Pin correction device

Abstract

The utility model discloses a pin correction device, and belongs to the field of semiconductor production equipment. The pin correction device comprises a positioning mechanism and a correction mechanism, the correction mechanism is arranged on one side of the positioning mechanism, the correction mechanism comprises an eccentric wheel motor and a mold, the mold is installed on the eccentric wheel motor, the positioning mechanism is used for fixing a semiconductor, a pin of the semiconductor is located on one side of the positioning mechanism, and the mold is arranged on one side of the positioning mechanism. And the eccentric wheel motor is used for driving the mold to move in a reciprocating manner, so that the moving direction of the mold is matched with the correction direction of the semiconductor pin. According to the utility model, the die can correct the semiconductor pin at a high speed, and compared with a pin correction device using a lead screw mechanism in the prior art, the pin correction device using the eccentric wheel motor has the advantages that the size of the pin correction device is reduced, and the problem that the size of the pin correction device using the lead screw mechanism in the prior art is too large is solved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment, specifically a pin correction device. Background Technology

[0002] In existing technologies, semiconductor pin alignment is mostly achieved by using a lead screw mechanism to convert the rotational motion of a motor into linear motion, thereby aligning the semiconductor pins. However, lead screw mechanisms typically require a large installation space. When using a lead screw mechanism to align the semiconductor pins with the direction that needs to be aligned, the pin alignment device becomes too bulky. Utility Model Content

[0003] The purpose of this utility model is to provide a pin straightening device that uses an eccentric wheel motor to drive the mold to reciprocate and straighten semiconductor pins at high speed, thereby reducing the size of the pin straightening device and solving the problem of excessive size of existing pin straightening devices using lead screw mechanisms.

[0004] The technical solution of this utility model is as follows: a pin correction device includes a positioning mechanism and a correction mechanism.

[0005] The correction mechanism is located on one side of the positioning mechanism.

[0006] The correction mechanism includes an eccentric wheel motor and a mold, wherein the mold is mounted on the eccentric wheel motor.

[0007] The positioning mechanism is used to fix the semiconductor, with the semiconductor's pins located on one side of the positioning mechanism.

[0008] The mold is positioned on one side of the positioning mechanism so that it engages with the semiconductor pins.

[0009] The eccentric wheel motor is used to drive the mold to move back and forth, so that the direction of the mold's movement matches the correction direction of the semiconductor pins.

[0010] In a further embodiment, the pin correction device includes a vertical correction mechanism.

[0011] The mold of the vertical correction mechanism includes: a first vertical correction mold base, a lateral displacement power component, and a second vertical correction mold base.

[0012] The first vertical correction mold base is installed on the eccentric wheel motor, and the first vertical correction mold base, the lateral displacement power component, and the second vertical correction mold base are connected in sequence.

[0013] The first vertical correction mold base is provided with a first correction cavity, which is used to accommodate the bent part of the semiconductor pin.

[0014] During operation, the semiconductor pins are inserted into the first correction cavity, and the lateral displacement power component drives the second vertical correction mold to move above the first correction cavity, so that the root of the semiconductor pin is located between the first vertical correction mold and the second vertical correction mold.

[0015] The eccentric wheel motor of the vertical correction mechanism is used to drive the first vertical correction mold base and the second vertical correction mold base to move back and forth in the vertical direction, which enables the mold to perform high-speed vertical correction of the root of the semiconductor pin.

[0016] In a further embodiment, the pin alignment device includes a lateral alignment mechanism.

[0017] The mold for the lateral straightening mechanism includes: a lateral straightening mold base.

[0018] The lateral straightening mold base is provided with a second straightening cavity for accommodating semiconductor pins, and the lateral dimension of the second straightening cavity matches the lateral dimension of the bent portion of the semiconductor pin.

[0019] The eccentric wheel motor of the lateral correction mechanism is used to drive the lateral correction mold base to move back and forth in the lateral direction, which enables the mold to perform high-speed lateral correction of the bent part of the semiconductor pin.

[0020] In a further embodiment, the pin alignment device includes a longitudinal alignment mechanism.

[0021] The mold for the longitudinal straightening mechanism includes: a longitudinal straightening mold base.

[0022] The longitudinal straightening mold base is provided with a third straightening cavity for accommodating semiconductor pins, and the longitudinal dimension of the third straightening cavity matches the longitudinal dimension of the bent portion of the semiconductor pin.

