Cleaning equipment

Abstract

The embodiment of the utility model provides cleaning equipment which comprises an upper groove part and a lower groove part which is arranged below the upper groove part in the vertical direction and communicated with the upper groove part, the upper groove part and the lower groove part are used for containing cleaning liquid and semiconductor products, and the lower groove part is used for containing the semiconductor products. The upper groove part is arranged to allow the semiconductor products to be placed in the upper groove part in the horizontal direction, and the lower groove part is arranged to allow the semiconductor products to be placed in the lower groove part in the vertical direction. And the products are allowed to be placed in the cleaning equipment in the horizontal direction or the vertical direction according to the shapes and the cleaning requirements of the products, so that the adaptability and the cleaning efficiency of the cleaning equipment are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing especially relates to a cleaning equipment. BACKGROUND

[0002] The cleaning tank is one of the important equipment in semiconductor manufacturing and other precision equipment manufacturing, and its main function is to clean the surface of the product to remove particles, chemical residues and other pollutants. In the semiconductor industry, products made of silicon (Si) and silicon carbide (SiC) are typical cleaning objects. Since the cleaning effect directly affects the final performance of the product, the cleaning process is considered as a crucial link in the production process.

[0003] In order to meet the strict requirements of the semiconductor industry on the cleanliness of the product surface, the cleaning tank needs to ensure high cleaning efficiency in multiple cleaning operations, while taking into account the overall production efficiency. In the prior art, the cleaning tank is usually provided with an internal space capable of accommodating multiple products to be cleaned, and the product surface is cleaned by using cleaning liquid. However, with the diversification of product shape and cleaning requirements, the existing cleaning tank faces challenges in compatibility and performance optimization. In particular, how to balance between cleaning efficiency and cleaning effect has become the main direction of improvement of the cleaning tank.

[0004] Although the existing cleaning tank technology is constantly optimized, there are still some problems to be solved. For example, the internal layout of the cleaning tank is not reasonable enough, resulting in large equipment space occupation and inefficient use of accommodation capacity. In addition, products of different shapes or cleaning requirements cannot be compatible in the existing cleaning tank, limiting the versatility of the equipment. At the same time, the contradiction between cleaning efficiency and cleaning effect is difficult to reconcile, which may affect production due to low efficiency, or affect product performance due to incomplete cleaning. SUMMARY

[0005] To solve the above technical problems, the utility model embodiment expects a cleaning equipment.

[0006] The technical scheme of the utility model is as follows:

[0007] The utility model embodiment provides a kind of cleaning equipment, and the cleaning equipment is used to clean semiconductor product, and the cleaning equipment includes: upper tank portion and lower tank portion being arranged below the upper tank portion in vertical direction and being communicated with the upper tank portion, wherein,

[0008] The upper tank portion and the lower tank portion are used to accommodate cleaning liquid and semiconductor product, and the upper tank portion is arranged to allow the semiconductor product to be placed in the upper tank portion along the horizontal direction, and the lower tank portion is arranged to allow the semiconductor product to be placed in the lower tank portion along the vertical direction.

[0009] In some alternative examples, the upper groove portion is provided with a first holding member, and the lower groove portion is provided with a second holding member, wherein the first holding member is configured to hold the semiconductor products in the upper groove portion in the horizontal direction, and the second holding member is configured to hold the semiconductor products in the lower groove portion in the vertical direction.

[0010] In some alternative examples, the cleaning apparatus includes a liquid supply port provided at the lower groove portion, for supplying the cleaning liquid to the upper groove portion and the lower groove portion.

[0011] In some alternative examples, the cleaning apparatus includes a gas supply port provided at the lower groove portion, for supplying gas to the upper groove portion and the lower groove portion.

[0012] In some alternative examples, the cleaning apparatus further includes a flow rectifying plate located above the liquid supply port and the gas supply port in the vertical direction, the flow rectifying plate being provided with a through hole to allow the cleaning liquid and the gas to flow therethrough in the vertical direction, thereby guiding the cleaning liquid and the gas to flow uniformly in the upper groove portion and the lower groove portion.

[0013] In some alternative examples, the cleaning apparatus further includes a rotating assembly provided in the lower groove portion, the rotating assembly being located above the flow rectifying plate in the vertical direction and being capable of contacting the semiconductor products held in the lower groove portion to drive the semiconductor products in the lower groove portion to rotate.

[0014] In some alternative examples, the cleaning apparatus further includes a spraying device provided above the upper groove portion, the spraying device being configured to spray the cleaning liquid into the upper groove portion and the lower groove portion.

[0015] In some alternative examples, an overflow portion is provided at an upper edge of the upper groove portion, the overflow portion being configured to guide the cleaning liquid to flow out of the cleaning apparatus.

