Wafer placing table

Abstract

The utility model discloses a wafer placing table, which relates to the field of wafers and comprises an installation bottom plate, two installation guide rails are symmetrically and fixedly installed at the upper end of the installation bottom plate, a containing table is fixedly installed at the upper end of the installation bottom plate and between the two installation guide rails, the containing table is composed of a base column and a supporting table top, and the supporting table top is fixedly installed at the upper end of the base column. The device comprises a mounting bottom plate, two mounting guide rails, a containing table, a clamping assembly and a clamping assembly, a driving assembly is mounted on the two mounting guide rails, the driving assembly is composed of two sliding blocks, a driving air cylinder, a rack and a transmission gear ring, and the two sliding blocks are slidably mounted on the two mounting guide rails correspondingly. According to the wafer fixing device, wafers of different specifications and sizes can be fixed, so that when the wafers are placed on the supporting table top, the wafers are not prone to moving due to external force, it is guaranteed that the wafers can be normally detected, the detection result is not prone to deviation, and meanwhile it can be guaranteed that the wafers have high detection efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer field especially relates to a wafer placing table. BACKGROUND

[0002] Wafer is the basic material in semiconductor industry, usually made of high-purity silicon or other semiconductor materials, shape is circular sheet. It is the core component of manufacturing integrated circuits and microprocessors and other electronic components. In the production process, wafer is subjected to multiple precision machining, such as photolithography, etching, ion implantation, to form micro circuit pattern on its surface. These circuits are extremely complex and dense, containing hundreds of millions of transistors, resistors, capacitors and other components. In the production process of large-scale integrated circuits, wafer needs to go through multiple processes such as thin film deposition, etching, polishing, etc., finally forming products. Wafer has different specifications such as 6 inches, 8 inches or 12 inches, etc. The main function of wafer placing table is to support and fix wafer, ensure the stability and accuracy of wafer in the processing process. It is widely used in photolithography machine, wafer bonding equipment, wafer testing equipment and other semiconductor production equipment.

[0003] In the existing patent application with application number CN202022903898.7, a wafer detection device is proposed. The wafer placing table on the device has a fixed size of the accommodating groove for placing wafers. However, wafers come in different sizes, which leads to the movement of wafers that do not match the size of the accommodating groove when placed in the groove, affecting the normal detection of wafers and ultimately leading to deviations in the detection results. This also reduces the detection efficiency of wafers. Therefore, a wafer placing table is needed to solve the above problems. UTILITY MODEL CONTENT

[0004] The main purpose of the utility model is to provide a wafer placing table that can effectively solve the problems in the background technology.

[0005] To achieve the above purpose, the technical scheme adopted by the utility model is as follows:

[0006] A wafer placing table, comprising a mounting base plate, two mounting rails symmetrically fixedly mounted on the upper end of the mounting base plate, and a containing table fixedly mounted on the upper end of the mounting base plate between the two mounting rails, wherein the containing table is composed of a base column and a supporting table top, the supporting table top is fixedly mounted on the upper end of the base column, a driving assembly is mounted on the two mounting rails, the driving assembly is composed of a sliding block, a driving cylinder, a rack and a transmission gear ring, the sliding block is provided with two sliding blocks which are slidingly mounted on the two mounting rails respectively, the rack is provided with two racks which are fixedly mounted on the two sliding blocks respectively, the piston rod of the driving cylinder is fixedly connected with one of the sliding blocks, the transmission gear ring is rotatably mounted on the base column and is engaged with the two racks at the same time, the upper end of each of the two racks is fixedly provided with a clamping assembly, and the clamping assembly is composed of an L-shaped supporting rod and a rubber air bag.

[0007] Preferably, the upper end of the mounting base plate is fixedly provided with an L-shaped mounting bracket.

[0008] Preferably, the base column on the containing table is fixedly mounted on the upper end of the mounting base plate, and two sliding grooves are formed in the outer wall of the supporting table top and penetrate the supporting table top from top to bottom.

[0009] Preferably, an annular groove is formed in the base column on the containing table.

[0010] Preferably, the driving cylinder of the driving assembly is fixedly mounted on the L-shaped mounting bracket, the rack is located below the supporting table top on the containing table, and the transmission gear ring is rotatably mounted in the L-shaped groove formed in the base column.

