Chip testing device and chip testing system

Abstract

The utility model discloses a chip testing device and a chip testing system, the chip testing device comprises a testboard and a pressing block, the top surface of the testboard is provided with a groove, two opposite side walls of the groove are respectively provided with an air inlet hole and an air outlet hole, and the bottom of the groove is provided with a plurality of probes; an air blowing hole and an air exhausting hole are formed in the outer wall of the test board, the air blowing hole is communicated with the air inlet, and the air exhausting hole is communicated with the air outlet; the pressing block is detachably arranged on the top side of the test board, and a pressing part is arranged at the position, right opposite to the groove, of the bottom side of the pressing block and used for pressing the chip in the groove; an air inlet channel and an air outlet channel are formed in the pressing block, the air inlet channel communicates with the air blowing hole, and the air outlet channel communicates with the air exhaust hole. According to the technical scheme of the utility model, the yield of chip testing is improved, and the productivity of chips is further ensured.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, and in particular to a chip testing device and a chip testing system. Background Technology

[0002] With the development of semiconductor chip testing technology, the testing content and requirements have also increased, placing higher demands on the corresponding equipment. Currently, test sockets are cleaned manually. However, due to the large number of test sockets and the fact that they may be designed inside the equipment, manual cleaning is very difficult. Manual cleaning also cannot remove contaminants from the test sockets in time, leading to contaminant residue. Test contamination can cause a significant drop in test yield and even affect production capacity. Utility Model Content

[0003] This invention provides a chip testing device and a chip testing system, aiming to solve the problem of testing contamination, thereby improving the yield of chip testing and ensuring chip production capacity.

[0004] To achieve the above objectives, the chip testing device proposed in this utility model includes a testing platform and a pressure block. The top surface of the testing platform is provided with a groove, and the two opposite side walls of the groove are respectively provided with an air inlet and an air outlet. The bottom of the groove is provided with multiple probes. The outer wall of the testing platform is provided with an air blowing hole and an air extraction hole. The air blowing hole is connected to the air inlet, and the air extraction hole is connected to the air outlet.

[0005] The pressure block is detachably disposed on the top side of the test stage, and the bottom side of the pressure block is provided with a holding part opposite to the groove for holding the chip in the groove;

[0006] The pressure block is provided with an air inlet channel and an air outlet channel. The air inlet channel is connected to the air blowing hole, and the air outlet channel is connected to the air extraction hole.

[0007] In some embodiments, the air inlet and the air outlet are both strip-shaped holes extending along the first surface, with the air inlet and the air outlet facing each other.

[0008] In some embodiments, the test bench includes a support block, and the test bench is provided with a first airflow channel and a second airflow channel. The blowing hole is connected to the air inlet through the first airflow channel, and the suction hole is connected to the air outlet through the second airflow channel.

[0009] In some embodiments, the first airflow channel extends adjacent to and along the air inlet that it communicates with, and the second airflow channel extends adjacent to and along the air outlet that it communicates with, with the inner end of the air inlet penetrating the sidewall of the first airflow channel and the inner end of the air outlet penetrating the sidewall of the second airflow channel.

[0010] In some embodiments, the test bench further includes a mounting block, the test bench includes a support block and a mounting block, the support block is located between the pressure block and the mounting block, the groove is provided on the top surface of the support block, the bottom of the groove is provided with at least one through hole for a probe to pass through, the through hole is located directly below the area between the air inlet and the air outlet; the mounting block is located below the support block, the top side of the mounting block is provided with a plurality of probes passing through the through holes; the top tip of the probe is lower than the air inlet.

[0011] In some embodiments, the mounting block and the bearing block are restricted from moving relative to each other in the horizontal direction by a positioning structure, and the mounting block and the bearing block are locked together by a plurality of screws;

[0012] The positioning structure includes multiple positioning posts and multiple positioning holes, one of which is located on the top side of the mounting block and the other is located on the bottom side of the bearing block.

[0013] In some embodiments, the test bench further includes a base located below the mounting block, the mounting block being mounted on the base.

[0014] In some embodiments, the section of the groove near its opening is a guide section, and the cross-sectional area of ​​the guide section gradually decreases from top to bottom.

[0015] In some embodiments, the blowing hole and the suction hole are located on the top surface of the test platform, the first end of the air inlet channel and the first end of the air outlet channel are both located on the bottom surface of the pressure block, the first end of the air inlet channel is connected to the blowing hole through a sealing joint, and the first end of the air outlet channel is connected to the suction hole through a sealing joint.

