Chip testing seat cleaning device, cleaning head of cleaning device and chip testing equipment
By designing a detachable cleaning component body and a cleaning head for the chip test socket, the problem of high cleaning costs for chip test sockets of different specifications is solved, achieving flexible adaptation and low-cost cleaning results.
Patent Information
- Application Number
- CN202323375302.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2033-12-11
AI Technical Summary
In the existing technology, cleaning chip test sockets requires cleaning equipment of different specifications, resulting in high cleaning costs.
Design a cleaning head for a chip test socket cleaning device, including a detachable cleaning component body and a cleaning component, which are threadedly connected to the cleaning component via a connecting rod. The cleaning component is replaceable and adaptable to various specifications of chip test sockets, thereby reducing cleaning costs.
It meets the cleaning needs of chip test sockets of different specifications, reduces cleaning costs, improves cleaning efficiency and stability, and reduces resource waste.
Smart Images
Figure CN223932165U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing equipment technology, and in particular to a chip test socket cleaning device, a cleaning head of the cleaning device, and chip testing equipment. Background Technology
[0002] Semiconductor chips are core components of modern electronic devices, boasting advantages such as high speed, high density, and low power consumption. To ensure chip performance and reliability, chips undergo various tests before leaving the factory, including functional testing, aging testing, and fault analysis. These tests require specialized test sockets. With increased usage time and repeated use, test sockets accumulate impurities such as dust, dirt, grease, and oxides. Failure to clean the test sockets promptly can affect the accuracy of chip testing and even lead to chip damage or failure. Therefore, cleaning the test sockets is crucial.
[0003] Currently, due to the large number of different specifications of chip test sockets, different cleaning heads of different cleaning devices need to be replaced each time the chip test sockets are cleaned to meet the cleaning requirements, resulting in high cleaning costs. Utility Model Content
[0004] The main purpose of this invention is to provide a cleaning head for a chip test socket cleaning device, which aims to solve the technical problem that the current cleaning of chip test sockets requires different cleaning heads, resulting in high cleaning costs.
[0005] To achieve the above objectives, this utility model proposes a cleaning head for a chip test socket cleaning device, the cleaning head of which includes:
[0006] Cleaning component body;
[0007] A connecting rod, one end of which is integrally formed with a first threaded rod, and the other end of which is integrally formed with a second threaded rod, wherein the first threaded rod is threadedly connected to the main body of the cleaning component;
[0008] A cleaning component is threadedly connected to the second threaded rod. The side of the cleaning component away from the second threaded rod is a cleaning surface, which is used to clean contaminants on the chip test socket.
[0009] In some embodiments, the cleaning component body is provided with a plurality of mounting holes, the plurality of mounting holes being located on the side of the cleaning component body away from the cleaning component, and magnets being installed in the plurality of mounting holes respectively.
[0010] In some embodiments, the magnet is bonded to the mounting hole using a high-temperature adhesive.
[0011] In some embodiments, the cleaning component body is provided with a protrusion located on the peripheral edge of the cleaning component body, and the protrusion is used to contact the chip test socket cleaning device to perform cleaning head in-situ sensing.
[0012] In some embodiments, the cleaning component body is provided with a positioning hole, which is located on the side of the cleaning component body away from the cleaning component, and the positioning hole is used for insertion and engagement with the chip test socket cleaning device.
[0013] In some embodiments, the cleaning component body is provided with a slot, which is an annular slot formed on the outer side of the cleaning component body, and the slot is used to engage with the chip test socket cleaning device.
[0014] This utility model also proposes a chip test socket cleaning device, including a cleaning head of the chip test socket cleaning device as described above.
[0015] This utility model further proposes a chip testing device, comprising:
[0016] A chip test socket, wherein a sensing element is provided inside the chip test socket;
[0017] A transfer robot is used to transfer the chip test socket cleaning device into the chip test socket;
[0018] And the chip test socket cleaning device described above.
[0019] In some embodiments, a vacuuming device is also included, the actuator of which is connected to the interior of the chip test socket for removing impurities from the chip test socket.
