Panel type plastic packaging mold with adjustable packaging thickness

Abstract

The utility model discloses a panel type plastic package mold with adjustable packaging thickness, which belongs to the field of plastic package molds and comprises a body mechanism, a connecting mechanism is mounted at the outer end of the body mechanism, an adjusting mechanism is movably connected to the bottom end of the body mechanism, the adjusting mechanism comprises an auxiliary closing mold, and the auxiliary closing mold is movably connected with the connecting mechanism. The auxiliary closing mold is movably connected to the bottom end of the body mechanism, mounting frames are mounted at the two ends of the auxiliary closing mold, and positioning rods are slidably connected to the inner ends of the mounting frames; by designing the auxiliary mold closing sleeve matched with the shape of the upper mold assembly to be arranged outside the mold base, the upper mold assembly can adjust the distance between the upper mold assembly and the lower mold assembly of the mold, the final packaging thickness is determined by the size of a mold gap, and a pair of positioning rods are pulled to be matched with the mold base. Therefore, the auxiliary closing mold can be conveniently assembled and disassembled, the packaging thickness adjusting effect of the panel type plastic packaging mold is improved, and the practicability of the panel type plastic packaging mold is improved.

Description

Technical Field

[0001] This utility model relates to the field of plastic encapsulation molds, and in particular to a panel-type plastic encapsulation mold with adjustable encapsulation thickness. Background Technology

[0002] Panel-type molding is a type of mold used for packaging electronic components. The main function of panel-type molding is to encapsulate and protect the electronic components to be packaged through heating, pressurization, and the injection of plastic materials, forming a robust plastic shell, thereby improving the performance of the components.

[0003] Existing panel-type molding compounds have certain drawbacks. First, most panel-type molding compounds have a relatively simple structure and cannot adjust the encapsulation thickness according to the needs of the components being manufactured. This reduces the practicality of panel-type molding compounds and affects their performance. Therefore, we propose a panel-type molding compound with adjustable encapsulation thickness. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide a panel-type plastic sealing mold with adjustable encapsulation thickness. By setting auxiliary mold closing and positioning rods, the auxiliary mold closing sleeve, which is designed to match the shape of the upper mold assembly, is fitted outside its mold base. This allows the upper mold assembly to adjust the distance between the upper mold assembly and the lower mold assembly. This structure controls the thickness of the plastic seal by adjusting the mold closing gap between the upper and lower molds. A smaller mold gap results in a thinner encapsulation, while a larger mold gap results in a thicker encapsulation. The size of the mold gap determines the final encapsulation thickness. Furthermore, when this adjustable structure needs adjustment or disassembly, simply pulling a pair of positioning rods will cause the positioning rods to contact and fix with the main body mechanism, allowing the auxiliary mold closing to be easily assembled and disassembled. This improves the encapsulation thickness adjustment effect of the panel-type plastic sealing mold and increases its practicality.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] A panel-type plastic encapsulation mold with adjustable encapsulation thickness includes a main body mechanism, a connecting mechanism installed at the outer end of the main body mechanism, and an adjusting mechanism movably connected to the bottom end of the main body mechanism.

[0007] The adjustment mechanism includes an auxiliary mold closing mechanism, which is movably connected to the bottom end of the main body mechanism. Both ends of the auxiliary mold closing mechanism are equipped with mounting brackets, and the inner ends of the mounting brackets are slidably connected with positioning rods. The positioning rods are T-shaped, and the outer ends of the positioning rods are fitted with reset rings. The top end of the positioning rods is equipped with positioning blocks, and the inner ends of the positioning blocks are movably connected with locking heads.

[0008] By installing auxiliary mold closing and positioning rods, the sealing thickness adjustment effect of this panel-type plastic sealing mold can be improved, thus increasing the practicality of the panel-type plastic sealing mold.

[0009] Furthermore, the card heads are symmetrically distributed, and each card head has an adjustment component installed at its outer end.

[0010] By installing a clamping head, the connection and installation between the auxiliary mold closing mechanism and the mounting bracket and the main body mechanism can be made more stable.

[0011] Furthermore, the outer end of the adjustment component is provided with a guide groove, which is located at the inner end of the main body mechanism.

[0012] By installing adjustment components and guide slots, the positioning of the chuck head can be adjusted more conveniently and offset can be avoided.

[0013] Furthermore, a connecting ring is movably connected to the outer side of the reset ring, the connecting ring being located at the outer end of the positioning rod, and the outer end of the connecting ring having a movable groove.

