Multi-channel programmable signal generator module
By using a bridge to separate the main control module from other modules in the multi-channel programmable signal generator module, and utilizing independent heat dissipation areas and thermally conductive materials for heat dissipation, the heat dissipation problem during multi-channel operation is solved, achieving efficient thermal management.
Patent Information
- Application Number
- CN202520503839.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-21
AI Technical Summary
Multi-channel programmable signal generator modules generate a lot of heat during operation, resulting in significant heat dissipation pressure, especially when multiple channels are operating simultaneously, and existing technologies struggle to effectively solve the heat dissipation problem.
A multi-channel programmable signal generator module was designed, using a bridge as the platform for the main control module, which is elevated and separated from other modules. A partition is installed in the middle of the substrate for physical isolation, and an independent heat dissipation area is adopted. Heat dissipation is achieved by combining a high thermal conductivity interface layer, a thermally conductive layer and a large area heat sink.
Through independent heat dissipation zone design and efficient heat dissipation measures, the lateral diffusion of heat is effectively reduced, heat dissipation efficiency is improved, and the stable operation of the multi-channel signal generator is ensured.
Smart Images
Figure CN223943063U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of signal generator technology, and in particular to a multi-channel programmable signal generator module. Background Technology
[0002] Signal generators are used to produce electrical test signals with specific parameters. These signals can simulate signals in actual circuits and are used in fields such as testing, research and development, repair, measurement, and calibration. They are the best tool for electronic engineers to conduct signal simulation experiments and play a vital role in electronic experiments and test processing.
[0003] Multi-channel programmable signal generator modules generate significant heat during operation, placing considerable pressure on heat dissipation. These modules require high output power to meet various testing demands. This means that components in the circuit must withstand greater current and voltage, resulting in increased heat generation. Especially when multiple channels operate simultaneously, each channel contributes heat, leading to a significant increase in overall heat generation. Therefore, a multi-channel programmable signal generator module is proposed to address these issues. Utility Model Content
[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.
[0005] Therefore, one objective of this utility model is to propose a multi-channel programmable signal generator module to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.
[0006] To achieve the above objectives, one embodiment of the present invention provides a multi-channel programmable signal generator module, including a substrate, a bridge, and a main control module. The bridge is fixedly connected to the top of the substrate, the bridge is raised, and the main control module is mounted on the top surface of the bridge.
[0007] The top surface of the substrate is equipped with a signal generation module, a digital-to-analog conversion module, a signal conditioning module, a multi-channel output module, a power management module, and a synchronous triggering module.
[0008] Several interfaces are installed at the edge of the top surface of the substrate. A partition is fixedly connected to the middle of the top surface of the substrate. The top of the partition is inclined outward. The signal generation module, signal conditioning module, and multi-channel output module are located on one side of the partition, and the digital-to-analog conversion module, power management module, and synchronous triggering module are located on the other side of the partition.
[0009] The top surface of the signal generation module, digital-to-analog conversion module, signal conditioning module, multi-channel output module, power management module, and synchronous triggering module is covered with an interface layer. The top surface of the interface layer is covered with a heat-conducting layer, and several heat sinks are fixedly connected to the top surface of the heat-conducting layer.
[0010] Preferably, in any of the above schemes, the main control module is connected to the signal generation module, the digital-to-analog conversion module, the synchronization triggering module, and the power management module via a bus.
[0011] Using the above technical solution: users set waveform parameters (frequency, amplitude, phase) through software.
[0012] The main control module sends parameters to the signal generation module to generate digital waveform data.
[0013] A DAC converts digital signals into analog signals, which are then amplified / filtered and output to a specified channel.
[0014] The synchronization module ensures phase alignment between multiple channels (e.g., in MIMO system testing).
[0015] The trigger module responds to external events (such as pulse edges) and dynamically adjusts the output state.
[0016] Preferably, in any of the above schemes, the output of the signal generation module is sequentially connected to the digital-to-analog conversion module, the signal conditioning module, and the multi-channel output module.
[0017] The above technical solution is adopted: the cable tray, serving as a platform for installing the main control module, is elevated and not concentrated with other modules, which facilitates its heat dissipation.
[0018] Main control module, function: core control and data processing, composition: processor (such as ARM, FPGA or DSP): responsible for algorithm calculation and parameter configuration.
[0019] Software platform: Provides user interface (GUI / API) and programming interface (such as LabVIEW, Python).
