Cleaning line of wafer corrosion cleaning system

Abstract

The utility model relates to a cleaning line of a wafer corrosion cleaning system, and belongs to the field of semiconductor cleaning. The device comprises a strong alkali corrosion pool, a spray cleaning pool, an ultrasonic cleaning pool, a drying pool and a cleaning platform, the strong alkali corrosion pool, the spray cleaning pool, the ultrasonic cleaning pool and the drying pool are sequentially arranged on the cleaning platform, and the device is structurally characterized in that the strong alkali corrosion pool is matched with a flip mechanism; the cover turning mechanism comprises a fixed seat, a cover turning air cylinder, telescopic teeth, a turning gear, a turning shaft, a turning plate, a turning frame and a turning cover, the fixed seat is fixed on a cylinder barrel of the cover turning air cylinder, the telescopic teeth are arranged on a piston rod of the cover turning air cylinder, the telescopic teeth are meshed with the turning gear, the turning gear is installed on the fixed seat through the turning shaft, and the turning plate is arranged on the turning frame. The overturning gear is fixed to the overturning plate, the overturning plate is connected with one end of the overturning frame, and the other end of the overturning frame is connected with the overturning cover.

Description

Technical Field

[0001] This utility model relates to a cleaning line of a wafer etching and cleaning system, belonging to the field of semiconductor cleaning. Background Technology

[0002] To ensure high reliability, stability, and lifespan of semiconductor silicon wafer devices, improve the yield of semiconductor silicon wafer products, and avoid circuit failure caused by contaminant contamination, semiconductor silicon wafers need to be cleaned. The cleaning process typically includes strong alkaline etching, spray cleaning, ultrasonic cleaning, and drying. Currently, the cleaning processes are independent of each other, and it is impossible to complete the functions of strong alkaline etching, spray cleaning, ultrasonic cleaning, and drying in the same system. They need to be carried out separately. After strong alkaline etching, the strong alkaline etching tank needs to be covered manually with a cover plate, as it cannot be automatically covered. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned deficiencies in the existing technology and to provide a cleaning line for a wafer etching and cleaning system with a reasonable structural design.

[0004] The technical solution adopted by this utility model to solve the above problems is as follows: the cleaning line of the wafer etching and cleaning system includes a strong alkaline etching tank, a spray cleaning tank, an ultrasonic cleaning tank, a drying tank, and a cleaning platform. The strong alkaline etching tank, the spray cleaning tank, the ultrasonic cleaning tank, and the drying tank are arranged sequentially on the cleaning platform. Its structural feature is that the strong alkaline etching tank cooperates with a flip-top mechanism. The flip-top mechanism includes a fixed base, a flip-top cylinder, a telescopic gear, a flip gear, a flip shaft, a flip plate, a flip frame, and a flip cover. The fixed base is fixed on the cylinder of the flip-top cylinder. The piston rod of the flip-top cylinder is provided with a telescopic gear. The telescopic gear meshes with the flip gear. The flip gear is installed on the fixed base through the flip shaft and is fixed to the flip plate. The flip plate is connected to one end of the flip frame, and the other end of the flip frame is connected to the flip cover.

[0005] Furthermore, a fixing bracket is installed on the cylinder barrel of the flip-top cylinder, and the fixing bracket is mounted on the machine frame.

[0006] Furthermore, an adjustment frame is fixed on the flip cover, and an adjustment hole is provided at the other end of the flip frame. The adjustment frame and the adjustment hole are connected by an adjustment shaft.

[0007] Furthermore, the adjustment hole is an oblong hole or a circular hole.

[0008] Furthermore, a limiting post is installed on the fixed base, and the limiting post contacts the flip plate.

[0009] Furthermore, a thrust ball bearing is fitted around the rotating shaft, and the two sides of the thrust ball bearing are in contact with the fixed seat and the rotating gear, respectively.

[0010] Furthermore, the spray cleaning tank includes a spray cleaning tank body, a spray cleaning head, and a spray cleaning head bracket. The spray cleaning head bracket is installed inside the spray cleaning tank body, and the spray cleaning head is installed on the spray cleaning head bracket.

[0011] Compared with the prior art, this utility model has the following advantages: This cleaning line can integrate strong alkali etching, spray cleaning, ultrasonic cleaning and drying into the same cleaning line. Through this cleaning line, the functions of strong alkali etching, spray cleaning, ultrasonic cleaning and drying of wafers can be realized in sequence. No independent operation is required, which can improve work efficiency. At the same time, after strong alkali etching, when spray cleaning, ultrasonic cleaning and drying are performed, the strong alkali etching tank can be automatically covered by the flip-top mechanism, which can improve safety without manual operation. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the cleaning line of the wafer etching and cleaning system according to an embodiment of the present invention.

