High-frequency heat dissipation circuit board

Abstract

The utility model discloses a high-frequency heat dissipation circuit board, which belongs to the field of heat dissipation of circuit boards and comprises a high-frequency circuit board with heat through holes, heat dissipation fins are adhered to the surface of the high-frequency circuit board, a heat dissipation mounting seat is arranged at the bottom of the high-frequency circuit board, heat dissipation grooves are formed in the heat dissipation fins, and heat dissipation attaching sheets are slidably connected to the inner wall of the heat dissipation mounting seat. And wind direction adjusting fan blades are rotationally connected into the heat dissipation mounting seat in a limiting manner. According to the utility model, through the cooperation of the wind direction adjusting fan blades and the heat dissipation attaching sheets, when the heat dissipation equipment generates downward airflow, the wind direction adjusting fan blades deflect along with the airflow, and extrude the bottoms of the heat dissipation attaching sheets under the action of the limiting chutes, so that the bottoms of the heat dissipation attaching sheets are lifted and attached to the heat dissipation sheets at the bottom of the high-frequency circuit board; the heat of the circuit board is transferred to the heat dissipation attaching sheet, and then the heat on the heat dissipation attaching sheet and the heat dissipation sheet is taken away by the air flow, so that the heat dissipation process is accelerated, and the effect of improving the heat dissipation performance of the high-frequency circuit board is achieved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for circuit boards, and in particular to a high-frequency heat dissipation circuit board. Background Technology

[0002] Existing high-frequency circuit boards have a large number of high-frequency electronic components, which generate a lot of heat. Moreover, most existing high-frequency circuit boards are fixed to the mounting parts, which makes the bottom of the circuit board fit tightly against the surface of the mounting part. This is not conducive to heat dissipation, which can lead to overheating of the circuit board, accelerated component aging, and degraded component performance or permanent damage.

[0003] Therefore, a high-frequency heat dissipation circuit board is proposed. Utility Model Content

[0004] The purpose of this invention is to solve the problem that in the existing technology, most high-frequency circuit boards are fixed to the mounting parts in a fixed manner, which makes the bottom of the circuit board and the surface of the mounting part fit tightly together, which is not conducive to heat dissipation of the circuit board, resulting in overheating of the circuit board, accelerated aging of components, and deterioration or permanent damage to the components. Therefore, this invention proposes a high-frequency heat dissipation circuit board.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-frequency heat dissipation circuit board includes a high-frequency circuit board with heat-through holes, a heat sink is attached to the surface of the high-frequency circuit board, and a heat dissipation mounting base is provided at the bottom of the high-frequency circuit board. The heat sink has heat dissipation grooves, a heat dissipation bonding sheet is slidably connected to the inner wall of the heat dissipation mounting base, and an airflow adjustment fan blade is rotatably connected to the inner limit of the heat dissipation mounting base.

[0007] Preferably, the heat dissipation grooves are symmetrically arranged on the upper and lower surfaces of the heat sink, and the opening directions of the two heat dissipation grooves are perpendicular to each other.

[0008] Preferably, the inner wall of the heat sink is provided with heat dissipation holes, and the two heat dissipation grooves on the upper and lower surfaces are connected through the heat dissipation holes.

[0009] Preferably, the heat dissipation bonding sheet has heat conduction holes adapted to the heat dissipation holes, and the bottom of the heat dissipation bonding sheet is in contact with the airflow adjustment fan blades.

[0010] Preferably, a balance column is provided at the bottom of the wind direction regulating fan blade, and the cross-section of the balance column is set as semi-circular.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. By coordinating the airflow adjustment fan blades and the heat dissipation pad, when the cooling device generates a downward airflow, the airflow adjustment fan blades will deflect with the airflow and, under the action of the limiting slide groove, squeeze the bottom of the heat dissipation pad, causing it to rise and adhere to the heat sink at the bottom of the high-frequency circuit board. In this way, the heat from the circuit board is transferred to the heat dissipation pad, and then the airflow carries away the heat from the heat dissipation pad and the heat sink, accelerating the heat dissipation process.

[0013] 2. By using symmetrically arranged heat sinks, when the temperature of the high-frequency circuit board is too high, the heat is transferred outward through the heat sink and heat dissipation holes, and heat exchange is achieved by using the airflow of the existing heat dissipation equipment. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a high-frequency heat dissipation circuit board proposed in this utility model.

