Electric bicycle controller

Abstract

The utility model relates to the field of electric bicycle controllers, and provides an electric bicycle controller which comprises a shell, an aluminum substrate and a main board, the aluminum substrate and the main board are arranged on the shell, a plurality of patch type power heating elements are arranged on the aluminum substrate, a plurality of mounting holes and pins are arranged on the aluminum substrate, and mounting parts fixedly connected with the shell are placed in the mounting holes. The aluminum substrate is further provided with an electrostatic protection circuit, and the electrostatic protection circuit is suitable for releasing static electricity on the shell to the negative electrode of the mainboard through the installation pieces in the installation holes and the pins of the aluminum substrate. The surface-mounted power heating element is arranged on the aluminum substrate, and the aluminum substrate not only has better heat dissipation performance, but also can bear higher current, so that the surface-mounted power heating element with higher power can be adopted; the aluminum substrate is further suitable for being provided with an electrostatic protection circuit, so that static electricity on the shell is released to the negative electrode of the mainboard through the installation piece and the pins, and the static electricity on the shell can be rapidly absorbed and released.

Description

Technical Field

[0001] This utility model relates to the field of electric bicycle controllers, and further to an electric bicycle controller. Background Technology

[0002] With the development of technology, electronic products are increasingly demanding smaller size, lighter weight, lower power consumption, and higher performance. Electric bicycles are also constantly evolving, requiring electric bicycle controllers to have strong performance, high cost-effectiveness, and strict standards. However, the increase in the power of electric bicycle controllers leads to a surge in heat generation, necessitating improved heat dissipation. The current conventional solution for electric bicycle controllers involves attaching a silicone pad to a plug-in MOSFET, with an aluminum strip behind the pad for heat dissipation. This structure has limited heat dissipation effectiveness. Currently, increasing the maximum power of the controller means that power devices account for a significant portion of the material cost, resulting in higher overall costs. In particular, there is the issue of static electricity (ESE) in electric bicycle controllers. Static electricity can enter the device through interfaces, motherboards, etc. Although the duration of ESD is extremely short, the energy is enormous, enough to damage electronic equipment, causing damage to sensitive components such as chips and capacitors, increasing subsequent repair costs. Therefore, electric bicycle controllers also need to pass the ESD test in safety regulations. Utility Model Content

[0003] To address the aforementioned technical problems, the purpose of this utility model is to provide an electric bicycle controller in which a surface-mount power heating element is mounted on an aluminum substrate. The aluminum substrate not only has better heat dissipation performance but also can carry higher current, allowing for the use of surface-mount power heating elements with higher power. The aluminum substrate is also suitable for setting up an electrostatic discharge protection circuit, so that static electricity on the housing can be released to the negative terminal of the main board through the mounting parts and pins. The static electricity on the housing can be quickly absorbed and discharged, increasing the safety performance of the electric bicycle controller.

[0004] To achieve the above objectives, this utility model provides an electric bicycle controller, including a housing and an aluminum substrate and a main board disposed on the housing. The aluminum substrate is provided with a plurality of surface-mount power heating elements, a plurality of mounting holes and pins, the mounting holes being adapted to house mounting parts for fixed connection to the housing, and the pins being adapted to be fixedly connected to the negative terminal of the main board. The aluminum substrate is also provided with an electrostatic discharge protection circuit, which is adapted to release static electricity on the housing through the mounting parts in the mounting holes and the pins of the aluminum substrate to the negative terminal of the main board.

[0005] In some embodiments, the electrostatic discharge protection circuit is further provided with a discharge resistor and a discharge capacitor. Part of the static electricity is absorbed by the discharge resistor and the discharge capacitor, and the remaining static electricity after passing through the electrostatic discharge protection circuit is released through the negative terminal of the motherboard. The mounting component includes screws.

[0006] In some embodiments, the aluminum substrate is further provided with an absorption circuit, which is connected to the surface-mount power heating element and the negative terminal of the main board, and is used to suppress and absorb the oscillation of the surface-mount power heating element.

[0007] In some embodiments, the absorption circuit includes an RC filter and a capacitor filter arranged side by side, the RC filter including an absorption resistor and an absorption capacitor.