[0013] Figure 2 This is a three-dimensional structural diagram of the flip-top mechanism according to an embodiment of the present utility model.

[0014] Figure 3 This is a three-dimensional structural diagram of the flip-top mechanism according to an embodiment of the present utility model.

[0015] Figure 4 This is a partial structural schematic diagram of the flip-top mechanism according to an embodiment of the present utility model.

[0016] Figure 5 This is a partial structural schematic diagram of the flip-top mechanism according to an embodiment of the present utility model.

[0017] Figure 6 This is a cross-sectional structural diagram of the flip-top mechanism (flip-top opening) of an embodiment of this utility model.

[0018] Figure 7 This is a cross-sectional structural schematic diagram of the flip-top mechanism (flip-top closing) of an embodiment of this utility model.

[0019] Figure 8 This is a three-dimensional structural diagram of the spray cleaning tank according to an embodiment of the present utility model.

[0020] In the diagram: Strong alkaline corrosion tank B1, spray cleaning tank B2, ultrasonic cleaning tank B3, drying tank B4, cleaning platform B5, flip-top mechanism B6.

[0021] Spray cleaning tank body B21, spray cleaning head B22, spray cleaning head support B23.

[0022] Fixed frame B61, fixed base B62, flip cover cylinder B63, telescopic gear B64, flip gear B65, flip shaft B66, flip plate B67, flip frame B68, flip cover B69, adjusting frame B6901, adjusting shaft B6902, adjusting hole B6903, limit post B6904, thrust ball bearing B6905. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and through embodiments. The following embodiments are explanations of the present invention, but the present invention is not limited to the following embodiments.

[0024] Example

[0025] See Figures 1 to 8 As shown in the accompanying drawings, the structures, proportions, sizes, etc., depicted in this specification are merely for illustrative purposes to aid those skilled in the art and to provide a clear understanding. They are not intended to limit the scope of this invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of this invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the use of terms such as "upper," "lower," "left," "right," "middle," and "one" in this specification is solely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0026] The cleaning line of the wafer etching and cleaning system in this embodiment includes a strong alkaline etching tank B1, a spray cleaning tank B2, an ultrasonic cleaning tank B3, a drying tank B4, and a cleaning platform B5. The strong alkaline etching tank B1, the spray cleaning tank B2, the ultrasonic cleaning tank B3, and the drying tank B4 are sequentially arranged on the cleaning platform B5. The strong alkaline etching tank B1 cooperates with the flip-top mechanism B6.

[0027] The flipping mechanism B6 in this embodiment includes a fixed base B62, a flipping cylinder B63, a telescopic gear B64, a flipping gear B65, a flipping shaft B66, a flipping plate B67, a flipping frame B68, and a flipping cover B69. The fixed base B62 is fixed on the cylinder of the flipping cylinder B63. A fixed frame B61 is installed on the cylinder of the flipping cylinder B63. The fixed frame B61 is installed on the frame. A limit post B6904 is installed on the fixed base B62. The limit post B6904 is in contact with the flipping plate B67.

[0028] In this embodiment, the piston rod of the flip-top cylinder B63 is provided with a telescopic tooth B64, which meshes with the flip gear B65. The flip gear B65 is mounted on the fixed seat B62 via the flip shaft B66 and is fixed to the flip plate B67. The flip shaft B66 is fitted with a thrust ball bearing B6905, and both sides of the thrust ball bearing B6905 are in contact with the fixed seat B62 and the flip gear B65, respectively. The flip plate B67 is connected to one end of the flip frame B68, and the other end of the flip frame B68 is connected to the flip cover B69.

[0029] In this embodiment, an adjustment bracket B6901 is fixed on the flip cover B69, and an adjustment hole B6903 is provided at the other end of the flip bracket B68. The adjustment bracket B6901 and the adjustment hole B6903 are connected by an adjustment shaft B6902. The adjustment hole B6903 is an oblong hole or a circular hole.

[0030] In this embodiment, the spray cleaning tank B2 includes a spray cleaning tank body B21, a spray cleaning head B22, and a spray cleaning head bracket B23. The spray cleaning head bracket B23 is installed inside the spray cleaning tank body B21, and the spray cleaning head B22 is installed on the spray cleaning head bracket B23.