[0016] In some alternative examples, the cleaning apparatus further includes a discharge device provided at a bottom of the lower groove portion, for discharging the cleaning liquid in the cleaning apparatus.

[0017] In some alternative examples, a bottom of the upper groove portion protrudes relative to an outer peripheral portion of the lower groove portion in the horizontal direction, and the cleaning apparatus includes a reinforcing portion provided at the bottom of the upper groove portion and the outer peripheral portion of the lower groove portion.

[0018] This invention provides a cleaning device. The device, through a combination of an upper and lower tank, meets the cleaning needs of semiconductor products with different shapes and cleaning orientations. The upper tank is suitable for semiconductor products placed horizontally, while the lower tank is suitable for those placed vertically. This effectively solves the problem of needing multiple cleaning devices due to differences in cleaning orientation. The cleaning device can simultaneously process multiple types of semiconductor products, achieving synchronous cleaning, which not only significantly improves cleaning efficiency but also avoids wasted time due to equipment switching. Furthermore, the compact vertical layout of the upper and lower tanks makes the overall structure of the cleaning device more rational, occupies less space, and is more suitable for high-density production environments. Attached Figure Description

[0019] Figure 1 This is a front view schematic diagram of a conventional semiconductor product.

[0020] Figure 2 This is a front view schematic diagram of another conventional semiconductor product.

[0021] Figure 3 This is a schematic diagram of a conventional cleaning tank.

[0022] Figure 4 This is a schematic diagram of another conventional cleaning tank.

[0023] Figure 5 This is a perspective view of a cleaning device provided in an embodiment of the present invention.

[0024] Figure 6 for Figure 5 A front view diagram of the cleaning equipment.

[0025] Figure 7 This is a front view schematic diagram of a cleaning device provided in another embodiment of the present invention.

[0026] Figure 8 This is a front view schematic diagram of a cleaning device provided in another embodiment of the present utility model.

[0027] Figure 9 This is a perspective view of a cleaning device provided in another embodiment of the present invention.

[0028] Figure 10 This is a perspective view of a cleaning device provided in another embodiment of the present invention.

[0029] Figure 11 This is a perspective view of a cleaning device provided in another embodiment of the present utility model.

[0030] Figure 12 for Figure 11 A top view of the cleaning equipment.

[0031] Figure 13 Figure 1 is a schematic perspective view of a cleaning apparatus according to an embodiment of the present application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be apparently and completely described with reference to the drawings in the embodiments of the present application.

[0033] At present, the cleaning of semiconductor products is usually carried out in a dedicated cleaning tank. The cleaning tank is designed to contain a certain amount of cleaning liquid and can contain at least one semiconductor product. During the cleaning process, the semiconductor product is placed in the cleaning tank, and the cleaning liquid is used to clean it thoroughly to remove surface particles, chemical residues and other contaminants.

[0034] Semiconductor products have various shapes due to different application fields. For example, as shown in Figure 1 , an electrode P1 made of silicon (Si) or silicon carbide (SiC) material is usually in the shape of a disc. As shown in Figure 2 , a ring-shaped structural component P2 used in semiconductor manufacturing is also usually made of silicon or silicon carbide, but in the shape of a ring. These differences in shape result in different ways required during cleaning. For example, the disc-shaped electrode P1 may need to be placed horizontally for cleaning, while the ring-shaped structural component P2 may need to be placed vertically for cleaning.

[0035] Taking the electrode P1 as an example, the disc-shaped electrode P1 usually needs to be placed horizontally during cleaning, i.e. the electrode P1 is placed with its central axis along the vertical direction to ensure the best cleaning effect. Therefore, a first cleaning tank 100 as shown in Figure 3 is used for cleaning. As shown in Figure 3 , the first cleaning tank 100 includes a first bearing 101 and a first tank body 102. The first bearing 101 is designed to horizontally support the electrode P1 (shown in Figure 3 by a dashed line) and can be placed together with the electrode P1 inside the first cleaning tank 100. The first tank body 102 is arranged to contain a certain amount of cleaning liquid, and when the electrode P1 is supported by the first bearing 101 and placed inside the first tank body 102, the electrode P1 can be completely immersed in the cleaning liquid to achieve an efficient cleaning process.

