General adsorption platform for laser drilling, scribing and cutting

Abstract

The utility model provides a general adsorption platform for laser drilling, scribing and cutting, which comprises a negative pressure adsorption base, an adsorption platform base is mounted at the upper end of the negative pressure adsorption base through screws, and a plurality of equal-height adsorption blocks are mounted on the upper surface of the adsorption platform base at equal intervals. A plurality of adsorption holes communicated with the internal space of the negative pressure adsorption base are uniformly formed in the upper surface of the equal-height adsorption block, and positioning pieces used for limiting the position of a semiconductor ceramic chip are installed at the positions, close to the two short edges of the adsorption platform base, of the upper surface of the adsorption platform base and the position, close to one long edge of the adsorption platform base, of the upper surface of the adsorption platform base; the utility model has the beneficial effects that the platform does not need to be replaced when the ceramic chip is cut and processed, and the flatness of the semiconductor ceramic chip when the semiconductor ceramic chip is adsorbed is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a laser drilling and scribing cutting universal adsorption platform and belongs to the field of semiconductor ceramic disc laser cutting. BACKGROUND

[0002] In the laser cutting of semiconductor ceramic discs, the universal cutting adsorption platform is divided into a drilling platform and a scribing platform. The drilling platform positions and fixes the ceramic disc by supporting and covering the four edges of the ceramic disc, and the middle of the adsorption platform is hollow. The middle part of the scribing platform is provided with a hole for adsorbing the ceramic disc, and the ceramic disc is adsorbed and attached to the platform in a vacuum, with the space around the ceramic disc being avoided to provide a space for laser drilling. Because the laser cutting needs to pass through the ceramic disc in the drilling process, the adsorption platform needs to be avoided below. In the production process, some ceramic disc processing technologies need to first make positioning holes around the ceramic disc on the scribing platform, then change the positioning reference, and position the ceramic disc on the drilling platform to make holes in the ceramic disc, and finally complete scribing. Because the drilling platform is hollow inside, the ceramic disc may be deformed when the negative pressure is adsorbed, which affects the cutting depth. SUMMARY

[0003] In view of the deficiencies of the prior art, the utility model aims to provide a laser drilling and scribing cutting universal adsorption platform to solve the problems in the background art. The utility model does not need to change the platform in the cutting process of the ceramic disc, and ensures the flatness of the semiconductor ceramic disc when it is adsorbed.

[0004] In order to achieve the above-mentioned purpose, the utility model is implemented by the following technical scheme: a laser drilling and scribing cutting universal adsorption platform, comprising a negative pressure adsorption base, a suction platform base is installed on the upper end of the negative pressure adsorption base through a screw, a plurality of equal-height adsorption blocks are installed on the upper surface of the suction platform base at equal intervals, a plurality of adsorption holes are uniformly formed in the upper surface of the equal-height adsorption block and communicated with the internal space of the negative pressure adsorption base, and a positioning member for limiting the position of the semiconductor ceramic disc is installed at the position close to the two short edges of the upper surface of the suction platform base and the position close to one long edge of the upper surface of the suction platform base.

[0005] Further, the positioning member comprises a positioning block, the positioning block is installed on the upper surface of the adsorption platform base near the two short edges of the adsorption platform base and near one long edge of the adsorption platform base, the thickness of the positioning block is less than the height of the isometric adsorption block, two waist-shaped holes are formed in the upper surface of the positioning block, a positioning screw is inserted into the waist-shaped hole and is screwed with the adsorption platform base, the first boss and the second boss are symmetrically arranged on the upper surface of the positioning block, a pressing block is arranged between the first boss and the second boss, an alumina ceramic plate is arranged on the side surface of the semiconductor ceramic wafer and is attached to the pressing block, a threaded hole is formed in the side of the second boss away from the first boss, and a clamping screw is screwed in the threaded hole and is used for pressing the pressing block.

[0006] Further, the first boss and the positioning block are an integral molding structure, and the second boss and the positioning block are an integral molding structure.

[0007] Further, the upper surface of the first boss is flush with the upper surface of the isometric adsorption block, and the upper surface of the second boss is flush with the upper surface of the isometric adsorption block.

[0008] Further, one side of the negative pressure adsorption base is provided with a pipe joint, and the pipe joint is communicated with the internal space of the negative pressure adsorption base.

