Bearing chuck

Abstract

A bearing chuck comprises a base body and a base plate. Wherein the base body comprises a central part and an edge part surrounding the central part, and the upper surface of the edge part is covered with an anti-static film layer; the substrate is arranged on the central part and comprises an adsorption plate and a sealing ring surrounding the adsorption plate; the surface of the side, away from the center part, of the adsorption plate is flush with the surface of the side, away from the center part, of the sealing ring. The upper surface of the anti-static film layer is not higher than the surface of the side, away from the center part, of the sealing ring. The base body is endowed with the anti-static capacity based on the anti-static film layer, and the structural characteristic that the upper surface of the anti-static film layer is not higher than the surfaces of the sealing ring and the adsorption plate is utilized, so that the anti-static film layer can be prevented from being abraded when the base plate is ground, and it is guaranteed that the whole area of the surface of the side, facing a workpiece, of the bearing chuck has the anti-static function; meanwhile, by means of the sealing ring, the risk of vacuum leakage at the joint of the adsorption plate and the base body can be reduced, the sealing performance of the bearing chuck is improved, the edge of the workpiece can be prevented from making contact with the base body, and the risk that the workpiece is polluted by static electricity is further reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of carriers, in particular to a bearing chuck. BACKGROUND

[0002] The bearing chuck is a carrier that uses the principle of vacuum to generate adsorption force to realize adsorption and fixation of objects. Taking the application of the bearing chuck in the semiconductor field as an example, the bearing chuck is commonly used to fix wafers so as to process and detect the wafers. In the related art, the bearing chuck is generally combined and built by a base and an adsorption plate; wherein the base is mostly made of insulating material, and the adsorption plate, as a component directly contacting and adsorbing the wafer, is made of material with anti-static performance; in the actual application process of the bearing chuck, since the base itself does not have anti-static capability, the wafer is easily electrostatically contaminated when the base contacts the wafer, thereby affecting the processing quality or detection result of the wafer. SUMMARY

[0003] The technical problem solved by the present application is to provide a bearing chuck, aiming to improve the anti-static performance.

[0004] In one embodiment, a bearing chuck is provided, comprising:

[0005] a base, comprising a center part and an edge part surrounding the center part, and an upper surface of the edge part is covered with an anti-static film layer; and

[0006] a base plate, disposed on the center part, comprising an adsorption plate and a sealing ring surrounding the adsorption plate, a surface of the adsorption plate away from the center part is flush with a surface of the sealing ring away from the center part, and an upper surface of the anti-static film layer is not higher than the surface of the sealing ring away from the center part.

[0007] In one embodiment, the center part comprises a first groove and a first boss surrounding the first groove, the adsorption plate and the sealing ring are disposed on the first boss, and the adsorption plate covers the first groove; wherein the first boss is sealingly attached to the combination part of the adsorption plate and the sealing ring, and the sealing ring is sealingly attached to the combination part of the adsorption plate and the edge part.

[0008] In one embodiment, the first boss is sealingly attached to the combination part of the adsorption plate and the sealing ring through a sealing glue layer, and the sealing ring is sealingly attached to the combination part of the adsorption plate and the edge part through a sealing glue layer.

[0009] In one embodiment, the center portion further comprises a second groove and a second boss surrounding the second groove, the first groove surrounding the second boss; the second boss is sealed and fitted at the joint with the adsorption plate to form a first chamber between the first boss, the first groove, the second boss and the adsorption plate, and to form a second chamber between the second boss, the second groove and the adsorption plate; the first chamber and the second chamber are independent of each other and connected to different gas paths to achieve vacuum adsorption of workpieces of different sizes.

[0010] In one embodiment, the adsorption plate comprises an inner ring adsorption plate and an outer ring adsorption plate; the outer ring adsorption plate surrounds the inner ring adsorption plate and is sleeved between the inner ring adsorption plate and the sealing ring; wherein:

[0011] the outer ring adsorption plate is sealed and fitted at the joint with the sealing ring, the first boss and the second boss to form the first chamber; the inner ring adsorption plate is sealed and fitted at the joint with the outer ring adsorption plate and the second boss to form the second chamber.

