Plug connector

Abstract

The utility model relates to a plug connector, which comprises an insulator, a wafer type module and a pin type module, the insulator is provided with an installation cavity used for assembling the wafer type module and the pin type module, the wafer type module comprises a PIN-wafer component, the PIN-wafer component comprises a PIN insulation insert and a PIN-pin, the PIN insulation insert wraps the bending part of the PIN-pin to fix the PIN-pin in a row, and the PIN insulation insert wraps the bending part of the PIN-pin to fix the PIN-pin in a row. A plurality of limiting grooves used for installing contact pin bending parts of contact pin type modules are formed in the top face of the PIN insulation insert, and the contact pins, installed in the limiting grooves, of the contact pin type modules can be coplanar with the surface-attaching faces welded to the PCB. And the coplanarity of all surface mounting sheets is ensured by arranging the PIN insulating inserts and the limiting grooves on the PIN insulating inserts.

Description

Technical Field

[0001] This utility model relates to the field of connector technology, specifically a plug connector. Background Technology

[0002] The SFF-8639 protocol specifies the product specifications for PSAS connectors, also known as U.2 connectors, and has defined the PIN definitions and external dimensions of plug and socket connectors. With the PCIe 5.0 specification published by the PCI-SIG Association, which increases the transmission rate from 16GT / s to 32GT / s, its transmission bandwidth has reached 128Gbps. U.2 connectors are gradually upgrading to the PCIe 5.0 specification standard, and the corresponding connectors are gradually beginning to be mass-produced.

[0003] US Patent 11211750B2 discloses an electrical connector assembly, specifically a PSAS connector. The assembly includes a plug connector and a receptacle connector. The plug connector is equipped with a grounding rod, which acts as a shield. The plug connector includes an insulating housing with mating tongues and multiple fixed plug contacts held within the insulating housing. Each plug contact is equivalent to a PIN pin. The plug contacts include multiple signal contacts and multiple ground contacts, effectively comprising multiple differential pairs and ground terminals. The grounding rod forms three contact points that respectively contact the ground contacts.

[0004] Technical Issue 1: This PSAS connector is a surface-mount product, which has strict requirements for the coplanarity of the surface-mount surface. The industry default is that the coplanarity standard for all PIN pins on the surface-mount surface is 0.10 Max. When assembling U.2 type products, multiple sets of PIN pins need to be assembled in multiple processes. Due to the coplanarity tolerance of multiple sets of PIN pins themselves and the cumulative tolerance introduced by assembly, the coplanarity yield of the finished product has always been a key issue restricting the development of the industry.

[0005] The above raises two questions:

[0006] ① The bending section of the multi-pin insert has a long cantilever and a large number of pins. The coplanarity requirement of the multi-pin insert itself is high, which is difficult to achieve with molds and results in high processing costs.

[0007] ② The accumulation of tolerances due to multiple sets of pins and multiple processes leads to a low yield rate and significant losses due to defects. Technical Problem 2: To ensure signal transmission quality, the grounding terminals of the differential signals of multiple sets of pins are usually connected in series and connected through a metal component. To make contact between the metal component and the grounding terminal, soldering is usually used. In actual production, as the number of grounding terminals increases, the requirements for the coplanarity of the metal component and the fit between the metal component and the grounding terminal also increase. In the actual production process, if there are gaps or tilted contact between the grounding pins and the grounding terminals, it will lead to poor soldering. In addition, the large number of solder joints directly results in a low soldering yield rate. Utility Model Content

[0008] To solve the above-mentioned technical problems, this utility model provides a plug connector that ensures the coplanarity of all surface mount chips by setting a PIN insulating insert and a limiting groove thereon.

[0009] To achieve the above technical objectives, the adopted technical solution is as follows: a plug connector, comprising an insulator, a wafer-type module, and a pin-type module. The insulator has a mounting cavity for assembling the wafer-type module and the pin-type module. The wafer-type module includes a PIN-wafer component, which includes a PIN insulating insert and a PIN pin. The PIN insulating insert wraps around the bent portion of the PIN pin and fixes the PIN pin in a row, so that the PIN pin is coplanar with the surface mount surface of the PCB board. The top surface of the PIN insulating insert has several limiting grooves for mounting the bent portion of the pin-type module, so that the pin of the pin-type module installed in the limiting groove can be coplanar with the surface mount surface of the PCB board.