[0020] Supports waveform generation algorithms (sine wave, square wave, arbitrary waveform, etc.).
[0021] It enables channel synchronization, phase control, and triggering functions.
[0022] Signal generation module: Function: Generate basic signals
[0023] composition:
[0024] Digital signal source: Waveform generation is implemented based on DDS (Direct Digital Synthesis) or FPGA.
[0025] Memory (RAM / ROM): Stores preset waveform data (such as arbitrary waveform ARB).
[0026] Clock source: High-precision crystal oscillator or external clock input to ensure signal frequency stability.
[0027] Digital-to-analog converter module: Function: Converts digital signals into analog signals.
[0028] Key parameters:
[0029] Resolution (e.g., 16-bit / 24-bit) determines signal accuracy.
[0030] The slew rate (e.g., 1 GSPS) determines the maximum output frequency.
[0031] Signal conditioning module: Function: Optimizes output signal quality
[0032] composition:
[0033] Amplifier (voltage / power amplifier): Adjusts the signal amplitude (e.g., ±10V).
[0034] Filters (low-pass / band-pass): suppress high-frequency noise and harmonics.
[0035] Attenuator: Enables dynamic range control.
[0036] Multi-channel output module:
[0037] Function: Independent or synchronous output of multiple signals
[0038] composition:
[0039] Channel switching matrix: Supports multiplexing or independent output.
[0040] Isolation circuit (optocoupler / transformer): Prevents crosstalk between channels.
[0041] Impedance matching network (e.g., 50Ω / 75Ω): adapts to load requirements.
[0042] Power Management Module: Function: Provides stable power supply.
[0043] composition:
[0044] Multi-stage voltage regulator circuits (LDO, DC-DC).
[0045] Overvoltage / overcurrent protection circuit.
[0046] Low-noise design to reduce power supply interference.
[0047] Synchronization and Triggering Module:
[0048] Function: Enables multi-channel synchronization and external triggering.
[0049] composition:
[0050] Clock distribution circuit: Ensures phase consistency across all channels.
[0051] Triggering interface (such as TTL / ECL): Supports the generation of external event trigger signals.
[0052] Preferably, in any of the above solutions, the power management module provides power to all modules after stabilizing the output voltage.
[0053] Preferably, in any of the above embodiments, the partition is bonded to the substrate, and the partition is made of ceramic.
[0054] Core Design:
[0055] The multi-channel signal generator features a specially designed cable tray. This tray serves as a platform for installing the main control module, and its elevated position separates it from other modules, allowing for better airflow and heat dissipation.
[0056] A partition is installed in the middle of the top surface of the substrate, using heat-insulating material to separate high-heat-generating modules such as the signal generation module and the digital-to-analog converter module, achieving physical isolation. The signal generation module, signal conditioning module, and multi-channel output module are located on one side of the partition, while the digital-to-analog converter module, power management module, and synchronous trigger module are located on the other side. Independent heat dissipation zones are adopted, with independent heat dissipation in the two zones to avoid lateral heat diffusion. At the same time, high thermal conductivity interface layers and thermal conductive layers are used in both zones to conduct heat away from multiple points, and large-area heat sinks are used for heat dissipation, thereby achieving efficient heat dissipation of this multi-channel signal generator module.
[0057] Preferably, in any of the above solutions, the interface layer is made of silicone grease, and the thermally conductive layer is specifically a copper foil layer.
[0058] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:
[0059] This multi-channel programmable signal generator module features a special design based on the multi-channel signal generator. The cable tray, serving as a platform for installing the main control module, is elevated and not concentrated with other modules. The elevated position provides better air circulation, which is beneficial for heat dissipation.
[0060] A partition is installed in the middle of the top surface of the substrate, using heat-insulating material to separate high-heat-generating modules such as the signal generation module and the digital-to-analog converter module, achieving physical isolation. The signal generation module, signal conditioning module, and multi-channel output module are located on one side of the partition, while the digital-to-analog converter module, power management module, and synchronous trigger module are located on the other side. Independent heat dissipation zones are adopted, with independent heat dissipation in the two zones to avoid lateral heat diffusion. At the same time, high thermal conductivity interface layers and thermal conductive layers are used in both zones to conduct heat away from multiple points, and large-area heat sinks are used for heat dissipation, thereby achieving efficient heat dissipation of this multi-channel signal generator module.