[0008] In some embodiments, a temperature-sensing resistor is also provided on the aluminum substrate, and the temperature-sensing resistor is close to the surface-mount power heating element.

[0009] In some embodiments, the aluminum substrate is vertically disposed above the motherboard, the surface-mount power heating element is disposed on one side of the aluminum substrate, the pin is disposed at the bottom of the aluminum substrate, and the pin is vertically connected to one end of the top surface of the motherboard.

[0010] In some embodiments, the pins include connectors, and the motherboard has a corresponding socket, the connectors being adapted to be fixedly connected to the socket.

[0011] In some embodiments, the surface-mount power heating element is a surface-mount MOSFET.

[0012] In some embodiments, a heat-dissipating copper fin is also provided on the aluminum substrate, and the heat-dissipating copper fin is located around the surface-mount power heating element.

[0013] In some embodiments, the motherboard is also provided with a connection hole adapted to connect the negative terminal of a power supply component via a wire.

[0014] Compared with the prior art, the electric bicycle controller provided by this utility model has at least one of the following beneficial effects:

[0015] 1. The surface-mount power heating element is mounted on an aluminum substrate. The aluminum substrate not only has better heat dissipation performance, but also can carry higher current, which allows for the use of surface-mount power heating elements with higher power. The aluminum substrate is also suitable for setting up electrostatic discharge protection circuits, so that the static electricity on the housing can be released to the negative terminal of the motherboard through the mounting parts and pins. The static electricity on the housing can be quickly absorbed and discharged, which increases the safety performance of the electric bicycle controller.

[0016] 2. The absorption circuit can suppress and absorb the oscillation of surface-mount power heating elements, reduce EMI electromagnetic interference, improve the reliability and efficiency of surface-mount power heating elements, and achieve higher operating frequencies.

[0017] 3. The temperature sensing resistor is placed next to the surface-mount power heating element, which can more accurately measure the current temperature of the surface of the surface-mount power heating element, thus facilitating the implementation of subsequent temperature protection functions.

[0018] 4. The aluminum substrate is vertically mounted above the motherboard, and the pins are vertically connected to one end of the motherboard. The aluminum substrate is flush with other components on the motherboard, which helps to reduce the overall height of the electric bicycle controller, making it very suitable for space-constrained applications.

[0019] 5. The copper heat sink is placed around the surface-mount power heating element, which can increase the heat dissipation area of ​​the aluminum substrate and improve the heat dissipation efficiency. Attached Figure Description

[0020] The preferred embodiments will be described below in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages and implementation methods of this utility model.

[0021] Figure 1 This is an overall diagram of the electric bicycle controller;

[0022] Figure 2 This is a structural diagram of the aluminum substrate;

[0023] Figure 3 This is a side view of the electric bicycle controller;

[0024] Figure 4 This is the circuit diagram for an electrostatic discharge (ESD) protection circuit.

[0025] Figure 5 This is the circuit diagram of the absorption circuit.

[0026] Explanation of icon numbers:

[0027] 1. Housing; 2. Aluminum substrate; 20. Mounting hole; 21. Surface mount power heating element; 22. Pin; 23. Mounting component; 24. Bleeding resistor; 25. Bleeding capacitor; 26. RC filter; 261. Absorption resistor; 262. Absorption capacitor; 27. Capacitor filter; 28. Temperature sensing resistor; 29. ​​Copper heat sink; 3. Main board; 31. Connecting hole. Detailed Implementation

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0029] To keep the drawings concise, each figure only schematically shows the parts relevant to the utility model, and these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some figures, only one of the components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0030] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0031] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] Furthermore, in the description of this application, the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance. It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this utility model. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

[0033] refer to Figure 1 and Figure 2 This utility model provides an electric bicycle controller, including a housing 1 and an aluminum substrate 2 and a main board 3 disposed on the housing 1. The aluminum substrate 2 is provided with a plurality of surface-mount power heating elements 21, a plurality of mounting holes 20 and pins 22. The mounting holes 20 are suitable for placing mounting parts 23 that are fixedly connected to the housing 1, and the pins 22 are suitable for fixedly connecting to the negative terminal of the main board 3. The aluminum substrate 2 is also provided with an electrostatic discharge protection circuit, which is suitable for releasing the static electricity on the housing 1 to the negative terminal of the main board 3 through the mounting parts 23 in the mounting holes 20 and the pins 22 of the aluminum substrate 2.