[0010] The wafer-type module described in this utility model also includes a PIN shield, which is disposed on the front and / or rear side of the PIN pin. The PIN shield includes a PIN shield body covering the differential pair of the PIN pin and a PIN grounding pin for multi-contact soldering to the grounding terminal of the PIN pin.

[0011] The PIN grounding pin of this invention has an opening or notch.

[0012] When the wafer-type module described in this utility model is placed in front of another set of wafer-type modules, the limiting groove on the PIN insulating insert in front is also used to install the bent part of the PIN pin behind, so that the PIN pin behind is coplanar with the surface mount surface of the PCB board for soldering.

[0013] When the wafer-type module described in this utility model is placed in front of another set of wafer-type modules, the rear PIN insulating insert is mounted on the front PIN insulating insert.

[0014] The PIN shield of this invention includes sheet shields and strip shields arranged perpendicularly to each other. The extension direction of the sheet shields is consistent with the extension direction of the differential pair. Adjacent sheet shields are connected by at least one strip shield. At least one side of the strip shield is connected to a PIN ground pin.

[0015] The PIN grounding pin of this utility model is arranged perpendicular to the strip shield and cantilevered.

[0016] The wafer-type module described in this utility model also includes a second PIN insulating insert for pressing in the PIN shielding sheet.

[0017] The PIN insulating insert of this utility model is provided with barbs, and the insulator is provided with receiving grooves for fixing the barbs when assembling wafer-type modules.

[0018] The insulator described in this invention has a patch installed on it for soldering to a PCB board.

[0019] The pin-type module of this invention has a convex bulge on the series-connected grounding terminals to provide assembly constraint force.

[0020] The beneficial effects of this utility model are:

[0021] 1. For the wafer-type module, a reasonable design is made. For the longer PIN-wafer, the area of ​​the PIN insulating insert is increased to wrap the PIN-pin bending part, reducing the cantilever length of the bending part exposed by the PIN insulating insert. This reduces the difficulty of PIN-pin processing and control, ensures the coplanarity of PIN-pins installed in a row, and adds a limiting groove on the top surface of the PIN insulating insert for mounting the bending part of the pin type to ensure the coplanarity consistency of the pin group, thereby improving the coplanarity yield of the finished product.

[0022] 2. By adding a PIN shield to the PIN-wafer, the signal transmission quality in the PIN-wafer is enhanced. When connected to the grounding terminal, the soldering yield is guaranteed, and there will be no gaps or tilted contact between the PIN-wafer and the grounding terminal.

[0023] 3. An opening or notch is made at the grounding pin. The location of the opening or notch is the solder joint location. When soldering, it can increase the solder joint area and the solder quality, and improve the tolerance during soldering.

[0024] 4. Another set of wafer-type modules located behind the wafer-type module. The coplanarity of the pins in the PIN-wafer can be achieved by limiting the position of the pins through the limiting slot, or by using a separate PIN insulating insert.

[0025] 5. Add a 7-pin second insulating insert to the wafer-type module. This insert can be used to press-fit the pin shield, directly determining the position of the grounding pin of the pin shield and preventing the grounding pin from shifting.

[0026] 6. Use barbs to secure the wafer-type module to prevent the pins from being stressed and affecting coplanarity during forced installation.

[0027] 7. The use of surface mount technology (SMT) facilitates the soldering of plug connectors to the PCB board.

[0028] 8. The PIN shield structure is reasonably set up. The sheet shield is used to ensure the coverage and shielding of the differential pair. The strip shield can be used to fix the sheet shields together to form a whole structure, which is more stable. In addition, the PIN ground pin is connected by the strip shield. The PIN ground pin can be set on different sides according to the required soldering points. The PIN ground pin is perpendicular to the strip shield and can be suspended, which can ensure that the PIN ground pin is completely aligned with the grounding terminal.

