Chip grinding structure

Abstract

The utility model provides a chip grinding structure which comprises a substrate, a chip to be ground and a plurality of imitation chips, the chip to be ground is positioned on the substrate, the imitation chips are positioned on the substrate and around the chip to be ground, and the chip to be ground and the imitation chips are fixed on the substrate through fixing glue; the imitation chip is a cylinder, and the axis of the cylinder is parallel to the horizontal plane of the substrate. According to the utility model, the plurality of imitation chips are arranged around the chip to be ground, so that the area of a grinding contact surface is effectively increased, the problem of non-uniform grinding of the chip to be ground caused by the operation of an operator is reduced, and the grinding difficulty of the chip to be ground is greatly reduced. Meanwhile, the imitated chip is cylindrical and easy to clean, and particles and organic matters are difficult to remain, so that the imitated chip can be combined with other delamination modes for use, that is, the chip grinding structure can be simultaneously suitable for delamination by grinding and delamination by other modes, and the delamination efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially relates to a chip grinding structure. BACKGROUND

[0002] When the sample chip is being ground, it is usually subjected to two kinds of forces, one is the normal pressure generated by the operator pressing the sample chip, and the other is the shear stress perpendicular to the normal direction generated when the grinding disc rotates. Since the normal pressure applied to the sample chip by the operator is not necessarily uniform when the operator operates, this will result in uneven grinding of the sample. The smaller the sample, the more obvious this phenomenon usually is. In semiconductor processing, the length and width of some dies are usually only a few millimeters, and the grinding target is often reached on one side, but far from being reached in other directions.

[0003] The traditional processing method is to place a circle of silicon wafers around the target chip as a baffle to increase the force area during grinding to reduce the difficulty of grinding.

[0004] However, this method requires a high level of operator skill, and it is difficult to combine with other delayering methods. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a chip grinding structure which can effectively increase the area of the grinding contact surface, reduce the problem of uneven grinding of the sample caused by the operator's operation, reduce the grinding difficulty of the sample, and can also be combined with other delayering methods.

[0006] To solve the above technical problems, the utility model provides a chip grinding structure, which comprises: a substrate, a chip to be ground located on the substrate, a plurality of dummy chips located on the substrate and around the chip to be ground, the chip to be ground and the dummy chips being fixed on the substrate by fixing glue; the dummy chips are in the shape of a cylinder, and the axis of the cylinder is parallel to the horizontal plane of the substrate.

[0007] Optionally, the four dummy chips are located around the chip to be ground respectively.

[0008] Optionally, the four dummy chips are connected end to end.

[0009] Optionally, there is a gap between adjacent dummy chips.

[0010] Optionally, the chip to be ground is located in the central region of the substrate.

[0011] Optionally, the height of the dummy chip is greater than the height of the chip to be ground, or the height of the dummy chip is less than the height of the chip to be ground.

[0012] Optionally, the chip to be ground is away from one side of the substrate, which is a surface to be ground.

[0013] Optionally, the chip to be ground is a chip made by semiconductor process, and the shape of the chip to be ground is rectangular.

[0014] Optionally, the material of the dummy chip is ceramic, metal or silicon, and the material of the fixing glue is paraffin wax.

[0015] Optionally, the substrate is a square silicon wafer.

[0016] In the chip grinding structure, a plurality of dummy chips are arranged around the chip to be ground, so that the area of the grinding contact surface is effectively increased, the problem of uneven grinding of the chip to be ground caused by the operator's operation is reduced, and the grinding difficulty of the chip to be ground is greatly reduced. Meanwhile, the dummy chip is a cylinder, and the axis of the cylinder is parallel to the horizontal plane of the substrate, that is, the side wall of the cylinder is fixed on the substrate. Compared with the dummy chip in the prior art which is a cuboid, the corner with an arc on the surface of the cylinder is easy to clean, and it is difficult to have particles and organic matter residues, so it can be combined with other delayering methods (such as using chemical reagents for delayering), that is, the chip grinding structure can be used for grinding and delayering and other delayering methods at the same time, thereby improving the delayering efficiency.

[0017] In addition, the height of the dummy chip can be greater than or less than the height of the chip to be ground. When the height of the dummy chip is greater than the height of the chip to be ground, the grinding process will preferentially grind the dummy chip. Compared with the cuboid, the cylinder has less grinding amount, and the grinding time can be greatly saved. When the height of the dummy chip is less than the height of the chip to be ground, the grinding process will preferentially grind the chip to be ground. Compared with the cuboid, the corner cutting phenomenon of the cylinder is much better, and the grinding uniformity can be greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Those skilled in the art will understand that the provided drawings are for better understanding of the utility model, and do not constitute any limitation on the scope of the utility model. Among them:

[0019] Figure 1 is a sectional view of the chip grinding structure provided by an embodiment of the utility model.