[0061] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0062] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0063] Figure 1 This is a first-view structural schematic diagram of the present invention;
[0064] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;
[0065] Figure 3 This is a schematic diagram of the interface layer of this utility model.
[0066] In the diagram: 1-substrate, 2-bridge, 3-main control module, 4-signal generation module, 5-digital-to-analog conversion module, 6-signal conditioning module, 7-multi-channel output module, 8-power management module, 9-synchronous trigger module, 10-interface, 11-partition, 12-interface layer, 13-thermal conductive layer, 14-heat sink. Detailed Implementation
[0067] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0068] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0069] like Figure 1-3 As shown, this multi-channel programmable signal generator module includes a base plate 1, a bridge 2, and a main control module 3. The bridge 2 is fixedly connected to the top of the base plate 1. The bridge 2 is raised, and the main control module 3 is installed on the top surface of the bridge 2.
[0070] The top surface of substrate 1 is equipped with a signal generation module 4, a digital-to-analog conversion module 5, a signal conditioning module 6, a multi-channel output module 7, a power management module 8, and a synchronous triggering module 9;
[0071] Several interfaces 10 are installed at the edge of the top surface of the substrate 1. A partition 11 is fixedly connected to the middle of the top surface of the substrate 1. The top of the partition 11 is tilted outward. The signal generation module 4, the signal conditioning module 6, and the multi-channel output module 7 are located on one side of the partition 11. The digital-to-analog conversion module 5, the power management module 8, and the synchronous triggering module 9 are located on the other side of the partition 11.
[0072] The top surface of the signal generation module 4, digital-to-analog conversion module 5, signal conditioning module 6, multi-channel output module 7, power management module 8, and synchronous trigger module 9 is covered with an interface layer 12. The top surface of the interface layer 12 is covered with a heat-conducting layer 13. Several heat sinks 14 are fixedly connected to the top surface of the heat-conducting layer 13.
[0073] Example 1: The main control module 3 is connected to the signal generation module 4, the digital-to-analog converter module 5, the synchronous trigger module 9, and the power management module 8 via a bus. The output of the signal generation module 4 is sequentially connected to the digital-to-analog converter module 5, the signal conditioning module 6, and the multi-channel output module 7. The power management module 8 provides power to all modules after stabilizing the output. The partition 11 is bonded to the substrate 1, and the material of the partition 11 is ceramic. The interface layer 12 is made of silicone grease, and the thermally conductive layer 13 is specifically a copper foil layer.
[0074] Example 2: Main control module 3, function: core control and data processing, composition: processor (such as ARM, FPGA or DSP): responsible for algorithm operation and parameter configuration.
[0075] Software platform: Provides user interface (GUI / API) and programming interface (such as LabVIEW, Python).
[0076] Supports waveform generation algorithms (sine wave, square wave, arbitrary waveform, etc.).
[0077] It enables channel synchronization, phase control, and triggering functions.
[0078] Signal Generation Module 4: Function: Generates basic signals
[0079] composition:
[0080] Digital signal source: Waveform generation is implemented based on DDS (Direct Digital Synthesis) or FPGA.
[0081] Memory (RAM / ROM): Stores preset waveform data (such as arbitrary waveform ARB).
[0082] Clock source: High-precision crystal oscillator or external clock input to ensure signal frequency stability.
[0083] Digital-to-analog converter module 5: Function: Converts digital signals into analog signals.
[0084] Key parameters:
[0085] Resolution (e.g., 16-bit / 24-bit) determines signal accuracy.
[0086] The slew rate (e.g., 1 GSPS) determines the maximum output frequency.
[0087] Signal Conditioning Module 6: Function: Optimizes output signal quality
[0088] composition:
[0089] Amplifier (voltage / power amplifier): Adjusts the signal amplitude (e.g., ±10V).
[0090] Filters (low-pass / band-pass): suppress high-frequency noise and harmonics.
[0091] Attenuator: Enables dynamic range control.
[0092] Multi-channel output module 7:
[0093] Function: Independent or synchronous output of multiple signals
[0094] composition:
[0095] Channel switching matrix: Supports multiplexing or independent output.
[0096] Isolation circuit (optocoupler / transformer): Prevents crosstalk between channels.
[0097] Impedance matching network (e.g., 50Ω / 75Ω): adapts to load requirements.
[0098] Power Management Module 8: Function: Provides stable power supply.