[0029] 9. Because the grounding terminals of the pin-type module are connected in series, a portion of the interference structure is missing. To prevent insufficient constraint at the grounding terminals, a protrusion can be added to the grounding terminals to increase the constraint force when the pin-type module is interference-fitted into the mounting cavity. Attached Figure Description

[0030] Figure 1 This is an exploded view of the present invention;

[0031] Figure 2 This is a schematic diagram of the assembled structure of this utility model;

[0032] Figure 3 for Figure 2 A schematic diagram of the rear view structure;

[0033] Figure 4 This is a schematic diagram of the structure of the 40PIN-wafer of this utility model;

[0034] Figure 5 This is a schematic diagram of the structure of the 40PIN first shielding sheet of this utility model;

[0035] Figure 6 This is a schematic diagram of the structure of the 40PIN second shielding sheet of this utility model;

[0036] Figure 7 This is a schematic diagram of the structure of the 40PIN-wafer component of this utility model;

[0037] Figure 8 This is a schematic diagram of the structure of the 7PIN-wafer of this utility model;

[0038] Figure 9 for Figure 8 A schematic diagram of the rear view structure;

[0039] Figure 10 This is a schematic diagram of the structure of the 7PIN shielding sheet of this utility model;

[0040] Figure 11 This is a schematic diagram of the 15-PIN insert of this utility model;

[0041] Figure 12 for Figure 11 A schematic diagram of the rear view structure;

[0042] Figure 13 This is a schematic diagram of the interference fit between the 15-pin connector and the insulator of this utility model;

[0043] Figure 14 This is a schematic diagram of the interference fit of the convex hull of this utility model;

[0044] Figure 15 This is a schematic diagram of the 6PIN pin structure of this utility model;

[0045] Figure 16 for Figure 15 A schematic diagram of the rear view structure;

[0046] Figure 17 This is a schematic diagram showing the interference fit between the 6PIN pin of this utility model and the insulator;

[0047] Figure 18 This is a schematic diagram of the opening or notch in this utility model;

[0048] Figure 19 for Figure 18 Enlarged view of Part I;

[0049] In the picture:

[0050] 1. Insulator; 11. Mounting cavity; 12. Receiving groove; 111. Insulator slot hole;

[0051] 2. Patch panel;

[0052] 3, 40PIN - wafer; 31, 40PIN - wafer components; 311, 40PIN - inserts; 312, 40PIN - insulating inserts; 32, 40PIN - shielding sheets; 32-1, 40PIN - long shielding sheets; 32-2, 40PIN - short shielding sheets; 321, 40PIN - shielding body; 322, 40PIN - grounding pin.

[0053] 4. 7PIN - wafer, 41. 7PIN - insert, 42. 7PIN - first insulating insert, 43. 7PIN - shield, 44. 7PIN - second insulating insert, 431. 7PIN - shield body, 432. 7PIN - ground pin;

[0054] 5, 6PIN - insert pin; 6, 15PIN - insert pin; 61, convex bulge; 7, opening or notch; 8, barb.

[0055] 9. Wafer module; 91. PIN-wafer component; 92. PIN shielding sheet; 911. PIN pin; 912. PIN insulating insert; 921. PIN shield; 922. PIN grounding pin; 9211. Sheet shield; 9212. Strip shield; 912-1. Limiting groove.

[0056] 10. Pin-type module. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0058] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0059] The structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0060] The terms "upper," "lower," "left," "right," "middle," "longitudinal," "lateral," "horizontal," "inner," "outer," "radial," and "circumferential" used in this specification to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the purpose of simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this utility model. Furthermore, the terms "first" and "second" are used only to distinguish similar objects and should not be construed as indicating a specific order or sequence. It should be understood that such use can be interchanged where appropriate.