[0020] The cleaning head of this chip test socket cleaning device is used in conjunction with the cleaning device to clean the chip test socket. The cleaning head is installed on the chip test socket cleaning device and removes contaminants on the chip test socket through the cleaning surface. When the chip test socket cleaning device needs to replace the cleaning head, the cleaning head is removed, and the cleaning component is removed from the main body of the cleaning component. The main body of the cleaning component does not need to be replaced; only the new cleaning component needs to be replaced. The main body of the cleaning component of this chip test socket cleaning device can be adapted to various specifications of cleaning components to meet cleaning needs. When replacing, only the cleaning component part needs to be replaced, thereby reducing cleaning costs. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the cleaning head of the chip test socket cleaning device in one embodiment of the present invention;
[0022] Figure 2 This is a schematic diagram of the cleaning component of the cleaning head in one embodiment of the present invention;
[0023] Figure 3 This is a schematic diagram of the connecting rod of the cleaning head in one embodiment of the present invention;
[0024] Figure 4 This is an exploded view of the cleaning head of the chip test socket cleaning device in one embodiment of the present invention;
[0025] Figure 5 This is a schematic diagram of the main body of the cleaning head in one embodiment of the present invention. Detailed Implementation
[0026] The solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.
[0027] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0028] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.
[0029] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.
[0030] This utility model proposes a cleaning head for a chip test socket cleaning device, referring to... Figures 1 to 4 The cleaning head of the chip test socket cleaning device includes:
[0031] Cleaning component body 100;
[0032] The connecting rod 200 has a first threaded rod 210 integrally formed at one end and a second threaded rod 220 integrally formed at the other end. The first threaded rod 210 is threadedly connected to the cleaning component body 100.
[0033] The cleaning component 300 is threadedly connected to the second threaded rod 220. The side of the cleaning component 300 away from the second threaded rod 220 is the cleaning surface 310, which is used to clean contaminants on the chip test socket.
[0034] In this embodiment, the cleaning head of the chip test socket cleaning device is detachably mounted on the chip test socket cleaning device, which is mounted on a transfer robot. During the cleaning process, the transfer robot moves to the location of the chip test socket cleaning device and transports it to the chip test socket that needs cleaning. When cleaning chip test sockets of different specifications, the cleaning head of the chip test socket cleaning device needs to be replaced. The main body 100 of the cleaning component is removed, and the cleaning component 300 is rotated out of the main body 100 and replaced with a new cleaning component 300, which completes the replacement. This is very convenient. Using the detachable cleaning component 300 can adapt to chip test sockets of various specifications to meet cleaning needs, and the cleaning head replacement is simple. Only the cleaning component 300 needs to be replaced, without involving the replacement of the main body 100 of the cleaning component, reducing resource waste. Optionally, the main body 100 of the cleaning component can be made of stainless steel or other materials that are not easy to rust and are easy to clean, ensuring its durability and ease of use. The cleaning component 300 can be made of sponge or silicone, ensuring its softness and cleaning efficiency. Of course, other materials can also be used for the cleaning component 300 according to actual needs. Optionally, the cleaning component 300 can be a dust-removing component, which includes a dust-removing cleaning surface for removing contaminants from the chip test socket. When the dust-removing component cleans the chip test socket, the dust-removing cleaning surface 310 of the dust-removing component contacts the inner wall and pin surface of the chip test socket, thereby removing impurities such as solder dross and oxide layer from the inner wall and pin surface of the chip test socket.
[0035] The connecting rod 200 is threadedly connected to the cleaning component body 100 and the cleaning component 300 respectively. Connecting the cleaning component body 100 and the cleaning component 300 through the connecting rod 200 can improve the stability of the cleaning component 300 and prevent the cleaning component 300 from shaking or falling off during the cleaning process. The cleaning component 300 is threadedly connected to the second threaded rod 220, which can realize the quick replacement of the cleaning component 300. The end of the first threaded rod 210 connected to the cleaning component body 100 is provided with a sealing ring 211. The sealing ring 211 is used to tightly fit the first threaded rod 210 and the cleaning component body 100, thereby ensuring the stability and sealing of the cleaning head. Optionally, the sealing ring 211 can be made of rubber, silicone or other polymer materials to ensure its wear resistance, high temperature resistance and sealing performance.