[0034] In this embodiment, the surface-mount power heating element 21 is disposed on the aluminum substrate 2. The aluminum substrate 2 not only has better heat dissipation performance, but also can carry higher current, so that a surface-mount power heating element 21 with higher power can be used. The aluminum substrate 2 is also suitable for setting electrostatic protection circuit, so that the static electricity on the housing 1 is released to the negative terminal of the motherboard 3 through the mounting part 23 and the pin 22. The static electricity on the housing 1 can be quickly absorbed and discharged, increasing the safety performance of the electric bicycle controller.

[0035] Specifically, the aluminum substrate 2 has mounting holes 20, and the mounting component 23 is adapted to pass through the mounting holes 20 and be fixedly connected to the housing 1, so that the aluminum substrate 2 is fixedly installed on the housing 1. The mounting component 23 includes, but is not limited to, screws, bolts, etc., and the mounting component 23 only needs to be able to fix the connection and transfer static electricity. The surface-mount power heating element 21 is directly soldered and fixed to the surface of the aluminum substrate 2. The aluminum substrate 2 also serves as a heat sink, which greatly increases the heat dissipation area of ​​the surface-mount power heating element 21 and improves the heat dissipation performance of the surface-mount power heating element 21. With the improved heat dissipation performance of the surface-mount power heating element 21, it is possible to use surface-mount power heating elements 21 with higher power. The aluminum substrate 2 does not only have a simple heat conduction function, but also, as a circuit board, it can greatly increase the flow path of the main current, making the circuit circuit smoother, simpler, and lower in cost. That is, after the surface-mount power heating element 21 is set on the aluminum substrate 2, there is more installation space on the main board 3, and the overall size of the main board 3 can be reduced, which is conducive to miniaturizing the electric bicycle controller of the main board 3.

[0036] The aluminum substrate 2 is connected to the main board 3 via pins 22. The aluminum substrate 2 and main board 3 are separately positioned, which facilitates heat dissipation of the surface-mount power heating element 21 on the aluminum substrate 2. The surface-mount power heating element 21 is a surface-mount MOSFET. An electrostatic discharge (ESD) protection circuit connects the mounting component 23 within the mounting hole 20 to the pins 22 of the aluminum substrate 2. The pins 22 are connected to the negative terminal of the main board 3, allowing static electricity on the housing 1 to be released to the negative terminal of the main board 3 through the mounting component 23 and the pins 22. The ESD protection circuit also allows for rapid absorption and discharge of static electricity on the housing 1, increasing the safety performance of the electric bicycle controller and preventing damage to the surface-mount power heating element 21 caused by static electricity. The mounting holes 20 are located between adjacent surface-mount power heating elements 21. In this application, two surface-mount power heating elements 21 are grouped together, with a total of three groups. A mounting hole 20 is provided between two adjacent groups. The number of surface-mount power heating elements 21 is not further limited in this application; this embodiment is merely an example. (Reference) Figure 2 and Figure 4 The electrostatic discharge protection circuit is also equipped with a discharge resistor 24 and a discharge capacitor 25. Some of the static electricity is absorbed by the discharge resistor 24 and the discharge capacitor 25, and the remaining static electricity after passing through the electrostatic discharge protection circuit is released through the negative terminal of the motherboard 3. Figure 4In this circuit, the bleeder resistor 24 is R5, the bleeder capacitor 25 is C1, and the surface-mount power heating element 21 is U7. The motherboard 3 also has a connection hole 31, which is suitable for connecting the negative terminal of the power supply component via a wire. Residual static electricity passing through the electrostatic discharge protection circuit reaches the negative terminal or ground through the connection hole 31 on the motherboard 3 and the wire.