[0061] like Figure 1 , Figure 2 , Figure 3 As shown, a plug connector includes an insulator 1, a wafer-type module 9, and a pin-type module 5. The insulator 1 has a mounting cavity 11 for assembling the wafer-type module 9 and the pin-type module 5. The number of wafer-type modules 9 and pin-type modules 5 assembled on the insulator 1 can be selected according to design requirements. The number of pins in the pin-type module 5 is not limited, for example, a 6-pin-5 or 15-pin-6 structure. The number of pins in the wafer-type module 9 is also not limited, for example, a 40-pin-wafer 3 or a 7-pin-wafer 4. The wafer-type module 9 includes PIN... -wafer component 91, the PIN-wafer component 91 includes a PIN insulating insert 912 and PIN pins 911. The PIN insulating insert 912 wraps around the bent portion of the PIN pins 911, fixing the PIN pins 911 in a row, so that the PIN pins 911 are coplanar with the surface mount surface to be soldered to the PCB board. The front of the pin-type module 5 is the wafer-type module 9. The top surface of the PIN insulating insert 912 is provided with several limiting grooves 912-1 for mounting the bent portion of the pins of the pin-type module 5, so that the pins of the pin-type module 5 installed in the limiting grooves 912-1 can be coplanar with the surface mount surface to be soldered to the PCB board. In this way, the coplanarity of the wafer-type module 9 and the pin-type module 5 is guaranteed.

[0062] like Figure 1 As shown, the wafer-type module 9 also includes a PIN shield 92, for example, as Figure 5 , Figure 6 The 40-pin first shield and the 40-pin second shield, or as... Figure 10 The 7-pin shield shown. The PIN shield 92 is disposed on the front and / or rear side of the PIN pin 911. The PIN shield 92 includes a PIN shield body 921 covering the differential pair of the PIN pin 911 and a PIN ground pin 922 for multi-contact soldering to the ground terminal of the PIN pin 911.

[0063] When the wafer-type module 9 is positioned in front of another set of wafer-type modules 9, the limiting groove 912-1 on the front PIN insulating insert 912 is also used to install the bent portion of the rear PIN-pin 911, making the rear PIN-pin 911 coplanar with the surface mount surface for soldering to the PCB board. That is, the rear wafer-type module 9 is installed using the limiting groove 912-1 on the front wafer-type module 9, just like a pin-type module, further ensuring coplanarity. The attached diagram showing the installation of another wafer-type module 9 using the limiting groove 912-1 is omitted.

[0064] When the wafer-type module 9 is placed in front of another set of wafer-type modules 9, the rear PIN insulating insert 912 is placed on the front PIN insulating insert 912, that is, the other set of wafer-type modules at the rear is installed as a whole module on the front PIN insulating insert 912 to ensure coplanarity after installation.

[0065] The PIN shield 921 includes a sheet shield 9211 and a strip shield 9212 arranged perpendicularly to each other. The extension direction of the sheet shield 9211 is consistent with the extension direction of the differential pair. Adjacent sheet shields 9211 are connected by at least one strip shield 9212. At least one side of the strip shield 9212 is connected to the PIN ground pin 922. This design allows the sheet shield 9211 to better cover the differential pair, and the strip shield 9212 can achieve an integral connection between the sheet shield 9211 and the PIN ground pin 922, resulting in a reasonable structure.

[0066] The PIN grounding pin 922 is suspended perpendicular to the strip shield 9212. This arrangement allows the PIN grounding pin 922 to be fully aligned with the grounding terminal and to be consistent with the extension direction of the grounding terminal, which facilitates soldering.

[0067] like Figure 1 As shown, the wafer-type module 9 also includes a second PIN insulating insert 913 for pressing the PIN shield 92, which is used to fix and position the PIN shield 92 and realize the soldering alignment of the PIN shield 92.

[0068] The PIN insulating insert 912 is provided with barbs 8, and the insulator 1 is provided with a receiving groove 12 for fixing the barbs 8 when assembling the wafer-type module 9.

[0069] The pin-type module 5 has a protrusion 61 on its series-connected grounding terminals to provide assembly constraint force.