[0009] Further, the inner bottom of the adsorption platform base is concave downward to form a plurality of equidistantly arranged positioning grooves, the isometric adsorption blocks are installed in the positioning grooves through screws, an adsorption cover plate is arranged between the two adjacent isometric adsorption blocks, the adsorption cover plate is inserted into the positioning groove between the two adjacent isometric adsorption blocks, a plurality of air holes are uniformly formed in the bottom of the positioning groove, and the air holes are communicated with the adsorption holes.

[0010] Further, the bottom of the negative pressure adsorption base is provided with a positioning seat, and the positioning seat and the negative pressure adsorption base are an integral molding structure.

[0011] The utility model discloses beneficial effects:

[0012] 1. The plurality of isometric adsorption blocks are uniformly distributed on the platform, and the flatness of the semiconductor ceramic wafer during adsorption is guaranteed.

[0013] 2. The line and the punching function are compatible, all pattern requirements of punching around and inside in the cutting processing semiconductor ceramic wafer are compatible, without changing the customized platform, one processing clamping position is saved, the efficiency is greatly improved and the machine cost is reduced.

[0014] 3、The contact part in the adjustable positioning block is a self-made alumina ceramic sheet, which is wear-resistant and easy to replace, two waist-shaped holes are formed on the positioning block, the position of the positioning screw in the waist-shaped hole is adjusted, so that the position of the alumina ceramic sheet changes, and the positioning of semiconductor ceramic sheets of different sizes is suitable. BRIEF DESCRIPTION OF DRAWINGS

[0015] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments thereof, read in conjunction with the accompanying drawings:

[0016] Figure 1 It is a structural schematic view of the universal adsorption platform for laser drilling, scribing and cutting of the utility model;

[0017] Figure 2 It is an assembly schematic view of the medium high adsorption block, the adsorption platform base and the negative pressure adsorption base in the universal adsorption platform for laser drilling, scribing and cutting of the utility model;

[0018] Figure 3 It is Figure 2 The enlarged view of A in the middle;

[0019] Figure 4 It is a use state schematic view of the universal adsorption platform for laser drilling, scribing and cutting of the utility model;

[0020] Figure 5 It is another use state schematic view of the universal adsorption platform for laser drilling, scribing and cutting of the utility model;

[0021] In the drawing: 1-negative pressure adsorption base, 2-pipe joint, 3-adsorption platform base, 4-positioning seat, 5-equal-height adsorption block, 6-adsorption hole, 7-positioning groove, 8-vent hole, 9-adsorption cover plate, 10-positioning block, 11-waist-shaped hole, 12-positioning screw, 13-first boss, 14-alumina ceramic sheet, 15-pressing block, 16-clamping screw, 17-second boss, 18-semiconductor ceramic sheet. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, purposes and effects realized by the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0023] Please refer to Figure 1 And Figure 2The utility model provides a technical scheme: a laser perforation and scribe cutting general adsorption platform, including negative pressure adsorption base 1, the one side of negative pressure adsorption base 1 is installed with pipe joint 2, and the inside space of pipe joint 2 and negative pressure adsorption base 1 communicates, and the bottom of negative pressure adsorption base 1 is installed with positioning seat 4, and positioning seat 4 and negative pressure adsorption base 1 are integrally formed structure, and the upper end of negative pressure adsorption base 1 is installed with adsorption platform base 3 through screw, and the upper surface of adsorption platform base 3 is installed with multiple isometric adsorption blocks 5, and the upper surface of isometric adsorption block 5 evenly is provided with multiple adsorption holes 6 with the inside space of negative pressure adsorption base 1 communicates, make multiple isometric adsorption blocks 5 evenly distribute on the platform, guarantee the flatness when semiconductor porcelain chip 18 adsorption.

[0024] Refer to Figure 1 And Figure 2 , and the inner bottom of adsorption platform base 3 is concave and forms multiple equidistantly arranged positioning grooves 7, and isometric adsorption block 5 is installed in positioning groove 7 through screw, and the adjacent two isometric adsorption blocks 5 are equipped with adsorption cover plate 9, and adsorption cover plate 9 is inserted in the positioning groove 7 between the adjacent two isometric adsorption blocks 5, and the inner bottom of positioning groove 7 evenly is provided with multiple air holes 8, and air hole 8 communicates with adsorption hole 6, and by taking out adsorption cover plate 9 from the corresponding positioning groove 7 after installing isometric adsorption block 5, the density of isometric adsorption block 5 is increased according to the need.