[0037] It is worth noting that electrostatic discharge (ESD) refers to the discharge phenomenon that occurs when static charge is transferred between two objects. Although this discharge is extremely short-lived, it carries enormous energy, enough to damage electronic devices. In electronic devices, ESD can enter the device through interfaces, motherboards, etc., damaging sensitive components such as chips and capacitors.

[0038] Because this application uses an aluminum substrate 2, an electrostatic discharge (ESD) protection circuit can be arranged on the aluminum substrate 2. By connecting the mounting hole 20 as a path for the ESD protection circuit to the discharge resistor 24 and the discharge capacitor 25, external static electricity can be quickly absorbed and discharged.

[0039] Further, refer to Figure 2 and Figure 5 An absorption circuit is also provided on the aluminum substrate 2. The absorption circuit is connected to the negative terminal of the surface-mount power heating element 21 and the main board 3 to suppress and absorb the oscillation of the surface-mount power heating element 21.

[0040] In this embodiment, the absorption circuit can suppress and absorb the oscillation of the surface-mount power heating element 21, reduce EMI electromagnetic interference, improve the reliability and efficiency of the surface-mount power heating element 21, and achieve a higher operating frequency.

[0041] Specifically, electromagnetic interference (EMI) refers to the electromagnetic energy generated by electronic devices during operation. This energy propagates in the form of electromagnetic waves and may interfere with the normal operation of other electronic devices. In the operation of an electric bicycle controller, the high-frequency surface-mount power heating element 21 generates high-order harmonic oscillations, which can easily cause EMI problems. Adding an absorption circuit to the aluminum substrate 2, with its short return path, effectively suppresses and absorbs the oscillations of the surface-mount power heating element 21, reducing radiation. The absorption circuit includes an RC filter 26 and a capacitor filter 27 arranged side-by-side. The RC filter 26 includes an absorption resistor 261 and an absorption capacitor 262. Figure 5 In the above, the absorption resistor 261 is R6, the absorption capacitor 262 is C7, the capacitor filter 27 is C8, and the surface-mount power heating element 21 is U7 and U8. Among them, the pin 22 of the surface-mount power heating element 21 of U8 is connected to the ground line GND of the aluminum substrate 2. The GND on the aluminum substrate 2 is connected to the GND on the motherboard 3 through the pin 22.

[0042] It is worth noting that the electrostatic protection circuit and absorption circuit of the electric bicycle controller of this utility model have a reasonable and simple structure, without increasing the size, low cost, and are easy to use. They enhance the user's performance experience and solve some functional safety issues, enabling customers to use the device more safely and with greater peace of mind.

[0043] Further, refer to Figure 2 A temperature sensing resistor 28 is also provided on the aluminum substrate 2, and the temperature sensing resistor 28 is close to the surface-mount power heating element 21.

[0044] In this embodiment, the temperature sensing resistor 28 is placed next to the surface-mount power heating element 21, which can more accurately measure the current temperature of the surface of the surface-mount power heating element 21, thus facilitating the implementation of subsequent temperature protection functions.

[0045] Specifically, existing methods for measuring the temperature of a surface-mount power heating element 21 only allow the temperature sensing wire to be placed inside the heat sink aluminum strip or near the pin 22. This cannot accurately measure the surface temperature of the heating element. However, by using a surface-mount power heating element 21, the temperature sensing resistor 28 can be placed next to the surface-mount power heating element 21, or even placed on the insulating part of the surface-mount power heating element 21's outer shell, to accurately measure the current surface temperature of the surface-mount power heating element 21 and transmit it to the controller for temperature protection and other functions.

[0046] Further, refer to Figure 3 The aluminum substrate 2 is vertically positioned above the motherboard 3. The surface-mount power heating element 21 is positioned on one side of the aluminum substrate 2. The pin 22 is positioned at the bottom of the aluminum substrate 2 and is vertically connected to one end of the top surface of the motherboard 3.

[0047] In this embodiment, the aluminum substrate 2 is vertically disposed above the motherboard 3, and the pin 22 is vertically connected to one end of the motherboard 3. The aluminum substrate 2 is relatively flush with other components on the motherboard 3, which helps to reduce the overall height of the electric bicycle controller, making the electric bicycle controller very suitable for space-constrained applications.