[0070] like Figure 1 , Figure 2 , Figure 3 As shown, taking a wafer-type module using 40PIN-wafer3 and 7PIN-wafer4, and a pin-type module 5 using 6PIN-pin5 and 15PIN-pin6 as an example, a PSAS type plug connector includes an insulator 1, a 40PIN-wafer3, a 7PIN-wafer4, a 6PIN-pin5, and a 15PIN-pin6. The insulator 1 has a mounting cavity 11 for assembling the 40PIN-wafer3, 7PIN-wafer4, 6PIN-pin5, and 15PIN-pin6. The mounting cavity 11 has an insulator slot 111 that matches the pins. The 40PIN-wafer3 is located in the front row, and the 7PIN-wafer4, 6PIN-pin5, and 15PIN-pin6 are arranged from right to left in the rear row of the 40PIN-wafer3. The assembly form is not limited to conventional connection structures such as interference fit, fastener fixation, and snap-fit ​​fixation. As shown in the diagram, the pins in 40PIN-wafer3, 7PIN-wafer4, 6PIN-pin5, and 15PIN-pin6 include a lower insertion portion that mates with the adapter connector, a forward-bent portion connected to the insertion portion, and an upward-bent surface-mount pin connected to the bend. The insertion portion has a contact area for mating with the suitable socket, and the surface-mount pin has a surface-mount surface for soldering to the PCB board. The surface-mount surfaces of 40PIN-wafer3, 7PIN-wafer4, 6PIN-pin5, and 15PIN-pin6 are coplanar, meaning that the surface-mount surfaces of all pins lie in the same plane. Each of 40PIN-wafer3, 7PIN-wafer4, 6PIN-pin5, and 15PIN-pin6 includes several differential pairs and several ground terminals. The insulator 1 is equipped with a patch 2 for soldering to the PCB board. The position, quantity, and structure of the patch 2 are adjusted according to the requirements of different soldering positions. The assembly sequence is as follows: first, install the 40-pin wafer 3 into the insulating housing, then the 7-pin wafer 4, the 15-pin connector 6, the 6-pin connector 5, and finally the patch 2, thus completing the assembly.

[0071] like Figure 4As shown, the 40-pin wafer 3 includes a 40-pin wafer component 31. The 40-pin wafer component 31 includes a 40-pin insulating insert 312 and 40-pin connectors 311. The 40-pin insulating insert 312 wraps around the bent portion of the 40-pin connectors 311, fixing the 40-pin connectors 311 in a row. The surface mount surface and contact area of ​​the 40-pin connectors 311 are on the same side, making the surface mount surfaces of the 40-pin connectors 311 for soldering to the PCB board coplanar. The 40-pin insulating insert 312 can... The 40-PIN-pin 311 can be encapsulated by injection molding or by assembly. The assembled 40-PIN-wafer component 31 can be installed as a whole. The 40-PIN insulating insert 312 extends as far as possible towards the surface mount pins as possible around the bent part. Without affecting the surface mount soldering, the cantilever length of the 40-PIN-pin 311 extending out of the 40-PIN insulating insert 312 on the surface mount side is further reduced, improving the coplanarity of the surface mount surface of the injection-molded 40-PIN-wafer component 31. The top surface of the 40PIN insulating insert 312 is provided with several limiting grooves 912-1 for installing the bent portions of 6PIN pins 5 and 15PIN pins 6. This ensures that the surface-mount surfaces of the 6PIN pins 5 and 15PIN pins 6 installed in the limiting grooves 912-1 are coplanar with those of the PCB board. When the 6PIN pins 5 and 15PIN pins 6 are assembled in the insulator 1, the width of the bent portion in the limiting groove 912-1 is consistent with the limiting groove 912-1, and the vertical portion of the bent portion abuts against the 40PIN insulating insert 312. This ensures that the 6PIN pins 5 and 15PIN pins 6 are constrained in the length and height directions of the insert when they are installed, thereby improving the cumulative assembly tolerance introduced by the subsequent assembly of the 6PIN pins 5 and 15PIN pins 6 and improving the coplanarity of the finished product.

[0072] like Figure 4 As shown, the 40-pin wafer component 31 also includes a 40-pin shield 32, which is disposed on the front and / or rear side of the 40-pin connector 311 to increase signal transmission quality. The specific structure is as follows: Figure 5 As shown, the 40-pin long shielding piece 32-1 located on the rear side of the 40-pin-wafer component 31 is as follows: Figure 6As shown, the 40-pin short shield 32-2, 40-pin long shield 32-1, and 40-pin short shield 32-2 located on the front side of the 40-pin wafer component 31 can be used simultaneously or individually as needed. The 40-pin shield 32 includes a 40-pin shield body 321 covering the differential pair of the 40-pin connector 311 and a 40-pin grounding pin 322 for multi-contact soldering to the grounding terminal of the 40-pin connector 311. The number of soldering contacts can be set as needed; for example, the 40-pin long shield 32-1 is soldered with four contacts to a single grounding terminal, and the 40-pin short shield 32-2 is soldered with two contacts to a single grounding terminal.