[0014] By installing the movable groove, the movable groove can restrict and guide the moving connecting ring and positioning rod, thus allowing the positioning rod to be adjusted to prevent it from shifting or falling off.

[0015] Furthermore, the main body mechanism includes a connecting seat, a lower mold assembly is mounted on the upper end of the connecting seat, an upper mold assembly is movably connected to the outer side of the lower mold assembly, and a mold cavity is mounted on the inner end of the lower mold assembly.

[0016] By installing the connector, the lower mold assembly can be made to operate stably.

[0017] Furthermore, a support frame is movably connected above the upper mold assembly, a cylinder is installed at the top of the support frame, and a guide frame is installed at the transmission end of the cylinder.

[0018] By installing guide frames, the upper mold assembly can be moved and adjusted more stably.

[0019] Furthermore, a feeding pipe is installed at the upper end of the connecting seat, a transmission component is fixedly connected to the outer end of the feeding pipe, a measuring cylinder is connected to the other end of the transmission component away from the feeding pipe, and a weight sensor is installed at the top of the measuring cylinder.

[0020] The ease of adjusting the encapsulation thickness of this panel-type molding die is further improved by installing a measuring cylinder and a weight sensor.

[0021] Furthermore, a connecting pipe is fixedly connected to the outer end of the measuring cylinder.

[0022] By installing connecting pipes, it is easy to connect to the injection-molded structure.

[0023] In summary, this utility model has the following beneficial effects:

[0024] 1. By setting auxiliary mold closing and positioning rods, an auxiliary mold closing sleeve that matches the shape of the upper mold assembly is designed and installed outside its mold base. This allows the upper mold assembly to adjust the distance between the upper mold assembly and the lower mold assembly. This structure controls the thickness of the plastic seal by adjusting the mold closing gap between the upper and lower molds. A smaller mold gap results in a thinner seal, while a larger mold gap results in a thicker seal. The size of the mold gap determines the final seal thickness. Furthermore, when this adjustable structure needs adjustment or disassembly, simply pull a pair of positioning rods. The positioning rods will then contact and fix the main body mechanism, allowing the auxiliary mold closing to be easily assembled and disassembled. This improves the seal thickness adjustment effect of the panel-type plastic seal mold and increases its practicality.

[0025] 2. By setting a clamping head with an arc-shaped structure, the clamping head can engage with the positioning block, making the connection and installation between the auxiliary mold closing and mounting frame and the main body mechanism more stable;

[0026] 3. By setting up a measuring cylinder and a weight sensor, the measuring cylinder is equipped with a scale on the outside, which allows for convenient observation of the transmitted injection molding material. During material feeding, the weight sensor detects the weight of the measuring cylinder, making the injection molding process more accurate. This allows for adjustment of the injection volume to achieve the desired thickness. By adjusting the amount of plastic filling in the injection molding machine, the encapsulation thickness can be adjusted, further improving the convenience of adjusting the encapsulation thickness of this panel-type encapsulation mold. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure in this embodiment;

[0028] Figure 2 This is a schematic diagram of the plane structure of the adjustment mechanism in this embodiment;

[0029] Figure 3 This is in this embodiment Figure 2 Enlarged structural diagram of the plane at point A in the middle;

[0030] Figure 4 This is in this embodiment Figure 2 A magnified structural diagram of the plane at point B in the middle;

[0031] Figure 5 This is a three-dimensional exploded structural diagram of the connecting mechanism in this embodiment.

[0032] In the diagram, 1. Main body mechanism; 101. Connecting seat; 102. Lower mold assembly; 103. Upper mold assembly; 104. Mold cavity; 105. Support frame; 106. Cylinder; 107. Guide frame; 2. Connecting mechanism; 201. Material conveying pipe; 202. Transmission assembly; 203. Measuring cylinder; 204. Weight sensor; 205. Connecting pipe; 3. Adjusting mechanism; 301. Auxiliary mold closing; 302. Mounting frame; 303. Positioning rod; 304. Reset ring; 305. Positioning block; 306. Clamp; 307. Adjusting assembly; 308. Guide groove; 309. Connecting ring; 310. Movable groove. Detailed Implementation

[0033] The present invention will be further described in detail below with reference to the accompanying drawings.

[0034] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0035] Reference Figure 1-5 As shown, this is a panel-type plastic encapsulation mold with adjustable encapsulation thickness in a preferred embodiment of the present invention, including a main body mechanism 1, a connecting mechanism 2 installed at the outer end of the main body mechanism 1, and an adjusting mechanism 3 movably connected to the bottom end of the main body mechanism 1.

