Liquid heating container
By using a one-piece molded glass body and base design, combined with an overflow tray and fixing components, the problem of water and electricity leakage after the bottom of the glass breaks is solved, which improves safety and heating efficiency, and reduces cleaning difficulty and the risk of dirt accumulation.
Patent Information
- Application Number
- CN202520209866.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-02-10
AI Technical Summary
Traditional all-glass bottom liquid heating containers are prone to leakage and electric shock when the bottom of the glass breaks, posing a safety hazard. Existing measures are insufficient to completely solve this problem.
A liquid heating container was designed, featuring a one-piece molded glass body and base plate, combined with a fixing component and overflow tank structure to ensure that water flows into the overflow tank without entering the component housing cavity, thus avoiding electrical pathways. Thermally conductive adhesive layers and buffer silicone rings are used to improve connection stability and safety.
It effectively blocks the electrical path between water and electronic components, avoiding safety hazards such as electric shock and short circuits, improving the safety and heating efficiency of the container, and reducing the difficulty of cleaning and the risk of dirt accumulation.
Smart Images

Figure CN223929933U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of liquid heating technology, and in particular to liquid heating containers. Background Technology
[0002] With the development of technology, one-piece molded glass containers with a body and base have long been favored by consumers for their elegant appearance and excellent heat retention. However, glass itself is brittle and has poor impact resistance, especially when subjected to mechanical impact or sudden temperature changes, significantly increasing the risk of breakage. A broken glass base not only causes leakage, affecting normal use, but more importantly, for liquid heating containers with electric heating elements, leakage can trigger short circuits, leading to electrical leakage. Once leakage occurs, it can damage the product itself and pose a serious threat to consumer safety, such as electric shock or fire. To address this issue, existing methods include using thicker glass and adding a protective layer to the bottom of the glass to reduce the likelihood of such accidents. However, these measures often increase costs and do not completely solve the problem of glass base breakage. Therefore, designing a one-piece molded glass container body that is both aesthetically pleasing and safe has become a pressing technical challenge. Utility Model Content
[0003] This application aims to address at least one of the technical problems existing in the related art. To this end, this application proposes a liquid heating container designed to solve the problems of water leakage and electrical leakage that may occur when the bottom of a traditional all-glass bottom liquid heating container breaks.
[0004] The liquid heating container according to the embodiments of this application includes:
[0005] The container body consists of a one-piece molded glass body and a base plate;
[0006] The bottom structure includes heating elements and fixing elements;
[0007] The fixing component is connected to the glass pot body. The fixing component includes a first bracket, which includes an outer wall, an inner wall, and a bottom wall. The bottom wall connects the outer wall and the inner wall. The inner wall forms a component receiving cavity. An overflow groove is formed between the outer wall and the inner wall.
[0008] The heating component includes a heating plate and electronic components. The heating plate is connected to the first bracket and is located at the bottom of the base plate, with the edge of the heating plate above the overflow tank. The electronic components are at least partially located in the component receiving cavity and are connected to the heating plate.
[0009] According to the embodiments of this application, the liquid heating container has an overflow tank in the first bracket. After the container body is broken, water can flow along the edge of the heating plate into the overflow tank and will not enter the component receiving cavity, thus avoiding the possibility of electric shock to electronic components.
[0010] According to one embodiment of this application, the vertical projection area of the heating plate on the horizontal plane is less than or equal to the area of the base plate, and the vertical projection area of the heating plate on the horizontal plane is less than the cross-sectional area enclosed by the outer wall, while the vertical projection area of the heating plate on the horizontal plane is greater than the cross-sectional area enclosed by the inner wall.
[0011] According to one embodiment of this application, the glass pot body includes an integrally formed first pot body and a second pot body, the first pot body being disposed above the second pot body, the base plate being integrally formed with the second pot body, the first pot body, the second pot body and the base plate having a smooth transition, the fixing component being connected to the second pot body, the vertical projection area of the second pot body on the horizontal plane being smaller than the cross-sectional area enclosed by the outer wall, and the vertical projection area of the second pot body on the horizontal plane being larger than the cross-sectional area enclosed by the inner wall.