[0036] Taking the ring-shaped structural component P2 as an example, this ring-shaped structural component P2 can be placed vertically during cleaning, i.e. the ring-shaped structural component P2 is placed with its central axis along the horizontal direction, so that multiple ring-shaped structural components P2 can be arranged for cleaning at a time to significantly improve the cleaning efficiency while meeting the cleaning requirements. At present, the ring-shaped structural component P2 is usually cleaned by using a second cleaning tank 200 as shown in Figure 4 . As shown inFigure 4 As shown, the second cleaning tank 200 includes a second carrier 201 and a second tank body 202. The second carrier 201 is designed to vertically support one or more ring structure components P2 (shown in dashed lines) and is placed inside the second cleaning tank 200 together with the ring structure components P2. The second tank body 202 can contain a certain amount of cleaning liquid, and when the ring structure components P2 are supported by the second carrier 201 and placed inside the second tank body 202, the ring structure components P2 can be completely immersed in the cleaning liquid, achieving effective cleaning. Figure 4 As shown, the second cleaning tank 200 includes a second carrier 201 and a second tank body 202. The second carrier 201 is designed to vertically support one or more ring structure components P2 (shown in dashed lines) and is placed inside the second cleaning tank 200 together with the ring structure components P2. The second tank body 202 can contain a certain amount of cleaning liquid, and when the ring structure components P2 are supported by the second carrier 201 and placed inside the second tank body 202, the ring structure components P2 can be completely immersed in the cleaning liquid, achieving effective cleaning.

[0037] As can be seen from the above analysis, different shapes of semiconductor products require different forms of cleaning tanks when cleaning. For example, the electrode P1 requires a horizontal cleaning tank, while the ring structure component P2 requires a vertical cleaning tank. This difference results in the inability to interchange between cleaning tanks. When producing a variety of semiconductor products, the production line may need to be equipped with multiple cleaning tanks, which not only significantly increases the cost of production equipment, but also negatively affects the production space and cleaning efficiency.

[0038] To solve the above problems, embodiments of the present application provide a cleaning device that can accommodate different forms of semiconductor products and allow these products to be placed inside the cleaning device according to their shape and cleaning requirements along the horizontal or vertical direction, thereby improving the adaptability and cleaning efficiency of the cleaning device.

[0039] The various embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0040] Referring to Figure 5 Some embodiments of the present application provide a cleaning device 1 for cleaning semiconductor products. The cleaning device 1 can include an upper tank portion 11 and a lower tank portion 12. The upper tank portion 11 and the lower tank portion 12 can be arranged vertically, with the upper tank portion 11 arranged vertically above the lower tank portion 12 and the two being in communication with each other. The upper tank portion 11 and the lower tank portion 12 are used to contain cleaning liquid and semiconductor products. The upper tank portion 11 is configured to allow semiconductor products to be placed in the upper tank portion 11 along the horizontal direction. The lower tank portion 12 is configured to allow semiconductor products to be placed in the lower tank portion 12 along the vertical direction.

[0041] It should be noted that in the various embodiments of the present application, the "horizontal direction" refers to a direction parallel to the horizontal plane, such as a direction parallel to the ground, and the "vertical direction" refers to a direction perpendicular to the horizontal plane, such as a direction perpendicular to the ground.

[0042] As Figure 5As shown, the cleaning device 1 has a top-open trough-shaped structure, and is vertically divided into two parts: an upper trough 11 and a lower trough 12. The space formed by the two troughs can hold the cleaning fluid, and is connected to the top of the lower trough 12 through the bottom of the upper trough 11, thus allowing the cleaning fluid to flow between the two. In other words, the cleaning fluid can flow from the upper trough 11 into the lower trough 12, or from the lower trough 12 into the upper trough 11. As an example, the cleaning fluid can be deionized water (DIW).

[0043] Both the upper tank 11 and the lower tank 12 are designed as square tanks with open tops to facilitate loading semiconductor products from above. Semiconductor products can be fully accommodated in either the upper tank 11 or the lower tank 12 and placed in the corresponding tank in the desired orientation. Through this vertical arrangement, the upper tank 11 and the lower tank 12 make full use of the vertical space of the cleaning equipment 1, resulting in a more compact structure and a smaller footprint. This design is particularly suitable for the high-density production environments common in semiconductor manufacturing.

[0044] More importantly, through the combined design of the upper tank 11 and the lower tank 12, this cleaning equipment 1 can meet the cleaning needs of semiconductor products with different shapes and cleaning directions. The upper tank 11 supports horizontal placement, suitable for cleaning disc-shaped or plate-shaped semiconductor products; the lower tank 12 supports vertical placement, suitable for cleaning annular or cylindrical semiconductor products. This design avoids the problem of needing to use multiple cleaning equipment due to differences in product shape, simplifying equipment configuration.