[0012] In one embodiment, the second boss is sealed and fitted at the joint with the inner ring adsorption plate and the outer ring adsorption plate by a sealing glue layer, and the joint of the inner ring adsorption plate and the outer ring adsorption plate is sealed and fitted by a sealing glue layer.

[0013] In one embodiment, the number of the second groove and the second boss is multiple, and multiple second grooves and multiple second bosses are arranged alternately to form multiple second chambers which are independent of each other and connected to different gas paths.

[0014] In one embodiment, the edge portion is higher than the first boss and the second boss.

[0015] In one embodiment, the sealing ring and the adsorption plate are made of porous ceramic material, and / or the anti-static film layer is made of Teflon material.

[0016] In one embodiment, the bearing chuck can bear a workpiece with a first outer diameter, the inner diameter of the sealing ring is smaller than the first outer diameter, and the outer diameter of the sealing ring is larger than the first outer diameter.

[0017] The bearing chuck according to the above embodiment comprises a base body and a base plate; wherein the base body comprises a center part and an edge part surrounding the center part, and an upper surface of the edge part is covered with an anti-static film layer; the base plate is arranged on the center part and comprises an adsorption plate and a sealing ring surrounding the adsorption plate; a surface of the adsorption plate away from the center part is flush with a surface of the sealing ring away from the center part, and an upper surface of the anti-static film layer is not higher than the surface of the sealing ring away from the center part. Based on the anti-static film layer giving the base body anti-static capability, by virtue of the structural feature that the upper surface of the anti-static film layer is not higher than the surfaces of the sealing ring and the adsorption plate, the anti-static film layer can be prevented from being worn during grinding of the base plate, so as to ensure that the surface of the bearing chuck on the side facing the workpiece has anti-static function in the whole area; meanwhile, by virtue of the sealing ring arranged between the adsorption plate and the edge part of the base body, the risk of vacuum leakage at the joint of the adsorption plate and the base body can be reduced, so as to improve the sealing performance of the bearing chuck, and the edge of the workpiece can be prevented from contacting the base body, so as to further reduce the risk of electrostatic pollution of the workpiece. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic diagram of the planar structure of the bearing chuck of an embodiment.

[0019] Figure 2 It is a schematic diagram of the planar structure of the base body of the bearing chuck of an embodiment.

[0020] Figure 3 It is a schematic diagram of the cross-sectional structure of the bearing chuck of an embodiment (I).

[0021] Figure 4 It is a schematic diagram of the cross-sectional structure of the bearing chuck of an embodiment (II).

[0022] Figure 5 It is a schematic diagram of the cross-sectional structure of the bearing chuck of an embodiment (III).

[0023] Figure 6 It is a schematic diagram of the cross-sectional structure of the bearing chuck of an embodiment (IV).

[0024] In the drawings:

[0025] 10, base body; 10a, center part; 10b, edge part; 11, first groove; 12, first boss; 13, second groove; 14, second boss; 20, base plate; 21, adsorption plate; 21a, inner ring adsorption plate; 21b, outer ring adsorption plate; 22, sealing ring; 30, anti-static film layer; 40, sealing glue layer. DETAILED DESCRIPTION

[0026] The application will be described in further detail below with specific reference being made to the drawings. Like elements in different embodiments are denoted by like reference numerals. In the following description, numerous specific details are described to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the application can be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the application. In addition, the features, operations or steps described in the specification can be combined in any suitable manner in various embodiments. Also, the various steps of the methods described can be performed in any suitable order, as would be apparent to one skilled in the art.

[0027] In addition, features, operations or steps described in the specification can be combined in any suitable manner in various embodiments. Also, the various steps of the methods described can be performed in any suitable order, as would be apparent to one skilled in the art.

[0028] The serial numbers of components in the specification, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "coupling" in the application include direct and indirect connection (coupling) unless otherwise specified.