[0012] According to one embodiment of this application, the heating plate has a stepped structure on the side away from the base plate, and the vertical surface of the stepped structure is located above the overflow tank;
[0013] And / or,
[0014] The bottom of the heating plate is provided with a heating tube arranged around it, and the heating tube has an inclined surface, which is located above the overflow tank.
[0015] According to one embodiment of this application, the bottom structure includes a thermally conductive adhesive layer disposed between the heating component and the base plate.
[0016] According to one embodiment of this application, the area of the thermally conductive adhesive layer is less than or equal to the area of the heating plate.
[0017] According to one embodiment of this application, the fixing component includes a second bracket, the second bracket including an annular body and a buckle, the annular body being disposed around the glass pot body, the buckle being used to lock the annular body, and the first bracket being connected to the annular body.
[0018] According to one embodiment of this application, a buffer silicone ring is provided between the annular body and the glass pot body.
[0019] According to one embodiment of this application, the glass pot body is provided with a groove, and the annular body is disposed in the groove.
[0020] According to one embodiment of this application, a housing is included, the housing covering the fixing component and the heating component, the housing being connected to the fixing component.
[0021] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a side view of the liquid heating container provided in an embodiment of this application.
[0024] Figure 2 This is a front view structural diagram of the liquid heating container provided in the embodiments of this application.
[0025] Figure 3 This is a schematic diagram of the structure of the first support provided in the embodiment of this application.
[0026] Figure 4 yes Figure 3 A cross-sectional view of the first support provided in the embodiment.
[0027] Figure 5 This is a schematic diagram of the structure of the second support provided in the embodiment of this application.
[0028] Figure 6 This is a schematic diagram of the liquid heating container provided in this application embodiment with the outer shell removed.
[0029] Figure 7 yes Figure 6 A partial enlarged structural diagram of point A provided in the embodiment.
[0030] Figure label:
[0031] 100. Container body; 110. Glass body; 111. First body; 112. Second body; 113. Groove; 120. Base plate;
[0032] 200. Bottom structure;
[0033] 210. Heating element; 211. Heating plate; 2111. Vertical surface; 212. Electronic component; 213. Heating tube; 2131. Inclined surface;
[0034] 220. Fixing component; 221. First bracket; 2211. Outer wall; 2212. Inner wall; 2213. Bottom wall; 2214. Overflow trough; 2215. Overflow hole; 222. Second bracket; 2221. Annular body; 2222. Lock;
[0035] 230. Thermally conductive adhesive layer;
[0036] 240. Buffer silicone ring;
[0037] 300. Outer casing; 310. Overflow outlet. Detailed Implementation
[0038] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.
[0039] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0040] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections, wherein a fixed connection can include an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0041] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0043] The following is combined with Figures 1 to 7 This application describes a liquid heating container.
[0044] Please refer to the liquid heating container proposed in the embodiments of this application. Figures 1 to 4 The liquid heating container includes: a container body 100 and a bottom structure 200. The container body 100 includes an integrally formed glass body 110 and a bottom plate 120. The bottom structure 200 includes a heating element 210 and a fixing element 220. The fixing element 220 is connected to the glass body 110. The fixing element 220 includes a first support 221, which includes an outer wall 2211, an inner wall 2212, and a bottom wall 2213. The bottom wall 2213 connects the outer wall 2211 and the inner wall 2212. The inner wall 2211 forms a component receiving cavity, and an overflow groove 2214 is formed between the outer wall 2211 and the inner wall 2212. The heating component 210 includes a heating plate 211 and an electronic component 212. The heating plate 211 is connected to the first bracket 221 and is located at the bottom of the base plate 120. The edge of the heating plate 211 is located above the overflow groove 2214. The electronic component 212 is at least partially located in the component receiving cavity and is connected to the heating plate 211.
