Wafer clamp for improving clamping force by using centrifugal force

Abstract

The utility model discloses a wafer clamp for improving clamping force by using centrifugal force, relates to wafer processing, and aims to solve the problems that the limitation on the centrifugal direction of a wafer is lacked, and the wafer moves due to the centrifugal force when the rotating speed is relatively high, and the key points of the technical scheme are that the wafer clamp for improving the clamping force by using the centrifugal force comprises a rotating disk, at least three limiting assemblies are arranged on the edge of the rotating disc at equal angles, each limiting assembly comprises a fixing base, a swing base connected to the fixing base in a swing mode, a supporting column arranged on the swing base and a guide clamping column, and each swing base is provided with a balancing weight. According to the wafer clamp for improving the clamping force by using the centrifugal force, a wafer is more convenient to load, and the hidden danger that the wafer moves when the rotating speed is relatively high is effectively eliminated.

Description

Technical Field

[0001] This utility model relates to wafer processing, and more specifically, to a wafer jig that utilizes centrifugal force to enhance clamping force. Background Technology

[0002] A wafer, also known as a silicon wafer, is a silicon wafer used to manufacture silicon semiconductor circuits. A wafer fixture is a component of equipment used for wafer processing, inspection, and cleaning. Its function is to clamp the wafer and drive it to rotate, providing circumferential motion for inspecting or cleaning the wafer surface.

[0003] Chinese Patent Announcement CN117594514B discloses a wafer clamp and wafer cleaning equipment. Its key technical features include: a body; the body includes a support surface; the support surface supports the wafer body, or the support surface supports a laminated wafer; the body further includes an adsorption part for adsorbing the wafer body onto the support surface; the body further includes a pressing part for pressing the laminated wafer onto the support surface; the adsorption part and the pressing part are configured to adsorb the wafer body or press the laminated wafer using air pressure. The wafer clamping method relies on the aforementioned wafer clamp and includes: when the wafer clamp is under negative pressure, the adsorption part adsorbs the wafer body; when the wafer clamp is under positive pressure, the pressing part presses the laminated wafer.

[0004] The above technical solution lacks restrictions on the centrifugal direction of the wafer. When the rotation speed is high, there is a risk that the wafer may move due to centrifugal force. Therefore, a new solution is needed to solve this problem. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a wafer jig that uses centrifugal force to increase clamping force, making it more convenient to load wafers and effectively eliminating the risk of wafer movement when the rotation speed is high.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a wafer jig that uses centrifugal force to enhance clamping force, including a rotating disk, at least three limiting components are provided at equal angles along the edge of the rotating disk, the limiting components include a fixed base, a swing base oscillatingly connected to the fixed base, a support column provided on the swing base, and a guide clamping column, the swing base being provided with a counterweight.

[0007] By adopting the above technical solution, the center of gravity of the swing seats is shifted downwards and outwards by the counterweight, so that each swing seat is in an outward swing state before the wafer is loaded, increasing the distance between the top of each guide clamping post and the central axis, making wafer loading more convenient. After the wafer is loaded, the swing seats swing inwards under the action of the wafer's gravity until they reach the limit, so that the guide clamping posts press against the circumferential edge of the wafer, achieving wafer clamping. When the rotating disk starts to rotate, due to the centrifugal force, the swing seats are given a further tendency to swing inwards, thereby clamping the edge of the wafer. The faster the rotation speed of the rotating disk, the greater the centrifugal force and the greater the clamping tendency force, thus limiting the centrifugal direction of the wafer and eliminating the risk of wafer movement at high speeds. In summary, this application makes wafer loading more convenient and effectively eliminates the risk of wafer movement at high speeds.

[0008] The present invention is further provided with a sealing ring on the lower surface edge of the rotating disk.

[0009] The present invention is further configured such that a flange is provided at the center of the rotating disk for connecting a torque power source.

[0010] The present invention is further configured such that: the swing seat is Z-shaped in side view, and has a first step and a second step, wherein the first step and the second step are respectively provided with a support column and a guide clamping column.

