Automatic grinding device for circuit board

Abstract

The utility model discloses an automatic grinding device for a circuit board. Comprising a rack, a workbench arranged on the rack, a plate thickness measuring device arranged at the feeding end of the workbench, a plurality of sets of conveying rollers arranged on the workbench, a plurality of sets of polish-brush assemblies distributed between the conveying rollers at intervals, a swing assembly connected with the polish-brush assemblies, and a lifting device arranged on the rack and used for adjusting the height positions of the polish-brush assemblies. And a controller; the plate thickness measuring device is electrically connected with the controller, and the controller is electrically connected with a power device of the lifting device. According to the automatic board grinding device for the circuit board, the board thickness of the circuit board is measured through the automatic board thickness measuring device, the height of the grinding brush roller is automatically controlled according to the board thickness, and the working efficiency and the board grinding quality are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of printed circuit board processing equipment, specifically to an automatic circuit board grinding device. Background Technology

[0002] PCB (Printed Circuit Board), also known as a printed circuit board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical connections. Because it is manufactured using electronic printing techniques, it is called a "printed" circuit board. The rapid development of my country's information electronics industry has provided a favorable market environment for the rapid development of the PCB industry. The continuous growth in the output of electronic communication equipment, computers, and home appliances has provided strong impetus for the rapid growth of the PCB industry. With the development of the electronics industry, the demand for high-end products such as precision circuit boards, thick backplanes, and high-end HDI boards is increasing. The manufacturing technology for these products is complex, with many technical challenges and intricate process control methods. The fabrication of outer layer circuitry is one of the more critical technical difficulties. Typically, outer layer circuitry is obtained through the following process: electroplating → resin filling → grinding → copper thinning → outer layer circuitry. However, the quality of the grinding process often becomes a technical bottleneck when applying this technology to thick boards, high-layer circuits, and fine-line circuits.

[0003] In related technologies, circuit boards are typically fed unidirectionally into a grinding machine. Grinding brushes within the machine grind the circuit boards, and these brushes are usually fixed to the machine. As the circuit board passes over the brushes, its surface is ground. In practical applications, different batches of circuit boards have varying thicknesses, requiring adjustment of the brush position during the grinding process. Current technologies primarily rely on manual brush adjustment, which is inefficient and introduces errors, affecting the grinding quality.

[0004] Therefore, the purpose of this utility model is to provide a new automatic circuit board grinding device to solve the above-mentioned technical problems. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an automatic circuit board grinding device, which measures the thickness of the circuit board through an automatic board thickness measuring device and automatically controls the height of the grinding brush roller according to the board thickness, thereby improving work efficiency and grinding quality.

[0006] The technical solution of this utility model is as follows:

[0007] An automatic circuit board grinding device includes a frame, a worktable on the frame, a board thickness measuring device at the feed end of the worktable, a plurality of conveying rollers on the worktable, a plurality of grinding brush assemblies spaced apart between the conveying rollers, a swing assembly connected to the grinding brush assemblies, a lifting device on the frame for adjusting the height of the grinding brush assemblies, and a controller.

[0008] Each brush assembly includes synchronously driven brush rollers and steel pressure rollers, with the brush rollers of two adjacent brush assemblies staggered on the upper and lower sides of the circuit board.

[0009] The oscillating assembly includes a drive motor, a drive wheel driven by the drive motor, an eccentric wheel connected to the drive wheel, a connecting rod connected to the eccentric wheel, and a swaying mounting seat sleeved on the shaft end of the brush roller. The connecting rod is connected to the swaying mounting seat, which drives the brush roller to reciprocate along its axis.

[0010] The lifting device includes a power unit, a telescopic rod connected to the power unit, and a lifting seat located at one end of the telescopic rod. The lifting seat is connected to the swing mounting base.

[0011] The plate thickness measuring device is electrically connected to the controller, and the controller is electrically connected to the power unit of the lifting device.

[0012] Furthermore, the brush rollers of two adjacent brush assemblies rotate in opposite directions.

[0013] Furthermore, the plate thickness measuring device is one of an ultrasonic measuring device, a laser measuring device, or an electromagnetic wave measuring device.

[0014] Furthermore, the swing mounting base is slidably connected to the lifting base.

[0015] Furthermore, the swing amplitude of the swing component is ±3.5mm, and the swing frequency is 180-220 times / minute.

[0016] Compared with the prior art, the automatic circuit board grinding device provided by this utility model has the following advantages:

[0017] I. The automatic circuit board grinding device provided by this utility model measures the thickness of the circuit board by installing a board thickness measuring device at the feeding end of the worktable, and adjusts the height of the grinding brush roller according to the thickness of the circuit board, so that the grinding brush roller can accurately grind the circuit board; during the grinding process of the grinding brush roller rotating, the grinding brush roller is driven to swing along its axis by the swing component, thereby improving the uniformity of grinding. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the automatic circuit board grinding device of this utility model;

[0020] Figure 2 yes Figure 1 The diagram shows a partial structural schematic of the automatic circuit board grinding device.

[0021] Figure 3 yes Figure 2 A schematic diagram showing the connection relationship between the oscillating component and the grinding brush roller in the automatic circuit board grinding device.

[0022] Figure 4 yes Figure 2 The diagram shows the connection relationship between the lifting device and the swing assembly in the automatic circuit board grinding device. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions in the embodiments of this utility model, and to make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be further described below in conjunction with the accompanying drawings.