[0045] For example, the upper groove 11 can allow such as Figure 1 The electrode P1 shown is accommodated and placed therein in a horizontal direction, and the lower groove 12 can allow for... Figure 2 The annular structure component P2 shown is accommodated and placed vertically within it. Due to differences in cleaning methods, the dimensions of the upper tank 11 and lower tank 12 must comprehensively consider the size of the semiconductor product, ease of handling, and cleaning stability. Specifically, the top opening of the upper tank 11 can be configured to allow the electrode P1 to enter the upper tank 11 with its central axis parallel to the vertical direction, and to allow the annular structure component P2 to enter the upper tank 11 with its central axis parallel to the horizontal direction; while the top opening of the lower tank 12 can be configured to allow the annular structure component P2 to enter the lower tank 12 with its central axis parallel to the horizontal direction.

[0046] The upper tank 11 and lower tank 12 of the cleaning equipment 1 can be used independently or simultaneously as needed, enabling synchronous cleaning of semiconductor products with different cleaning direction requirements. This structure of the cleaning equipment 1 avoids the equipment switching and operation waiting time required for sequential cleaning with multiple cleaning tanks, thereby significantly improving production efficiency. Furthermore, see...Figure 6 The lower groove part 12 can also accommodate a plurality of ring structure parts P2, further improving the cleaning efficiency.

[0047] The embodiment of the utility model provides a kind of cleaning equipment 1.The cleaning equipment 1 is combined design by upper groove part 11 and lower groove part 12, meet the cleaning needs of semiconductor product of different shapes and cleaning direction, wherein, upper groove part 11 is suitable for semiconductor product along horizontal direction is placed, and lower groove part 12 is suitable for semiconductor product along vertical direction is placed, which effectively solves the problem that multiple cleaning equipment needs to be used due to the difference of cleaning direction.Cleaning equipment 1 can also realize the synchronous cleaning of multiple types of semiconductor products, not only significantly improve the cleaning efficiency, but also avoid wasting time due to equipment switching.In addition, the compact layout of upper groove part 11 and lower groove part 12 along the vertical direction makes the overall structure of cleaning equipment 1 more reasonable, occupies less space and is more suitable for high-density production environment.

[0048] Although in the embodiment shown in Figure 5 , electrode P1 and ring structure part P2 are directly placed in cleaning equipment 1 for cleaning.But it can be understood that in the embodiment not shown, upper groove part 11 and lower groove part 12 can be arranged to allow semiconductor products to be placed in cleaning equipment 1 via a carrier, such as Figure 3 The first carrier 101 shown and Figure 4 The second carrier 201 shown, that is, after placing semiconductor products in the carrier, they can be placed in cleaning equipment 1 together.In this way, the taking and placing of semiconductor products can be facilitated, especially the one-time taking and placing of multiple semiconductor products from lower groove part 12.

[0049] In order to make cleaning equipment 1 have more compact structure, upper groove part 11 and lower groove part 12 can be arranged to hold semiconductor products in a predetermined direction by a simpler structure.

[0050] Specifically, referring to Figure 5 And Figure 6 In some embodiments of the utility model, first holding member 14 is arranged in upper groove part 11, and second holding member 15 is arranged in lower groove part 12, wherein, first holding member 14 is arranged to hold semiconductor products in upper groove part 11 along horizontal direction, and second holding member 15 is arranged to hold multiple semiconductor products in lower groove part 12 along vertical direction.

[0051] In some cases, first holding member 14 and second holding member 15 can also be further arranged to be able to clamp semiconductor products to resist the impact caused by the flow of cleaning liquid, so that they can be held in a predetermined direction in the corresponding groove part.

[0052] The arrangement of the first holding member 14 in the upper groove portion 11 can be flexibly adjusted according to actual needs. For example, as shown in Figure 5 , the first holding member 14 can be arranged on the inner wall of the upper groove portion 11. In some examples, the first holding member 14 takes the form of a plurality of protrusions protruding from the inner wall or corner of the upper groove portion 11 towards the center of the upper groove portion 11. In this case, the protruding distance of the first holding member 14 is set so as not to interfere with the entry or exit of the semiconductor product into or out of the lower groove portion 12. The first holding member 14 can directly support the semiconductor product, or can also indirectly support the semiconductor product by holding the first carrier 101, thereby being able to stably accommodate the semiconductor product in the upper groove portion 11 in a horizontal state.

[0053] The second holding member 15 is mainly used to vertically hold the semiconductor product in the lower groove portion 12, and is usually arranged at the bottom of the lower groove portion 12, as shown in Figure 5 . In other embodiments, the second holding member 15 can also be flexibly arranged on the inner wall or other appropriate positions of the lower groove portion 12. For example, in a design not shown, the second holding member 15 can be fixed on the inner side wall of the lower groove portion 12, providing multi-angle support. As shown in Figure 5 and Figure 6 , the second holding member 15 can take the form of a support seat and be able to directly contact the semiconductor product, thereby stably standing it in the lower groove portion 12.