[0025] Refer to Figures 1-5The positioning block 10 is installed on the upper surface of the adsorption platform base 3 near the two short edges and near one long edge of the adsorption platform base 3, the thickness of the positioning block 10 is less than the height of the equal-height adsorption block 5, two waist-shaped holes 11 are formed in the upper surface of the positioning block 10, the positioning screws 12 are inserted into the waist-shaped holes 11 and are screwed with the adsorption platform base 3, the first boss 13 and the second boss 17 are symmetrically arranged on the upper surface of the positioning block 10, the upper surfaces of the first boss 13 and the second boss 17 are flush with the upper surface of the equal-height adsorption block 5, the pressing block 15 is arranged between the first boss 13 and the second boss 17 which are integrally formed with the positioning block 10, the alumina ceramic sheet 14 is arranged between the pressing block 15 and the first boss 13 for abutting against the side surface of the semiconductor ceramic sheet 18, a threaded hole is formed in the side of the second boss 17 away from the first boss 13, the clamping screw 16 is screwed into the threaded hole for pressing the pressing block 15, the alumina ceramic sheet 14 is arranged between the first boss 13 and the pressing block 15, then the clamping screw 16 is screwed, so that the alumina ceramic sheet 14 is clamped between the first boss 13 and the pressing block 15, which facilitates the replacement of the alumina ceramic sheet 14, the position of the alumina ceramic sheet 14 is changed by adjusting the position of the positioning screw 12 in the waist-shaped hole 11, which is suitable for positioning the semiconductor ceramic sheet 18 of different sizes, the semiconductor ceramic sheet 18 is positioned on the left lower side, the punching and cutting of the patterns around and in the large part of the inside can be completed, after completion, the semiconductor ceramic sheet 18 is pushed to the left upper side to complete the punching and cutting of the remaining patterns, this method cooperates with the cutting program to meet the cutting and punching of all patterns of the same size ceramic sheet, and is compatible with the line marking and punching functions, in the cutting and processing of the semiconductor ceramic sheet 18, all pattern requirements of the punching around and in the inside are met, without the need to replace the customized platform, one processing clamping position is saved, the efficiency is greatly improved and the cost of the machine is reduced.

[0026] Although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A laser drilling, scribing and cutting universal adsorption platform comprising a negative pressure adsorption base (1), characterized in that: The negative pressure adsorption base (1) is provided with an adsorption platform base (3) at the upper end and is fixed by screws.

2. The universal adsorption platform for laser drilling, scribing and cutting according to claim 1, characterized in that: The positioning member comprises a positioning block (10), and the positioning block (10) is arranged on the upper surface of the adsorption platform base (3) near the two short edges and near one long edge. 3.The laser drilling, scribing and cutting universal suction platform according to claim 2, characterized in that: The first boss (13) and the second boss (17) are integrally formed with the positioning block (10).

4. The universal adsorption platform for laser drilling, scribing and cutting according to claim 2, characterized in that: The first boss (13) and the second boss (17) are integrally formed with the positioning block (10).

5. The universal adsorption platform for laser drilling, scribing and cutting according to claim 1, characterized in that: The first boss (13) and the second boss (17) are integrally formed with the positioning block (10).

6. The universal adsorption platform for laser drilling, scribing and cutting according to claim 1, characterized in that: The negative pressure adsorption base (1) is provided with a pipe joint (2) on one side, and the pipe joint (2) is communicated with the internal space of the negative pressure adsorption base (1).

7. The universal adsorption platform for laser drilling, scribing and cutting according to claim 1, characterized in that: The adsorption platform base (3) is provided with a plurality of positioning grooves (7) arranged at equal intervals on the inner bottom and recessed downward, the equal-height adsorption blocks (5) are arranged in the positioning grooves (7) by screws, and an adsorption cover plate (9) is arranged between adjacent two equal-height adsorption blocks (5). The negative pressure adsorption base (1) is provided with a positioning seat (4) at the bottom.

Images