Shearing device for semiconductor component production

Abstract

The utility model discloses a shearing device for semiconductor component production, which belongs to the technical field of semiconductor component production, and comprises an equipment plate, the upper surface of the equipment plate is fixedly connected with a working plate, the outer wall of the working plate is fixedly connected with a motor, and the output end of the motor is fixedly connected with a connecting shaft; the surface of the working plate is fixedly connected with a long rod, and the interior of the long rod is movably connected with a laser cutting head through an electric sliding rail. When the shearing device for semiconductor component production works, a workpiece is clamped on the placing plate, the workpiece is clamped through the limiting stopper, then the laser cutting head is controlled through the long rod and the electric sliding rail, cutting of the workpiece is completed, meanwhile, the placing plate can be driven to move through the motor, the cutting process is more flexible, and the cutting efficiency is improved. And in addition, the main suction head and the auxiliary suction head are arranged, so that smoke in the machining process can be treated, the working environment is guaranteed, and the safety is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor component manufacturing technology, specifically a shearing device for semiconductor component manufacturing. Background Technology

[0002] Semiconductors are core components in the field of electronic information, used in devices such as microprocessors, memory chips, and logic chips. Semiconductor components include wafers, lead frames, and packages. During the production of lead frames, they need to be cut. For example, a lead frame cutting device with application number 202322848728.7 has a movable laser cutter on the upper surface of the connecting plate during operation, which can cut lead frames of different sizes. At the same time, the use of laser cutter to cut the lead frame effectively avoids deformation during the cutting process, ensures the quality of the lead frame, and facilitates subsequent processing and use.

[0003] During laser cutting, fumes are generated, which can have negative effects on the human body. The laser cutting machine mentioned in the above application does not have a fume treatment structure during use. These fumes not only have a strong odor but also affect the health of workers. Therefore, we propose a shearing device for semiconductor component manufacturing to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of this invention is to provide a shearing device for the production of semiconductor components, in order to solve the problem mentioned in the background art that the device does not have a structure for treating fumes during use, and that the fumes not only have a strong odor but also affect the health of the workers.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a shearing device for semiconductor component production, comprising a device plate, a working plate fixedly connected to the upper surface of the device plate, a motor fixedly connected to the outer wall of the working plate, and a connecting shaft fixedly connected to the output end of the motor; a long rod fixedly connected to the surface of the working plate, and a laser cutting head movably connected to the inside of the long rod via an electric slide rail; a placement plate threadedly connected to the surface of the connecting shaft, and a limiter provided on the upper surface of the placement plate; an outer plate fixedly connected to the surface of the working plate, and an adsorption plate rotatably disposed inside the outer plate, and main suction heads fixedly connected at equal intervals on the surface of the adsorption plate; a column fixedly connected to the upper surface of the device plate, and an auxiliary suction head fixedly connected to the end of the column.

[0006] Preferably, a limiting rod is fixedly connected to the surface of the working plate, and the limiting rod passes through the interior of the placement plate, and the placement plate and the limiting rod are slidably connected.

[0007] Preferably, the working plate is provided with an inner shaft for rotation, and the inner shaft is connected to the connecting shaft via a pulley.

[0008] Preferably, a cam is fixedly connected to the surface of the inner shaft, and a positioning rod is fixedly connected to the surface of the work plate.

[0009] Preferably, a rack is fixedly connected to the lower surface of the placement plate, and the rack is symmetrically distributed on both sides of the placement plate.

[0010] Preferably, a column is rotatably connected to the upper surface of the equipment plate, and a gear is fixedly connected to the surface of the column, with each gear corresponding to a rack.

[0011] Preferably, the rack and the gear are meshed together, and a working pipe is fixedly connected to the upper surface of the adsorption plate and the upper surface of the auxiliary suction head. The working pipe is connected to the input end of the external flue gas treatment device through an external flexible hose.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the shearing device for producing semiconductor components adopts a novel structural design, the specific details of which are as follows:

[0013] (1) The shearing device for semiconductor component production clamps the workpiece on the placement plate during operation. The workpiece is clamped by the limiter. Then, the laser cutting head is controlled by the long rod and electric slide rail to complete the cutting of the workpiece. At the same time, the placement plate can be moved by the motor, making the cutting process more flexible. In addition, a main suction head and an auxiliary suction head are set up to treat the fumes during the processing, ensuring the working environment and improving safety.