[0020] Figure 2is a top view of the chip grinding structure provided by an embodiment of the utility model.

[0021] Figure 3 is a sectional view of the chip grinding structure when the height of the dummy chip is greater than the height of the chip to be ground.

[0022] Figure 4 is a sectional view of the chip grinding structure when the height of the dummy chip is less than the height of the chip to be ground.

[0023] Figure 5 is a flow chart of the manufacturing method of the chip grinding structure provided by an embodiment of the utility model.

[0024] In the drawings:

[0025] 10-substrate; 20-chip to be ground; 30-dummy chip; 40-fixing glue. DETAILED DESCRIPTION

[0026] As described in the background, in order to avoid the problem of uneven grinding caused by uneven positive pressure applied by the operator during grinding, a dummy chip is arranged around the chip to be ground as a baffle, which is a cuboid to increase the stress area during grinding and reduce the difficulty of grinding. However, this method is difficult to combine with other layer removal methods, that is, the grinding structure thus arranged cannot be used for layer removal, because other layer removal methods generally use chemical reagents for layer removal, which will produce a lot of fine particles and organic matter during use. The particles and organic matter on the cuboid-shaped dummy chip are difficult to remove, and then the grinding and layer removal will easily contaminate the sample.

[0027] In view of the above problems, the utility model provides a chip grinding structure, which comprises: a substrate, a chip to be ground on the substrate, a plurality of dummy chips on the substrate and around the chip to be ground, the chip to be ground and the dummy chips being fixed on the substrate by fixing glue; the dummy chip is a cylinder, and the axis of the cylinder is parallel to the horizontal plane of the substrate.

[0028] The utility model discloses a plurality of imitative chips are arranged on the four sides of the chip to be ground, thereby effectively increasing the area of the grinding contact surface, reducing the problem of uneven grinding of the chip to be ground caused by the operation of the operator, and greatly reducing the grinding difficulty of the chip to be ground. Meanwhile, the imitative chip is a cylinder, and the axis of the cylinder is parallel to the horizontal plane of the substrate, that is, the side wall of the cylinder is fixed on the substrate. Compared with the imitative chip in the prior art which is a cuboid, the corner with the arc of the surface of the cylinder is easy to clean, and it is difficult to have particles and organic matter residues, so that the chip grinding structure can be combined with other delayering methods (for example, using chemical reagents for delayering), that is, the chip grinding structure can be suitable for grinding delayering and other removal methods at the same time, thereby improving the delayering efficiency.

[0029] To make the purpose, advantages and characteristics of the utility model more clear, the following will make further detailed description to the utility model combining with the drawings and specific embodiments. It is to be noted that the drawings are all very simplified and not drawn according to the proportion, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing needs to be different, and sometimes different proportions are used.

[0030] As used in the present utility model, the singular forms "a", "an" and "the" include plural referents unless the content clearly dictates otherwise. As used in the present utility model, the term "or" is generally used in the sense of "and / or" unless the content clearly dictates otherwise. As used in the present utility model, the term "several" is generally used in the sense of "at least one" unless the content clearly dictates otherwise. As used in the present utility model, the term "at least two" is generally used in the sense of "two or more" unless the content clearly dictates otherwise. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second", "third" can explicitly or implicitly include one or at least two features.

[0031] Figure 1 is a sectional view of the chip grinding structure provided by an embodiment of the utility model, Figure 2 is a top view of the chip grinding structure provided by an embodiment of the utility model. Please refer to Figure 1 and Figure 2As shown in the chip grinding structure provided by the embodiment of the utility model, the chip grinding structure comprises a substrate 10, a chip to be ground 20 located on the substrate 10, a plurality of imitation chips 30 located on the substrate 10 and around the chip to be ground 20, and the chip to be ground 20 and the imitation chips 30 are fixed on the substrate 10 by fixing glue 40.

[0032] The horizontal plane of the substrate 10 refers to Figure 2 As shown in the plane, the axis of the cylinder is parallel to the horizontal plane of the substrate 10, which means that the cylinder is laid down, and the side wall of the cylinder is attached to the surface of the substrate 10. The side walls of a plurality of the cylinders are fixed on the substrate 10 to form a ring to surround the chip to be ground 20.

[0033] The utility model discloses a plurality of imitation chips 30 are arranged around the chip to be ground 20, thereby effectively increasing the area of the grinding contact surface, reducing the problem that the chip to be ground 20 is not ground uniformly due to the operation of the operator, and greatly reducing the grinding difficulty of the chip to be ground 20.