[0031] Specifically, the cleaning line of this wafer etching and cleaning system can be used to clean wafers. The wafer cleaning process typically includes strong alkaline etching, spray cleaning, ultrasonic cleaning, and drying tanks, which are respectively achieved through strong alkaline etching tank B1, spray cleaning tank B2, ultrasonic cleaning tank B3, and drying tank B4. In the spray cleaning tank B2, the spray cleaning head B22 can be installed through the spray cleaning head bracket B23. The spray cleaning head B22 can be adjusted in angle and fixed to the spray cleaning head bracket B23.

[0032] The wafers are sequentially fed into a strong alkaline etching tank B1, a spray cleaning tank B2, an ultrasonic cleaning tank B3, and a drying tank B4 via a robotic arm to achieve strong alkaline etching, spray cleaning, ultrasonic cleaning, and drying. After the wafers have undergone strong alkaline etching, the strong alkaline etching tank B1 is sealed tightly by a flip-top mechanism B6 to prevent alkali splashing. When the flip-top mechanism B6 is in operation, the piston rod of the flip-top cylinder B63 extends and retracts, causing the telescopic gear B64 on the piston rod to drive the rotating gear B65 to rotate. The rotating gear B65 drives the rotating plate B67 to rotate, which in turn drives the rotating cover B69 to rotate via the rotating frame B68. The rotating cover B69 covers the strong alkaline etching tank B1. When the rotating frame B68 rotates, the tilted adjustment hole B6903 drives the adjustment shaft B6902 downward, thereby pressing the rotating cover B69 tightly.

[0033] Furthermore, it should be noted that the specific embodiments described in this specification may differ in the shape and name of their components. The above description is merely illustrative of the structure of this utility model. All equivalent or simple variations made based on the structure, features, and principles described in this utility model patent concept are included within the protection scope of this utility model patent. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, as long as they do not deviate from the structure of this utility model or exceed the scope defined in these claims, all of which should fall within the protection scope of this utility model.

Claims

1. A cleaning line for a wafer etching and cleaning system, comprising a strong alkaline etching tank (B1), a spray cleaning tank (B2), an ultrasonic cleaning tank (B3), a drying tank (B4), and a cleaning platform (B5), wherein the strong alkaline etching tank (B1), the spray cleaning tank (B2), the ultrasonic cleaning tank (B3), and the drying tank (B4) are sequentially arranged on the cleaning platform (B5), characterized in that: The strong alkali corrosion tank (B1) cooperates with the flip-top mechanism (B6); the flip-top mechanism (B6) includes a fixed base (B62), a flip-top cylinder (B63), a telescopic gear (B64), a flip gear (B65), a flip shaft (B66), a flip plate (B67), a flip frame (B68), and a flip cover (B69). The fixed base (B62) is fixed on the cylinder of the flip-top cylinder (B63). The piston rod of the flip-top cylinder (B63) is provided with a telescopic gear (B64). The telescopic gear (B64) meshes with the flip gear (B65). The flip gear (B65) is mounted on the fixed base (B62) through the flip shaft (B66), and the flip gear (B65) is fixed to the flip plate (B67). The flip plate (B67) is connected to one end of the flip frame (B68), and the other end of the flip frame (B68) is connected to the flip cover (B69).

2. The cleaning line of the wafer etching and cleaning system according to claim 1, characterized in that: The cylinder of the flip-top cylinder (B63) is equipped with a fixing bracket (B61), which is mounted on the frame.

3. The cleaning line of the wafer etching and cleaning system according to claim 1, characterized in that: An adjustment bracket (B6901) is fixed on the flip cover (B68), and an adjustment hole (B6903) is provided at the other end of the flip bracket (B68). The adjustment bracket (B6901) and the adjustment hole (B6903) are connected by an adjustment shaft (B6902).

4. The cleaning line of the wafer etching and cleaning system according to claim 3, characterized in that: The adjustment hole (B6903) is either an oblong hole or a circular hole.

5. The cleaning line of the wafer etching and cleaning system according to claim 1, characterized in that: A limiting post (B6904) is installed on the fixed base (B62), and the limiting post (B6904) contacts the flip plate (B67).

6. The cleaning line of the wafer etching and cleaning system according to claim 1, characterized in that: The rotating shaft (B66) is fitted with a thrust ball bearing (B6905), and the two sides of the thrust ball bearing (B6905) are in contact with the fixed seat (B62) and the rotating gear (B65) respectively.

7. The cleaning line of the wafer etching and cleaning system according to claim 1, characterized in that: The spray cleaning tank (B2) includes a spray cleaning tank body (B21), a spray cleaning head (B22), and a spray cleaning head bracket (B23). The spray cleaning head bracket (B23) is installed inside the spray cleaning tank body (B21), and the spray cleaning head (B22) is installed on the spray cleaning head bracket (B23).

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