[0014] Furthermore, when the main suction head is working, the inner shaft rotates inside the working plate under the action of the connecting shaft and the pulley. At this time, the inner shaft will intermittently push the adsorption plate through the cam, so that the adsorption plate is in a state of intermittent rotation. At this time, the working range of the adsorption plate and the main suction head increases, which can better treat the flue gas.

[0015] Furthermore, when the adsorption plate is not pushed by the cam, it will rotate under its own gravity. At this time, the positioning rod plays a role in limiting the rotation angle of the adsorption plate, thus ensuring stability.

[0016] (2) The shearing device for semiconductor component production will drive the rack to move synchronously during the movement of the placement plate. When the rack moves to mesh with the gear, the column rotates inside the equipment plate under the action of the gear and the rack. At this time, the column drives the auxiliary suction head to rotate, thereby increasing the working range of the auxiliary suction head, making it more flexible and wider in the working range.

[0017] (3) When the main suction head and the auxiliary suction head of the shearing device for the production of semiconductor components are working, the flue gas is discharged through the working pipe and absorbed and treated by the external flue gas treatment device, which ensures the cleanliness of the air around the equipment board, thereby improving safety and ensuring the health of the staff. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the connection structure between the equipment plate and the work plate of this utility model;

[0019] Figure 2 This is a schematic diagram of the connection structure between the working plate and the motor of this utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the placement plate and the limiter of this utility model;

[0021] Figure 4 This is a schematic diagram of the main suction head distribution structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the working structure of the adsorption plate and main suction head of this utility model;

[0023] Figure 6 This is a schematic diagram of the connection structure between the column and the auxiliary suction head of this utility model;

[0024] Figure 7 This is a schematic diagram of the working structure of the auxiliary suction head of this utility model.

[0025] In the diagram: 1. Equipment plate; 2. Working plate; 3. Motor; 4. Long rod; 5. Laser cutting head; 6. Connecting shaft; 7. Limiting rod; 8. Placement plate; 9. Inner shaft; 10. Limiter; 11. Cam; 12. Adsorption plate; 13. Main suction head; 14. Outer plate; 15. Positioning rod; 16. Rack; 17. Column; 18. Gear; 19. Auxiliary suction head; 20. Working tube. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-7 The present invention provides the following technical solution: a shearing device for the production of semiconductor components.

[0028] Example 1: The placement plate 8 and limiter 10 can quickly clamp the workpiece, and the laser cutting head 5 can quickly cut the workpiece. Figures 1-3 As shown, the device includes a device plate 1, a working plate 2 fixedly connected to the upper surface of the device plate 1, a motor 3 fixedly connected to the outer wall of the working plate 2, and a connecting shaft 6 fixedly connected to the output end of the motor 3; a long rod 4 fixedly connected to the surface of the working plate 2, and a laser cutting head 5 movably connected to the inside of the long rod 4 via an electric slide rail; a placement plate 8 threadedly connected to the surface of the connecting shaft 6, and a limiter 10 provided on the upper surface of the placement plate 8; a limit rod 7 fixedly connected to the surface of the working plate 2, and the limit rod 7 penetrates the interior of the placement plate 8, and the placement plate 8 and the limit rod 7 are slidably connected.

[0029] During operation, the workpiece is placed on the placement plate 8 and clamped by the limiter 10. Then, the laser cutting head 5 is moved by the electric slide rail inside the long rod 4 to cut the workpiece. The workflow is quick and convenient, and the work efficiency is high.

[0030] Example 2: Unlike Example 1, the adsorption plate 12 and main suction head 13 can quickly remove smoke, and the adsorption plate 12 and main suction head 13 are in a swinging state, resulting in a wider working range and higher working efficiency. Figure 4 and Figure 5 As shown, an outer plate 14 is fixedly connected to the surface of the working plate 2, and an adsorption plate 12 is rotatably arranged inside the outer plate 14. The main suction head 13 is fixedly connected to the surface of the adsorption plate 12 at equal intervals. An inner shaft 9 is rotatably arranged inside the working plate 2, and the inner shaft 9 is connected to the connecting shaft 6 through a pulley. A cam 11 is fixedly connected to the surface of the inner shaft 9, and a positioning rod 15 is fixedly connected to the surface of the working plate 2.

[0031] A column 17 is fixedly connected to the upper surface of the equipment plate 1, and an auxiliary suction head 19 is fixedly connected to the end of the column 17.