[0048] Specifically, the motherboard 3 is placed horizontally, while the aluminum substrate 2 is vertical, perpendicular to the motherboard 3, and its length is approximately equal to that of the motherboard 3. The bottom of the aluminum substrate 2 has pins 22, which extend along its length and connect to one end of the top surface of the motherboard 3. The pins 22 include, but are not limited to, pins. Corresponding locations on the motherboard 3 have sockets, and the pins are adapted to be fixedly connected to these sockets. The sockets are also spaced along the length of the motherboard 3, and the pins are adapted to be fixedly connected to the sockets on the motherboard 3. Several components are also mounted on the upper surface of the motherboard 3. The height of these components is approximately the same as the vertical height of the aluminum substrate 2, resulting in a significant overlap between the height of the components and the area along the vertical height of the aluminum substrate 2. This reduces the overall height of the electric bicycle controller, making it more compact and ideal for space-constrained applications.

[0049] Furthermore, a heat dissipation copper fin 29 is provided on the aluminum substrate 2, and the heat dissipation copper fin 29 is located around the surface-mount power heating element 21.

[0050] In this embodiment, the heat dissipation copper sheet 29 is disposed around the surface-mount power heating element 21, which can increase the heat dissipation area of ​​the aluminum substrate 2 and improve the heat dissipation efficiency.

[0051] Specifically, since the surface-mount power heating element 21 is surrounded by heat dissipation copper fins 29, the heat dissipation area of ​​the aluminum substrate 2 can be increased, making the contact surface with the back heat sink much larger than a single area on the back of the surface-mount power heating element 21, resulting in better heat dissipation efficiency of the electric bicycle controller.

[0052] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this utility model. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. An electric bicycle controller, characterized in that, The device includes a housing, an aluminum substrate and a main board disposed on the housing. The aluminum substrate has a plurality of surface-mount power heating elements, a plurality of mounting holes and pins. The mounting holes are adapted to house mounting parts that are fixedly connected to the housing, and the pins are adapted to be fixedly connected to the negative terminal of the main board. The aluminum substrate also has an electrostatic discharge (ESD) protection circuit, which is adapted to release static electricity on the housing to the negative terminal of the main board through the mounting parts in the mounting holes and the pins of the aluminum substrate.

2. The electric bicycle controller according to claim 1, characterized in that, The electrostatic discharge protection circuit is also provided with a discharge resistor and a discharge capacitor. Some of the static electricity is absorbed by the discharge resistor and the discharge capacitor. The remaining static electricity after passing through the electrostatic discharge protection circuit is released through the negative terminal of the motherboard. The mounting component includes screws.

3. An electric bicycle controller according to claim 1, characterized in that, An absorption circuit is also provided on the aluminum substrate. The absorption circuit is connected to the negative terminal of the surface-mount power heating element and the main board, and is used to suppress and absorb the oscillation of the surface-mount power heating element.

4. An electric bicycle controller according to claim 3, characterized in that, The absorption circuit includes an RC filter and a capacitor filter arranged side by side, and the RC filter includes an absorption resistor and an absorption capacitor.

5. An electric bicycle controller according to claim 1, characterized in that, The aluminum substrate is also provided with a temperature sensing resistor, which is close to the surface-mount power heating element.

6. An electric bicycle controller according to any one of claims 1-5, characterized in that, The aluminum substrate is vertically disposed above the motherboard, the surface-mount power heating element is disposed on one side of the aluminum substrate, the pin is disposed at the bottom of the aluminum substrate, and the pin is vertically connected to one end of the top surface of the motherboard.

7. An electric bicycle controller according to claim 6, characterized in that, The pins include connectors, and the motherboard has a corresponding socket, the connectors being adapted to be fixedly connected to the socket.

8. An electric bicycle controller according to claim 6, characterized in that, The surface-mount power heating element is a surface-mount MOSFET.

9. An electric bicycle controller according to claim 6, characterized in that, The aluminum substrate is also provided with heat dissipation copper fins, which are located around the surface-mount power heating element.

10. An electric bicycle controller according to claim 1, characterized in that, The motherboard is also provided with a connection hole, which is suitable for connecting the negative terminal of the power supply component through a wire.

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