[0036] The cleaning head of this chip test socket cleaning device is used in conjunction with the cleaning device to clean the chip test socket. The cleaning head is installed on the chip test socket cleaning device and removes contaminants on the chip test socket through the cleaning surface 310. When the chip test socket cleaning device needs to replace the cleaning head, the cleaning head is removed, and the cleaning component 300 is removed from the cleaning component body 100. The cleaning component body 100 does not need to be replaced; only the new cleaning component 300 needs to be replaced. The cleaning component body 100 of this chip test socket cleaning device can be adapted to various specifications of cleaning components 300 to meet cleaning needs. When replacing, only the cleaning component 300 needs to be replaced, thereby reducing cleaning costs.
[0037] In some embodiments, refer to Figure 5 The main body 100 of the cleaning component is provided with a plurality of mounting holes 110, which are located on the side of the main body 100 of the cleaning component away from the cleaning component 200, and magnets 111 are respectively installed in the plurality of mounting holes 110.
[0038] In this embodiment, the cleaning component body 100 is magnetically attracted to the cleaning device by the magnet 111, so that the cleaning component body 100 can be firmly installed on the cleaning device. When the cleaning head needs to be replaced, the cleaning component body 100 can also be easily removed from the cleaning device. The shape and size of the mounting hole 110 are adapted to the shape and size of the magnet 111.
[0039] In some embodiments, the magnet 111 is bonded to the mounting hole 110 by a high-temperature adhesive.
[0040] In this embodiment, the magnet 111 is bonded to the mounting hole 110 using a high-temperature adhesive. This ensures the magnet 111 is securely installed within the mounting hole 110, and the high-temperature adhesive also increases the attraction between the magnet 111 and the mounting hole 110, making the magnet 111 more stably installed. Optionally, the high-temperature adhesive can be a two-component adhesive. The magnet 111 is placed inside the mounting hole 110, and then the two-component high-temperature adhesive is mixed in a certain proportion and applied to the contact surface between the magnet 111 and the mounting hole 110. Once the high-temperature adhesive cures, the magnet 111 is firmly bonded to the mounting hole 110. Of course, depending on actual needs, the high-temperature adhesive can also be made of other types of polymer materials, as long as it can firmly bond the magnet 111 to the mounting hole 110. The contact surface between the magnet 111 and the mounting hole 110 needs to be cleaned to ensure the bonding effect of the high-temperature adhesive. Meanwhile, when applying high-temperature adhesive to the contact surface between magnet 111 and mounting hole 110, it is necessary to ensure the uniformity and thickness of the coating to guarantee the bonding effect of the high-temperature adhesive.
[0041] In some embodiments, refer to Figure 5The cleaning component body 100 is provided with a protrusion 120, which is located on the peripheral edge of the cleaning component body 100. The protrusion 120 is used to contact the chip test socket cleaning device to perform cleaning head in-situ sensing.
[0042] In this embodiment, when the cleaning head needs to be replaced, the transfer robot moves the cleaning device to the cleaning head placement rack in the cleaning head replacement area. When the protrusion 120 of the cleaning part body 100 touches the sensor of the cleaning head placement rack, it indicates that there is a cleaning head at this position. Then the transfer robot drives the cleaning device to separate from the cleaning head, and then the cleaning part 300 is replaced. Optionally, the protrusion 120 can be a sensing pin, which can be set according to the actual situation.
[0043] In some embodiments, refer to Figure 5 The cleaning component body 100 is provided with a positioning hole 130, which is located on the side of the cleaning component body 100 away from the cleaning component 300. The positioning hole is used to connect and cooperate with the chip test socket cleaning device.
[0044] In this embodiment, by inserting the positioning pin of the cleaning device into the positioning hole 130 of the cleaning component body 100, the cleaning device can be firmly connected to the cleaning component body 100. Optionally, the number and size of the positioning holes 130 can be adjusted according to actual needs. At the same time, the positioning holes 130 can also be circular, square, or other shapes, as long as they can be adapted to the positioning pin of the cleaning device.
[0045] In some embodiments, refer to Figure 5 The cleaning component body 100 is provided with a slot 140, which is an annular slot formed on the outer side of the cleaning component body 100. The slot is used to engage with the chip test socket cleaning device.