[0054] In addition, the second holding member 15 can also be arranged to be able to limit the carrier holding the semiconductor product, so as to stably hold it in the lower groove portion 12. For example, the second holding member 15 can be arranged to be able to limit the second carrier 201 holding the ring-shaped structural component P2. In this case, if the gravity of the second carrier 201 and the ring-shaped structural component P2 is sufficient to resist the vertical impact force brought by the cleaning liquid, and the second carrier 201 can keep the semiconductor product in a standing state, the structure of the second holding member 15 can be further simplified. For example, the second holding member 15 can be simplified to not directly contact the ring-shaped structural component P2, but can only limit the movement of the second carrier 201 in the horizontal direction. This design can effectively maintain the stability of the semiconductor product, and also simplify the structural complexity of the equipment, improving the convenience of manufacturing and maintenance.

[0055] By using the cleaning equipment 1, the semiconductor product can be effectively cleaned by being completely immersed. In order to facilitate the filling of cleaning liquid into the interior of the cleaning equipment 1, in some embodiments of the present application, the cleaning equipment 1 can include a liquid supply port 16 arranged at the lower groove portion 12, for supplying cleaning liquid into the upper groove portion 11 and the lower groove portion 12. As shown in Figure 7As shown, the liquid supply ports 16 can be arranged near the bottom of the lower tank portion 12, for example, on the circumferential wall of the lower tank portion 12 adjacent to the bottom.

[0056] To ensure that the cleaning liquid can quickly and uniformly fill the interior of the cleaning apparatus 1, a plurality of liquid supply ports 16 can be provided. For example, in the embodiment shown, the liquid supply ports 16 are arranged on the circumferential wall of the lower tank portion 12 at a plurality of positions spaced apart from each other in the circumferential direction. Figure 7 In the embodiment shown, the liquid supply ports 16 are arranged on opposite sides of the lower tank portion 12. This arrangement can significantly improve the uniformity of the distribution of the cleaning liquid, avoiding the problems of uneven coverage or local flow rate differences that can be caused by the top liquid supply method, thereby ensuring the consistency of the cleaning effect.

[0057] In addition, when the cleaning liquid flows into the lower tank portion 12 from the bottom, the natural upward flow of the liquid can not only fill the entire interior space of the apparatus, but also effectively flush the particles and contaminants on the surface of the semiconductor product by flowing. This liquid supply method makes full use of the dynamic characteristics of the liquid, not only improving the cleaning efficiency, but also enhancing the removal of contaminants. Thus, the cleaning apparatus 1 can achieve fast, uniform, and efficient cleaning operation with a simple structure.

[0058] To enhance the removal effect of contaminants on the surface of the semiconductor product, according to some embodiments of the present application, referring to Figure 7 The cleaning apparatus 1 can further include a gas supply port 17 provided at the lower tank portion 12 for supplying gas into the upper tank portion 11 and the lower tank portion 12. The gas supply port 17 is in communication with a gas source (not shown in the figure) through a gas supply line to introduce gas from the gas source into the interior of the cleaning apparatus 1. To improve the cleaning efficiency, the gas supply port 17 can be arranged near the bottom of the lower tank portion 12 to achieve uniform distribution and efficient bubbling of the gas in the cleaning liquid.

[0059] By injecting gas into the cleaning liquid, the cleaning apparatus 1 can achieve a gas bubbling function. The physical disturbance effect of the micro-bubbles in the cleaning liquid enhances the loosening and detachment effect of the contaminants. In particular, the instantaneous micro-impact force generated by the rupture of the bubbles not only improves the detachment efficiency of the particles, but also enhances the overall cleaning capacity of the cleaning liquid. In addition, the flow action of the bubbles can also prevent the cleaning liquid from stagnating, optimizing the liquid distribution in the tank, thereby ensuring the uniformity of the cleaning process.

[0060] The type of gas filled can be selected according to the cleaning needs of the semiconductor product, for example, nitrogen (N2) or clean dry air (CDA) can be selected. The application of nitrogen can avoid the oxidation of the product surface, while the clean dry air can further improve the circulation and flow of the cleaning liquid. In addition, the bubbling action of the gas can also optimize the distribution of the cleaning liquid in the tank, avoiding the problem of dead angles or local stagnation of the cleaning liquid, thereby ensuring the uniformity of the cleaning process.

[0061] To further improve the uniformity of cleaning, in some embodiments of the present application, referring to Figure 8 , the cleaning device 1 can further include a flow regulation plate 18 located above the liquid supply port 16 and the gas supply port 17 in the vertical direction, the flow regulation plate 18 is provided with through holes 181 to allow the cleaning liquid and gas to flow through in the vertical direction, thereby guiding the cleaning liquid and gas to flow uniformly in the upper tank portion 11 and the lower tank portion 12.