[0015] Figure 2 This is a schematic diagram of the structure and assembly of a high-frequency heat dissipation circuit board proposed in this utility model;

[0016] Figure 3 This is a schematic cross-sectional view of the internal structure of the heat dissipation mounting base for a high-frequency heat dissipation circuit board proposed in this utility model.

[0017] Figure 4 This is a schematic diagram of the heat sink structure of a high-frequency heat dissipation circuit board proposed in this utility model.

[0018] In the diagram: 1. High-frequency circuit board; 2. Heat sink; 201. Heat sink groove; 202. Heat dissipation hole; 3. Heat dissipation mounting base; 4. Heat dissipation bonding sheet; 401. Heat conduction hole; 5. Airflow adjustment fan blade; 501. Balance column. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0020] Reference Figures 1-4 A high-frequency heat dissipation circuit board includes a high-frequency circuit board 1 with heat-through holes, a heat sink 2 attached to the surface of the high-frequency circuit board 1, and a heat dissipation mounting base 3 provided at the bottom of the high-frequency circuit board 1.

[0021] It should be noted that: the high-frequency circuit board 1 is fixedly mounted on the heat sink mounting base 3 with screws and is electrically connected to the interface provided on the heat sink mounting base 3. The heat sink 2 is respectively set to fit the upper and lower surfaces of the high-frequency circuit board 1. It is a common practice to set a cooling fan in the working area of ​​the high-frequency circuit board 1. It will not be described in detail in the following description of the cooling fan.

[0022] like Figure 4 As shown, heat sink 2 has heat dissipation grooves 201, which are symmetrically arranged on the upper and lower surfaces of heat sink 2, and the grooves of the two heat dissipation grooves 201 are perpendicular to each other.

[0023] Furthermore, the inner wall of the heat sink 2 is provided with heat dissipation holes 202, and the two heat dissipation grooves 201 on the upper and lower surfaces are connected through the heat dissipation holes 202.

[0024] It should be noted that when the operating temperature of the high-frequency circuit board 1 is too high, the heat on the surface of the high-frequency circuit board 1 can be transferred to the outside through the heat dissipation holes 202 via the heat dissipation slots 201, and the heat exchange can be completed under the airflow of the existing heat dissipation equipment, thereby realizing the heat dissipation function of the high-frequency circuit board 1.

[0025] The further advantage of the above is that by also setting a heat dissipation groove 201 between the high-frequency circuit board 1 and the heat sink 2, it is possible to avoid the high-frequency circuit board 1 being at risk of burning out due to the lack of air circulation at the contact point between the high-frequency circuit board 1 and the heat sink 2, which would prevent the high-frequency circuit board 1 from being unable to exchange heat with the outside air in time.

[0026] Based on the above, the heat dissipation slots 201 are connected by heat dissipation holes 202, which allows the heat in the heat dissipation slots 201 near the high frequency circuit board 1 to be discharged in time through the heat dissipation slots 201 on the outside, increasing the heat dissipation path of the heat sink 2 and avoiding overheating caused by the slow flow of high temperature air on the surface of the high frequency circuit board 1.

[0027] like Figure 2 and Figure 3 As shown, a heat dissipation bonding plate 4 is slidably connected to the inner wall of the heat dissipation mounting base 3, and an air direction adjustment fan blade 5 is rotatably connected to the inner limit of the heat dissipation mounting base 3.

[0028] Furthermore, the heat dissipation bonding sheet 4 has heat conduction holes 401 that are adapted to the heat dissipation holes 202, and the bottom of the heat dissipation bonding sheet 4 is in contact with the airflow adjustment fan blade 5.

[0029] Furthermore, a balance column 501 is provided at the bottom of the wind direction regulating fan blade 5, and the cross-section of the balance column 501 is set as a semi-circle;

[0030] It should be noted that when the existing heat dissipation equipment generates airflow downward from one side of the high-frequency circuit board 1, it will cause the airflow adjustment fan blade 5 to deflect with the airflow. Under the limiting action of the limiting groove opened on the inner wall of the heat dissipation mounting base 3, the bottom of the heat dissipation bonding piece 4 is squeezed and the heat dissipation bonding piece 4 is lifted, so that it is in contact with the heat sink 2 at the bottom of the high-frequency circuit board 1. This transfers the temperature in the circuit board to the heat dissipation bonding piece 4, and the heat on the heat dissipation bonding piece 4 and the heat sink 2 is carried away by the airflow, thus accelerating the heat dissipation process of the high-frequency circuit board 1 and achieving the effect of improving the heat dissipation performance of the high-frequency circuit board 1.