[0099] composition:
[0100] Multi-stage voltage regulator circuits (LDO, DC-DC).
[0101] Overvoltage / overcurrent protection circuit.
[0102] Low-noise design to reduce power supply interference.
[0103] Synchronization and Triggering Module 9:
[0104] Function: Enables multi-channel synchronization and external triggering.
[0105] composition:
[0106] Clock distribution circuit: Ensures phase consistency across all channels.
[0107] Triggering interface (such as TTL / ECL): Supports the generation of external event trigger signals.
[0108] The working principle of this utility model is as follows:
[0109] Users set waveform parameters (frequency, amplitude, phase) through the software.
[0110] The main control module 3 sends the parameters to the signal generation module 4 to generate digital waveform data.
[0111] A DAC converts digital signals into analog signals, which are then amplified / filtered and output to a specified channel.
[0112] The synchronization module ensures phase alignment between multiple channels (e.g., in MIMO system testing).
[0113] The trigger module responds to external events (such as pulse edges) and dynamically adjusts the output state.
[0114] Compared with the prior art, the present invention has the following advantages:
[0115] This multi-channel programmable signal generator module is specially designed based on the multi-channel signal generator. The cable tray 2 serves as a platform for installing the main control module 3. It is elevated and not concentrated with other modules. The elevated position can provide better air circulation and facilitate its heat dissipation.
[0116] A partition 11 is installed in the middle of the top surface of the substrate 1. It is made of heat insulation material to separate high-heat modules such as signal generation module 4 and digital-to-analog conversion module 5, achieving physical isolation. Signal generation module 4, signal conditioning module 6, and multi-channel output module 7 are located on one side of partition 11, while digital-to-analog conversion module 5, power management module 8, and synchronous trigger module 9 are located on the other side of partition 11. Independent heat dissipation areas are adopted, and the heat dissipation of the two areas is independent to avoid lateral heat diffusion. At the same time, the two areas use a high thermal conductivity interface layer 12 and a thermal conductivity layer 13 to conduct heat out from multiple points, and use a large area heat sink 14 for heat dissipation, thereby achieving efficient heat dissipation of this multi-channel signal generator module.
Claims
1. A multi-channel programmable signal generator module, characterized in that, Includes a base plate (1), a cable tray (2), and a main control module (3). The top of the base plate (1) is fixedly connected to the cable tray (2), the cable tray (2) is raised, and the main control module (3) is installed on the top surface of the cable tray (2). The top surface of the substrate (1) is equipped with a signal generation module (4), a digital-to-analog conversion module (5), a signal conditioning module (6), a multi-channel output module (7), a power management module (8), and a synchronous triggering module (9). Several interfaces (10) are installed at the edge of the top surface of the substrate (1). A partition (11) is fixedly connected to the middle of the top surface of the substrate (1). The top of the partition (11) is inclined outward. The signal generation module (4), signal conditioning module (6), and multi-channel output module (7) are located on one side of the partition (11). The digital-to-analog conversion module (5), power management module (8), and synchronous triggering module (9) are located on the other side of the partition (11). The top surface of the signal generation module (4), digital-to-analog conversion module (5), signal conditioning module (6), multi-channel output module (7), power management module (8), and synchronous triggering module (9) is covered with an interface layer (12), and the top surface of the interface layer (12) is covered with a heat-conducting layer (13), and a number of heat sinks (14) are fixedly connected to the top surface of the heat-conducting layer (13).
2. The multi-channel programmable signal generator module as described in claim 1, characterized in that: The main control module (3) is connected to the signal generation module (4), the digital-to-analog conversion module (5), the synchronous triggering module (9), and the power management module (8) via a bus.
3. The multi-channel programmable signal generator module as described in claim 2, characterized in that: The output of the signal generation module (4) is sequentially connected to the digital-to-analog conversion module (5), the signal conditioning module (6), and the multi-channel output module (7).
4. The multi-channel programmable signal generator module as described in claim 3, characterized in that: The power management module (8) provides power to all modules after stabilizing the output voltage.
5. A multi-channel programmable signal generator module as described in claim 4, characterized in that: The partition (11) is bonded to the substrate (1), and the partition (11) is made of ceramic.
6. The multi-channel programmable signal generator module as described in claim 5, characterized in that: The interface layer (12) is made of silicone grease, and the thermal conductive layer (13) is specifically a copper foil layer.