[0032] When the main suction head 13 is working, the inner shaft 9 rotates inside the working plate 2 under the action of the connecting shaft 6 and the pulley. At this time, the inner shaft 9 will intermittently push the adsorption plate 12 through the cam 11. When the adsorption plate 12 is pushed, the adsorption plate 12 rotates inside the outer plate 14. When the inner shaft 9 and the cam 11 continue to rotate until they no longer push the adsorption plate 12, the adsorption plate 12 rotates under its own gravity. That is, the adsorption plate 12 and the main suction head 13 are in a state of intermittent rotation. At this time, the working range of the adsorption plate 12 and the main suction head 13 increases, which can better treat the flue gas.

[0033] Example 3: Unlike Example 2, a secondary suction head 19 is provided to assist in processing the smoke. Furthermore, the secondary suction head 19 is in an oscillating state, which allows for better smoke processing. Figure 6 and Figure 7 As shown, a rack 16 is fixedly connected to the lower surface of the placement plate 8, and the rack 16 is symmetrically distributed on both sides of the placement plate 8. A column 17 is rotatably connected to the upper surface of the equipment plate 1, and a gear 18 is fixedly connected to the surface of the column 17. The gear 18 corresponds one-to-one with the rack 16, and the rack 16 and the gear 18 are meshed. A working pipe 20 is fixedly connected to the upper surface of the adsorption plate 12 and the upper surface of the auxiliary suction head 19, and the working pipe 20 is connected to the input end of the external flue gas treatment device through an external flexible hose.

[0034] During the movement of the placement plate 8, the rack 16 moves synchronously. When the rack 16 engages with the gear 18, the column 17 rotates inside the equipment plate 1 under the action of the gear 18 and the rack 16. At this time, the column 17 drives the auxiliary suction head 19 to rotate. That is, during the movement and return of the placement plate 8, the auxiliary suction head 19 is in a swinging state. At this time, the working range of the auxiliary suction head 19 is increased, and its flexibility is better and its working range is wider. When the main suction head 13 and the auxiliary suction head 19 are working, the flue gas is discharged through the working pipe 20 and absorbed and treated by the external flue gas treatment device, ensuring the cleanliness of the air around the equipment plate 1, thereby improving safety and ensuring the health of the staff.

[0035] The above is the entire working process of the device, and all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A shearing device for manufacturing semiconductor components, comprising a device plate (1), a working plate (2) fixedly connected to the upper surface of the device plate (1), a motor (3) fixedly connected to the outer wall of the working plate (2), and a connecting shaft (6) fixedly connected to the output end of the motor (3); Its features are: The surface of the work plate (2) is fixedly connected to a long rod (4), and the inside of the long rod (4) is movably connected to a laser cutting head (5) via an electric slide rail; The surface of the connecting shaft (6) is threadedly connected to the placement plate (8), and the upper surface of the placement plate (8) is provided with a limiter (10); The working plate (2) is fixedly connected to an outer plate (14), and an adsorption plate (12) is rotatably arranged inside the outer plate (14), and a main suction head (13) is fixedly connected to the surface of the adsorption plate (12) at equal intervals. A column (17) is fixedly connected to the upper surface of the equipment plate (1), and a secondary suction head (19) is fixedly connected to the end of the column (17).

2. The shearing device for manufacturing semiconductor components according to claim 1, characterized in that: A limiting rod (7) is fixedly connected to the surface of the working plate (2), and the limiting rod (7) passes through the interior of the placement plate (8), and the placement plate (8) and the limiting rod (7) are slidably connected.

3. The shearing device for manufacturing semiconductor components according to claim 1, characterized in that: The working plate (2) is provided with an inner shaft (9) for rotation, and the inner shaft (9) is connected to the connecting shaft (6) by a pulley.

4. The shearing device for manufacturing semiconductor components according to claim 3, characterized in that: A cam (11) is fixedly connected to the surface of the inner shaft (9), and a positioning rod (15) is fixedly connected to the surface of the working plate (2).

5. A shearing device for manufacturing semiconductor components according to claim 1, characterized in that: A rack (16) is fixedly connected to the lower surface of the placement plate (8), and the rack (16) is symmetrically distributed on both sides of the placement plate (8).

6. A shearing device for manufacturing semiconductor components according to claim 5, characterized in that: The upper surface of the equipment plate (1) is rotatably connected to a column (17), and a gear (18) is fixedly connected to the surface of the column (17), and the gear (18) corresponds one-to-one with the rack (16).

7. A shearing device for manufacturing semiconductor components according to claim 6, characterized in that: The rack (16) and the gear (18) are meshed together. The upper surface of the adsorption plate (12) and the upper surface of the auxiliary suction head (19) are both fixedly connected with working pipes (20), and the working pipes (20) are connected to the input end of the external flue gas treatment device through an external hose.

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