[0045] According to the liquid heating container of this application embodiment, when the container body 100 breaks due to various reasons (such as mechanical impact or sudden temperature drop), water will flow out along the break. The water will first flow to the edge of the heating plate 211 and then flow into the overflow tank 2214, without entering the component receiving cavity, thus preventing direct contact between the water and the electronic components 212 located in the component receiving cavity. This effectively blocks the electrical path between the water and the electronic components 212, thereby avoiding safety hazards such as electric shock and short circuits caused by water leakage.
[0046] The container body 100 is composed of a one-piece molded glass body 110 and a base plate 120, ensuring the integrity and aesthetics of the container while improving the heating efficiency of the heating element 210 on the container body 100. Understandably, in traditional liquid heating containers, the heating element 210 (such as a heating plate 211) is often directly fixed to the base plate 120 (forming part of the inner cavity of the container body 100). This design easily leads to gaps that are difficult to clean between the heating element 210 and the container body 100, increasing the risk of dirt accumulation and making cleaning more difficult. In this application, the container body 100's glass body 110 and base plate 120 are integrally molded with a seamless structure. Therefore, the heating element 210 will not directly contact the liquid or food inside the container body 100, reducing the possibility of discoloration of the silicone ring at the bottom of the pot when cooking food, and also avoiding the problem of dirt accumulation in the silicone joint gaps.
[0047] It should be noted that the all-glass kettle body (one-piece molded glass kettle body 110 and bottom plate 120) is prone to bottom cracking when heated unevenly. The bottom structure 200 of this application can also solve the defects of the all-glass kettle body in terms of installation firmness and uneven heating, forming a new installation form that can ensure uniform heating.
[0048] The bottom structure 200 includes a heating element 210 and a fixing element 220. The fixing element 220 is connected to the glass vessel body 110 via a first support 221, ensuring the stability and safety of the container. The first support 221 includes an outer wall 2211, an inner wall 2212, and a bottom wall 2213, and an overflow groove 2214 formed therebetween.
[0049] The heating element 210 includes a heating plate 211 and electronic components 212. The heating plate 211 is connected to the first support 221 and located at the bottom of the base plate 120, and is used to heat the liquid in the container. The electronic components 212 are located in the component receiving cavity and connected to the heating plate 211, and are used to control the operation of the heating plate 211. Due to the design of the overflow tank 2214, even if the container breaks, water will not enter the component receiving cavity and directly contact the electronic components 212, thereby avoiding safety hazards such as electric shock and short circuits.
[0050] In one embodiment, the bottom wall 2213 is provided with an overflow hole 2215, which is connected to the overflow tank 2214.
[0051] When the container body 100 breaks, water can flow along the edge of the heating plate 211 into the overflow tank 2214, and then be quickly discharged from the container through the overflow hole 2215 on the bottom wall 2213, reducing further damage to the internal structure of the container.
[0052] According to one embodiment of this application, the vertical projection area of the heating plate 211 on the horizontal plane is less than or equal to the area of the base plate 120, and the vertical projection area of the heating plate 211 on the horizontal plane is less than the cross-sectional area enclosed by the outer wall 2211, while the vertical projection area of the heating plate 211 on the horizontal plane is greater than the cross-sectional area enclosed by the inner wall 2212.
[0053] Understandably, the fact that the vertical projection area of the heating plate 211 on the horizontal plane is less than or equal to the area of the base plate 120 ensures that the heating plate 211 can be placed completely on the base plate 120 without exceeding its boundaries. This arrangement ensures uniform heat transfer, avoids heat concentration at the edges of the base plate 120, thereby extending the service life of the base plate 120 and preventing the risk of container breakage due to uneven heat distribution.
[0054] In this embodiment, the vertical projected area of the heating plate 211 on the horizontal plane is smaller than the cross-sectional area enclosed by the outer wall 2211. The cross-sectional area enclosed by the outer wall 2211 represents the maximum possible accommodating range of the first support 221 on the horizontal plane. The fact that the vertical projected area of the heating plate 211 on the horizontal plane is smaller than this range ensures that the heating plate 211 has sufficient space inside the support and will not be in direct contact with the outer wall 2211.
