Wafer test auxiliary device

Abstract

The utility model relates to the field of semiconductor testing, in particular to a wafer testing auxiliary device, which comprises a frame body, a wafer testing auxiliary device and a wafer testing auxiliary device, the rotating mechanism comprises an adsorption part used for adsorbing the dummy wafer, and the rotating mechanism drives the dummy wafer and the wafer on the placing platform to rotate; wherein an arc-shaped shaping wall is formed on one side of the placing platform, when the dummy wafer and the wafer are placed on the placing platform, part of the side edges of the dummy wafer and the wafer abut against the shaping wall, part of the side edges which do not abut against the shaping wall protrude out of the placing platform, and the projection of the side edges abutting against the shaping wall and the projection of the side edges protruding out of the placing platform are at least partially overlapped. The wafer test auxiliary device not only can effectively solve the problem of insufficient vacuum adsorption force of an air flow meter wafer caused by a microfluidic network structure, but also can avoid additional damage to the wafer, and meanwhile, improves the test efficiency and accuracy.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing, and more specifically, to a wafer testing auxiliary device. Background Technology

[0002] In the semiconductor manufacturing industry, wafer testing is a critical step in ensuring chip quality and performance. Especially in the production process of air flow meter wafers, traditional wafer testing methods face numerous challenges due to their unique microfluidic network design.

[0003] Traditional CP (Chip Probe) testing typically relies on vacuum adsorption using a probe table to hold the wafer in place. However, because the wafer has a microfluidic network, this network can lead to insufficient adsorption force during wafer placement. This insufficient adsorption force can not only trigger equipment alarms but may also cause the wafer to float during testing, thus preventing normal testing procedures from being performed.

[0004] To address this issue, the industry has attempted to switch to a dense-pore TABLE method. While this approach mitigates the problem of insufficient vacuum suction to some extent, the vacuum suction in the flow region of the wafer microfluidic network still exists, affecting the CP test results for certain specific flow parameters. This makes accurate CP testing of these critical parameters impossible, hindering the effective screening of defective products and reducing the utilization rate of subsequent packaging costs.

[0005] To further improve wafer stability on the probe station, customized dense-hole chucks have emerged. These chucks enhance wafer stability by increasing vacuum adsorption points. However, this method requires higher vacuum levels, increasing equipment costs and potentially generating greater gas disturbance within the probe station. This disturbance causes dust to rise within the machine, increasing the risk of wafer contamination.

[0006] Given the limitations of the aforementioned methods, the industry began exploring compatibility testing methods, which involve manual wafer testing without altering existing equipment. However, this method is inefficient without auxiliary tools and is prone to quality issues such as wafer contamination, coating damage, and even breakage. This not only increases production costs but also severely impacts product yield and reliability. Utility Model Content

[0007] The purpose of this invention is to provide a wafer testing auxiliary device that can effectively solve the problem of insufficient vacuum adsorption force of air flow meter wafers due to the microfluidic network structure, avoid causing additional damage to the wafers, and improve testing efficiency and accuracy.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a wafer testing auxiliary device, comprising:

[0009] The frame includes a platform for stacking dummy wafers and crystal wafers; and

[0010] The rotating mechanism includes an adsorption element for adsorbing dummy wafers, and the rotating mechanism drives the dummy wafers and wafers on the placement platform to rotate.

[0011] The placement platform has an arc-shaped shaping wall on one side. When the dummy wafer and the wafer are placed on the placement platform, a portion of the side of the dummy wafer and the wafer abuts against the shaping wall, while the portion of the side that does not abut against the shaping wall protrudes from the placement platform. The projection of the side abutting against the shaping wall and the projection of the side protruding from the placement platform at least partially overlap.

[0012] Furthermore, the placement platform has a cross-section that forms a dummy wafer and a wafer protruding from the placement platform and an arcuate surface that connects to both ends of the cross-section.

[0013] Furthermore, an assembly hole is formed through the center of the placement platform, the center of the assembly hole overlaps with the center of the circle containing the arc-shaped surface, and the adsorption component is disposed in the assembly hole.

[0014] Furthermore, the rotating mechanism also includes a rotating rod for mounting the adsorption element and a rotating handle disposed on the rotating rod, the rotating handle being located below the placement platform.

[0015] Furthermore, the rotating mechanism also includes a floating component mounted on the rotating rod, the floating component driving the rotating rod to move upward along its axial direction.

[0016] Furthermore, the floating assembly includes a bracket mounted on the rotating rod and an elastic element disposed below the bracket.

[0017] Furthermore, the shaping wall extends upward along the arcuate surface.

