Circuit board pasting equipment

Abstract

The utility model relates to the technical field of circuit board processing, in particular to circuit board paste coating equipment which comprises a workbench and a clamping assembly arranged in the workbench, a paste coating assembly is further suspended at the position, located on the clamping assembly, of the top end of the workbench, and a circuit board is clamped and fixed through the clamping assembly so as to be matched with the paste coating assembly to conduct solder paste brushing on the surface of the circuit board. The clamping assembly is arranged in the workbench, and the paste coating assembly is arranged at the top end of the clamping assembly, so that the circuit board can be clamped and fixed through the clamping assembly, then discharging and tin paste coating are conducted through the paste coating assembly, and it is ensured that the tin paste on the surface of the circuit board is evenly coated.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a circuit board paste application device. Background Technology

[0002] With the development of the industry, circuit boards are found in almost every electronic device. During the processing of circuit boards, in order to ensure that the circuits can be soldered normally, solder paste is usually applied to the surface of the circuit board. Nowadays, the common processing procedure is manual application of solder paste. However, during the manual application process, it is difficult to maintain a constant force applied by the operator, which leads to uneven application of solder paste on the circuit board surface. This results in excess solder paste remaining on the surface of the circuit board, which can cause short circuits. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides a circuit board solder paste application device, including a worktable and a clamping assembly disposed within the worktable. A solder paste application assembly is also suspended at the top of the worktable above the clamping assembly. The circuit board is clamped and fixed by the clamping assembly to cooperate with the solder paste application assembly to apply solder paste to the surface of the circuit board, thereby ensuring uniform solder paste application on the surface of the circuit board.

[0004] Preferably, the clamping assembly includes a rotary limiting frame rotatably disposed within the worktable and a first driving assembly disposed on the outer wall of the worktable, wherein the driving end of the first driving assembly is connected to the rotary limiting frame, thereby improving the work efficiency of solder paste application.

[0005] Preferably, the clamping assembly further includes clamping blocks disposed on both sides of the rotating limiting frame, and a second driving assembly is disposed on the other side of the rotating limiting frame located on the opposite side of the two clamping blocks. The driving end of the second driving assembly is connected to one of the clamping blocks to achieve the application of solder paste to circuit boards of different sizes.

[0006] Preferably, a first locking member is provided at the top of the clamping block for controlling the clamping block's tightness in clamping the circuit board, thereby limiting and fixing the circuit board to cooperate with the processing of the paste application assembly.

[0007] Preferably, the paste application assembly includes mounting brackets disposed on both sides of the workbench, a guide rail is provided on the mounting bracket along the length of the circuit board, a sliding block is slidably disposed on the guide rail, a third driving assembly is also disposed on the side wall of the mounting bracket, the driving end of the third driving assembly is connected to the sliding block, and an application assembly and a feeding assembly are disposed on the side of the sliding block facing the clamping assembly, so as to drive the paste application assembly to move along the direction parallel to the placement of the circuit board.

[0008] Preferably, the coating component includes a fourth driving component fixedly disposed on the sliding block, and a scraper is disposed at the driving end of the fourth driving component. The fourth driving component is used to drive the scraper to approach or move away from the circuit board on the clamping component, thereby driving the scraper to apply solder paste.

[0009] Preferably, the unloading assembly includes a fixing frame and a control assembly disposed on the fixing frame. The fixing frame is also provided with a mounting plate. Several sets of spray nozzles are provided on the side of the mounting plate facing the clamping assembly. A switch valve is provided inside the mounting plate. The control assembly is used to control the switch valve to unload the material, thereby controlling the unloading assembly to spray solder paste onto the surface of the circuit board.

[0010] Preferably, a storage tank is also provided on the fixed frame. The storage tank is connected to the mounting plate through a connecting hose. A connecting channel is provided in the mounting plate. The nozzle is connected to the connecting hose through the connecting channel to realize the quick filling of solder paste material and improve the working efficiency of the equipment.