[0023] The eccentric wheel motor of the longitudinal straightening mechanism is used to drive the longitudinal straightening mold base to move back and forth in the longitudinal direction.

[0024] In a further embodiment, the mold base includes two rows of correction cavities, the positions of which are matched with the two rows of bent portions of the semiconductor pins, thereby correcting the two rows of bent portions of the semiconductor pins.

[0025] In a further embodiment, the pin correction device includes: a moving mechanism, multiple suction cup mechanisms, multiple positioning mechanisms, and multiple correction mechanisms.

[0026] The positioning mechanism includes a lower positioning mold base and an upper positioning mold base. Multiple lower positioning mold bases are distributed along the longitudinal direction. The suction cup mechanism and the upper positioning mold base are installed on the moving mechanism. An upper positioning mold base is provided between every two suction cup mechanisms. The suction cup mechanism and the upper positioning mold base are located above the lower positioning mold base.

[0027] The multiple correction mechanisms are respectively arranged on one side of the multiple positioning lower mold bases.

[0028] The moving mechanism is used to drive the positioning upper mold base and the suction cup mechanism to move in the vertical and longitudinal directions. By setting a positioning upper mold base between every two suction cup mechanisms, the suction cup mechanism can move between the loading station, multiple positioning lower mold bases and the unloading station, so that the suction cup mechanism can pick up the semiconductor and transport it.

[0029] In a further embodiment, the pin alignment device includes: four suction cup mechanisms, three positioning mechanisms, and three alignment mechanisms. The three alignment mechanisms can be vertical alignment mechanism, horizontal alignment mechanism, and longitudinal alignment mechanism, respectively. Through the cooperation of the moving mechanism, suction cup mechanism, positioning mechanism, and alignment mechanism, the automatic alignment of semiconductor pins in three directions can be achieved.

[0030] In a further embodiment, the moving mechanism is a two-axis moving mechanism.

[0031] In a further embodiment, the positioning mechanism includes: a lower positioning mold base, an upper positioning mold base, and a lifting power component.

[0032] The upper positioning mold base is installed on the lifting power component, and the upper positioning mold base is located above the lower positioning mold base.

[0033] The upper positioning mold base and the lower positioning mold base are provided with a main body receiving cavity.

[0034] During operation, the lower positioning mold base and the upper positioning mold base close together to house the semiconductor body within the body housing cavity.

[0035] In a further embodiment, the upper positioning mold base and the lower positioning mold base are provided with pin clamping parts, which cooperate with the root of the semiconductor pin.

[0036] During operation, the lower positioning mold base and the upper positioning mold base close together to clamp the root of the semiconductor pin by the pin clamping part. By clamping the root of the semiconductor pin, the root of the semiconductor pin can be vertically corrected. When the positioning mechanism and the vertical correction mechanism cooperate, they can vertically correct the root of the two rows of semiconductor pins.

[0037] The beneficial effects of this utility model are: This application uses an eccentric wheel motor to drive the mold to move back and forth, and makes the direction of mold movement match the correction direction of semiconductor pins, which enables the mold to correct semiconductor pins at high speed. Compared with the pin correction device using the lead screw mechanism in the prior art, the pin correction device using the eccentric wheel motor reduces the size of the pin correction device and solves the problem of the excessive size of the pin correction device using the lead screw mechanism in the prior art.

[0038] Furthermore, the more directions the pins need to be corrected, the more the size of the pin correction device can be reduced. Attached Figure Description

[0039] Figure 1 This is an isometric schematic diagram of an embodiment of the suction cup mechanism of this utility model located above the positioning lower mold base.

[0040] Figure 2 This is an isometric schematic diagram of the internal structure of the moving mechanism of this utility model.

[0041] Figure 3 This is an isometric schematic diagram of an embodiment of the present invention in which the three positioning mechanisms and three correction mechanisms are distributed along the longitudinal direction.

[0042] Figure 4 This is a utility model Figure 3 Enlarged diagram of point A.

[0043] Figure 5 This is a utility model Figure 3 Enlarged diagram of point B.

[0044] Figure 6 This is a partial cross-sectional schematic diagram of the vertical correction mechanism and positioning mechanism of this utility model.