[0016] The chip testing system proposed in this utility model includes an air blowing device, an air extraction device, and the chip testing device described in the above embodiments. The air blowing device is connected to the air inlet channel through an air pipe, and the air extraction device is connected to the air outlet channel through another air pipe.

[0017] The technical solution of this chip testing device involves setting a pressure block above the test stage. During chip testing, the pressing part of the pressure block can press the chip in the groove of the test stage, ensuring full contact between the chip and the probe at the bottom of the groove to avoid insufficient chip testing due to insufficient chip and probe contact. Furthermore, by setting air inlet and outlet holes on two opposite sidewalls of the groove of the test stage, an air inlet channel communicating with the air blowing hole and an air outlet channel communicating with the air extraction hole are provided inside the pressure block, and an air blowing hole communicating with the air inlet and an air extraction hole communicating with the air outlet are provided on the outer wall of the support block. This allows compressed gas to be blown into the groove through the air inlet channel and air blowing hole, while air is simultaneously extracted into the groove through the air outlet channel and air extraction hole, forming a high-speed airflow layer between the air inlet and outlet holes. This effectively removes contaminants from the groove and the probes penetrating the through holes, and allows contaminants to fall from above the groove into the groove or onto the probes. This effectively prevents contaminants from affecting the chip testing yield, improves the testing yield, and thus ensures chip production capacity. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the chip testing device in one embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the support block from one perspective in one embodiment of the present invention;

[0020] Figure 3 This is a structural schematic diagram of the support block from another perspective in one embodiment of the present invention;

[0021] Figure 4 This is a cross-sectional schematic diagram of the bearing block in one embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the pressing block from one perspective in one embodiment of the present invention;

[0023] Figure 6 This is a schematic diagram of the pressure block from another perspective in one embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the mounting block in one embodiment of the present invention. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0027] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0028] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0029] This utility model proposes a chip test socket.

[0030] Reference Figures 1-7 The chip testing device 1000 proposed in this utility model includes a testing stage 100 and a pressure block 200, wherein:

[0031] The test platform 100 in this embodiment is mainly used for testing chips. Chips can be placed on the test platform 100 for testing. The top surface of the test platform 100 is provided with a groove 11. The two opposite side walls of the groove 11 are respectively provided with an air inlet 111 and an air outlet 112. The bottom of the groove 11 is provided with multiple probes 21. That is to say, one side wall of the groove 11 is provided with an air inlet 111, and the other side wall opposite to this side wall is provided with an air outlet 112. Compressed gas can enter the groove 11 through the air inlet 111 and then leave the groove 11 through the air outlet 112.

[0032] The outer wall of the test stage 100 is provided with an air blowing hole 12 and an air extraction hole 13. The air blowing hole 12 is connected to the air inlet 111, and the air extraction hole 13 is connected to the air outlet 112. That is to say, compressed gas can be sent into the groove 11 from the air blowing hole 12 on the outside of the test stage 100. At the same time, the air extraction hole 13 can extract the gas sent into the groove 11 from the air blowing hole 12. Through the combination of air blowing and air extraction, dust and other contaminants attached to the groove 11 can be more easily removed from the groove 11, thereby avoiding contaminants remaining in the groove 11 and affecting the chip test results.

[0033] The pressure block 200 is detachably disposed on the top side of the test stage 100. The bottom side of the pressure block 200 is provided with a holding part 210 facing the groove 11, which is used to hold the chip in the groove 11. It can be understood that when performing chip testing, the holding part 210 of the pressure block 200 can hold the chip placed in the groove 11, so that the chip can fully contact the probe 21 for chip testing.

[0034] The pressure block 200 is provided with an air inlet channel 220 and an air outlet channel 230. The air inlet channel 220 is connected to the air blowing hole 12, and the air outlet channel 230 is connected to the air extraction hole 13. In this way, compressed gas can be sent from the air inlet channel 220 inside the pressure block 200 through the air blowing hole 12 to the air inlet hole 111 and into the groove 11 of the test stage 100. Then the gas can be drawn from the air outlet hole 112 to the air extraction hole 13, and then extracted through the air outlet channel 230. This allows the gas to carry away the contaminants in the groove 11 when it flows at high speed in the groove 11, thereby avoiding contaminants remaining in the groove 11 and affecting the chip test results.