[0018] Furthermore, the wafer testing auxiliary device also includes a tape positioning accessory, which has an insertion interface for inserting dummy wafers and the side of the wafer.

[0019] Furthermore, an extension rod is formed protruding outward from the cross-section on the placement platform, and a sliding hole for inserting the extension rod is formed on the tape positioning accessory.

[0020] Furthermore, the wafer testing auxiliary device also includes a side positioning block, which abuts against the dummy wafer and the side of the wafer that protrudes from the placement platform.

[0021] The beneficial effects of this utility model are as follows: By using the wafer testing auxiliary device of this application, wafers and dummy wafers can be stacked, which not only ensures that wafers such as those used for testing flowmeter wafers can be tested on conventional probe stations, but also improves the efficiency of wafer testing. Specifically, the wafer testing auxiliary device of this application uses a placement platform and a shaping wall to place the dummy wafers and wafers onto the placement platform, achieving shaping during the stacking of the dummy wafers and wafers, ensuring that the outer contours of the dummy wafers and wafers overlap to meet testing requirements. After shaping, a rotating mechanism drives the dummy wafers and wafers to rotate horizontally to meet the need for applying tape at different positions on the dummy wafers and wafers, while avoiding misalignment of the dummy wafers and wafers during tape application. This helps to avoid repeated shaping, which could cause multiple impacts to the wafers, resulting in coating damage or even breakage. Furthermore, during the above-mentioned shaping and tape application processes, direct contact between the wafers and the operator is reduced, helping to prevent wafer contamination and ensuring the cleanliness of the testing environment.

[0022] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a wafer testing auxiliary device according to an embodiment of this application;

[0024] Figure 2 for Figure 1 A schematic diagram of the wafer testing auxiliary device from another direction;

[0025] Figure 3 This is a schematic diagram of the structure of an existing dummy wafer or chip.

[0026] Figure 4 This is a schematic diagram of the structure of an existing wafer;

[0027] Figure 5a and Figure 5b This is a schematic diagram of the shaping of fake wafers and crystal wafers;

[0028] Figure 6a and Figure 6b This is a diagram illustrating the application of tape. Detailed Implementation

[0029] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0030] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0033] Please combine Figure 1 and Figure 2 The wafer testing auxiliary device 100 shown in a preferred embodiment of this application includes a frame 10 for placing a dummy wafer 200 and a wafer 300, and a rotation mechanism 20 for rotating the dummy wafer 200 and the wafer 300. In this embodiment, the structure of the dummy wafer 200 and the wafer 300 is as follows: Figure 3 and Figure 4As shown, the wafer 300 in this embodiment is a test flow meter wafer 300. In other embodiments, the wafer 300 may be of other types. The frame 10 has a placement platform 11 for stacking dummy wafers 200 and wafers 300. An arc-shaped shaping wall 111 is formed on one side of the placement platform 11. When the dummy wafers 200 and wafers 300 are placed on the placement platform 11, a portion of the side of the dummy wafers 200 and wafers 300 abuts against the shaping wall 111, and the portion of the side not abutting against the shaping wall 111 protrudes from the placement platform 11. The projection of the side abutting against the shaping wall 111 and the projection of the side protruding from the placement platform 11 at least partially overlap. In this embodiment, the projection of the side abutting against the shaping wall 111 and the projection of the side protruding from the placement platform 11 completely overlap. The rotating mechanism 20 includes an adsorption member 21 for adsorbing the dummy wafer 200. When the dummy wafer 200 is placed on the placement platform 11, the adsorption member 21 adsorbs the dummy wafer 200 and positions it for shaping. After the dummy wafer 200 and the wafer 300 are shaped, the rotating mechanism 20 drives the adsorption member 21 to rotate, thereby rotating the dummy wafer 200 and the wafer 300 on it by a certain angle.

[0034] By using the aforementioned wafer testing auxiliary device 100, wafers 300 and dummy wafers 200 can be stacked, which ensures that wafers 300 of the type used for testing flowmeter wafers can be tested on a conventional probe station, while also improving the efficiency of wafer 300 testing. The wafer testing auxiliary device 100 of this application places the dummy wafer 200 and the wafer 300 on the placement platform 11 and the shaping wall 111, thereby shaping the dummy wafer 200 and the wafer 300 when they are stacked, so that the outer contours of the dummy wafer 200 and the wafer 300 overlap to meet the testing requirements. After the shaping is completed, the rotating mechanism 20 drives the dummy wafer 200 and the wafer 300 to rotate in the horizontal direction to meet the requirements of applying tape at different positions on the dummy wafer 200 and the wafer 300, while avoiding misalignment of the dummy wafer 200 and the wafer 300 during the tape application process. This helps to avoid repeated shaping, which could cause the wafer 300 to be subjected to multiple impacts and cause the coating to break or even crack. At the same time, the direct contact between the wafer 300 and the operator is reduced during the above-mentioned shaping and tape application process, which helps to avoid contamination of the wafer 300 and ensures the cleanliness of the testing environment.