[0045] The reference numerals in the figure are as follows: positioning mechanism 1, lower positioning mold base 11, upper positioning mold base 12, pin clamping part 111, straightening mechanism 2, longitudinal straightening mechanism 21, longitudinal straightening mold base 211, third straightening cavity 2111, transverse straightening mechanism 22, transverse straightening mold base 221, second straightening cavity 2211, vertical straightening mechanism 23, first vertical straightening mold base 231, first straightening cavity 2311, lateral displacement power component 232, second vertical straightening mold base 233, moving mechanism 3, mounting plate 31, longitudinal moving mechanism 32, vertical moving mechanism 33, suction cup mechanism 4. Detailed Implementation

[0046] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0047] This application discloses a pin straightening device that can be used independently or installed on a frame bending machine. It can also be connected to a control device such as a PLC to automate its operation. The device uses an eccentric wheel motor to drive the mold to reciprocate and straighten semiconductor pins at high speed, which reduces the size of the pin straightening device and solves the problem of excessive size of the existing pin straightening device using a lead screw mechanism.

[0048] like Figure 1 and 3 The pin correction device shown includes: a positioning mechanism 1 and a correction mechanism 2.

[0049] The correction mechanism 2 is located on one side of the positioning mechanism 1.

[0050] The correction mechanism 2 includes an eccentric wheel motor and a mold, with the mold mounted on the eccentric wheel motor.

[0051] Positioning mechanism 1 is used to fix the semiconductor, and the semiconductor pins are located on one side of positioning mechanism 1.

[0052] The mold is positioned on one side of the positioning mechanism 1 so that the mold mates with the semiconductor pin.

[0053] An eccentric wheel motor is used to drive the mold to move back and forth, so that the direction of the mold movement matches the direction of the semiconductor pin correction.

[0054] The pin correction device includes: at least one correction mechanism 2, such as... Figure 3 The diagram shows three correction mechanisms 2, which can be a longitudinal correction mechanism 21, a transverse correction mechanism 22, and a vertical correction mechanism 23.

[0055] like Figure 3 and 4 The pin correction device shown includes: a longitudinal correction mechanism 21.

[0056] The mold for the longitudinal straightening mechanism 21 includes: longitudinal straightening mold base 211.

[0057] The longitudinal straightening mold base 211 is provided with a third straightening cavity 2111, which is used to accommodate semiconductor pins. The longitudinal dimension of the third straightening cavity 2111 matches the longitudinal dimension of the bent portion of the semiconductor pin.

[0058] The eccentric wheel motor of the longitudinal straightening mechanism 21 is used to drive the longitudinal straightening mold base 211 along... Figure 4 It moves back and forth in the longitudinal direction indicated by the middle arrow.

[0059] like Figure 3 and 5 The pin correction device shown includes: a lateral correction mechanism 22.

[0060] The mold for the lateral straightening mechanism 22 includes: a lateral straightening mold base 221.

[0061] The lateral straightening mold base 221 is provided with a second straightening cavity 2211, which is used to accommodate semiconductor pins. The lateral dimension of the second straightening cavity 2211 matches the lateral dimension of the bent portion of the semiconductor pin.

[0062] The eccentric wheel motor of the lateral straightening mechanism 22 is used to drive the lateral straightening mold base 221 along... Figure 5 It moves back and forth in the horizontal direction indicated by the middle arrow.

[0063] like Figure 4 and 5 The semiconductor pin shown has two rows of bent portions. The mold base of the longitudinal straightening mechanism 21 and the transverse straightening mechanism 22 includes two rows of straightening cavities, and the positions of the two rows of straightening cavities are matched with the two rows of bent portions of the semiconductor pin.

[0064] like Figure 3 and 6 The pin correction device shown includes: a vertical correction mechanism 23.

[0065] The mold of the vertical correction mechanism 23 includes: a first vertical correction mold base 231, a lateral displacement power component 232, and a second vertical correction mold base 233.

[0066] The first vertical straightening mold base 231 is installed on the eccentric wheel motor, and the first vertical straightening mold base 231, the lateral displacement power component 232, and the second vertical straightening mold base 233 are connected in sequence.

[0067] The first vertical correction mold base 231 is provided with a first correction cavity 2311, which is used to accommodate the bent part of the semiconductor pin.

[0068] During operation, the semiconductor pins are inserted into the first correction cavity 2311, and the lateral displacement power component 232 drives the second vertical correction mold base 233 to move above the first correction cavity 2311, so that the root of the semiconductor pin is located between the first vertical correction mold base 231 and the second vertical correction mold base 233.

