Silicon wafer shaping and degumming mechanism for degumming machine

Abstract

The utility model provides a silicon wafer shaping and degumming mechanism for a degumming machine, and aims to solve the problems that the traditional manual operation is low in efficiency and the silicon wafer is easy to damage. The device mainly comprises a shaping workbench, a plurality of cavities in the shaping workbench, a shaping assembly and a degumming assembly. According to the utility model, after the silicon wafer stack is transferred into the cavity through the external manipulator, the shaping and degumming treatment of the silicon wafer stack can be efficiently and accurately completed through the cooperative work of the shaping assembly and the degumming assembly, so that the production efficiency and the product quality are remarkably improved, and the device has a wide application prospect.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer production, especially to a silicon wafer shaping and degumming mechanism for a degumming machine. BACKGROUND

[0002] In the production process of silicon wafers, degumming is an important link. The silicon wafer stack after degumming often has problems such as irregular arrangement and surface residual gum, which needs to be shaped and degummed. The traditional manual operation method is low in efficiency and easy to cause damage to the silicon wafers. Therefore, a silicon wafer shaping mechanism with high automation degree and high operation precision is needed to improve production efficiency and product quality. SUMMARY

[0003] The present application provides a silicon wafer shaping and degumming mechanism for a degumming machine, which can automatically shape and degum the silicon wafer stack, ensure the silicon wafer stack to be arranged in order and the surface to be free of residual gum, and improve production efficiency and product quality.

[0004] The technical scheme adopted by the utility model is as follows:

[0005] A silicon wafer shaping and degumming mechanism for a degumming machine comprises a shaping workbench, the inside of the shaping workbench comprises a plurality of cavities, each cavity is provided with a set of shaping components for correcting the posture of the silicon wafer and a set of degumming components for removing the residual gum on the surface of the silicon wafer stack.

[0006] Further, the shaping components comprise at least three sets, which are respectively arranged in three spatial dimensions of the corresponding cavities.

[0007] Further, the shaping components are three sets and are arranged at the top of the cavities and the left and right sides of the corresponding cavities.

[0008] Further, the shaping components are arranged at the top of the cavities and the front and back sides of the corresponding cavities.

[0009] Further, the shaping components are five sets and are arranged at the top of the cavities and the front and back sides and the left and right sides of the corresponding cavities.

[0010] Further, each set of shaping components comprises a push cylinder, the drive end of the push cylinder is provided with a wheel set mounting rack, and the wheel set mounting rack is symmetrically provided with a correction sponge roller capable of freely rolling.

[0011] Further, the degumming components comprise two sets of clamping components arranged at least on the front and back or left and right sides in the corresponding cavities, and further comprise a degumming mechanism arranged above the corresponding cavities.

[0012] Further, the clamping assembly comprises a clamping cylinder fixed on the cavity wall, and a mounting frame is arranged on the driving end of the clamping cylinder, and a flexible cushion block is fixedly arranged on the mounting frame.

[0013] Further, the degumming mechanism comprises a degumming cylinder arranged on one side above the cavity, the stroke range of the degumming cylinder covers the upper surface of the silicon wafer stack, and a degumming wheel frame is arranged on the driving end of the degumming cylinder, and a degumming brush roller is arranged on the main shaft of the degumming wheel frame.

[0014] The beneficial effects of the present application are as follows:

[0015] Compared with the prior art, the present application can automatically shape and degum the silicon wafer stack by arranging the shaping assembly and the degumming assembly, so as to ensure that the silicon wafer stack is arranged in order and the surface is free of residual glue. At the same time, the correction sponge roller of the shaping assembly and the degumming brush roller of the degumming assembly are both made of flexible material, so that the device can avoid damaging the silicon wafer and improve the versatility and production efficiency of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Fig. 1 is a structural schematic view of the shaping assembly in the present application;

[0017] Figure 2 Fig. 2 is a structural schematic view of the degumming assembly in the present application.

[0018] Wherein: 1, shaping workbench; 2, cavity; 3, shaping assembly; 4, degumming assembly; 5, pushing cylinder; 6, wheel set mounting frame; 7, correction sponge roller; 8, clamping assembly; 9, degumming mechanism; 10, clamping cylinder; 11, mounting frame; 12, flexible cushion block; 13, degumming cylinder; 14, degumming wheel frame; 15, degumming brush roller. DETAILED DESCRIPTION

[0019] The specific implementation manner of the present application will be described below in combination with the drawings.

[0020] As shown in Figure 1 and Figure 2 The silicon wafer shaping mechanism comprises a shaping workbench 1, and two cavities 2 are arranged in the shaping workbench 1. A set of shaping assemblies 3 for correcting the posture of the silicon wafer and a set of degumming assemblies 4 for removing the residual glue on the surface of the silicon wafer stack are arranged in each cavity 2.

[0021] The shaping assembly 3 includes at least three sets respectively arranged in three spatial dimensions of the corresponding cavity 2. The accompanying drawings of this utility model only illustrate a structure with three sets, but are not limited thereto; specifically, the shaping assembly 3 can be arranged on the top of the cavity 2 and the left and right sides of the corresponding cavity, or on the top of the cavity 2 and the front and rear sides of the corresponding cavity, or on the top of the cavity 2 and the front, rear, left, and right sides of the corresponding cavity. Each shaping assembly 3 includes a pushing cylinder 5, and the driving end of the pushing cylinder 5 is provided with a wheel assembly mounting frame 6. Symmetrically arranged on the wheel assembly mounting frame 6 are free-rolling correction sponge rollers 7. Driven by the pushing cylinder 5, the correction sponge rollers 7 squeeze and correct the silicon wafer stack, ensuring that the silicon wafer stack is neatly arranged.