[0024] It should be noted that the descriptions of these embodiments are for the purpose of aiding understanding of the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0025] Please refer to the following: Figures 1 to 4 ,in Figure 1 This is a schematic diagram of the automatic circuit board grinding device of this utility model. Figure 2 yes Figure 1 The diagram shows a partial structural schematic of the automatic circuit board grinding device. Figure 3 yes Figure 2 A schematic diagram showing the connection relationship between the oscillating component and the grinding brush roller in the automatic circuit board grinding device. Figure 4 yes Figure 2The diagram shows the connection relationship between the lifting device and the swing assembly in the automatic circuit board grinding device. The automatic circuit board grinding device of this invention includes a frame 1, a worktable (not shown) mounted on the frame 1, a board thickness measuring device 3 mounted on the feed end of the worktable, several sets of conveying rollers 4 mounted on the worktable, multiple sets of grinding brush assemblies 5 spaced apart between the conveying rollers, a swing assembly 6 connected to the grinding brush assemblies, a lifting device 7 for adjusting the height of the grinding brush assemblies, and a controller.

[0026] In this invention, the board thickness measuring device 3 can be one of an ultrasonic measuring device, a laser measuring device, or an electromagnetic wave measuring device. The board thickness measuring device 3 is electrically connected to the controller, which detects the thickness of the circuit board to be ground online and sends the circuit board thickness information to the controller. The controller then controls the lifting device 7 to work so that the grinding brush assembly can be adapted to the processing of the circuit board with the corresponding board thickness.

[0027] The grinding brush assembly 5 includes a grinding brush roller 51 and a steel pressure roller 52, as well as a drive assembly 53 for synchronously driving the grinding brush roller and the steel pressure roller. The grinding brush rollers of two adjacent sets of grinding brush assemblies are staggered and distributed on the upper and lower sides of the circuit board, which can realize the simultaneous grinding of both sides of the circuit board. During the grinding process, the grinding brush rollers of two adjacent sets of grinding brush assemblies rotate in opposite directions.

[0028] The oscillating assembly 6 includes a drive motor 61, a drive wheel 62 driven by the drive motor 61, an eccentric wheel 63 connected to the drive wheel, a connecting rod 64 connected to the eccentric wheel 63, and an oscillating mounting base 65 sleeved on the end of the brush roller shaft. The connecting rod 64 is connected to the oscillating mounting base 65. When the drive motor 61 starts, it drives the eccentric wheel 63 to rotate through the drive wheel 62, thereby causing the connecting rod to drive the oscillating mounting base to reciprocate along the axis of the brush roller.

[0029] The lifting device 7 includes a power unit 71, a telescopic rod 72 connected to the power unit 71, and a lifting seat 73 located at one end of the telescopic rod. The lifting seat 73 is connected to the swing mounting base 65. When the lifting device 7 is raised or lowered, the lifting seat drives the swing mounting base 65 to rise or fall together, thereby driving the grinding brush roller to rise or fall, so that the distance between the grinding brush roller and the steel pressure roller conforms to the grinding process of the circuit board of corresponding thickness. At this time, other components of the swing assembly also rise or fall simultaneously. The power unit 71 can be hydraulically driven or electrically driven.

[0030] In this embodiment, the swing mounting base 65 and the lifting base 73 are slidably connected by a slider / groove. When the swing assembly drives the brush roller to move linearly along its axis, the swing mounting base 65 slides relative to the lifting base 73, which can make the swing of the brush roller more stable, and the swing operation and the lifting operation are relatively independent.

[0031] In this embodiment, each brush assembly is equipped with two sets of swing components and lifting devices, located at both ends of the brush roller. The swing amplitude of the swing components is ±3.5mm, and the swing frequency is 180-220 times / minute.

[0032] The automatic circuit board grinding device provided by this utility model measures the thickness of the circuit board by installing a board thickness measuring device at the feeding end of the worktable, and adjusts the height of the grinding brush roller according to the thickness of the circuit board, so that the grinding brush roller can accurately grind the circuit board; during the grinding process of the grinding brush roller rotating, the grinding brush roller is driven to swing along its axis by the swing component, thereby improving the uniformity of grinding.

[0033] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of this utility model still fall within the protection scope of this utility model.

Claims

1. An automatic circuit board grinding device, characterized in that, It includes a frame, a worktable on the frame, a plate thickness measuring device at the feed end of the worktable, several sets of conveying rollers on the worktable, multiple sets of grinding brush assemblies spaced apart between the conveying rollers, a swing assembly connected to the grinding brush assemblies, a lifting device on the frame for adjusting the height of the grinding brush assemblies, and a controller. Each brush assembly includes synchronously driven brush rollers and steel pressure rollers, with the brush rollers of two adjacent brush assemblies staggered on the upper and lower sides of the circuit board. The oscillating assembly includes a drive motor, a drive wheel driven by the drive motor, an eccentric wheel connected to the drive wheel, a connecting rod connected to the eccentric wheel, and a swaying mounting seat sleeved on the shaft end of the brush roller. The connecting rod is connected to the swaying mounting seat, which drives the brush roller to reciprocate along its axis. The lifting device includes a power unit, a telescopic rod connected to the power unit, and a lifting seat located at one end of the telescopic rod. The lifting seat is connected to the swing mounting base. The plate thickness measuring device is electrically connected to the controller, and the controller is electrically connected to the power unit of the lifting device.

2. The automatic circuit board grinding device according to claim 1, characterized in that, The brush rollers of two adjacent brush assemblies rotate in opposite directions.

3. The automatic circuit board grinding device according to claim 1, characterized in that, The plate thickness measuring device is one of an ultrasonic measuring device, a laser measuring device, or an electromagnetic wave measuring device.

4. The automatic circuit board grinding device according to claim 1, characterized in that, The swing mounting base is slidably connected to the lifting base.

5. The automatic circuit board grinding device according to claim 1, characterized in that, The swing amplitude of the swing component is ±3.5mm, and the swing frequency is 180-220 times / minute.

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