[0029] Referring to Figures 1 to 6 The embodiment of the application provides a bearing chuck, which can adsorb product workpieces (such as wafers, chips, display screen panels, optical lenses, etc.) through vacuum adsorption, so as to realize the bearing and fixing of the product workpieces. Specifically, in the field of semiconductors, the wafer can be adsorbed and fixed by the bearing chuck, so as to facilitate the processing, detection and other operations of the wafer. The bearing chuck comprises a base body 10, a base plate 20 and other functional components (for example, related components for connecting the bearing chuck and a vacuum source in a gas circuit, and a driving device for driving the bearing chuck to move the product workpiece in an environmental space) as needed, which will be described in detail below.

[0030] Referring to Figures 1 to 6 The base body 10 is mainly used as a mounting carrier of other constituent components of the bearing chuck. The base body 10 can adopt natural minerals or artificial synthetic materials with a gas permeability close to zero, such as alumina ceramic, aluminum nitride ceramic, silicon nitride ceramic, silicon carbide ceramic, etc. In addition, other materials with sufficient structural strength (for example, aluminum material) can also be adopted.

[0031] Referring to Figure 2The base body 10 comprises a center portion 10a and an edge portion 10b surrounding the center portion 10a; please refer to Figure 1 and Figure 3 The substrate 20 is arranged on the center portion 10a in a form of covering the upper surface of the center portion 10a, and mainly serves to directly contact the product workpiece to carry and adsorb the product workpiece; the substrate 20 can be made of a material with good anti-static performance, such as porous ceramic material. Please refer to Figures 2 to 6 The upper surface of the edge portion 10b is covered with an anti-static film layer 30, which can be made of Teflon material (i.e. polytetrafluoroethylene, abbreviated as PTFE), or other materials with good electrostatic adsorption performance (such as polyethylene material, polyvinyl chloride material, etc.). The anti-static film layer 30 can avoid the accumulation of static electricity on the base body 10, thereby preventing the product workpiece from being electrostatically contaminated.

[0032] It should be noted that Figure 2 The bold dashed line in the above figure represents the approximate boundary between the center portion 10a and the edge portion 10b. The center portion 10a can be understood as a structural part of the base body 10 that cooperates with the substrate 20 to achieve the carrying and adsorption of the product workpiece. The edge portion 10b can be understood as a structural part of the base body 10 other than the center portion 10a and surrounding the geometric center line of the base body 10 or the carrying chuck. For example, the carrying chuck or the base body 10 is in the form of a disc, and the edge portion 10b refers to the structural edge part of the base body 10 surrounding the outer circle of the center portion 10a or the substrate 20. The upper surfaces of the center portion 10a and the edge portion 10b can be understood as the surfaces of the center portion 10a and the edge portion 10b facing the product workpiece when the carrying chuck is applied.

[0033] When the carrying chuck is applied, the structural part of the base body 10 that is not covered by the substrate 20 (such as the edge portion 10b) may come into contact with or be close to the product workpiece. Therefore, the anti-static film layer 30 is used to endow the base body 10 with anti-static capability, which is beneficial to realize the electrostatic protection capability of the carrying chuck for the whole area of the product workpiece, thereby effectively reducing the risk of electrostatic pollution of the product workpiece by the base body 10.

[0034] Of course, in some embodiments, other surfaces of the edge portion 10b can also be covered with the anti-static film layer 30, such as the outer peripheral surface of the edge portion 10b.

[0035] Please refer to Figure 1 , Figures 3 to 6, the substrate 20 comprises an adsorption plate 21 and a sealing ring 22; the adsorption plate 21 has an adsorption hole structure and can be a porous ceramic sheet, which serves as a carrier directly contacting the product workpiece in the bearing chuck and plays a role of bearing and adsorbing and fixing the product workpiece; for example, a channel structure communicating with the adsorption hole structure is formed between the adsorption plate 21 and the base 10, and a vacuum source or the like is used to pump the channel structure, so that a negative pressure adsorption force is generated on the surface of the adsorption plate 21 away from the center part 10, thereby adsorbing and fixing the product workpiece on the adsorption plate 21; for another example, based on the connection relationship between the adsorption hole structure of the adsorption plate 21 and the gas path of the vacuum source, the adsorption plate 21 can directly adsorb and fix the product workpiece.