[0022] The adhesive removal assembly 4 includes two sets of clamping assemblies 8 disposed at least on the front and rear or left and right sides within the corresponding cavity 2, and an adhesive removal mechanism 9 disposed above the corresponding cavity 2.

[0023] Clamping component 8: such as Figure 2 As shown, the clamping assembly 8 includes a clamping cylinder 10 fixed to the wall of the cavity 2. The driving end of the clamping cylinder 10 is provided with a mounting bracket 11, and a flexible pad 12 is fixedly disposed on the mounting bracket 11. The flexible pad 12 is used to clamp the silicon wafer stack to prevent it from shifting during the adhesive removal process.

[0024] Adhesive removal mechanism 9: such as Figure 2 As shown, the adhesive removal mechanism 9 includes an adhesive removal cylinder 13 disposed on one side above the cavity 2, the stroke range of which covers the upper surface of the silicon wafer stack. An adhesive removal wheel frame 14 is provided at the drive end of the adhesive removal cylinder 13, and an adhesive removal brush roller 15 is mounted on the main shaft of the adhesive removal wheel frame 14. Driven by the adhesive removal cylinder 13, the adhesive removal brush roller 15 moves left and right to remove residual adhesive from the surface of the silicon wafer stack.

[0025] Silicon wafer stack shaping: After the silicon wafer stack is fed into the cavity 2 of the shaping worktable 1, the pushing cylinder 5 of the shaping component 3 drives the correction sponge roller 7 to squeeze and correct the silicon wafer stack to ensure that the silicon wafer stack is neatly arranged.

[0026] Silicon wafer stack clamping: After the shaping is completed, the clamping cylinder 10 of the clamping assembly 8 drives the flexible pad 12 to clamp the silicon wafer stack and prevent it from shifting during the adhesive removal process.

[0027] Silicon wafer stack adhesive removal: The adhesive removal cylinder 13 of the adhesive removal mechanism 9 drives the adhesive removal brush roller 15 to move left and right to remove residual adhesive from the surface of the silicon wafer stack.

[0028] Silicon wafer stack output: After the adhesive removal is completed, the clamping component 8 is released from the silicon wafer stack, and the shaped silicon wafer stack is output to the next process by an external robot.

[0029] The utility model discloses a silicon wafer shaping and degumming mechanism for degumming machine, through the cooperation of shaping assembly and degumming assembly, the shaping and degumming of silicon wafer stack can be completed efficiently and accurately, which significantly improves the production efficiency and product quality, and has a wide application prospect.

[0030] In conclusion, the utility model provides a kind of silicon wafer shaping and degumming mechanism for degumming machine, through the cooperation of shaping assembly and degumming assembly, the shaping and degumming of silicon wafer stack can be completed efficiently and accurately, which significantly improves the production efficiency and product quality, and has a wide application prospect.

[0031] The above description is an explanation of the utility model, not a limitation of the utility model, the range defined by the utility model is seen from claim, within the protection scope of the utility model, any form of modification can be made.

Claims

1. A silicon wafer shaping and degreasing mechanism for a degreasing machine, characterized by: The application relates to a silicon wafer shaping device, which comprises a shaping table (1) with a plurality of cavities (2) in the interior of the shaping table (1), each cavity (2) being provided with a set of shaping components (3) for correcting the posture of a silicon wafer and a set of glue removing components (4) for removing glue on the surface of a silicon wafer stack.

2. The silicon wafer shaping and stripping mechanism for a beveler as recited in claim 1, wherein: The shaping components (3) are at least three sets arranged in the spatial dimension of the corresponding cavity (2).

3. The silicon wafer shaping and stripping mechanism for a dicing saw as recited in claim 2, wherein: The shaping components (3) are three sets arranged at the top of the cavity (2) and the left and right sides of the corresponding cavity (2).

4. The silicon wafer shaping and stripping mechanism for a dicing saw as recited in claim 2, wherein: The shaping components (3) are three sets arranged at the top of the cavity (2) and the front and back sides of the corresponding cavity (2).

5. The silicon wafer shaping and stripping mechanism for a dicing saw as recited in claim 2, wherein: The shaping components (3) are five sets arranged at the top of the cavity (2) and the front and back sides and the left and right sides of the corresponding cavity (2).

6. The silicon wafer shaping and stripping mechanism for a beveler as recited in claim 2, wherein: Each set of the shaping components (3) comprises a pushing air cylinder (5), the driving end of the pushing air cylinder (5) being provided with a wheel set mounting rack (6), and the wheel set mounting rack (6) being symmetrically provided with correction sponge rollers (7) capable of freely rolling.

7. The silicon wafer shaping and stripping mechanism for a dicing saw as recited in claim 1, wherein: The glue removing components (4) comprise at least two sets of clamping components (8) arranged on the front and back sides or the left and right sides in the corresponding cavity (2), and further comprise a glue removing mechanism (9) arranged above the corresponding cavity (2).

8. The wafer shaping and stripping mechanism for a beveler as recited in claim 7 wherein: The clamping components (8) comprise clamping air cylinders (10) fixed on the wall surface of the cavity (2), the driving end of the clamping air cylinder (10) being provided with a mounting rack (11), and the mounting rack (11) being fixedly provided with flexible pads (12).

9. The silicon wafer shaping and stripping mechanism for a beveler as recited in claim 7, wherein: The glue removing mechanism (9) comprises a glue removing air cylinder (13) arranged on one side above the cavity (2), the stroke range of the glue removing air cylinder (13) covering the upper surface of the silicon wafer stack, the driving end of the glue removing air cylinder (13) being provided with a glue removing wheel rack (14), and the main shaft of the glue removing wheel rack (14) being provided with a glue removing brush roller (15).

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