[0011] As can be seen from the above, the following beneficial effects can be obtained by applying the method provided in this application: This application uses a workbench and a clamping component disposed in the workbench. A paste application component is also suspended on the clamping component at the top of the workbench. The circuit board is clamped and fixed by the clamping component so as to cooperate with the paste application component to apply solder paste to the surface of the circuit board. By providing a clamping component in the workbench and a paste application component at the top of the clamping component, the circuit board can be clamped and fixed by the clamping component, and then the paste application component can be used to apply solder paste, thereby ensuring that the solder paste is evenly applied to the surface of the circuit board. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only a part of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of the paste application equipment according to an embodiment of this application;

[0014] Figure 2 This is a perspective view of the paste application component according to an embodiment of this application;

[0015] Figure 3 This is a top view of the clamping component according to an embodiment of this application.

[0016] Figure Labels

[0017] 10. Workbench; 20. Clamping assembly; 30. Applying assembly; 21. Rotary limit frame; 22. First drive assembly; 23. Clamping block; 24. Second drive assembly; 25. First locking element; 31. Mounting bracket; 32. Guide rail; 33. Sliding block; 34. Third drive assembly; 35. Applying assembly; 36. Dispensing assembly; 351. Fourth drive assembly; 352. Scraper; 361. Fixing frame; 362. Control assembly; 363. Mounting plate; 364. Spray head; 365. Storage tank; 366. Connecting hose. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0019] Example

[0020] To address the aforementioned technical problems, this embodiment provides a circuit board paste application device, such as... Figure 1 As shown, the system includes a worktable 10 and a clamping component 20 disposed within the worktable 10. A solder paste application component 30 is also suspended at the top of the worktable 10 above the clamping component 20. The circuit board is clamped and fixed by the clamping component 20 so that the solder paste application component 30 can apply solder paste to the surface of the circuit board. By providing the clamping component 20 within the worktable 10 and the solder paste application component 30 at the top of the clamping component 20, the circuit board can be clamped and fixed by the clamping component 20, and then the solder paste application component 30 can be used to apply solder paste, thereby ensuring that the solder paste is applied evenly to the surface of the circuit board.

[0021] Specifically, such as Figure 3 As shown, the clamping assembly 20 includes a rotating limiting frame 21 rotatably disposed within the worktable 10 and a first driving assembly 22 disposed on the outer wall of the worktable 10. The driving end of the first driving assembly 22 is connected to the rotating limiting frame 21. By rotatably disposing of the rotating limiting frame 21 within the worktable 10 and by also disposing of the first driving assembly 22 on the outer wall of the worktable 10 with its driving end connected to the rotating limiting frame 21, when the circuit board is fixedly positioned within the rotating limiting frame 21, the first driving assembly 22 can drive the rotating limiting frame 21 to rotate, thereby causing the circuit board to rotate and flip. This allows for simultaneous processing of both sides of the circuit board without removing it, thus improving the efficiency of solder paste application.

[0022] Furthermore, the clamping assembly 20 also includes clamping blocks 23 disposed on both sides of the rotating limiting frame 21. A second driving assembly 24 is also disposed on the other side of the rotating limiting frame 21 opposite to the two clamping blocks 23. The driving end of the second driving assembly 24 is connected to one of the clamping blocks 23. By disposing of clamping blocks 23 on both sides of the rotating limiting frame 21 and disposing of a second driving assembly 24 on the rotating limiting frame 21 with its driving end connected to one of the clamping blocks 23, when it is necessary to clamp the circuit board, one end of the circuit board is first clamped and fixed by one clamping block 23, and then the other clamping block 23 is driven by the second driving assembly 24 to approach and clamp the other end of the circuit board, thereby completing the clamping and fixing of the circuit board and enabling the application of solder paste to circuit boards of different sizes.