[0035] In this embodiment, when the chip testing apparatus is used for chip testing, the probe 21 passes through the through hole 113 at the bottom of the groove 11, so that the tip of the probe 21 extends into the groove 11. After the chip is placed in the groove 11, the holding part 210 of the pressure block 200 can hold the chip in the groove 11 of the test stage 100, so that the chip and the probe 21 at the bottom of the groove 11 are in full contact. The air inlet channel 220 of the pressure block 200 is connected to the air blowing device, and the air outlet channel 230 of the pressure block 200 is connected to the air extraction device. In this way, the air blowing device and the air extraction device can be activated before the chip is placed in the groove 11 for testing, so that the air blowing device blows air into the air blowing hole 12 connected to the air inlet channel 220, and the air is extracted through the strip connecting the air blowing hole 12. The shaped hole 121 is inserted into the groove 11, while the air extraction device draws air into the air extraction hole 13 connected to the air outlet channel 230. Air is then drawn from the groove 11 through the air outlet 112 connected to the air extraction hole 13. This combination of blowing and extraction creates a high-speed airflow layer within the groove 11. This high-speed airflow layer carries away dust and other contaminants adhering to the groove 11 or on the probe 21 through the air outlet 112 connected to the air extraction hole 13. During this process, dust and other contaminants falling from above the groove 11 are directly carried out by the high-speed airflow layer and do not fall into the groove 11 or onto the probe 21. Therefore, it effectively prevents contaminants in the groove 11 and on the probe 21 from affecting the chip test results. When it is time to insert the chip for testing, the blowing and extraction devices are turned off, allowing the chip to be placed in the groove 11 to contact the tip of the probe for testing.

[0036] In the technical solution of the chip testing device 1000 of this utility model, a pressure block 200 is set above the test stage 100. During chip testing, the pressing part 210 of the pressure block 200 can press the chip in the groove 11 of the test stage 100, so that the chip and the probe 21 at the bottom of the groove 11 can fully contact each other to avoid insufficient chip testing due to insufficient contact between the chip and the probe 21. Furthermore, an air inlet 111 and an air outlet 112 are respectively set on two opposite side walls of the groove 11 of the test stage 100. An air inlet channel 220 communicating with the air blowing hole 12 and an air outlet channel 230 communicating with the air extraction hole 13 are set in the pressure block 200. An air inlet 12 connected to the air inlet 111 and an air outlet 13 connected to the air outlet 112 are provided on the outer wall. Compressed gas can be blown into the groove 11 through the air inlet channel 220 via the air inlet 12, and air can be drawn into the groove 11 through the air outlet channel 230 via the air outlet 13. A high-speed airflow layer is formed between the air inlet 111 and the air outlet 112, which can remove contaminants from the groove 11 and the probe 21 that passes through the through hole 113. Contaminants falling from above the groove 11 can also fall into the groove 11 or onto the probe 21, effectively preventing contaminants from affecting the chip test yield, improving the test yield, and thus ensuring the chip production capacity.

[0037] Reference Figure 2 and Figure 3 , in some embodiments, both the air inlet hole 111 and the air outlet hole 112 are strip-shaped holes extending along the first surface, and the air inlet hole 111 faces the air outlet hole 112. That is, it can be understood that when the compressed gas flows between the air inlet hole 111 and the air outlet hole 112, a high-speed gas flow layer can be formed, so that the pollutants in the groove 11 can be carried away during the gas flow, avoiding affecting the chip test results.

[0038] Refer to Figures 1-4 , in some embodiments, a first air flow channel 14 and a second air flow channel 15 are provided in the test bench 100. The air blowing hole 12 is connected to the air inlet hole 111 through the first air flow channel 14, and the air extraction hole 13 is connected to the air outlet hole 112 through the second air flow channel 15. That is, it can be understood that the air blowing hole 12 can send the compressed gas to the air inlet hole 111 through the first air flow channel 14 to enter the groove 11; the air extraction hole 13 can bring the gas in the groove 11 from the air outlet hole 112 through the second air flow channel 15 to the air extraction hole 13 to discharge the gas in the groove 11. The first air flow channel 14 and the second air flow channel 15 in this embodiment can be cylindrical.

[0039] Refer to Figures 1-4 , in some embodiments, the first air flow channel 14 extends adjacent to and along the air inlet hole 111 it is connected to, and the second air flow channel 15 extends adjacent to and along the air outlet hole 112 it is connected to. The inner end of the air inlet hole 111 penetrates the side wall of the first air flow channel 14, and the inner end of the air outlet hole 112 penetrates the side wall of the second air flow channel 15. That is, it can be known that the first air flow channel 14 and the second air flow channel 15 are arranged in the same direction as the air inlet hole 111 and the air outlet hole 112. The first air flow channel 14 can be connected to the groove 11 through the air inlet hole 111, and the second air flow channel 15 can be connected to the groove 11 through the air outlet hole 112. The air inlet hole 111 in this embodiment can be rectangular.