[0046] In this embodiment, when the cleaning head needs to be replaced, the slot 140 of the cleaning component body 100 engages with the cleaning head placement rack in the replacement area. Then, the transfer robot moves the cleaning device upward to separate it from the cleaning head, thereby replacing the cleaning component 300. After replacement, the transfer robot moves the cleaning device downward to successfully engage the cleaning device and the cleaning head. At this point, the transfer robot moves laterally out of the cleaning device to complete the head replacement operation. Preferably, the slot 140 is an annular slot to achieve quick engagement between the cleaning head and the cleaning head placement rack.
[0047] This utility model also proposes a chip test socket cleaning device, including a cleaning head as described above. The specific structure of the cleaning head of this chip test socket cleaning device is the same as described in the above embodiments. Since this chip test socket cleaning device adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.
[0048] The chip testing equipment further proposed in this utility model includes a chip test socket, a transfer robot, and a chip test socket cleaning device. The specific structure of the chip test socket cleaning device is as described in the above embodiments. Since this chip testing equipment adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The chip test socket is equipped with a sensing element. A transfer robot is used to transfer the chip test socket cleaning device to the chip test socket for cleaning. When the cleaning head needs to be replaced, the transfer robot moves the chip test socket cleaning device to the cleaning head replacement area and engages the slot 140 of the cleaning device body 100 with the cleaning head placement rack in the replacement area. At this time, when the protrusion 120 of the cleaning device body 100 touches the sensor of the cleaning head placement rack, it indicates that a cleaning head is present at this position. Then, the transfer robot moves the positioning pin of the cleaning device to disengage from the positioning hole 130 of the cleaning device body 100 to replace the cleaning device 300. After the cleaning device 300 is replaced, the transfer robot moves the positioning pin of the cleaning device to engage with the positioning hole 130 of the cleaning device body 100, and magnetically attracts the cleaning device body 100 and the cleaning device. After successful attraction, the transfer robot moves the cleaning device laterally to disengage the slot 140 of the cleaning device body 100 from the cleaning head placement rack, thus completing the cleaning head replacement operation.
[0049] In some embodiments, the chip testing equipment also includes a dust extraction device. Specifically, the actuating end of the dust extraction device is connected to the inside of the chip test socket to extract impurities inside the chip test socket. In this way, in conjunction with the cleaning head of the chip test socket cleaning device, impurities such as solder dross can be cleaned more quickly, further improving cleaning efficiency and cleaning effect.
[0050] The above description is only a part or preferred embodiment of this utility model. Neither the text nor the drawings should limit the scope of protection of this utility model. All equivalent structural transformations made using the content of this utility model specification and drawings under the overall concept of this utility model, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.
Claims
1. A cleaning head for a chip test socket cleaning device, characterized in that, include: Cleaning component body; A connecting rod, one end of which is integrally formed with a first threaded rod, and the other end of which is integrally formed with a second threaded rod, wherein the first threaded rod is threadedly connected to the main body of the cleaning component; A cleaning component is threadedly connected to the second threaded rod. The side of the cleaning component away from the second threaded rod is a cleaning surface, which is used to clean contaminants on the chip test socket.
2. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The main body of the cleaning component has multiple mounting holes, which are located on the side of the main body away from the cleaning component, and magnets are installed in each of the multiple mounting holes.
3. The cleaning head of the chip test socket cleaning device according to claim 2, characterized in that, The magnet is bonded to the mounting hole using high-temperature adhesive.
4. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The cleaning component body is provided with a protrusion located on the peripheral edge of the cleaning component body. The protrusion is used to contact the chip test socket cleaning device to sense the presence of the cleaning head.
5. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The cleaning component body is provided with a positioning hole, which is located on the side of the cleaning component body away from the cleaning component. The positioning hole is used to connect and cooperate with the chip test socket cleaning device.
6. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The cleaning component body is provided with a slot, which is an annular slot formed on the outer side of the cleaning component body, and the slot is used to engage with the chip test socket cleaning device.
7. A chip test socket cleaning device, characterized in that, The cleaning head of the chip test socket cleaning device as described in any one of claims 1-6.
8. A chip testing device, characterized in that, include: A chip test socket, wherein a sensing element is provided inside the chip test socket; A transfer robot is used to transfer the chip test socket cleaning device into the chip test socket; And the chip test socket cleaning device as described in claim 7.
9. The chip testing equipment according to claim 8, characterized in that, It also includes a vacuuming device, the actuator of which is connected to the inside of the chip test socket and is used to remove impurities from the chip test socket.