[0036] The adjustment mechanism 3 includes an auxiliary mold closing 301, which is movably connected to the bottom of the main body mechanism 1. Both ends of the auxiliary mold closing 301 are equipped with mounting brackets 302. The inner ends of the mounting brackets 302 are slidably connected with positioning rods 303. The positioning rods 303 have a T-shaped structure. The outer ends of the positioning rods 303 are fitted with reset rings 304. The top end of the positioning rods 303 is equipped with positioning blocks 305. The inner ends of the positioning blocks 305 are movably connected with clips 306.

[0037] Reference Figure 2-4 As shown, the card heads 306 are symmetrically distributed, and each of the outer ends of the card heads 306 is equipped with an adjustment component 307.

[0038] Reference Figure 4 As shown, the outer end of the adjustment component 307 is provided with a guide groove 308, which is located at the inner end of the main body mechanism 1.

[0039] Reference Figure 2-3 As shown, a connecting ring 309 is movably connected to the outer side of the reset ring 304. The connecting ring 309 is located at the outer end of the positioning rod 303, and a movable groove 310 is provided at the outer end of the connecting ring 309.

[0040] By installing the auxiliary mold closing 301 and positioning rods 303, the auxiliary mold closing 301, designed to fit the shape of the upper mold assembly 103, is fitted onto the outside of its mold base. This allows the upper mold assembly 103 to adjust the distance between the upper mold assembly 103 and the lower mold assembly 102. This structure controls the thickness of the encapsulation by adjusting the mold closing gap between the upper and lower molds. A smaller mold gap results in a thinner encapsulation, while a larger mold gap results in a thicker encapsulation. The size of the mold gap determines the final encapsulation thickness. Furthermore, this adjustable structure can be adjusted and disassembled simply by pulling a pair of positioning rods 303, which then engage with the main body mechanism. The contact fixation between the two parts allows for easy assembly and disassembly of the auxiliary mold closing 301. When the auxiliary mold closing 301 is installed, the clamping head 306 has an arc-shaped structure and can engage with the positioning block 305. The adjusting component 307 consists of a guide connecting rod and a sleeved elastic element, which allows for easy position adjustment of the connected clamping head 306 so that it can easily engage and disengage with the positioning block 305. During the positioning process, the guide groove 308 can guide the adjusting component 307, making it easier to adjust and position the clamping head 306 and avoid deviation, thus improving the packaging thickness adjustment effect of the panel-type plastic sealing mold.

[0041] Reference Figure 1 As shown, the main body mechanism 1 includes a connecting seat 101, a lower mold assembly 102 is mounted on the upper end of the connecting seat 101, an upper mold assembly 103 is movably connected to the outer side of the lower mold assembly 102, and a mold cavity 104 is mounted on the inner end of the lower mold assembly 102.

[0042] Reference Figure 1 As shown, a support frame 105 is movably connected above the upper mold assembly 103, a cylinder 106 is installed at the top of the support frame 105, and a guide frame 107 is installed at the transmission end of the cylinder 106.

[0043] The lower mold assembly 102 can be supported at the outer end by the mounting bracket 101, making the lower mold assembly 102 stable in operation. The guide frame 107 is composed of a slide rod and a slide, and the guide frame 107 can form a support structure at the outer end of the upper mold assembly 103, making the upper mold assembly 103 more stable when it is moved and adjusted.

[0044] Reference Figure 1 and Figure 5 As shown, a material conveying pipe 201 is installed on the upper end of the connecting seat 101. A transmission component 202 is fixedly connected to the outer end of the material conveying pipe 201. A measuring cylinder 203 is connected to the other end of the transmission component 202 away from the material conveying pipe 201. A weight sensor 204 is installed on the top of the measuring cylinder 203.

[0045] Reference Figure 5 As shown, a connecting pipe 205 is fixedly connected to the outer end of the measuring cylinder 203.

[0046] The measuring cylinder 203 has a scale on its outside, which allows for convenient observation of the transmitted injection molding material. During material feeding, the weight sensor 204 senses the weight of the measuring cylinder 203, making the injection molding process more precise. This allows for adjustment of the injection volume to control the thickness, and the encapsulation thickness can be adjusted by regulating the amount of plastic filling in the injection molding machine.