[0023] To ensure that the circuit board is fixedly positioned on the clamping block 23, in a preferred embodiment, a first locking member 25 is provided at the top of the clamping block 23 for controlling the tightness of the clamping block 23 in clamping the circuit board. When the clamping block 23 clamps both ends of the circuit board, the first locking member 25 is turned to further ensure that the clamping block 23 clamps and fixes the circuit board, preventing the circuit board from being thrown out and damaged when the rotating limit frame 21 rotates, thus achieving the goal of fixing the circuit board to cooperate with the paste application assembly 30 for processing.

[0024] Specifically, the paste application assembly 30 includes mounting brackets 31 disposed on both sides of the workbench 10. A guide rail 32 is provided on the mounting brackets 31 along the length of the circuit board. A sliding block 33 is slidably disposed on the guide rail 32. A third drive assembly 34 is also disposed on the side wall of the mounting brackets 31, and the drive end of the third drive assembly 34 is connected to the sliding block 33. An application assembly 35 and a feeding assembly 36 are disposed on the side of the sliding block 33 facing the clamping assembly 20. The mounting brackets 31 have a guide rail 32, and the sliding block 33 is slidably disposed on the guide rail 32. Furthermore, by providing a third drive assembly 34 with a drive end connected to the sliding block 33 on the mounting bracket 31, and providing an applicator 35 and a feeding assembly 36 on the sliding block 33, when the circuit board is being fed and coated with paste, the third drive assembly 34 drives the sliding block 33 to slide along the guide rail 32, thereby driving the applicator 35 and the feeding assembly 36 on the sliding block 33 to the designated work station, so that the applicator 35 and the feeding assembly 36 can perform the paste application process on the circuit board, thereby driving the applicator 30 to move parallel to the placement direction of the circuit board.

[0025] Furthermore, such as Figure 2As shown, the coating component 35 includes a fourth driving component 351 fixedly disposed on the sliding block 33. A scraper 352 is disposed at the driving end of the fourth driving component 351. The fourth driving component 351 is used to drive the scraper 352 to approach or move away from the circuit board on the clamping component 20. By distributing the fourth driving component 351 on the sliding block 33 and connecting the scraper 352 to the driving end of the fourth driving component 351, when the unloading component 36 sprays solder paste onto the surface of the circuit board, the fourth driving component 351 drives the scraper 352 to approach the surface of the circuit board, and then the third driving component 34 drives the sliding block 33 to move in a direction parallel to the circuit board, thereby driving the scraper 352 to spread the solder paste evenly on the surface of the circuit board, thus realizing the scraper 352 scraping solder paste.

[0026] In the above scheme, the unloading component 36 includes a fixing frame 361 and a control component 362 disposed on the fixing frame 361. The fixing frame 361 is also provided with a mounting plate 363. Several sets of spray nozzles 364 are provided on the side of the mounting plate 363 facing the clamping component 20. A switch valve is provided in the mounting plate 363. The control component 362 is used to control the switch valve to unload. By providing a mounting plate 361 on the fixing frame 361, several sets of spray nozzles 364 on the mounting plate 361, and a mounting valve on the mounting plate 363, and a control component 362 on the fixing frame 361 to control the switch of the mounting valve to unload, when the sliding block 33 drives the unloading component 36 to the designated station, the control component 362 drives the mounting valve to open, and then the solder paste can be unloaded onto the circuit board through the spray nozzles 364, thereby realizing the control of the unloading component 36 to spray solder paste onto the surface of the circuit board.

[0027] To facilitate rapid material filling, as a preferred embodiment, a storage tank 365 is also provided on the fixed frame 361. The storage tank 365 is connected to the mounting plate 363 via a connecting hose 366. A connecting channel is provided within the mounting plate 363, and a nozzle 364 is connected to the connecting hose 366 via the connecting channel. By providing a storage tank 365 containing solder paste on the fixed frame 361, and connecting the storage tank to the mounting plate 363 via the connecting hose 366, and the connecting channel within the mounting plate 363 connecting the connecting hose 366 and the nozzle 364, the solder paste stored in the storage tank 365 can flow through the connecting hose 366 into the connecting channel within the mounting plate 363. Then, the control component 362 drives the mounting valve switch, allowing the solder paste to be dispensed through the nozzle 364 connected to the connecting channel, achieving rapid solder paste filling and improving equipment efficiency.