[0035] In this embodiment, the frame 10 includes an upper plate 12 and a lower plate 13 arranged parallel to each other, and a support rod 14 disposed between the upper plate 12 and the lower plate 13. A placement platform 11 is formed on the upper plate 12, and the upper plate 12 also includes an outer edge platform 15 formed outside the placement platform 11. Specifically, the placement platform 11 is formed by a downward recess from the upper surface of the upper plate 12, and the upper surface of the outer edge platform 15 is higher than the upper surface of the placement platform 11. The outer edge platform 15 is used to fix the support rod 14. The shaping wall 111 is a sidewall formed by the downward recess of the placement platform 11. In other embodiments, only the placement platform 11 may be provided, with the shaping wall 111 extending upward from the placement platform 11.

[0036] The orthographic projection shape of the placement platform 11 is approximately the same as that of the dummy wafer 200. The placement platform 11 has a cross-section 112 that allows the dummy wafer 200 and wafer 300 to protrude from the placement platform 11, and an arcuate surface 113 connecting to both ends of the cross-section 112. This configuration allows the placement platform 11 to match the state of the dummy wafer 200, making it easier to shape the dummy wafer 200 and wafer 300. When the dummy wafer 200 and wafer 300 are placed on the placement platform 11, the arcuate sides 201 and 301 of the dummy wafer 200 and wafer 300 abut against the shaping wall 111, and the straight chord edges 202 and 302 of the dummy wafer 200 and wafer 300 face the same direction as the cross-section 112.

[0037] To further improve the shapeability of the dummy wafer 200 and the wafer 300, the shaping wall 111 extends upward along the arc surface 113. In another embodiment, the shaping wall 111 may only be partially provided, wherein the line connecting the equidistant points of the arc surface of the shaping wall 111 and the center of the circle in which the shaping wall 111 is located is perpendicular to the cross section 112; or, in another embodiment, there are several shaping walls 111, and the several shaping walls 111 are arranged circumferentially at equal intervals.

[0038] In a preferred embodiment, in order to facilitate the placement of the dummy wafer 200 and the wafer 300 on the placement platform 11, two clearance grooves 114 are formed recessed from the shaping wall 111 toward the outer edge platform 15. The two clearance grooves 114 are symmetrically arranged on both sides of the placement platform 11, and the line connecting the centers of the two clearance grooves 114 passes through the center of the circle in which the shaping wall 111 is located.

[0039] In this embodiment, the outer edge platform 15 does not surround the placement platform 11 circumferentially, and the outer edge platform 15 forms an opening 151 that exposes the cross-section 112. Specifically, the orthographic projection of the outer edge platform 15 is U-shaped. In a preferred embodiment, to facilitate the shaping of the dummy wafer 200 and the wafer 300 and to facilitate the application of tape 400 to the shaped dummy wafer 200 and the wafer 300, the wafer testing auxiliary device 100 further includes a side positioning block 16 and a tape positioning attachment 17. The side positioning block 16 is inserted into the outer edge platform 15 through the opening 151 to hold the sides of the dummy wafer 200 and the wafer 300 that protrude from the placement platform 11, thereby working together with the shaping wall 111 to shape the dummy wafer 200 and the wafer 300. In practical work, the side positioning block 16 can be omitted. Instead, the fingertip can be placed against the side of the wafer 300 protruding from the placement platform 11, and the fingertip and the shaping wall 111 work together to shape the dummy wafer 200 and the wafer 300. The tape positioning accessory 17 is inserted into the outer edge platform 15 through the opening 151 so that the tape 400 on it is attached to the dummy wafer 200 and the wafer 300 to facilitate subsequent testing.

[0040] An extension rod 18 protrudes outward from the cross-section 112 on the placement platform 11. The side positioning block 16 and the tape positioning accessory 17 are respectively provided with a first sliding hole and a second sliding hole for inserting the extension rod 18. The side positioning block 16 and the tape positioning accessory 17 are positioned by the cooperation of the first sliding hole and the second sliding hole with the extension rod 18. In this embodiment, two types of extension rods 18 are provided to respectively connect with the side positioning block 16 and the tape positioning accessory 17. In other embodiments, only one type of extension rod 18 can be provided, where the side positioning block 16 and the tape positioning accessory 17 both connect with the extension rod 18.