[0040] Refer to Figures 1-7 , in some embodiments, the test bench 100 includes a bearing block 10 and a mounting block 20. The bearing block 10 is located between the pressing block 200 and the mounting block 20. The groove 11 is provided on the top surface of the bearing block 10. At least one through hole 113 for the probe 21 to pass through is provided at the bottom of the groove 11. The through hole 113 is directly below the area between the air inlet hole 111 and the air outlet hole 112. That is, it can be understood that the area between the air inlet hole 111 and the air outlet hole 112 can cover all the through holes 113, so that the gas between the air inlet hole 111 and the air outlet hole 112 can cover all the probes 21 when flowing through the groove 11, avoiding cleaning dead corners, and thus improving the cleaning strength of the pollutants in the groove 11.

[0041] Refer to Figure 1 and Figure 7In some embodiments, the mounting block 20 is located below the support block 10. The top side of the mounting block 20 is provided with multiple probes 21 passing through through holes 113. In this embodiment, each through hole 113 corresponds to one probe 21, and the number of probes 21 is the same as the number of through holes 113. The top tip of the probe 21 is lower than the air inlet 111, so that the gas between the air inlet 111 and the air outlet 112 can cover all probes 21 when flowing through the groove 11, avoiding cleaning dead zones and thus improving the cleaning power of contaminants in the groove 11. In this example, when the chip is pressed by the holding part 210 of the pressure block 200, the top tip of the probe 21 can be able to be cushioned downwards, allowing the probe 21 to make good contact with the chip and avoiding damage to the chip or the probe 21.

[0042] Reference Figure 1 and Figure 7 In some embodiments, the mounting block 20 and the support block 10 are restricted from relative movement in the horizontal direction by a positioning structure, and the mounting block 20 and the support block 10 are locked and fixed by multiple screws, thereby preventing the installation positions of the mounting block 20 and the support block 10 from shifting. In this embodiment, the positioning structure can restrict the horizontal movement of the mounting block 20 and the support block 10 by means of a pin. In this embodiment, the pin can be located at the edge of the top side of the mounting block 20; in this embodiment, the top side of the mounting block 20 and the bottom side of the support block 10 can be provided with corresponding threaded holes to fix the mounting block 20 and the support block 10 by screws.

[0043] The positioning structure includes multiple positioning pins 22 and multiple positioning holes. One of the positioning pins 22 and the positioning holes is located on the top side of the mounting block 20, and the other is located on the bottom side of the support block 10. In this embodiment, the positioning pin 22 can be a pin. In this embodiment, the positioning pin 22 can be located on the top side of the mounting block 20, and the positioning hole can be located on the bottom side of the support block 10. In other embodiments, the positioning pin 22 can be located on the bottom side of the support block 10, and the positioning hole can be located on the top side of the mounting block 20.

[0044] Reference Figure 1 In some embodiments, the test bench 100 also includes a base 30 located below the mounting block 20, with the mounting block 20 mounted on the base 30. In this embodiment, the base 30 mainly serves a supporting function.

[0045] Reference Figure 2 and Figure 3In some embodiments, the section of the groove 11 near its opening is a guide section 114. The cross-sectional area of ​​the guide section 114 gradually decreases from the opening of the groove 11 towards the bottom. That is, it can be understood that the section of the groove 11 near the opening is an outwardly inclined surface. During the chip placement process, the guide section 114 can tolerate a larger positional error, so that the chip can complete the chip position adjustment during the sliding process and finally fall into the customized position. In this embodiment, the guide section 114 mainly serves to guide the chip when it is placed in the groove 11.

[0046] Reference Figures 1-6 In some embodiments, the blowing hole 12 and the suction hole 13 are located on the top surface of the test bench 100, and the first end of the air inlet channel 220 and the first end of the air outlet channel 230 are both located on the bottom surface of the pressure block 200. The first end of the air inlet channel 220 is connected to the blowing hole 12 through a sealing joint 240, and the first end of the air outlet channel 230 is connected to the suction hole 13 through a sealing joint 240. That is, the bottom side of the pressure block 200 is provided with two sealing joints 240 for connecting with the test bench 100. In this way, the blowing hole 12 can be connected to the air inlet channel 220 and the suction hole 13 can be connected to the air outlet channel 230. Thus, by pressing the sealing joint 240 into the blowing hole 12 and the air outlet 112, the air inlet channel 220 in the pressure block 200 can be connected to the first airflow channel 14 in the test bench 100, and the air outlet channel 230 in the pressure block 200 can be connected to the second airflow channel 15 in the test bench 100.