[0028] In summary, in one or more embodiments of this application, this application provides a circuit board solder paste application device, including a worktable and a clamping component disposed within the worktable. A solder paste application component is also suspended on the clamping component at the top of the worktable. The circuit board is clamped and fixed by the clamping component to cooperate with the solder paste application component to apply solder paste to the surface of the circuit board. By providing a clamping component within the worktable and a solder paste application component at the top of the clamping component, the circuit board can be clamped and fixed by the clamping component, and then the solder paste application component can be used to apply solder paste, thereby ensuring that the solder paste is evenly applied to the surface of the circuit board.

[0029] The embodiments described above do not constitute a limitation on the scope of protection of this technical solution. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the above embodiments should be included within the scope of protection of this technical solution.

Claims

1. A circuit board paste application device, characterized in that: The device includes a worktable (10) and a clamping assembly (20) disposed within the worktable (10). A solder paste application assembly (30) is also suspended on the clamping assembly (20) at the top of the worktable (10). The circuit board is clamped and fixed by the clamping assembly (20) to cooperate with the solder paste application assembly (30) to apply solder paste to the surface of the circuit board. The clamping assembly (20) includes a rotating limit frame (21) rotatably disposed within the worktable (10) and a first drive assembly (22) disposed on the outer side wall of the worktable (10). The drive end of the first drive assembly (22) is connected to the rotating limit frame (21).

2. The circuit board paste coating equipment according to claim 1, characterized in that: The clamping assembly (20) further includes clamping blocks (23) disposed on both sides of the rotating limiting frame (21). A second driving assembly (24) is also disposed on the other side of the rotating limiting frame (21) located on the opposite side of the two clamping blocks (23). The driving end of the second driving assembly (24) is connected to one of the clamping blocks (23).

3. The circuit board paste coating equipment according to claim 2, characterized in that: A first locking member (25) for controlling the clamping block (23) to tighten or loosen the circuit board is also provided at the top of the clamping block (23).

4. The circuit board paste coating equipment according to claim 1, characterized in that: The paste application assembly (30) includes a mounting bracket (31) disposed on both sides of the workbench (10). A guide slide rail (32) is provided on the mounting bracket (31) along the length of the circuit board. A sliding block (33) is slidably disposed on the guide slide rail (32). A third drive assembly (34) is also provided on the side wall of the mounting bracket (31). The drive end of the third drive assembly (34) is connected to the sliding block (33). An application assembly (35) and a feeding assembly (36) are provided on the side of the sliding block (33) facing the clamping assembly (20).

5. The circuit board paste coating equipment according to claim 4, characterized in that: The coating component (35) includes a fourth drive component (351) fixedly disposed on the sliding block (33). A scraper (352) is provided at the drive end of the fourth drive component (351). The fourth drive component (351) is used to drive the scraper (352) to approach or move away from the circuit board on the clamping component (20).

6. The circuit board paste coating equipment according to claim 4, characterized in that: The feeding assembly (36) includes a fixed frame (361) and a control assembly (362) disposed on the fixed frame (361). The fixed frame (361) is also provided with a mounting plate (363). Several sets of nozzles (364) are disposed on the side of the mounting plate (363) facing the clamping assembly (20). A switch valve is disposed inside the mounting plate (363). The control assembly (362) is used to control the switch valve to feed the material.

7. The circuit board paste coating equipment according to claim 6, characterized in that: A storage tank (365) is also provided on the fixed frame (361). The storage tank (365) is connected to the mounting plate (363) through a connecting hose (366). A connecting channel is provided in the mounting plate (363). The spray head (364) is connected to the connecting hose (366) through the connecting channel.

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