[0036] The sealing ring 22 is arranged around the adsorption plate 21 at the outer circle of the adsorption plate 21 and mainly plays a role of supporting the edge of the product workpiece and sealing the entire bearing chuck; wherein the surface of the adsorption plate 21 away from the center part 10a is flush with the surface of the sealing ring 22 away from the center part 10a, and the upper surface of the anti-static film layer 30 is not higher than the surface of the sealing ring 22 away from the center part 10a. For the convenience of description, the surface of the adsorption plate 21 away from the center part 10a is defined as the upper surface of the adsorption plate 21, and the surface of the sealing ring 22 away from the center part 10a is defined as the upper surface of the sealing ring 22.

[0037] Exemplarily, referring to Figure 4 , the upper surface of the sealing ring 22 is higher than the upper surface of the anti-static film layer 30; in this way, after the substrate 20 is assembled with the base 10, when the entire substrate 20 needs to be ground for the purpose of ensuring that the upper surface of the adsorption plate 21 is flush with the upper surface of the sealing ring 22 or ensuring the overall flatness of the substrate 20 and other precision indexes, the upper surface of the sealing ring 22 is higher than the upper surface of the anti-static film layer 30, so that only the adsorption plate 21 and the sealing ring 22 will be ground in the grinding process without grinding the anti-static film layer 30, thereby avoiding damaging the anti-static film layer 30.

[0038] Exemplarily, referring to Figure 3 , Figure 5 and Figure 6 , the upper surface of the sealing ring 22 is flush with the upper surface of the anti-static film layer 30, and the sealing ring 22 forms a structural isolation between the adsorption plate 21 and the edge part 10b (specifically, the anti-static film layer 30), so that when the product workpiece is adsorbed and fixed on the adsorption plate 21, the sealing ring 22 can support or bear the profile edge of the product workpiece, preventing the profile edge of the product workpiece from contacting the edge part 10b (i.e. the anti-static film layer 30).

[0039] Therefore, the adsorption plate 21, the sealing ring 22 and the anti-static film layer 30 can endow the bearing chuck with the anti-static capability for the whole area of the product workpiece, so as to avoid affecting the processing quality or detection result of the product workpiece due to static pollution of the product workpiece during the process of bearing the product workpiece. Meanwhile, the sealing ring 22 can seal the joint part of the adsorption plate 21 and the center part 10a, so as to avoid or reduce the risk of vacuum leakage at the joint part of the adsorption plate 21 and the base 10, and improve the sealing performance of the bearing chuck.

[0040] In addition, the sealing ring 22 supports the profile edge of the product workpiece to prevent the product workpiece from directly contacting the base 10, which can further reduce the risk of static pollution of the product workpiece and avoid damaging the anti-static film layer 30 during the process of grinding the adsorption plate 21. Specifically, in some embodiments, the bearing chuck can be configured to bear and adsorb a workpiece with a first outer diameter, and the inner diameter of the sealing ring 22 is smaller than the first outer diameter, and the outer diameter is larger than the first outer diameter. For example, the bearing chuck can bear and adsorb a maximum size wafer of 12 inches, and at this time, the inner diameter of the sealing ring 22 is smaller than the outer diameter of the 12-inch wafer, and the outer diameter is larger than the outer diameter of the 12-inch wafer. In this way, when the product workpiece is adsorbed and fixed by the adsorption plate 22, the edge of the product workpiece can be overlapped on the sealing ring 22 without contacting the base 10 (specifically, the anti-static film layer 30).

[0041] In some embodiments, referring to Figures 2 to 6 , the center part 10a includes a first groove 11 and a first boss 12 surrounding the first groove 11. The edge part 10b is higher than the first boss 12 (which can also be understood as the upper surface of the edge part 10b is higher than the upper surface of the first boss 12, and the upper surface of the first boss 12 is higher than the groove surface of the first groove 11), and the adsorption plate 21 and the sealing ring 22 are arranged on the first boss 12, and the adsorption plate 21 covers the first groove 11.