[0011] Preferably, the L-shaped supporting rod of the clamping assembly is fixedly mounted on the upper end of the rack, and the lower end of the rubber air bag is at the same height as the upper end of the supporting table top.

[0012] Compared with the prior art, the wafer placing table has the following beneficial effects:

[0013] The placing table composed of the mounting base plate, the mounting rails, the containing table, the driving assembly and the clamping assembly can fix wafers of different specifications and sizes, so that the wafers are not easily moved by external force when placed on the supporting table top, thereby ensuring that the wafers can be normally detected and the detection results are not easily deviated, and the wafers can have a high detection efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a whole structure schematic view of the utility model;

[0015] Figure 2 It is a structure schematic view of the mounting base plate, the mounting rails, the containing table and the L-shaped mounting bracket of the utility model;

[0016] Figure 3 The structural schematic view of the utility model after the supporting table top is removed;

[0017] Figure 4 The structural schematic view of the driving assembly and the clamping assembly of the utility model.

[0018] In the figure: 1, mounting bottom plate; 2, mounting guide rail; 3, containing table; 4, driving assembly; 5, clamping assembly; 6, L-shaped mounting bracket; 7, base column; 8, supporting table top; 9, annular groove; 10, sliding groove; 11, sliding block; 12, driving cylinder; 13, rack; 14, L-shaped supporting rod; 15, rubber air bag; 16, transmission gear ring. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, purposes and effects realized by the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0020] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown in the figure, a wafer placing table, including mounting bottom plate 1, the upper end of mounting bottom plate 1 is fixedly installed with two mounting guide rails 2, the upper end of mounting bottom plate 1 and between two mounting guide rails 2 is fixedly installed with containing table 3, containing table 3 is composed of base column 7 and supporting table top 8, supporting table top 8 is fixedly installed on the upper end of base column 7, two mounting guide rails 2 are installed with driving assembly 4, driving assembly 4 is composed of sliding block 11, driving cylinder 12, rack 13 and transmission gear ring 16, sliding block 11 has two and is slidably installed on two mounting guide rails 2, rack 13 has two and is fixedly installed on two sliding blocks 11, the piston rod of driving cylinder 12 is fixedly connected with one of sliding blocks 11, transmission gear ring 16 is rotatably installed on base column 7, and transmission gear ring 16 is engaged with two racks 13 at the same time, the upper end of two racks 13 is fixedly installed with one clamping assembly 5, clamping assembly 5 is composed of L-shaped supporting rod 14 and rubber air bag 15, rubber air bag 15 is fixedly installed on the inner end of L-shaped supporting rod 14, the placing table can be placed below the detection equipment, when it is needed to detect the wafer, the wafer can be placed on the upper end of supporting table top 8 on containing table 3, then driving assembly 4 is started, so that two clamping assemblies 5 are close to each other, and then the wafer on supporting table top 8 is clamped and fixed by two clamping assemblies 5, and then the wafer can be detected by the detection equipment; when the wafer is detected and needs to be taken off from the upper end of supporting table top 8, driving assembly 4 can be started, so that two clamping assemblies 5 are away from each other, when clamping assembly 5 is away from the wafer, the fixing of the wafer is released, and then the wafer can be taken off from the upper end of supporting table top 8.

[0021] Therefore, by setting the placing table composed of the mounting base plate 1, the mounting guide rail 2, the containing table 3, the driving assembly 4 and the clamping assembly 5, different specifications and sizes of wafers can be fixed, so that the wafers are not easy to move under external force when placed on the support table 8, thereby ensuring that the wafers can be normally detected, the detection result is not easy to deviate, and the wafers have high detection efficiency.