[0011] The present invention is further configured such that: the swing seat is provided with a swing connecting block, the fixed seat is provided with a connecting clamp, the swing connecting block is embedded in the connecting clamp, and a connecting shaft is provided through the connecting clamp and the swing connecting block.

[0012] The present invention is further provided with bearings between the two ends of the connecting shaft and the connecting clamp.

[0013] The present invention is further configured such that: the counterweight is provided with a threaded post, and the threaded post is threadedly connected to the swing seat.

[0014] In summary, this utility model has the following beneficial effects: it makes loading wafers more convenient and effectively eliminates the hidden danger of wafer movement when the rotation speed is high; it provides support and limiting functions for wafers of multiple sizes, achieving the technical effect of being applicable to the clamping of wafers of various sizes; by limiting the gap between the lower end face of the swing connecting block and the connecting clamp, the extreme swing angle of the swing seat is limited, and there is no risk of crushing the wafer during the clamping process; by adjusting the height of the counterweight, the clamping tendency force generated by centrifugal force can be adjusted. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this application;

[0016] Figure 2 This is a schematic diagram of the structure of the wafer after it has been clamped in this application;

[0017] Figure 3 This is a schematic diagram of the rotating disk structure of this application;

[0018] Figure 4 This is a schematic diagram of the limiting component of this application. For ease of representation, this diagram has been partially cross-sectional.

[0019] Figure descriptions: 1. Rotary disk; 2. Fixed seat; 3. Swing seat; 4. Support column; 5. Guide clamping column; 6. Counterweight block; 7. Sealing ring; 8. Flange; 9. First step; 10. Second step; 11. Swing connecting block; 12. Connecting clamp; 13. Connecting shaft; 14. Bearing; 15. Threaded column. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to the accompanying drawings.

[0021] A wafer jig that utilizes centrifugal force to increase clamping force, such as Figure 1 As shown, it includes a rotating disk 1, and six limiting components are set at equal angles along the edge of the rotating disk 1. The limiting components include a fixed base 2, a swing seat 3 that is oscillatingly connected to the fixed base 2, a support column 4 set on the swing seat 3, and a guide clamping column 5. The swing seat 3 is provided with a counterweight 6, which causes the center of gravity of the swing seat 3 to be biased towards the lower outer side of the swing center axis.

[0022] like Figure 1 , Figure 2 As shown, this application uses counterweight 6 to make the center of gravity of the swing seat 3 lower and outward, so that before loading the wafer, each swing seat 3 is in an outward swing state, increasing the distance between the top of each guide clamping post 5 and the central axis of the rotating disk 1, making wafer loading more convenient. After the wafer is loaded, under the action of the wafer's gravity, the swing seat 3 swings inward until it reaches the limit, so that the guide clamping post 5 abuts against the circumferential edge of the wafer, realizing the clamping of the wafer. When the rotating disk 1 starts to rotate, due to the action of centrifugal force, it gives the swing seat 3 a tendency force to swing inward further, thereby realizing the clamping of the edge of the wafer. The faster the rotation speed of the rotating disk 1, the greater the centrifugal force and the greater the clamping tendency force, thus limiting the centrifugal direction of the wafer and eliminating the risk of wafer movement when the rotation speed is high. At the same time, due to the existence of the limit, there is no risk of wafer breakage during the clamping process. In summary, this application makes wafer loading more convenient and effectively eliminates the risk of wafer movement when the rotation speed is high.

[0023] The specific structure of the rotating disk 1 is as follows: Figure 3As shown, a sealing ring 7 is machined along the lower edge of the rotating disk 1 to meet the technical requirements for sealing assembly in the corresponding equipment, and is suitable for equipment using corrosive liquids such as etching and cleaning; a flange 8 is machined in the center of the rotating disk 1 for connecting a torque power source, thereby meeting the assembly requirements of this application with the torque power source.