[0042] Meanwhile, the joint part of the first boss 11 and the adsorption plate 21 and the sealing ring 22 is sealed and attached by the sealing adhesive layer 40, for example, the sealing adhesive layer 40 is arranged between the upper surface of the first boss 11 and the lower surface of the adsorption plate 21, and between the upper surface of the first boss 11 and the lower surface of the sealing ring 22. The joint part of the sealing ring 22 and the adsorption plate 21 and the edge part 10b is sealed and attached by the sealing adhesive layer 40, for example, the sealing adhesive layer 40 is arranged between the circumferential side surfaces of the sealing ring 22 and the adsorption plate 10 close to each other, and the sealing adhesive layer 40 is arranged between the circumferential side surface of the sealing ring 22 away from the adsorption plate 10 and the edge part 10b.

[0043] Therefore, by virtue of the structure feature that the edge portion 10b is higher than the first boss 12, the substrate 20 is assembled on the center portion 10a in a manner of being embedded on the base body 10, and the bonding positions among the first boss 12, the adsorption plate 21 and the sealing ring 22 are sealed and glued by the sealing glue layer 40, so as to realize the overall sealing and gluing of the bonding positions among the sealing ring 22, the adsorption plate 21 and the base body 22, and ensure the vacuum sealing property and the structural stability of the whole chuck.

[0044] Specifically, on one hand, by virtue of the structure feature that the adsorption plate 21 covers the first groove 11, a cavity in communication with the adsorption hole structure of the adsorption plate 21 can be formed among the adsorption plate 21, the first boss 12 and the first groove 11, and the negative pressure adsorption force can be generated on the upper surface of the adsorption plate 21 by vacuumizing the cavity, so as to realize the vacuum adsorption and fixation of the product workpiece. On the other hand, by virtue of the sealing glue layer 40, the adsorption plate 21 and the sealing ring 22 can be stably assembled and fixed on the base body 10, so as to effectively improve the sealing property and the stability of the whole chuck structure, ensure that the vacuum leakage does not occur at the bonding positions of the base body 10, the adsorption plate 21 and the sealing ring 22, and effectively reduce the structural boundary between the sealing ring 22 and the adsorption plate 21, so as to improve the integrity of the upper surface of the substrate 20.

[0045] In some other embodiments, the bonding positions among the first boss 11 and the adsorption plate 21, the first boss 11 and the sealing ring 22, the adsorption plate 21 and the sealing ring 22, and the sealing ring 22 and the edge portion 10b can also be sealed and glued in other manners; for example, based on the selection and setting of the material or structure of the sealing ring 22, the sealing and gluing relationship between the adsorption plate 21 and the first boss 11 and the edge portion 10b is established by the sealing ring 22, so as to stably assemble and fix the adsorption plate 21 on the base body 10, and prevent the vacuum leakage from occurring at the bonding positions of the adsorption plate 21 and the base body 10.

[0046] In some other embodiments, the edge portion 10b can also be arranged to be flush with or lower than the first boss 11, so as to reduce the number of bonding positions among the related structures or components, and form the chuck with different structural forms.

[0047] In some embodiments, both the adsorption plate 21 and the sealing ring 22 are made of porous ceramic material. This not only effectively reduces the material configuration cost of the substrate 20 or the carrier chuck, but also facilitates the consistency of the processing or grinding of the adsorption plate 21 and the sealing ring 22. The sealing of the relevant joint areas using the sealing adhesive layer 40 effectively ensures the vacuum seal of the carrier chuck. Regarding the porous ceramic sealing ring 22, the sealing adhesive layer 40 can be used to seal the surface of the sealing ring 22, or the interior of the sealing ring 22 can be sealed using methods such as potting. Of course, other suitable materials can also be used for the sealing ring 22 according to actual needs, which will not be elaborated here.

[0048] In some embodiments, please refer to Figure 2 , Figures 4 to 6 The central portion 10a also includes a second groove 13 and a second protrusion 14; wherein the second protrusion 14 surrounds the second groove 13, and the first groove 11 surrounds the second protrusion 14; correspondingly, the adsorption plate 21 overlaps the first protrusion 12 and the second protrusion 14, and the joint between the second protrusion 14 and the adsorption plate 21 is sealed and fitted, for example, the upper surface of the second protrusion 14 and the lower surface of the adsorption plate 21 are sealed and fitted by a sealant layer 40.