[0062] The flow regulation plate 18 can be provided with a plurality of uniformly distributed through holes 181. In order to achieve better flow regulation effect, the flow regulation plate 18 can be arranged immediately adjacent to and above the liquid supply port 16 and the gas supply port 17, so that the cleaning liquid and gas can flow through the through holes 181 rapidly after entering the cleaning device 1, thereby changing the flow direction to be more uniformly distributed in the upper tank portion 11 and the lower tank portion 12.

[0063] In addition, the guiding effect of the flow regulation plate 18 can fully play the bubbling effect of the gas and the flow performance of the cleaning liquid, thereby significantly improving the cleaning efficiency while reducing the consumption of the cleaning liquid. The flow regulation plate 18 can also improve the flow path of the gas and the cleaning liquid, reduce turbulence and impact phenomenon, thereby improving the stability and consistency of the cleaning process.

[0064] In some embodiments of the present application, referring to Figure 9 and Figure 10 , the cleaning device 1 can further include a rotating assembly 19 arranged in the lower tank portion 12, the rotating assembly 19 is arranged above the flow regulation plate 18 in the vertical direction and can be in contact with the semiconductor products retained in the lower tank portion 12 to drive the semiconductor products in the lower tank portion 12 to rotate.

[0065] As shown in Figure 9 and Figure 10 , the rotating assembly 19 can include a support 191 arranged on the upper surface of the flow regulation plate 18 and a rotating member 192. The rotating member 192 can adopt the form of a roller and is rotatably mounted on the support 191. Through the contact between the circumferential surface of the rotating member 192 and the outer circumferential surface of the semiconductor products, the rotating member 192 not only can provide effective support, but also can drive the semiconductor products to rotate around their own axes by friction and the like.

[0066] The rotating assembly 19 can be driven by a driving device (not shown in the figure) arranged outside the upper tank portion 11 and the lower tank portion 12, such as a motor. The driving device can be in transmission connection with the rotating member 192 through transmission devices such as gears, connecting rods, etc. to drive the rotating member 192 to rotate. During the cleaning process, the rotating assembly 19 enables the semiconductor products to rotate in the lower tank portion 12, so that the cleaning liquid and gas can more uniformly contact the surface of the products, further improving the cleaning effect.

[0067] In some embodiments, the driving device can drive the rotating member 192 from below the lower tank portion 12, as shown in Figure 9 In other embodiments, the driving device can drive the rotating member 192 from above the upper tank portion 11, as shown in Figure 10 In the embodiment shown in Figure 10 , the driving device drives the rotating member 192 through a plurality of toothed transmission rods, and these transmission rods are arranged at the corners of the upper tank portion 11 and the lower tank portion 12, thus not interfering with the cleaning operation. The rotating member 192 is arranged as an elongated roller capable of contacting a plurality of ring-shaped structural components P2, so as to simultaneously drive the plurality of ring-shaped structural components P2 to rotate, thereby achieving synchronous rotation of the ring-shaped structural components P2. In addition, although the embodiment shown in Figure 10 arranges the semiconductor products directly in the cleaning device 1 without using any carrier, it can be understood that the rotating assembly 19 can also achieve rotational driving of the semiconductor products in the case of using a carrier. For example, in the case of using the second carrier 201 shown in Figure 4 to carry a plurality of ring-shaped structural components P2 and collectively put into the lower tank portion 12 of the cleaning device 1, the lower end of each ring-shaped structural component P2 can extend downward from the opening at the bottom of the second carrier 201, and then be capable of contacting and being driven to rotate by the rotating member 192. This diversified configuration can adapt to different types of semiconductor product cleaning requirements, and further improve the versatility and cleaning efficiency of the device.

[0068] Further, in order to match the size of the semiconductor products to be cleaned, and to avoid interference when the semiconductor products are loaded into the cleaning device 1, in some embodiments of the present application, the horizontal size of the upper tank portion 11 can be larger than the horizontal size of the lower tank portion 12, so that the cleaning device 1 as a whole has a "wide upper and narrow lower" shape. However, this shape can have a certain impact on the structural stability of the cleaning device 1.

[0069] In order to solve this problem, in some embodiments of the present application, referring to Figure 11 and Figure 12 , the bottom 111 of the upper tank portion 11 protrudes in the horizontal direction relative to the outer peripheral portion of the lower tank portion 12, and the cleaning device 1 can include a reinforcing portion 13 arranged at the bottom of the upper tank portion 11 and the outer peripheral portion of the lower tank portion 12.