[0055] In this embodiment, the vertical projected area of the heating plate 211 on the horizontal plane is larger than the cross-sectional area enclosed by the inner wall 2212, which represents the boundary of the component receiving cavity. The target area of the heating plate 211 is larger than this range, ensuring that the heating plate 211 can completely cover the upper part of the component receiving cavity. Thus, even if the container body 100 ruptures, the overflowing water will not directly contact the electronic components 212, further enhancing product safety.
[0056] According to one embodiment of this application, the glass pot body 110 includes an integrally formed first pot body 111 and a second pot body 112. The first pot body 111 is disposed above the second pot body 112. The bottom plate 120 and the second pot body 112 are integrally formed. The first pot body 111, the second pot body 112 and the bottom plate 120 have a smooth transition. The fixing component 220 is connected to the second pot body 112. The vertical projection area of the second pot body 112 on the horizontal plane is smaller than the cross-sectional area enclosed by the outer wall 2211. The vertical projection area of the second pot body 112 on the horizontal plane is larger than the cross-sectional area enclosed by the inner wall 2212.
[0057] The first body 111 is positioned above the second body 112. The first body 111 serves as the main part of the container, holding the liquid to be heated, while the second body 112 provides support and connection. The outer contour of the second body 112 can be smaller than that of the first body 111, allowing the outer wall 2211 of the first support 221 to cover the second body 112. Based on this, the outer shell 300 (mentioned later) can smoothly transition into the first body 111, improving the user experience. Of course, the outer contour of the second body 112 can also be larger than that of the first body 111; no specific limitation is made here.
[0058] Understandably, there is a smooth transition between the first body 111, the second body 112, and the base plate 120: the smooth transition design not only improves the aesthetics of the container, but also reduces the risk of stress concentration and breakage caused by improper treatment of corners or seams.
[0059] In this embodiment, the projected area of the second kettle body 112 is smaller than the cross-sectional area enclosed by the outer wall 2211, but larger than the cross-sectional area enclosed by the inner wall 2212. This ensures that the first support 221 can be stably supported on the second kettle body 112 without exceeding the boundary of the outer wall 2211. Simultaneously, because the projected area of the second kettle body 112 is larger than the cross-sectional area enclosed by the inner wall 2212, it also ensures that the heating plate 211 can completely cover the top of the component receiving cavity.
[0060] According to one embodiment of this application, the heating plate 211 is provided with a stepped structure on the side away from the base plate 120, and the vertical surface 2111 of the stepped structure is located above the overflow tank 2214.
[0061] In this embodiment, even if the container body 100 ruptures, the overflowing water will first be blocked by the stepped structure of the heating plate 211, and then flow along the vertical surface 2111 of the stepped structure into the overflow tank 2214 below, avoiding direct contact between the water and the electronic components 212. This design greatly improves the safety of the container and reduces safety hazards such as electric shock and short circuits caused by water leakage.
[0062] According to one embodiment of this application, the bottom of the heating plate 211 is provided with a heating tube 213 arranged around it, the heating tube 213 is provided with an inclined surface 2131, and the inclined surface 2131 is located above the overflow tank 2214.
[0063] In this embodiment, the heating element 213 is arranged around the bottom of the heating plate 211, ensuring uniform heat distribution. During heating, the heat generated by the heating element 213 is evenly transferred to the liquid inside the container. The heating element 213 has an inclined surface 2131, so even if the container body 100 breaks, the overflowing water will first be blocked by the inclined surface 2131 and then flow down to the overflow tank 2214, avoiding direct contact between water and electronic components 212. This design greatly improves the safety of the container and reduces safety hazards such as electric shock and short circuits caused by water leakage.
[0064] According to one embodiment of this application, please refer to Figure 6 and Figure 7 The bottom structure 200 includes a thermally conductive adhesive layer 230, which is disposed between the heating component 210 and the base plate 120.
[0065] The thermally conductive adhesive layer 230 is cleverly placed between the heating element 210 and the base plate 120, which can effectively transfer the heat generated by the heating element 210 to the base plate 120, and also enhance the connection strength between the two, ensuring that there will be no loosening or falling off during the heating process.
