Copper foil pressing mechanism applied to diffusion welding of multiple layers of copper foils

By designing a copper foil clamping mechanism, the problems of welding misalignment and displacement in multi-layer copper foil welding were solved, improving production efficiency and reducing the skill requirements for operators.

CN223947009UActive Publication Date: 2026-02-27KUNSHAN VEKAN PRECISION TECH CO LTD
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Patent Information

Application Number
CN202423038408.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2026-02-27
Estimated Expiration
2034-12-10

AI Technical Summary

Technical Problem

In the existing multi-layer copper foil welding process, manual material handling leads to welding skew and misalignment, resulting in low production efficiency and requiring a high level of operator skill.

Method used

A copper foil pressing mechanism is designed, including a frame, a positioning plate, a pressing mechanism, and a positioning pin ejection mechanism. The pressing mechanism presses multiple layers of copper foil onto the positioning plate, and the positioning pin ejection mechanism ejects the positioning pin from the copper foil to ensure that the copper foil does not shift.

Benefits of technology

It reduces misalignment and deviation during the welding process, improves production efficiency, and lowers the skill requirements for operators.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a copper foil pressing mechanism applied to diffusion welding of multiple layers of copper foils. The positioning plate is fixedly arranged on the middle side of the rack, a positioning hole is formed in the positioning plate, and the positioning hole is configured to allow a positioning pin for positioning the multiple layers of copper foils to be inserted; the pressing mechanism is fixedly arranged on the top side of the rack, and the pressing mechanism is used for pressing the multiple layers of copper foils on the positioning plate; and the positioning pin ejection mechanism is fixedly arranged on the bottom side of the rack, and the positioning pin ejection mechanism is used for ejecting the positioning pins on the multiple layers of copper foils in the pressing state out of the positioning holes. According to the copper foil pressing mechanism applied to diffusion welding of the multiple layers of copper foils, the multiple layers of copper foils are pressed on the positioning plate through the pressing mechanism firstly, then the positioning pins used for fixing the multiple layers of copper foils are ejected out of the multiple layers of copper foils through the positioning pin ejection mechanism, in the ejection process, due to the fact that the multiple layers of copper foils are pressed, deviation cannot occur, and the multiple layers of copper foils are fixed through the positioning pin ejection mechanism. And the problems of welding deflection, dislocation and the like in the subsequent welding process are reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to soft row welding technical field, especially relate to copper foil pressure mechanism for multilayer copper foil diffusion welding. BACKGROUND

[0002] The soft row is usually made by multilayer copper foil welding, and the diffusion welding process is usually used at present. That is, the graphite is heated by continuous current, and the molecular diffusion is realized by applying pressure to the workpiece, and the whole connection interface is formed by metal bond, and then the diffusion welding process is completed.

[0003] However, since the welding material is multilayer copper foil, the material needs to be sorted before welding, and manual sorting is usually used at present. Manual sorting is prone to errors, which leads to welding deviation and misplacement. The operator's proficiency is required, which leads to low production efficiency.

[0004] Therefore, in view of the deficiencies of the prior art, it is necessary to design a copper foil pressure mechanism for multilayer copper foil diffusion welding to solve the above problems. UTILITY MODEL CONTENT

[0005] In order to overcome the deficiencies of the prior art, the utility model aims to provide a copper foil pressure mechanism for multilayer copper foil diffusion welding.

[0006] In order to achieve the above-mentioned purpose and other related purposes, the technical scheme provided by the utility model is: a copper foil pressure mechanism for multilayer copper foil diffusion welding, comprising:

[0007] A rack;

[0008] A positioning plate is fixedly arranged on the middle side of the rack, and a positioning hole is arranged on the positioning plate, which is configured to insert a positioning pin for positioning multilayer copper foil.

[0009] A pressure mechanism is fixedly arranged on the top side of the rack, and the pressure mechanism is used to press the multilayer copper foil on the positioning plate.

[0010] A positioning pin ejection mechanism is fixedly arranged on the bottom side of the rack, and the positioning pin ejection mechanism is used to eject the positioning pin on the multilayer copper foil in the pressure state from the positioning hole.

[0011] The preferred technical scheme is that the top side of the rack is provided with a top plate, the pressure mechanism is composed of a pressure cylinder and a pressure block, the pressure cylinder is fixedly arranged on the top plate, and the pressure cylinder is used to drive the pressure block to move up and down above the positioning plate.

[0012] The preferred technical scheme is that the bottom side of the rack is provided with a bottom plate, the positioning pin ejection mechanism is composed of a jacking cylinder and a jacking rod, the jacking cylinder is fixed on the bottom plate, and the jacking cylinder is used to drive the jacking rod to move up and down below the positioning plate; and the jacking rod is correspondingly matched with the positioning hole.

[0013] The preferred technical scheme is that the pressing block is provided with a space corresponding to the positioning hole.

[0014] The preferred technical scheme is that the guiding assembly is composed of a guiding rod and a guiding sleeve, the guiding sleeve is fixed on the top plate, the guiding rod is slidably sleeved in the guiding sleeve, and the bottom end of the guiding rod is fixedly connected with the pressing block.