[0069] The eccentric wheel motor of the vertical straightening mechanism 23 is used to drive the first vertical straightening mold base 231 and the second vertical straightening mold base 233 along... Figure 6 It moves back and forth in the vertical direction indicated by the middle arrow.

[0070] like Figure 1 The pin correction device shown includes: a moving mechanism 3, multiple suction cup mechanisms 4, multiple positioning mechanisms 1, and multiple correction mechanisms 2.

[0071] The positioning mechanism 1 includes a lower positioning mold base 11 and an upper positioning mold base 12. Multiple lower positioning mold bases 11 are distributed along the longitudinal direction. The suction cup mechanism 4 and the upper positioning mold base 12 are installed on the moving mechanism 3. A upper positioning mold base 12 is provided between every two suction cup mechanisms 4. The suction cup mechanism 4 and the upper positioning mold base 12 are located above the lower positioning mold base 11.

[0072] Multiple correction mechanisms 2 are respectively set on one side of multiple positioning lower mold bases 11.

[0073] The moving mechanism 3 is used to drive the positioning upper mold base 12 and the suction cup mechanism 4 to move in the vertical and longitudinal directions. The suction cup mechanism 4 is existing technology and will not be limited here.

[0074] like Figure 1 The pin straightening device shown includes: four suction cup mechanisms 4, three positioning mechanisms 1, and three straightening mechanisms 2.

[0075] The moving mechanism 3 is a two-axis moving mechanism 3, such as Figure 1 The moving mechanism 3 shown includes a longitudinal linear motion mechanism, a vertical linear motion mechanism mounted on the longitudinal linear motion mechanism, and a mounting plate 31 mounted on the vertical linear motion mechanism. The suction cup mechanism 4 and the positioning upper mold base 12 are mounted on the mounting plate 31.

[0076] like Figure 2 The longitudinal linear motion mechanism shown is a linear motion mechanism in which the motor drives the synchronous belt mechanism, while the vertical linear motion mechanism is a linear motion mechanism in which the motor drives the lead screw mechanism through the pulley.

[0077] like Figure 4-6 The semiconductor pin shown has two rows of bent portions. The upper positioning mold 12 and the lower positioning mold 11 are provided with pin clamping portions 111, which cooperate with the root of the semiconductor pin.

[0078] During operation, the lower positioning mold base 11 and the upper positioning mold base 12 close together to clamp the root of the semiconductor pin with the pin clamping part 111.

[0079] Working method: The moving mechanism 3 drives the semiconductor through the suction cup mechanism 4 to pass through the loading station, multiple positioning mold bases 11 and the unloading station in sequence.

[0080] Whenever the semiconductor moves to a positioning lower mold base 11, the positioning upper mold base 12 and the positioning lower mold base 11 close together to position the semiconductor body. At the same time, the pin clamping part 111 clamps the root of the semiconductor pin and performs correction work on the part of the semiconductor pin that is close to the body.

[0081] Then, the correction mechanism 2 performs correction work on the semiconductor pins.

[0082] Finally, the moving mechanism 3 moves the corrected semiconductor from the positioning mold base 11 to the unloading station via the suction cup mechanism 4.

[0083] In another embodiment, the moving mechanism 3 and the suction cup mechanism 4 may be omitted, and the positioning mechanism 1 may include: a lower positioning mold base 11, an upper positioning mold base 12, and a lifting power component.

[0084] The upper positioning mold base 12 is installed on the lifting power component, and the upper positioning mold base 12 is positioned above the lower positioning mold base 11.

[0085] The upper positioning mold base 12 and the lower positioning mold base 11 are provided with a body receiving cavity.

[0086] During operation, the lower positioning mold base 11 and the upper positioning mold base 12 close together to house the semiconductor body within the body housing cavity.

[0087] The lifting power component can be independent, such as Figure 2 The linear motion mechanism shown is driven by a motor through a pulley and a lead screw mechanism. It can be loaded and unloaded manually or by a robotic arm, and can work in conjunction with the positioning mechanism 1 and the correction mechanism 2.

[0088] In the above embodiments, vertical refers to the thickness direction of the semiconductor pin root, horizontal refers to the extension direction of the semiconductor pin root, and longitudinal refers to the extension direction of the side of the semiconductor with pins, that is, the arrangement direction of multiple semiconductor pins.

[0089] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes in form and detail may be made to the present invention without departing from the spirit and scope of the appended claims.