[0066] The thermally conductive adhesive layer 230 can also reduce the flatness requirements of the base plate 120. Traditional liquid heating containers often have high requirements for the flatness of the base plate 120 during assembly to ensure tight contact between the heating element 210 and the base plate 120. However, the introduction of the thermally conductive adhesive layer 230 can reduce this requirement to some extent. The thermally conductive adhesive layer 230 has a certain degree of filling and adaptability, capable of filling the tiny gaps between the heating element 210 and the base plate 120, ensuring effective heat transfer. Therefore, even if there is a certain error in the flatness of the base plate 120, the thermally conductive adhesive layer 230 can compensate for it, ensuring uniform heat distribution and efficient heat transfer.
[0067] In extreme cases, such as if the container body 100 ruptures for some reason, the thermally conductive adhesive layer 230 can also act as a barrier to prevent liquid from directly contacting the heat-generating component 210 or electronic component 212. The thermally conductive adhesive layer 230 is usually made of a material with a certain degree of viscosity and elasticity. When liquid spills, it can block the flow of liquid to a certain extent, providing an extra layer of protection for the electronic component 212.
[0068] According to one embodiment of this application, the area of the thermally conductive adhesive layer 230 is less than or equal to the area of the heating plate 211. The main function of the thermally conductive adhesive layer 230 is to transfer the heat generated by the heating plate 211 to the base plate 120. If the area of the thermally conductive adhesive layer 230 is too large, it may cause uneven temperature distribution between the thermally conductive adhesive at the edges and the thermally conductive adhesive in the center. Matching the area of the thermally conductive adhesive layer 230 to the heating plate 211 ensures that heat can be evenly transferred to the base plate 120, thereby improving heating efficiency. This not only reduces heating time but also lowers energy consumption.
[0069] According to one embodiment of this application, please refer to Figure 1 , Figure 2 and Figure 5 The fixing component 220 includes a second bracket 222, which includes an annular body 2221 and a buckle 2222. The annular body 2221 is circumferentially disposed around the glass pot body 110, and the buckle 2222 is used to lock the annular body 2221. The first bracket 221 is connected to the annular body 2221.
[0070] The annular body 2221 surrounds and fits tightly against the outside of the glass pot body 110, thus providing stable support and fixation. The annular body 2221 can be a plastic annular body 2221 or a metal annular body 2221, as long as it can withstand the thermal and mechanical stress between the heating plate 211 and the glass pot body 110.
[0071] The latch 2222 is used to lock the annular body 2221, ensuring a secure connection between it and the glass pot body 110. The latch 2222 includes one or more clips, screws or other fastening devices that can easily secure and release the annular body 2221, thereby allowing the user to easily install and remove the annular body 2221.
[0072] The first bracket 221 is directly connected to the fixing component 220 and the annular body 2221 to ensure that the heating plate 211 can be stably placed under the glass pot body 110. The connection method of the first bracket 221 may include screw fixing, snap connection or other reliable connection methods.
[0073] In one embodiment, the annular body 2221 is provided with one or more stud structures in the circumferential direction, and the annular body 2221 can be fixed to the glass pot body 110 by tightening the studs.
[0074] According to one embodiment of this application, a buffer silicone ring 240 is provided between the annular body 2221 and the glass pot body 110.
[0075] The buffer silicone ring 240 can be made of highly elastic, wear-resistant, and high-temperature resistant silicone material. The buffer silicone ring 240 has excellent sealing and cushioning properties, forming an effective protective barrier between the glass body 110 and the annular body 2221. In practical applications, the presence of the buffer silicone ring 240 allows users to confidently tighten the annular body 2221 without worrying about damaging the container body 100.
[0076] According to one embodiment of this application, the glass pot body 110 is provided with a groove 113, and the annular body 2221 is disposed in the groove 113. The annular body 2221 can be precisely placed within the groove 113. Its size and shape match the groove 113, allowing it to fit tightly against the outside of the glass pot body 110 without loosening or falling off. Through the tight fit between the groove 113 and the annular body 2221, the connection of the bottom structure 200 of the glass pot body 110 is more stable and reliable.