[0022] Further, the upper end of the mounting base plate 1 is fixedly provided with an L-shaped mounting frame 6, the base column 7 on the containing table 3 is fixedly provided on the upper end of the mounting base plate 1, two sliding grooves 10 are formed on the outer wall of the support table 8 and penetrate the support table 8, a ring-shaped groove 9 is formed on the base column 7 on the containing table 3, the driving cylinder 12 on the driving assembly 4 is fixedly provided on the L-shaped mounting frame 6, the rack 13 is located below the support table 8 on the containing table 3, the transmission gear ring 16 is rotatably provided in the L-shaped groove 9 formed on the base column 7, the L-shaped support rod 14 on the clamping assembly 5 is fixedly provided on the upper end of the rack 13, and the lower end of the rubber air bag 15 has the same height as the upper end of the support table 8. When it is needed to clamp and fix the wafer on the upper end of the support table 8 by the clamping assembly 5, the driving cylinder 12 on the driving assembly 4 can be started, so that the piston rod of the driving cylinder 12 pushes one of the sliding blocks 11 to slide on one of the mounting guide rails 2. At this time, the sliding block 11 drives the rack 13 fixedly provided thereon to move, and the rack 13 drives the transmission gear ring 16 to rotate on the base column 7. Then, the transmission gear ring 16 drives the other rack 13 and the sliding block 11 to move, so that the two clamping assemblies 5 on the two racks 13 move close to each other. Finally, the L-shaped support rod 14 on the clamping assembly 5 moves into the sliding groove 10, and the rubber air bag 15 contacts the wafer. At this time, the wafer is clamped and fixed. Conversely, when it is needed to release the fixation of the wafer, the piston rod of the driving cylinder 12 can be used to pull one of the sliding blocks 11 and the rack 13. At this time, the rack 13 drives the transmission gear ring 16 to rotate reversely on the base column 7, and the transmission gear ring 16 drives the other rack 13 and the sliding block 11 to move reversely. Finally, under the driving of the two racks 13, the two clamping assemblies 5 move away from each other. When the rubber air bag 15 is separated from the wafer, the fixation of the wafer is released.

[0023] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can modify the technical solutions recorded in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application. The protection scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer placement stage, comprising a mounting base plate (1), characterized in that: Two mounting guide rails (2) are symmetrically fixedly mounted on the upper end of the mounting base plate (1). A holding platform (3) is fixedly mounted on the upper end of the mounting base plate (1) and between the two mounting guide rails (2). The holding platform (3) consists of a base column (7) and a support platform (8). The support platform (8) is fixedly mounted on the upper end of the base column (7). A drive assembly (4) is mounted on the two mounting guide rails (2). The drive assembly (4) consists of a slider (11), a drive cylinder (12), a rack (13), and a transmission gear ring (16). There are two sliders (11), which are slidably mounted on the two guide rails respectively. On the mounting guide rail (2), there are two racks (13) and they are fixedly mounted on two sliders (11) respectively. The piston rod of the driving cylinder (12) is fixedly connected to one of the sliders (11). The transmission gear ring (16) is rotatably mounted on the base column (7) and the transmission gear ring (16) meshes with both racks (13) at the same time. A clamping assembly (5) is fixedly mounted on the upper end of each of the two racks (13). The clamping assembly (5) consists of an L-shaped support rod (14) and a rubber airbag (15). The rubber airbag (15) is fixedly mounted on the inner end of the L-shaped support rod (14).

2. A wafer placement stage according to claim 1, characterized in that: An L-shaped mounting bracket (6) is fixedly installed on the upper end of the mounting base plate (1).

3. A wafer placement stage according to claim 2, characterized in that: The base column (7) on the holding platform (3) is fixedly installed on the upper end of the mounting base plate (1). Two sliding grooves (10) are opened on the outer wall of the support platform (8), and the sliding grooves (10) pass through the support platform (8) from top to bottom.

4. A wafer placement stage according to claim 3, characterized in that: The base column (7) on the holding platform (3) is provided with an annular groove (9).

5. A wafer placement stage according to claim 4, characterized in that: The drive cylinder (12) on the drive assembly (4) is fixedly mounted on the L-shaped mounting bracket (6), the rack (13) is located below the support platform (8) on the serving platform (3), and the transmission gear ring (16) is rotatably mounted in the L-shaped annular groove (9) opened on the base column (7).

6. A wafer placement stage according to claim 5, characterized in that: The L-shaped support rod (14) on the clamping assembly (5) is fixedly installed on the upper end of the rack (13), and the lower end of the rubber airbag (15) is at the same height as the upper end of the support platform (8).

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