Claims

1. A pin correction device, characterized in that, include: Positioning and correction mechanisms; The correction mechanism is located on one side of the positioning mechanism; The correction mechanism includes: an eccentric wheel motor and a mold, wherein the mold is mounted on the eccentric wheel motor; The positioning mechanism is used to fix the semiconductor, and the semiconductor's pins are located on one side of the positioning mechanism; The mold is positioned on one side of the positioning mechanism so that the mold can mate with the semiconductor pin; The eccentric wheel motor is used to drive the mold to move back and forth, so that the direction of the mold's movement matches the correction direction of the semiconductor pins.

2. The pin correction device according to claim 1, characterized in that, include: Vertical correction mechanism; The mold of the vertical correction mechanism includes: a first vertical correction mold base, a lateral displacement power component, and a second vertical correction mold base; The first vertical correction mold base is installed on the eccentric wheel motor, and the first vertical correction mold base, the lateral displacement power component, and the second vertical correction mold base are connected in sequence. The first vertical correction mold base is provided with a first correction cavity, which is used to accommodate the bent part of the semiconductor pin; During operation, the semiconductor pins are inserted into the first correction cavity, and the lateral displacement power component drives the second vertical correction mold base to move above the first correction cavity, so that the root of the semiconductor pins is located between the first vertical correction mold base and the second vertical correction mold base. The eccentric wheel motor of the vertical correction mechanism is used to drive the first vertical correction mold base and the second vertical correction mold base to move back and forth in the vertical direction.

3. The pin correction device according to claim 1, characterized in that, include: Lateral correction mechanism; The mold for the lateral straightening mechanism includes: a lateral straightening mold base; The lateral straightening mold base is provided with a second straightening cavity for accommodating semiconductor pins, and the lateral dimension of the second straightening cavity matches the lateral dimension of the bent portion of the semiconductor pin. The eccentric wheel motor of the lateral straightening mechanism is used to drive the lateral straightening mold base to move back and forth in the lateral direction.

4. The pin correction device according to claim 1, characterized in that, include: Longitudinal correction mechanism; The mold for the longitudinal straightening mechanism includes: a longitudinal straightening mold base; The longitudinal straightening mold base is provided with a third straightening cavity for accommodating semiconductor pins, and the longitudinal dimension of the third straightening cavity matches the longitudinal dimension of the bent portion of the semiconductor pin. The eccentric wheel motor of the longitudinal straightening mechanism is used to drive the longitudinal straightening mold base to move back and forth in the longitudinal direction.

5. A pin correction device according to claim 3 or 4, characterized in that, The mold base includes two rows of correction cavities, the positions of which are matched with the two rows of bent portions of the semiconductor pins.

6. The pin correction device according to claim 1, characterized in that, include: The system includes a moving mechanism, multiple suction cup mechanisms, multiple positioning mechanisms, and multiple correction mechanisms. The positioning mechanism includes: a lower positioning mold base and an upper positioning mold base. A plurality of the lower positioning mold bases are distributed along the longitudinal direction. The suction cup mechanism and the upper positioning mold base are mounted on the moving mechanism. A upper positioning mold base is provided between every two suction cup mechanisms. The suction cup mechanism and the upper positioning mold base are located above the lower positioning mold base. Multiple correction mechanisms are correspondingly disposed on one side of multiple positioning lower mold bases; The moving mechanism is used to drive the positioning upper mold base and the suction cup mechanism to move in the vertical and longitudinal directions.

7. The pin correction device according to claim 6, characterized in that, include: It has four suction cup mechanisms, three positioning mechanisms, and three correction mechanisms.

8. The pin correction device according to claim 6, characterized in that, The moving mechanism is a two-axis moving mechanism.

9. The pin correction device according to claim 1, characterized in that, The positioning mechanism includes: a lower positioning mold base, an upper positioning mold base, and a lifting power component; The upper positioning mold base is installed on the lifting power component, and the upper positioning mold base is located above the lower positioning mold base; The upper positioning mold base and the lower positioning mold base are provided with a main body receiving cavity; During operation, the lower positioning mold base and the upper positioning mold base close together to house the semiconductor body within the body housing cavity.

10. A pin correction device according to any one of claims 6-9, characterized in that, The upper positioning mold base and the lower positioning mold base are provided with pin clamping parts, which cooperate with the root of the semiconductor pin; During operation, the lower positioning mold and the upper positioning mold close together to clamp the root of the semiconductor pin with the pin clamping part.

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