[0041] The tape positioning accessory 17 is a rectangular block structure with an insertion interface 171 formed thereon for the dummy wafer 200 and the wafer 300 to be inserted into the side. When the tape 400 is not transferred to the side of the dummy wafer 200 and the wafer 300, the tape 400 is perpendicular to the insertion interface 171, located on the end face of the tape positioning accessory 17 facing away from the cross section 112, and both ends of the tape 400 are adhered to the end faces of the two side walls of the insertion interface 171.

[0042] In this embodiment, the frame 10, the side positioning block 16, and the tape positioning accessory 17 are all made of engineering plastics and coated with an antistatic coating. It should be noted that in this embodiment, flexible materials such as silicone are not used on the side positioning block 16. This is because, firstly, silicone is easily contaminated, which could cause secondary contamination of the wafer 300; secondly, silicone is prone to generating static electricity during application. When silicone comes into close contact with the wafer 300, the accumulation of static electricity may trigger electrostatic discharge (ESD), causing electrostatic breakdown of the microelectronic components on the wafer 300, thus affecting product yield and reliability. The tape 400 uses a high-temperature resistant transparent tape 400, which can meet the high and low temperature mode testing requirements of the wafer 300.

[0043] As mentioned above, the rotation mechanism 20 enables the rotation of the dummy wafer 200 and the wafer 300 on the placement platform 11. The adsorption member 21 adsorbs the dummy wafer 200 to ensure stable rotation of both. In one embodiment, the adsorption member 21 is set to one. A mounting hole is formed through the center of the placement platform 11, and the center of the mounting hole overlaps with the center of the circle containing the arc surface 113. The adsorption member 21 is disposed within the mounting hole. The adsorption member 21 uses a conventional vacuum suction cup assembly, which will not be described in detail here. In other embodiments, there can be multiple adsorption members 21, such as multiple arc-shaped grooves formed on the placement platform 11, with multiple adsorption members 21 arranged one-to-one within each groove.

[0044] In this embodiment, the rotating mechanism 20 is manually driven. Specifically, the rotating mechanism 20 also includes a rotating rod 22 on which the adsorption member 21 is mounted and a rotating handle 23 disposed on the rotating rod 22. The rotating handle 23 is located below the placement platform 11. The rotating handle 23 is a turntable with several gripping grooves 231. In other embodiments, the rotating mechanism 20 can also be electrically driven (such as by a motor), which will not be described in detail here.

[0045] The rotating mechanism 20 also includes a floating component mounted on the rotating rod 22. The floating component drives the rotating rod 22 to move axially upwards. This floating component allows the adsorption member 21 to float slightly axially relative to the placement platform 11, which facilitates the connection between the adsorption member 21 and the dummy piece 200 after it is placed on the placement platform 11. In an alternative embodiment, the floating component includes a bracket 241 mounted on the rotating rod 22 and an elastic member 242 disposed below the bracket 241. Specifically, sleeves 25 are fitted at both ends of the rotating rod 22. One sleeve 25 is fixed below the upper plate 12, and the other sleeve 25 is fixed on the lower plate 13. The rotating rod 22 can rotate relative to the sleeves 25 and move axially. The rotating rod 22 is also provided with a first fixed cylinder 261 and a second fixed cylinder 262. The rotating handle 23 is fixed on the first fixed cylinder 261, the bracket 241 is fixed on the second fixed cylinder 262, and the elastic member 242 is arranged between the bracket 241 and the lower plate 13. The elastic element 242 is a spring. By adopting the structure of spring and bracket 241, the overall structure is made simpler.

[0046] The operating steps of the wafer testing auxiliary device 100 of this application are as follows:

[0047] S1. Place the fake film 200 on the placement platform 11, with the long chord edge of the fake film 200 close to the cross section 112, and the two orientations as parallel as possible.

[0048] S2. Insert the side positioning block 16 into the opening 151 until it abuts against the long chord edge of the dummy piece 200, thereby shaping the dummy piece 200. Figure 5a The direction indicated by arrow a is the rotation direction during the shaping of dummy piece 200; then the side positioning block 16 is moved out from the opening 151.

[0049] S3. Activate the adsorption component 21 to adsorb the dummy piece 200, thereby fixing the dummy piece 200 in position on the placement platform 11.