[0070] As shown in Figure 11 and Figure 12As shown, the upper groove part 11 has a larger size in the horizontal direction than the lower groove part 12, thereby providing a larger accommodation space in the horizontal direction to meet the horizontal cleaning requirement of the semiconductor products. The bottom 111 of the upper groove part 11 protrudes from the opposite sides of the outer peripheral part 121 of the lower groove part 12 to provide reliable support for the semiconductor products accommodated in the upper groove part 11. Since the lower groove part 12 occupies a smaller size in the horizontal direction, the overall design of the cleaning device 1 is more compact, reducing the waste of space.

[0071] In Figure 11 and Figure 12 the embodiment shown, the design of the reinforcing part 13 further enhances the stability of the cleaning device 1. The reinforcing part 13 can include vertical reinforcing plates 131 and a horizontal reinforcing plate 132. The horizontal reinforcing plate 132 can extend from the outer peripheral part 121 of the lower groove part 12 in the horizontal direction and is spaced apart from the bottom 111 of the upper groove part 11. A plurality of vertical reinforcing plates 131 are arranged on the outer peripheral part 121 of the lower groove part 12 in a spaced-apart manner. Each vertical reinforcing plate 131 extends between the bottom 111 of the upper groove part 11 and the horizontal reinforcing plate 132 in the vertical direction to provide further support for the upper groove part 11. By adding the reinforcing part 13, not only can the overall structural strength of the cleaning device 1 be improved, but also the problem of instability of the cleaning device 1 caused by the large size of the upper groove part 11 can be effectively prevented, ensuring the reliability and safety of the cleaning device 1 during cleaning operation.

[0072] In addition, as shown in Figure 12 , when the cleaning device 1 has an overall structure of "wide at the top and narrow at the bottom", the first retaining member 14 can be arranged on the bottom 111 of the upper groove part 11, thereby providing more reliable and stable support for the horizontally placed semiconductor products and the carrier, such as the ring-shaped structural part P2 and the first carrier 101.

[0073] In order to further improve the cleaning effect, in addition to the bottom-up liquid supply mode, the cleaning device 1 can further include a spraying device 20 arranged above the upper groove part 11, the spraying device 20 being arranged to spray cleaning liquid into the upper groove part 11 and the lower groove part 12.

[0074] As shown in Figure 13 , the spraying device 20 can be removably mounted above the upper edge of the upper groove part 11 by a bracket 21. The spraying device 20 can include a tubular body 20a and a plurality of nozzles 20b distributed on the tubular body 20a. The nozzles 20b can spray cleaning liquid into the upper groove part 11. The spraying device 20 can be arranged along the upper edge of the upper groove part 11, and the tubular body 20a can have a small radial size, thereby minimizing the occupation of the space directly above the upper groove part 11, without affecting the picking and placing operation of the semiconductor products.

[0075] At the beginning of the cleaning operation, the cleaning liquid can be filled into the interior of the cleaning apparatus 1 from top to bottom by the spraying device 20, and the filled cleaning liquid can be directly sprayed onto the semiconductor products accommodated in the upper tank portion 11 to clean them. After the cleaning operation ends, the semiconductor products can be further rinsed by the cleaning liquid sprayed from the spraying device 20 during the process of taking the semiconductor products out of the cleaning apparatus 1 to further remove the particles, chemical residues and other contaminants that can be left on the surface of the semiconductor products, ensuring the cleaning effect.

[0076] The cleaning apparatus 1 can further include sensors for sensing the water level and temperature of the cleaning liquid, not shown in the figure. The sensors can also be supported by the bracket 21 arranged on the upper edge of the upper tank portion 11 to facilitate timely understanding of the state of the cleaning liquid in the cleaning apparatus 1.

[0077] The cleaning apparatus 1 has an open-top structure, which enables it to be suitable for the overflow cleaning process. In the overflow cleaning process, the cleaning liquid overflows from the top of the cleaning apparatus 1, while part of the impurities and contaminants are discharged, thereby maintaining the cleanliness of the cleaning liquid and ensuring that the semiconductor products accommodated in the interior of the cleaning apparatus 1 are always in a clean cleaning environment. In addition, in order to achieve the purpose of fully immersing the semiconductor products, the interior of the cleaning apparatus 1 needs to be filled with sufficient cleaning liquid. During the cleaning process, the cleaning liquid circulates in the interior of the apparatus and naturally overflows during the flow.

[0078] To effectively guide the overflowing cleaning liquid, in some embodiments of the present application, see Figure 13 An overflow portion 22 can be arranged at the upper edge of the upper tank portion 11, which can be used to guide the flow of the cleaning liquid to leave the cleaning apparatus 1, avoiding the waste or inconvenience caused by disordered overflow.

[0079] As shown in Figure 13 The overflow portion 22 can adopt a zigzag design and be continuously arranged along the upper edge of the upper tank portion 11. This design can ensure that the cleaning liquid is evenly distributed when overflowing, avoiding excessive local flow. The specific shape of the overflow portion 22 is not limited to zigzag, and can be flexibly adjusted according to actual needs to meet different cleaning needs. The present application does not limit this.