[0047] This invention further proposes a chip testing system.

[0048] Reference Figure 1 and Figure 5 The chip testing system proposed in this utility model includes an air blowing device, an air extraction device, and the chip testing device 1000 in the above embodiments. The specific structure of the chip testing device 1000 is as described in the above embodiments. Since this chip testing system adopts all the technical solutions of all embodiments of the chip testing device 1000, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The air blowing device is connected to the air inlet channel 220 through an air pipe 300, and the air extraction device is connected to the air outlet channel 230 through another air pipe 300. In this embodiment, the air blowing device blows compressed gas into the air inlet channel 220 through the air pipe 300, and the air extraction device draws gas from the air outlet channel 230 through the other air pipe 300, thereby cleaning the test platform 100 can be completed through the cooperation of the air blowing device and the air extraction device.

[0049] The above description is only a part or preferred embodiment of this utility model. Neither the text nor the drawings should limit the scope of protection of this utility model. All equivalent structural transformations made using the content of this utility model specification and drawings under the overall concept of this utility model, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.

Claims

1. A chip testing device, characterized in that, include: The test stand has a groove on its top surface, and an air inlet and an air outlet are respectively provided on two opposite side walls of the groove. Multiple probes are provided at the bottom of the groove. The outer wall of the test stand has an air blowing hole and an air extraction hole, with the air blowing hole communicating with the air inlet and the air extraction hole communicating with the air outlet. A pressure block is detachably disposed on the top side of the test stage, and a holding part is provided on the bottom side of the pressure block opposite the groove for holding the chip in the groove; The pressure block is provided with an air inlet channel and an air outlet channel. The air inlet channel is connected to the air blowing hole, and the air outlet channel is connected to the air extraction hole.

2. The chip testing apparatus according to claim 1, characterized in that, Both the air inlet and the air outlet are strip-shaped holes extending along the top surface, with the air inlet and the air outlet facing each other.

3. The chip testing apparatus according to claim 1, characterized in that, The test bench is provided with a first airflow channel and a second airflow channel. The blowing hole is connected to the air inlet through the first airflow channel, and the suction hole is connected to the air outlet through the second airflow channel.

4. The chip testing apparatus according to claim 3, characterized in that, The first airflow channel extends adjacent to and along the air inlet that it communicates with, and the second airflow channel extends adjacent to and along the air outlet that it communicates with, with the inner end of the air inlet penetrating the sidewall of the first airflow channel and the inner end of the air outlet penetrating the sidewall of the second airflow channel.

5. The chip testing apparatus according to claim 3, characterized in that, The test bench includes a support block and a mounting block. The support block is located between the pressure block and the mounting block. The groove is provided on the top surface of the support block, and the bottom of the groove has at least one through hole for a probe to pass through. The through hole is located directly below the area between the air inlet and the air outlet. The mounting block is located below the support block, and the top side of the mounting block has multiple probes that pass through the through holes. The top of the probe is lower than the air inlet.

6. The chip testing apparatus according to claim 5, characterized in that, The mounting block and the bearing block are restricted from moving relative to each other in the horizontal direction by a positioning structure, and the mounting block and the bearing block are locked and fixed by multiple screws; The positioning structure includes multiple positioning posts and multiple positioning holes, one of which is located on the top side of the mounting block and the other is located on the bottom side of the bearing block.

7. The chip testing apparatus according to claim 5, characterized in that, The test bench also includes a base located below the mounting block, and the mounting block is mounted on the base.

8. The chip testing apparatus according to claim 1, characterized in that, The section of the groove near its opening is a guide section, and the cross-sectional area of ​​the guide section gradually decreases from top to bottom.

9. The chip testing apparatus according to claim 1, characterized in that, The blowing hole and the suction hole are located on the top surface of the test platform. The first end of the air inlet channel and the first end of the air outlet channel are both located on the bottom surface of the pressure block. The first end of the air inlet channel is connected to the blowing hole through a sealing joint, and the first end of the air outlet channel is connected to the suction hole through a sealing joint.

10. A chip testing system, characterized in that, The device includes an air blowing device, an air extraction device, and a chip testing apparatus according to any one of claims 1-9, wherein the air blowing device is connected to the air inlet channel through an air pipe, and the air extraction device is connected to the air outlet channel through another air pipe.

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