[0047] Specific implementation process: When using this device, firstly, the auxiliary mold closing 301 is installed or removed according to the encapsulation thickness. The auxiliary mold closing 301 is snapped onto the outer end of the upper mold assembly 103. The clamping head 306 has an arc-shaped structure and can be snapped onto the positioning block 305. The adjusting assembly 307 consists of a guide connecting rod and a sleeved elastic element, which allows the connected clamping head 306 to be easily adjusted in position so that it can be easily snapped onto and separated from the positioning block 305. In addition, during the positioning process, the guide groove 308 can adjust the adjusting assembly 307. By guiding the mold, the adjustment and positioning of the card head 306 becomes more convenient. After positioning, the auxiliary mold closing 301, which is designed to match the shape of the upper mold assembly 103, is fitted outside its mold base. This allows the upper mold assembly 103 to adjust the distance between the upper mold assembly 103 and the lower mold assembly 102. This structure controls the thickness of the encapsulation by adjusting the mold closing gap between the upper and lower molds. A smaller mold gap results in a thinner encapsulation, while a larger mold gap results in a thicker encapsulation. The size of the mold gap determines the final encapsulation thickness.

[0048] When disassembly is required, a pair of positioning rods 303 are pulled, and the positioning rods 303 are fixed and restricted to the main body mechanism 1, which allows the auxiliary mold closing 301 to be easily assembled and disassembled, improving the packaging thickness adjustment effect of the panel-type plastic sealing mold.

[0049] Finally, the injection molding machine performs the injection molding operation. The feed pipe 201 connected to the injection molding machine transmits the injection molding material. The measuring cylinder 203 is equipped with a scale on the outside, which allows for convenient observation of the transmitted injection molding material. During material feeding, the weight sensor 204 senses the weight of the measuring cylinder 203, thereby making the device more accurate during the injection molding operation, so as to achieve the injection volume for adjusting the thickness. By adjusting the plastic filling amount of the injection molding machine, the encapsulation thickness can be adjusted, further improving the convenience of adjusting the encapsulation thickness of this panel-type encapsulation mold.

[0050] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A panel-type molding die with adjustable encapsulation thickness, characterized in that: It includes a main body mechanism (1), a connecting mechanism (2) is installed at the outer end of the main body mechanism (1), and an adjusting mechanism (3) is movably connected to the bottom end of the main body mechanism (1); The adjustment mechanism (3) includes an auxiliary mold closing mechanism (301), which is movably connected to the bottom end of the main body mechanism (1). Both ends of the auxiliary mold closing mechanism (301) are equipped with mounting brackets (302). The inner ends of the mounting brackets (302) are slidably connected with positioning rods (303). The positioning rods (303) are T-shaped. The outer end of the positioning rods (303) is fitted with a reset ring (304). The top end of the positioning rods (303) is equipped with a positioning block (305). The inner end of the positioning block (305) is movably connected with a locking head (306).

2. The panel-type molding die with adjustable encapsulation thickness according to claim 1, characterized in that: The card heads (306) are symmetrically distributed, and each card head (306) is equipped with an adjustment component (307) at its outer end.

3. The panel-type molding die with adjustable encapsulation thickness according to claim 2, characterized in that: The outer end of the adjustment component (307) is provided with a guide groove (308), which is located at the inner end of the main body mechanism (1).

4. The panel-type molding die with adjustable encapsulation thickness according to claim 1, characterized in that: A connecting ring (309) is movably connected to the outer side of the reset ring (304). The connecting ring (309) is located at the outer end of the positioning rod (303), and a movable groove (310) is provided at the outer end of the connecting ring (309).

5. A panel-type molding die with adjustable encapsulation thickness according to claim 1, characterized in that: The main body mechanism (1) includes a connecting seat (101), a lower mold assembly (102) is installed on the upper end of the connecting seat (101), an upper mold assembly (103) is movably connected to the outer side of the lower mold assembly (102), and a mold cavity (104) is installed on the inner end of the lower mold assembly (102).

6. A panel-type molding die with adjustable encapsulation thickness according to claim 5, characterized in that: A support frame (105) is movably connected above the upper mold assembly (103). A cylinder (106) is installed at the top of the support frame (105), and a guide frame (107) is installed at the transmission end of the cylinder (106).

7. A panel-type molding die with adjustable encapsulation thickness according to claim 5, characterized in that: The upper end of the connecting seat (101) is equipped with a feeding pipe (201), the outer end of the feeding pipe (201) is fixedly connected to a transmission component (202), the other end of the transmission component (202) away from the feeding pipe (201) is connected to a measuring cylinder (203), and a weight sensor (204) is installed at the top of the measuring cylinder (203).

8. A panel-type molding die with adjustable encapsulation thickness according to claim 7, characterized in that: The outer end of the measuring cylinder (203) is fixedly connected to a connecting pipe (205).

Images