[0015] Due to the above technical scheme, the utility model has the beneficial effects that:

[0016] The copper foil pressing mechanism applied to the multi-layer copper foil diffusion welding is used to press the multi-layer copper foil on the positioning plate through the pressing mechanism, and then the positioning pin for fixing the multi-layer copper foil is ejected from the multi-layer copper foil through the positioning pin ejection mechanism, so that the multi-layer copper foil is not offset during the ejection process, and the problems of welding deviation and misalignment in the subsequent welding process are reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The utility model relates to a pressing mechanism structure schematic view. DETAILED DESCRIPTION

[0018] The skilled in the art can easily understand other advantages and effects of the utility model from the content disclosed in the specification.

[0019] Please refer to Figure 1It should be noted that in the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. These terms are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," and "suspended," etc., do not indicate that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0020] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Example:

[0022] like Figure 1 As shown, according to a general technical concept of this utility model, a copper foil clamping mechanism for use in multilayer copper foil diffusion soldering is provided, comprising:

[0023] Rack 1;

[0024] Positioning plate 2 is fixed to the middle side of frame 1. Positioning plate 2 is provided with positioning hole 21, which is configured to allow positioning pins for positioning multilayer copper foil to be inserted.

[0025] The pressing mechanism 3 is fixed on the top side of the frame 1 and is used to press the multi-layer copper foil onto the positioning plate 2.

[0026] The positioning pin ejection mechanism 4 is fixed to the bottom side of the frame 1. The positioning pin ejection mechanism 4 is used to eject the positioning pin on the multilayer copper foil under the pressing state from the positioning hole 21 and detach it from the multilayer copper foil.

[0027] like Figure 1As shown, in an exemplary embodiment of this utility model, the top side of the frame 1 is provided with a top plate 11, and the pressing mechanism 3 is composed of a pressing cylinder 31 and a pressing block 32. The pressing cylinder 31 is fixed on the top plate 11 and is used to drive the pressing block 32 to move up and down above the positioning plate 2.

[0028] like Figure 1 As shown, in an exemplary embodiment of this utility model, the bottom side of the frame 1 is provided with a base plate 12, and the positioning pin ejection mechanism 4 is composed of a lifting cylinder 41 and a push rod 42. The lifting cylinder 41 is fixed on the base plate 12 and is used to drive the push rod 42 to move up and down below the positioning plate 2; the push rod 42 is correspondingly matched with the positioning hole 21.

[0029] like Figure 1 As shown, in an exemplary embodiment of this utility model, the clamping block 32 is provided with a clearance space corresponding to the positioning hole 21 to avoid interference.

[0030] like Figure 1 As shown, in an exemplary embodiment of this utility model, a guide component 5 is also included. The guide component 5 consists of a guide rod 51 and a guide sleeve 52. The guide sleeve 52 is fixed on the top plate 11, and the guide rod 51 is slidably sleeved in the guide sleeve 52. The bottom end of the guide rod 51 is fixedly connected to the pressing block 32.

[0031] Therefore, this utility model has the following advantages:

[0032] The copper foil clamping mechanism proposed in this utility model for diffusion soldering of multilayer copper foil first clamps the multilayer copper foil onto the positioning plate, and then the positioning pin ejection mechanism ejects the positioning pin used to fix the multilayer copper foil from the multilayer copper foil. During the ejection process, since the multilayer copper foil is clamped, it will not shift, reducing problems such as welding skew and misalignment that occur in the subsequent welding process.

[0033] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A copper foil pressing mechanism applied to a multi-layer copper foil diffusion welding, characterized in that, The utility model relates to a copper foil pressing device, including: A rack; A positioning plate is fixed to the middle side of the rack, and a positioning hole is arranged on the positioning plate, which is configured to insert a positioning pin for positioning a multilayer copper foil; A pressing mechanism is fixed to the top side of the rack, which is used to press the multilayer copper foil on the positioning plate; A positioning pin ejection mechanism is fixed to the bottom side of the rack, which is used to eject the positioning pin on the multilayer copper foil in the pressed state from the positioning hole.

2. The copper foil pressing mechanism for use in the diffusion welding of a multi-layer copper foil according to claim 1, characterized in that: The top side of the rack is provided with a top plate, the pressing mechanism is composed of a pressing cylinder and a pressing block, the pressing cylinder is fixed to the top plate, and the pressing cylinder is used to drive the pressing block to move up and down above the positioning plate.

3. The copper foil pressing mechanism for use in the diffusion welding of multi-layer copper foils according to claim 1, characterized in that: The bottom side of the rack is provided with a bottom plate, the positioning pin ejection mechanism is composed of a lifting cylinder and a lifting rod, the lifting cylinder is fixed to the bottom plate, and the lifting cylinder is used to drive the lifting rod to move up and down below the positioning plate; the lifting rod is correspondingly matched with the positioning hole.

4. The copper foil pressing mechanism for use in the diffusion welding of multi-layer copper foils according to claim 2, characterized in that: The pressing block is provided with a space corresponding to the positioning hole.

5. The copper foil pressing mechanism for use in the diffusion welding of multi-layer copper foils according to claim 2, characterized in that: It also includes a guide assembly composed of a guide rod and a guide sleeve, the guide sleeve is fixed to the top plate, the guide rod is slidably sleeved in the guide sleeve, and the bottom end of the guide rod is fixedly connected with the pressing block.