[0077] According to one embodiment of this application, a housing 300 is included, which covers the fixing component 220 and the heating component 210. The housing 300 is connected to the fixing component 220. The housing 300 is provided with an overflow port 310, which communicates with the overflow hole 2215 and the outside.
[0078] The housing 300 can be made of materials with good heat resistance, insulation, and durability, such as stainless steel, plastic, or composite materials. The connection between the housing 300 and the fixing component 220 can be achieved through any of the following methods: screw fixing, snap-fit connection, or adhesive. The housing 300 is provided with an overflow port 310, which communicates with the internal overflow hole 2215, thereby allowing liquid entering the overflow tank 2214 to drain to the outside.
[0079] Finally, it should be noted that the above embodiments are only used to illustrate this application and are not intended to limit this application. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of this application do not depart from the spirit and scope of the technical solutions of this application and should be covered within the scope of the claims of this application.
Claims
1. A liquid heating container, characterized in that, include: The container body consists of a one-piece molded glass body and a base plate; The bottom structure includes heating elements and fixing elements; The fixing component is connected to the glass pot body. The fixing component includes a first bracket, which includes an outer wall, an inner wall, and a bottom wall. The bottom wall connects the outer wall and the inner wall. The inner wall forms a component receiving cavity. An overflow groove is formed between the outer wall and the inner wall. The heating component includes a heating plate and electronic components. The heating plate is connected to the first bracket and is located at the bottom of the base plate, with the edge of the heating plate above the overflow tank. The electronic components are at least partially located in the component receiving cavity and are connected to the heating plate.
2. The liquid heating container according to claim 1, characterized in that, The vertical projection area of the heating plate on the horizontal plane is less than or equal to the area of the base plate, and the vertical projection area of the heating plate on the horizontal plane is less than the cross-sectional area enclosed by the outer wall, while the vertical projection area of the heating plate on the horizontal plane is greater than the cross-sectional area enclosed by the inner wall.
3. The liquid heating container according to claim 1, characterized in that, The glass kettle body includes an integrally formed first kettle body and a second kettle body. The first kettle body is located above the second kettle body. The base plate and the second kettle body are integrally formed. The first kettle body, the second kettle body and the base plate have a smooth transition. The fixing component is connected to the second kettle body. The vertical projection area of the second kettle body on the horizontal plane is smaller than the cross-sectional area enclosed by the outer wall. The vertical projection area of the second kettle body on the horizontal plane is larger than the cross-sectional area enclosed by the inner wall.
4. The liquid heating container according to claim 1, characterized in that, The heating plate has a stepped structure on the side away from the base plate, and the vertical surface of the stepped structure is located above the overflow tank. And / or, The bottom of the heating plate is provided with a heating tube arranged around it, and the heating tube has an inclined surface, which is located above the overflow tank.
5. The liquid heating container according to claim 1, characterized in that, The bottom structure includes a thermally conductive adhesive layer disposed between the heating component and the base plate.
6. The liquid heating container according to claim 5, characterized in that, The area of the thermally conductive adhesive layer is less than or equal to the area of the heating plate.
7. The liquid heating container according to claim 1, characterized in that, The fixing component includes a second bracket, which includes an annular body and a buckle. The annular body is encircled by the glass pot body, and the buckle is used to lock the annular body. The first bracket is connected to the annular body.
8. The liquid heating container according to claim 7, characterized in that, A buffer silicone ring is provided between the annular body and the glass pot body; and / or, the glass pot body is provided with a groove, and the annular body is located in the groove.
9. The liquid heating container according to claim 1, characterized in that, The bottom wall is provided with an overflow hole, which is connected to the overflow tank.
10. The liquid heating container according to any one of claims 1 to 9, characterized in that, It includes a housing that covers the fixing component and the heating component, and the housing is connected to the fixing component.