[0049] Therefore, based on the sealed fit at the joint of the adsorption plate 21 with the second protrusion 14 and the first protrusion 12, two independent chambers that do not cross-ventilate each other can be formed on both sides of the second protrusion 14. That is, a first chamber is formed between the first protrusion 12, the first groove 11, the second protrusion 14 and the adsorption plate 21, and a second chamber is formed between the second protrusion 12, the second groove 13 and the adsorption plate 21. By connecting the first chamber and the second chamber with different air passages, vacuum adsorption of workpieces of different sizes can be achieved.

[0050] For example, when only the second chamber is connected to the vacuum source gas path, a negative pressure adsorption force can be generated in the region of the adsorption plate 21 corresponding to the second chamber. At this time, the carrier chuck can be used to carry and adsorb and fix the 8-inch wafer. When the first chamber and the second chamber are connected to the vacuum source gas path respectively, a negative pressure adsorption force can be generated in the region of the adsorption plate 21 corresponding to the first chamber and the second chamber. At this time, the carrier chuck can be used to carry and adsorb and fix the 12-inch wafer.

[0051] In some embodiments, please refer to Figure 1 , Figure 4 and Figure 5, the adsorption plate 21 comprises an inner ring adsorption plate 21a and an outer ring adsorption plate 21b; wherein the outer ring adsorption plate 21b surrounds the inner ring adsorption plate 21a and is sleeved between the inner ring adsorption plate 21a and the sealing ring 22; correspondingly, the outer ring adsorption plate 21b is sealed and attached to the sealing ring 22, the first boss 12 and the combined part of the second boss 14 by the sealing adhesive layer 40 to form a first chamber; the inner ring adsorption plate 21a is sealed and attached to the outer ring adsorption plate 21b and the combined part of the second boss 14 by the sealing adhesive layer 40 to form a second chamber. In specific implementation, the second boss 14 can be arranged to be the same height as the first boss 12, that is, the upper surface of the second boss 14 is flush with the upper surface of the first boss 12.

[0052] On the one hand, the inner ring adsorption plate 21a and the outer ring adsorption plate 21b are combined to build the adsorption plate 21, which can not only reduce the structural combination difficulty of the adsorption plate 21, the base body 10 and the sealing ring 22, but also facilitate the formation of mutually independent different chambers to realize the partitioned setting of the adsorption area of the bearing chuck to adapt to different sizes of workpieces.

[0053] On the other hand, compared with the related art, since a certain width of isolation belt is used to separate the chambers between different adsorption areas, the isolation belt is prone to produce indentation marks on the back of the product workpiece such as a wafer. In the present application, the sealing adhesive layer 40 is used to establish a sealed and attached relationship between the inner ring adsorption plate 21a and the outer ring adsorption plate 21b to realize the adhesive sealing between different adsorption areas of the adsorption plate 21 or the bearing chuck, which can effectively reduce the width of the structural boundary line between the outer ring adsorption plate 21b and the inner ring adsorption plate 21a to form a structure of nearly seamless splicing between the inner ring adsorption plate 21a and the outer ring adsorption plate 21b. In this way, when the product workpiece (such as a wafer) is adsorbed and fixed, indentation marks on the back of the wafer can be effectively avoided to achieve the effect of protecting the product workpiece.

[0054] In some embodiments, referring to Figure 6 , the number of the second grooves 13 and the second bosses 14 can also be set to multiple, and the multiple second grooves 13 and the multiple second bosses 14 are alternately arranged in the direction from the center to the edge of the bearing chuck. In this way, multiple second chambers which are mutually independent and can communicate different gas paths can be formed between the adsorption plate 21 and the base body 10, so that the bearing chuck can carry and adsorb and fix more sizes of workpieces (such as wafers of different sizes of 2 inches, 4 inches, 6 inches, 8 inches, 12 inches, 14 inches, etc.). It can be understood that in specific implementation, the inner ring adsorption plate 21a or the outer ring adsorption plate 21b can be combined by multiple ring-sleeved adsorption plate units, so that the second boss 14 is sealed and attached to the adjacent two adsorption plate units to form corresponding chambers on both sides of each second boss 14.