[0073] To further improve the coplanarity of the 7PIN-wafer4 mounting, it is installed in two ways. The first method utilizes a limiting groove 912-1, similar to the 6PIN-pin 5 and 15PIN-pin 6, ensuring coplanarity. Specifically, the 7PIN-wafer4 includes a 7PIN-pin 41, with the surface mount surface and contact area located on opposite sides. The limiting groove 912-1 can also accommodate the bent portion of the 7PIN-pin 41, ensuring that the surface mount surface of the 7PIN-pin 41 is coplanar with the PCB board surface mount surface (see attached diagram). The second method uses individual inserts to assemble the 7PIN-pin 41 into a modular structure, also ensuring coplanarity. The specific structure is as follows... Figure 8 As shown, the 7PIN-wafer 4 includes a 7PIN pin 41 and a 7PIN first insulating insert 42 mounted on a 40PIN insulating insert 312. The 7PIN first insulating insert 42 wraps around the bent portion of the 7PIN pin 41, fixing the 7PIN pin 41 in a row so that the surface surfaces of the 7PIN pin 41 are coplanar for soldering to the PCB board. The 7PIN first insulating insert 42 is formed by injection molding or assembly. After the 40PIN-wafer component is installed, the space between the 40PIN insulating insert 312 and the rear cavity wall of the mounting cavity 11 ensures the proper installation of the 7PIN first insulating insert 42, so that the surface surfaces of the 7PIN pin 41 within the 7PIN first insulating insert 42 are coplanar with the surface surfaces of the 40PIN pin 311.

[0074] like Figure 8 , Figure 10As shown, the 7PIN-wafer 4 also includes a 7PIN shield 43, which is disposed on the front and / or rear side of the 7PIN pin 41. Only the front 7PIN shield 43 is shown in the figure; in actual use, it is not limited to this position. The 7PIN shield 43 includes a 7PIN shield body 431 covering the differential pair of the 7PIN pin 41 and a 7PIN grounding pin 432 for multi-contact soldering to the ground terminal of the 7PIN pin 41. In the figure, the 7PIN grounding pin 432 has two contact points with a single ground terminal. The number of contact points is not limited and can be designed as needed.

[0075] like Figure 8 As shown, the 7PIN-wafer 4 also includes a 7PIN second insulating insert 44 for press-fitting the 7PIN shield 43. The 7PIN first insulating insert 42 is formed by injection molding or assembly. The 7PIN second insulating insert 44 is equivalent to the PIN second insulating insert 913, which not only further stabilizes the 7PIN pin 41, but also allows the 7PIN shield 43 to be installed through its positioning slot, thus determining the installation position of the 7PIN shield 43 and ensuring that the 7PIN ground pin 432 is aligned with the ground terminal. During assembly, the 7PIN ground pin 432 of the 7PIN shield 43 is first attached to the 7PIN-wafer 4, and then laser soldering is used to connect all 7PIN ground pins 432 to the 7PIN pin 41, achieving interconnection of all ground pins.

[0076] like Figure 2 , Figure 3 , Figure 7 , Figure 9 As shown, the 40PIN insulating insert 312 and / or the 7PIN second insulating insert 44 are provided with barbs 8. The insulator 1 is provided with a receiving groove 12 for fixing the barbs 8 when assembling the 40PIN-wafer 3 and / or the 7PIN second insulating insert 44. The barbs 8 and the receiving groove 12 cooperate to prevent the 7PIN-wafer 4 and the 40PIN-wafer 3 from detaching from the insulator 1. Compared with other forced mounting structures, this prevents the pins from being subjected to force that affects the coplanarity.

[0077] like Figure 11 , Figure 12 As shown, the 15-pin connector 6 has its pin surface and contact area located on opposite sides and is provided with an interference fit, allowing it to be interference-fitted with the insulator slot 111 during assembly. The series-connected grounding terminals of the 15-pin connector 6 have a protrusion 61 providing assembly constraint. (See diagram below.) Figure 14 As shown, the convex hull 61 is located on the same side as the contact area of ​​the 15-PIN pin 6, providing a constraint force for the series-connected grounding terminal in case of series failure.