[0031] The further advantage of the above is that when no heat dissipation equipment generates airflow, the airflow adjustment fan blade 5 will rotate to a horizontal state under the action of the balance column 501 and the gravity of the heat dissipation bonding plate 4, so that the heat dissipation bonding plate 4 falls to the bottom and is not attached to the heat sink 2 at the bottom of the high frequency circuit board 1 at all times, thereby keeping the heat dissipation bonding plate 4 at a low temperature, which can work with the existing cooling fan to improve the heat dissipation performance of the high frequency circuit board 1.

[0032] Based on the above, when the airflow-adjusting fan blade 5 is rotated by the airflow, the airflow space between the airflow-adjusting fan blade 5 and the heat dissipation mounting base 3 will be reduced, causing a large amount of airflow to blow from the heat dissipation bonding plate 4 to the high-frequency circuit board 1, accelerating the airflow speed, and causing the cooler airflow to flow upward from the bonding area of ​​the high-frequency circuit board 1, thus avoiding the inability to dissipate heat from the bonding area between the high-frequency circuit board 1 and the mounting area in a timely manner.

[0033] Working principle:

[0034] When this utility model is in use, if the operating temperature of the high-frequency circuit board 1 is too high, the heat on the surface of the high-frequency circuit board 1 can be transferred to the outside through the heat dissipation holes 202 through the heat dissipation groove 201, and the heat exchange is completed under the airflow of the existing heat dissipation equipment, thereby realizing the heat dissipation function of the high-frequency circuit board 1.

[0035] Based on the above, when the existing heat dissipation equipment generates airflow downwards from one side of the high-frequency circuit board 1, it will cause the airflow direction adjustment fan blade 5 to deflect with the airflow. Under the limiting action of the limiting groove opened in the inner wall of the heat dissipation mounting base 3, the bottom of the heat dissipation bonding piece 4 is squeezed and the heat dissipation bonding piece 4 is lifted, so that it is in contact with the heat sink 2 at the bottom of the high-frequency circuit board 1. This transfers the temperature in the circuit board to the heat dissipation bonding piece 4, and the heat on the heat dissipation bonding piece 4 and the heat sink 2 is carried away by the airflow, thus accelerating the heat dissipation process of the high-frequency circuit board 1 and achieving the effect of improving the heat dissipation performance of the high-frequency circuit board 1.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-frequency heat dissipation circuit board, comprising a high-frequency circuit board (1) with heat-perforated vias, characterized in that, The surface of the high-frequency circuit board (1) is covered with a heat sink (2), and a heat sink mounting base (3) is provided at the bottom of the high-frequency circuit board (1). A heat sink groove (201) is provided on the heat sink (2). A heat sink bonding sheet (4) is slidably connected to the inner wall of the heat sink mounting base (3), and a wind direction adjusting fan blade (5) is rotatably connected to the inside of the heat sink mounting base (3).

2. The high-frequency heat dissipation circuit board according to claim 1, characterized in that, The heat dissipation grooves (201) are symmetrically arranged on the upper and lower surfaces of the heat sink (2), and the groove directions of the two heat dissipation grooves (201) are perpendicular to each other.

3. A high-frequency heat dissipation circuit board according to claim 1, characterized in that, The heat sink (2) has heat dissipation holes (202) on its inner wall, and the two heat dissipation grooves (201) on its upper and lower surfaces are connected through the heat dissipation holes (202).

4. A high-frequency heat dissipation circuit board according to claim 3, characterized in that, The heat dissipation bonding sheet (4) has heat conduction holes (401) that are compatible with the heat dissipation holes (202), and the bottom of the heat dissipation bonding sheet (4) is in contact with the airflow adjustment fan blade (5).

5. A high-frequency heat dissipation circuit board according to claim 1, characterized in that, The bottom of the wind direction regulating fan blade (5) is provided with a balance column (501), and the cross-section of the balance column (501) is set as a semi-circle.

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