[0055] It should be noted that Figure 1The bold dashed line in the figure indicates the boundary between the inner adsorption plate 21a and the outer adsorption plate 21b, or the sealing glue layer 40 at the joint between the inner adsorption plate 21a and the outer adsorption plate 21b; Figures 3 to 6 The bold solid line in the figure only indicates that the relevant joint is sealed and attached by the sealing glue layer 40, and does not indicate the structure, size, etc. of the sealing glue layer 40.

[0056] The above application of specific examples is used to help understand the application and does not limit the application. For those skilled in the art to which the application belongs, according to the idea of the application, a number of simple deductions, deformations or substitutions can be made.

Claims

1. A load bearing chuck, characterized by, The bearing chuck comprises: a base body comprising a central part and an edge part surrounding the central part, an upper surface of the edge part being covered with an anti-static film layer; and a substrate arranged on the central part, the substrate comprising an adsorption plate and a sealing ring surrounding the adsorption plate, a surface of the adsorption plate away from the central part being flush with a surface of the sealing ring away from the central part, and an upper surface of the anti-static film layer being not higher than the surface of the sealing ring away from the central part.

2. The load cartridge of claim 1, wherein The central part comprises a first groove and a first boss surrounding the first groove, the adsorption plate and the sealing ring being arranged on the first boss, and the adsorption plate covering the first groove; wherein the first boss is sealingly fitted at a joint part of the first boss, the adsorption plate and the sealing ring, and the sealing ring is sealingly fitted at a joint part of the sealing ring, the adsorption plate and the edge part.

3. The load cartridge of claim 2, wherein, The first boss is sealingly fitted at the joint part of the first boss, the adsorption plate and the sealing ring by a sealing glue layer, and the sealing ring is sealingly fitted at the joint part of the sealing ring, the adsorption plate and the edge part by a sealing glue layer.

4. The load cartridge of claim 2, wherein, The central part further comprises a second groove and a second boss surrounding the second groove, the first groove surrounding the second boss; the second boss is sealingly fitted at a joint part of the second boss and the adsorption plate, so as to form a first chamber between the first boss, the first groove, the second boss and the adsorption plate, and form a second chamber between the second boss, the second groove and the adsorption plate; the first chamber and the second chamber are independent of each other and connected to different gas paths, so as to realize vacuum adsorption of workpieces of different sizes.

5. The load cartridge of claim 4, wherein, The adsorption plate comprises an inner ring adsorption plate and an outer ring adsorption plate; the outer ring adsorption plate surrounds the inner ring adsorption plate and is sleeved between the inner ring adsorption plate and the sealing ring; wherein: the outer ring adsorption plate is sealingly fitted at a joint part of the outer ring adsorption plate, the sealing ring, the first boss and the second boss, so as to form the first chamber; the inner ring adsorption plate is sealingly fitted at a joint part of the inner ring adsorption plate, the outer ring adsorption plate and the second boss, so as to form the second chamber.

6. The load cartridge of claim 5, wherein, The second boss is sealingly fitted at the joint part of the second boss, the inner ring adsorption plate and the outer ring adsorption plate by a sealing glue layer, and the inner ring adsorption plate is sealingly fitted at the joint part of the inner ring adsorption plate and the outer ring adsorption plate by a sealing glue layer.

7. The load cartridge of claim 4, wherein, The number of the second grooves and the second bosses is set to be multiple, and the multiple second grooves and the multiple second bosses are alternately arranged, so as to form multiple second chambers which are independent of each other and connected to different gas paths.

8. The load cartridge of claim 4, wherein, The edge part is higher than the first boss and the second boss.

9. The load cartridge of any one of claims 1-8, wherein, The sealing ring and the adsorption plate are made of porous ceramic material, and / or the anti-static film layer is made of Teflon material.

10. The load cartridge of any one of claims 1-8, wherein, The bearing chuck is capable of bearing a workpiece with a first outer diameter, an inner diameter of the sealing ring is smaller than the first outer diameter, and an outer diameter of the sealing ring is greater than the first outer diameter.

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