[0050] S4, please combine Figure 5b Wafer 300 is stacked on top of dummy wafer 200. Figure 5b In order to distinguish between wafer 300 and dummy wafer 200 (dummy wafer 200 is represented by a dashed line), the side positioning block 16 is inserted into the opening 151 again to hold wafer 300, thereby achieving the shaping of wafer 300. Figure 5b In the middle, the direction pointed to by arrow a is the rotation direction during wafer 300 shaping; then the side positioning block 16 is removed;

[0051] S5. Insert the tape positioning attachment 17 with tape 400 applied into the opening 151 until the long chord edge of the dummy wafer 200 and wafer 300 protruding from the placement platform 11 is inserted into the insertion interface 171. At this time, the tape 400 is transferred and applied to the dummy wafer 200 and wafer 300. Then, remove the tape positioning attachment 17.

[0052] In this step, please combine Figure 6a and Figure 6b The illustrated diagram shows the tape application. Initially, the tape 400 is applied to the tape positioning attachment 17. By moving the tape positioning attachment 17 toward the dummy wafer 200 and the wafer 300, when parts of the dummy wafer 200 and the wafer 300 are inserted into the insertion interface 171, the tape 400 is transferred and applied to the dummy wafer 200 and the wafer 300. At this time, the middle section a3 of the tape 400 is applied to the side of the dummy wafer 200 and the wafer 300, and the two sides a1 and a2 can be gently pressed onto the upper surface of the wafer 300 and the lower surface of the dummy wafer 200 by the fingertips, respectively. In this way, the tape 400 is fixed to the wafer 300 and the dummy wafer 200. Finally, the tape positioning attachment 17 is removed.

[0053] S6. Rotate the rotating handle 23 to rotate the dummy wafer 200 and the wafer 300 by a certain angle (usually 90 degrees);

[0054] Repeat steps S5 and S6 until the designated positions on the dummy wafer 200 and the wafer 300 are completely covered with tape 400. Then close the adsorption unit 21 and transfer the assembled dummy wafer 200 and wafer 300 to the probe station for CP testing.

[0055] After the dummy wafer 200 and wafer 300 are coated with tape 400, they can be integrated as a modular component into subsequent automated ATE (Automatic Test Equipment) testing equipment, thereby enabling automated testing of the special wafer 300. This integration not only significantly improves testing efficiency but also reduces manual intervention, meeting the cleanliness requirements of unmanned workshops. Through automated testing processes, a high degree of cleanliness in the testing environment can be ensured, avoiding the risk of contamination introduced by human operation, while improving the consistency and reliability of testing.

[0056] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer testing auxiliary device, characterized in that, include: The frame has a platform for stacking dummy wafers and crystal wafers; and The rotating mechanism includes an adsorption element for adsorbing dummy wafers, and the rotating mechanism drives the dummy wafers and wafers on the placement platform to rotate. The placement platform has an arc-shaped shaping wall on one side. When the dummy wafer and the wafer are placed on the placement platform, a portion of the side of the dummy wafer and the wafer abuts against the shaping wall, while the portion of the side that does not abut against the shaping wall protrudes from the placement platform. The projection of the side abutting against the shaping wall and the projection of the side protruding from the placement platform at least partially overlap.

2. The wafer testing auxiliary device as described in claim 1, characterized in that, The placement platform has a cross-section that allows the dummy wafer and the die to protrude from the placement platform and an arcuate surface that connects to both ends of the cross-section.

3. The wafer testing auxiliary device as described in claim 2, characterized in that, An assembly hole is formed through the center of the placement platform, and the center of the assembly hole overlaps with the center of the circle containing the arc-shaped surface. The adsorption component is disposed in the assembly hole.

4. The wafer testing auxiliary device as described in claim 3, characterized in that, The rotating mechanism also includes a rotating rod for mounting the adsorption element and a rotating handle disposed on the rotating rod, the rotating handle being located below the placement platform.

5. The wafer testing auxiliary device as described in claim 4, characterized in that, The rotating mechanism also includes a floating component mounted on the rotating rod, which drives the rotating rod to move upward along its axis.

6. The wafer testing auxiliary device as described in claim 5, characterized in that, The floating assembly includes a bracket mounted on the rotating rod and an elastic element disposed below the bracket.

7. The wafer testing auxiliary device as described in claim 2, characterized in that, The shaping wall extends upward along the arc-shaped surface.

8. The wafer testing auxiliary device as described in claim 2, characterized in that, The wafer testing auxiliary device also includes a tape positioning accessory, which has an insertion interface for inserting dummy wafers and the side of the wafer.

9. The wafer testing auxiliary device as described in claim 8, characterized in that, An extension rod is formed protruding outward from the cross-section on the placement platform, and a sliding hole is formed on the tape positioning accessory for inserting the extension rod.

10. The wafer testing auxiliary device as described in claim 8, characterized in that, The wafer testing auxiliary device further includes a side positioning block, which abuts against the dummy wafer and the side of the wafer that protrudes from the placement platform.

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