[0024] Wafer sizes are typically four inches, six inches, eight inches, and twelve inches. To accommodate various wafer sizes, such as... Figure 1 , Figure 4 As shown, the swing seat 3 is Z-shaped in side view, and has a first step 9 and a second step 10. The first step 9 and the second step 10 are respectively provided with support column 4 and guide clamping column 5, thereby providing support and limiting functions for wafers of multiple sizes, achieving the technical effect of being suitable for clamping wafers of various sizes.

[0025] The swing seat 3 is oscillatingly assembled to the fixed seat 2 in the following manner, such as... Figure 4 As shown, the swing seat 3 is formed with a swing connecting block 11, and the fixed seat 2 is formed with a connecting clamp 12. The swing connecting block 11 is embedded in the connecting clamp 12. A connecting shaft 13 is inserted through the connecting clamp 12 and the swing connecting block 11. The connecting shaft 13 is rotatably inserted into the connecting clamp 12 and the swing connecting block 11. The connecting shaft 13 is interference-fitted with the swing connecting block 11. The swing seat 3 achieves the technical requirement of swinging connection to the fixed seat 2 through the connecting shaft 13. Furthermore, the limit swing angle of the swing seat 3 can be limited by limiting the gap between the lower end face of the swing connecting block 11 and the connecting clamp 12.

[0026] To improve the smoothness of the swing of the swing seat 3, such as Figure 4 As shown, bearings 14 are provided between the two ends of the connecting shaft 13 and the connecting clamp 12, thereby reducing the frictional resistance experienced by the swing seat 3 when it swings.

[0027] To achieve adjustment of clamping force, such as Figure 4 As shown, the counterweight 6 is provided with a threaded post 15, which is threadedly connected to the swing seat 3; this gives the counterweight 6 the ability to adjust its height, so that by turning the threaded post 15, the counterweight 6 is forced to move upward, thereby adjusting the swing seat 3 so that its center of gravity is close to the swing center line, thereby reducing the clamping tendency force generated by centrifugal force. When the height of the swing seat 3 is adjusted downward, the center of gravity of the swing seat 3 moves downward, thereby increasing the clamping tendency force generated by centrifugal force.

[0028] The specific embodiments are merely explanations of this utility model and are not intended to limit it. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this utility model.

Claims

1. A wafer chuck for improving chucking force using centrifugal force, comprising a rotating disk (1), characterized in that: The edge of the rotating disc (1) is provided with at least three limiting assemblies at equal angles, the limiting assembly comprises a fixed seat (2), a swing seat (3) swing connected to the fixed seat (2), a support column (4) provided on the swing seat (3), and a guide clamping column (5), the swing seat (3) is provided with a counterweight (6).

2. The wafer chuck of claim 1, wherein: The lower surface of the rotating disc (1) is provided with a sealing ring (7) at the edge.

3. The wafer chuck of claim 1, wherein: the first and second clamping members are configured to be moved toward each other by a centrifugal force generated by the rotation of the wafer chuck. The center of the rotating disc (1) is provided with a flange plate (8) for connecting a torsion power source.

4. The wafer chuck of claim 1, wherein: The swing seat (3) is Z-shaped in side view, which has a first step (9) and a second step (10), the first step (9) and the second step (10) are respectively provided with the support column (4) and the guide clamping column (5).

5. The wafer chuck of claim 1, wherein: the first and second clamping members are configured to be moved toward each other by a centrifugal force generated by the rotation of the wafer chuck. The swing seat (3) is provided with a swing connecting block (11), the fixed seat (2) is provided with a connecting clamp opening (12), the swing connecting block (11) is embedded in the connecting clamp opening (12), a connecting shaft (13) is provided through the connecting clamp opening (12) and the swing connecting block (11).

6. The wafer chuck of claim 5, wherein: The connecting shaft (13) is provided with a bearing (14) between the two ends and the connecting clamp opening (12).

7. The wafer chuck of claim 1, wherein: The counterweight (6) is provided with a threaded column (15), the threaded column (15) is threadedly connected with the swing seat (3).

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