[0080] Through the action of the overflow portion 22, the overflow path of the cleaning liquid is optimized, realizing the uniform discharge of the cleaning liquid, and improving the recycling efficiency of the cleaning liquid. The application of the overflow cleaning process not only improves the stability of the cleaning effect, but also ensures the cleanliness and operation convenience of the cleaning apparatus 1.

[0081] In order to realize the rapid emptying of the cleaning apparatus, in some embodiments of the present application, see Figure 13The cleaning device 1 can further include a drain device 23 disposed at the bottom of the lower tank portion 12 for draining the cleaning liquid in the cleaning device 1. The drain device 23 can be in communication with the interior of the lower tank portion 12, so that the cleaning liquid can be directly drained from the interior of the cleaning device 1 under the action of gravity, thereby simplifying the draining operation.

[0082] The drain device 23 can be installed at the bottom of the lower tank portion 12 to ensure complete drainage of the cleaning liquid. In addition, the drain device 23 can include a drain valve 231 for controlling the drainage process of the cleaning liquid, thereby further improving the drainage rate and meeting the needs of different operation scenarios.

[0083] To adapt to diversified cleaning needs, the cleaning device 1 can be equipped with multiple drain devices 23. For example, as shown in FIG. 5, two independent drain devices 23 can be provided at different positions of the lower tank portion 12 to allow selective activation of the drain devices according to application needs, thereby improving the drainage efficiency and providing flexibility for complex operations. Figure 13

[0084] By providing the drain device 23, the cleaning device 1 can quickly empty the internal cleaning liquid, significantly improve its turnover efficiency, and reduce the time required for device cleaning and maintenance, thereby further improving the efficiency and reliability of the overall cleaning process.

[0085] It should be noted that the technical solutions described in the embodiments of the present application can be combined arbitrarily without conflict.

[0086] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.​

Claims

1. A cleaning apparatus for cleaning semiconductor products, characterized in that, The cleaning equipment includes: an upper tank and a lower tank arranged vertically below and communicating with the upper tank, wherein... The upper tank and the lower tank are used to contain cleaning fluid and semiconductor products, and the upper tank is configured to allow the semiconductor products to be placed horizontally in the upper tank, and the lower tank is configured to allow the semiconductor products to be placed vertically in the lower tank.

2. The cleaning equipment according to claim 1, characterized in that, The upper groove portion is provided with a first retaining member, and the lower groove portion is provided with a second retaining member. The first retaining member is configured to hold the semiconductor product in the upper groove portion along the horizontal direction, and the second retaining member is configured to hold a plurality of the semiconductor products in the lower groove portion along the vertical direction.

3. The cleaning equipment according to claim 1, characterized in that, The cleaning equipment includes a liquid supply port located at the lower tank section for supplying the cleaning liquid to the upper tank section and the lower tank section.

4. The cleaning equipment according to claim 3, characterized in that, The cleaning equipment includes a gas supply port located at the lower tank section for supplying gas to the upper tank section and the lower tank section.

5. The cleaning equipment according to claim 4, characterized in that, The cleaning equipment also includes a rectifier plate located above the liquid supply port and the gas supply port in the vertical direction. The rectifier plate is provided with through holes to allow the cleaning liquid and the gas to flow through in the vertical direction, thereby guiding the cleaning liquid and the gas to flow evenly in the upper tank and the lower tank.

6. The cleaning equipment according to claim 5, characterized in that, The cleaning equipment also includes a rotating component disposed within the lower tank. The rotating component is positioned above the rectifier plate in the vertical direction and is capable of contacting the semiconductor product held in the lower tank to drive the semiconductor product in the lower tank to rotate.

7. The cleaning equipment according to any one of claims 1 to 6, characterized in that, The cleaning equipment also includes a spraying device disposed above the upper tank, the spraying device being configured to spray the cleaning liquid into the upper tank and the lower tank.

8. The cleaning equipment according to any one of claims 1 to 6, characterized in that, An overflow section is provided at the upper edge of the upper tank, and the overflow section is used to guide the cleaning fluid to flow away from the cleaning equipment.

9. The cleaning equipment according to any one of claims 1 to 6, characterized in that, The cleaning equipment also includes a discharge device located at the bottom of the lower tank for discharging the cleaning liquid from the cleaning equipment.

10. The cleaning equipment according to any one of claims 1 to 6, characterized in that, The bottom of the upper tank protrudes in the horizontal direction relative to the outer periphery of the lower tank, and the cleaning device includes reinforcing portions disposed at the bottom of the upper tank and the outer periphery of the lower tank.

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