device, characterized in that, The application relates to an up-and-down feeding device. The up-and-down feeding device comprises a workbench, a storage mechanism, an up-feeding mechanism and a down-feeding mechanism, the storage mechanism is arranged around the up-feeding mechanism and the down-feeding mechanism, the storage mechanism is provided with a plurality of storage compartments for storing wafers, the up-and-down feeding device further comprises an edge searching mechanism, the edge searching mechanism is arranged on one side of the storage mechanism and is used for positioning the center of a wafer.

2. The feeding and discharging device according to claim 1, characterized in that, The storage mechanism comprises a rack and a plurality of wafer boxes, the rack is arranged in the storage compartment, and the wafer boxes are placed on the rack.

3. The feeding and discharging device according to claim 2, characterized in that, The rack is provided with a partition plate, the partition plate divides the rack into an up-feeding layer and a down-feeding layer.

4. The feeding and discharging device according to claim 3, characterized in that, The up-feeding layer and the down-feeding layer are provided with first sensors, the first sensors are used for detecting the type of the wafer box placed on the rack.

5. The feeding and discharging device according to claim 2, characterized in that, The up-and-down feeding device further comprises a second sensor, the second sensor is arranged at the bottom end of the rack, and the second sensor is used for detecting the placement position of the wafer in the wafer box.

6. The feeding and discharging device according to claim 1, characterized in that, The up-feeding mechanism and the down-feeding mechanism are the same in structure and each comprises a transfer manipulator and a wafer fork, one end of the transfer manipulator is connected to the workbench, the other end of the transfer manipulator is connected to the wafer fork, and the wafer fork is provided with suction holes.

7. The feeding and discharging device according to claim 1, characterized in that, The edge searching mechanism comprises a supporting seat, a rotating driving element and an edge searching detection element, the rotating driving element is connected to the workbench, the bottom of the supporting seat is connected to the rotating driving element, and the edge searching detection element is arranged on the side of the supporting seat.

8. The feeding and discharging device according to claim 1, characterized in that, The up-and-down feeding device further comprises a shell, the shell covers the storage mechanism, the up-feeding mechanism and the down-feeding mechanism.

9. A wafer processing apparatus characterized by comprising: The application relates to an up-and-down feeding device. The application relates to an up-and-down feeding device. The application relates to an up-and-down feeding device.

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