[0078] like Figure 13 As shown, the 15PIN pin 6 has its pin surface and contact area located on opposite sides and is provided with an interference fit. During assembly, it is interference-fitted with the insulator slot 111.

[0079] like Figure 15 , 16 The 6-pin connector 5 shown has its pin surface and contact area opposite, and it has an interference fit. During assembly, it is interference-fitted with the insulator slot 111. The specific interference fit is as follows: Figure 17 As shown.

[0080] like Figure 18 , Figure 19 As shown, the 40-pin grounding pin 322 has an opening or notch 7. The 7-pin grounding pin 42 also has an opening or notch 7. The center of the opening or notch 7 is the solder joint location. Compared to a design without an opening, this increases the soldering area and quality, improving soldering tolerance. The size of the opening is not significantly different from the solder joint diameter. The choice between an opening or notch depends on the size of the grounding pin; for grounding pins with limited space, a notch is the optimal choice.

[0081] The above are merely preferred embodiments of this utility model and are not intended to limit or restrict this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection declared by this utility model.

Claims

1. A plug connector, comprising an insulator (1), a wafer-type module (9), and a pin-type module (5), wherein the insulator (1) is provided with a mounting cavity (11) for assembling the wafer-type module (9) and the pin-type module (5), characterized in that: The wafer-type module (9) includes a PIN-wafer component (91), which includes a PIN insulating insert (912) and a PIN pin (911). The PIN insulating insert (912) wraps around the bent portion of the PIN pin (911) and fixes the PIN pin (911) in a row so that the PIN pin (911) is coplanar with the surface of the PCB board. Several limiting grooves (912-1) for installing the bent portion of the pin-type module (5) are provided on the top surface of the PIN insulating insert (912) so that the pin of the pin-type module (5) installed in the limiting groove (912-1) can be coplanar with the surface of the PCB board.

2. A plug connector as described in claim 1, characterized in that: The wafer-type module (9) further includes a PIN shield (92), which is disposed on the front and / or rear side of the PIN pin (911). The PIN shield (92) includes a PIN shield body (921) covering the differential pair of the PIN pin (911) and a PIN grounding pin (922) for multi-contact soldering to the grounding terminal of the PIN pin (911).

3. A plug connector as described in claim 2, characterized in that: The PIN grounding pin (922) is provided with an opening or notch (7).

4. A plug connector as described in claim 1, characterized in that: When the wafer-type module (9) is placed in front of another set of wafer-type modules (9), the limiting groove (912-1) on the PIN insulating insert (912) located in front is also used to install the bent part of the PIN pin (911) behind, so that the PIN pin (911) behind is coplanar with the surface of the PCB board for soldering.

5. A plug connector as described in claim 1, characterized in that: When the wafer-type module (9) is placed in front of another set of wafer-type modules (9), the rear PIN insulating insert (912) is placed on the front PIN insulating insert (912).

6. A plug connector as described in claim 2, characterized in that: The PIN shield (921) includes a sheet shield (9211) and a strip shield (9212) arranged perpendicularly to each other. The extension direction of the sheet shield (9211) is consistent with the extension direction of the differential pair. Adjacent sheet shields (9211) are connected by at least one strip shield (9212). At least one side of the strip shield (9212) is connected to a PIN ground pin (922).

7. A plug connector as described in claim 6, characterized in that: The PIN grounding pin (922) is suspended perpendicular to the strip shield (9212).

8. A plug connector as described in claim 2, characterized in that: The wafer-type module (9) also includes a second PIN insulating insert (913) for press-fitting the PIN shield (92).

9. A plug connector as described in claim 1, characterized in that: The PIN insulating insert (912) is provided with barbs (8), and the insulator (1) is provided with a receiving groove (12) for fixing the barbs (8) when assembling the wafer-type module (9).

10. A plug connector as described in claim 1, characterized in that: The insulator (1) is fitted with a patch (2) for soldering to the PCB board.

11. A plug connector as described in claim 1, characterized in that: The pin-type module (5) has a convex bulge (61) on its series-connected grounding terminals to provide assembly constraint force.

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