[0034] Meanwhile, the imitation chip 30 is a cylinder, and the axis of the cylinder is parallel to the horizontal plane of the substrate 10, that is, the side wall of the cylinder is fixed on the substrate 10. Compared with the imitation chip in the prior art which is a cuboid, the corner of the curved surface of the cylinder is easy to clean, and it is difficult for particles and organic matter to remain, for example, the particles and organic matter on the surface of the cylinder can be effectively removed by cleaning with a cotton swab dipped in isopropyl alcohol. Therefore, the chip grinding structure can be used in combination with other delayering methods (for example, delayering by using chemical reagents), that is, the chip grinding structure can be simultaneously applied to grinding delayering and other delayering methods, for example, a certain layer on the chip to be ground 20 in the chip grinding structure can be removed by using a chemical delayering method first, and then the next layer on the chip to be ground 20 in the chip grinding structure can be removed by using a grinding method, thereby improving the delayering efficiency.

[0035] In an embodiment of the utility model, the chip grinding structure comprises four imitation chips 30, and the four imitation chips 30 are respectively located around the chip to be ground 20, that is, one imitation chip 30 is placed above, below, left and right of the chip to be ground 20, wherein above, below, left and right refer to Figure 2The four imitation chips 30 are arranged vertically and horizontally around the chip 20 to be polished. The two imitation chips 30 located above and below the chip 20 are parallel to each other; the two imitation chips 30 located to the left and right of the chip 20 are parallel to each other; and the two imitation chips 30 located to the left and below the chip 20 are perpendicular to each other. These four imitation chips 30 form a square. However, this is not a limitation; any other suitable shape can be formed. The number of imitation chips 30 is not limited to four; the number and shape can be determined according to actual needs.

[0036] In one embodiment, four of the simulacrated chips 30 can be connected end-to-end to form a closed loop, such as a closed square, which surrounds the chip 20 to be polished. Figure 2 As shown. In another embodiment, adjacent replica chips 30 may have a gap forming an open ring, for example, forming a square with four sides that do not intersect each other, and this open ring surrounds the chip 20 to be polished.

[0037] In one embodiment of the present invention, the chip to be polished 20 is located in the central region of the substrate 10, and a plurality of the imitation chips 30 are located in the edge region of the substrate 10 to surround the chip to be polished 20.

[0038] In one embodiment of this invention, the height of the replica chip 30 can be greater than the height of the chip 20 to be polished, the height of the replica chip 30 can be equal to the height of the chip 20 to be polished, or the height of the replica chip 30 can be less than the height of the chip 20 to be polished. That is, cylinders of different sizes can be freely selected as the replica chip 30, thereby reducing costs. Of course, the height difference between the replica chip 30 and the chip 20 to be polished should not be too large to reduce the difficulty of polishing.

[0039] Figure 3 This is a cross-sectional view of the chip grinding structure provided in one embodiment of this utility model when the height of the replicated chip is greater than the height of the chip to be ground. Please refer to it. Figure 3 As shown, the height of the imitation chip 30 is greater than the height of the chip 20 to be ground. In this case, the grinding process will prioritize grinding the imitation chip 30. Compared with the cuboid imitation chip 30 in the prior art, the cylindrical imitation chip 30 requires less grinding, which can save grinding time to a great extent.

[0040] Figure 4 This is a cross-sectional view of the chip grinding structure provided in one embodiment of the present invention when the height of the replicated chip is less than the height of the chip to be ground. Please refer to it. Figure 4As shown, the height of the dummy chip 30 is less than the height of the chip to be polished 20, so that the polishing process will preferentially polish the chip to be polished 20, and the corner cutting phenomenon of the cylindrical dummy chip 30 is much better than that of the cuboid dummy chip 30 in the prior art, and the uniformity of polishing can be greatly improved. Therefore, the height of the dummy chip 30 can be arbitrarily selected, and the limitation on the selection of the dummy chip 30 is reduced.

[0041] Please refer to Figure 1 As shown, the side of the chip to be polished 20 away from the substrate 10 is the polishing side. The chip to be polished 20 and the dummy chip 30 are fixed on the substrate 10 by the fixing glue 40, and the side of the substrate 10 on which the chip to be polished 20 is fixed faces the polishing pad. The operator presses the side of the substrate 10 away from the chip to be polished 20 to polish the chip to be polished 20 and the dummy chip 30.

[0042] In an embodiment of the utility model, the chip to be polished is a chip made by a semiconductor process, and the shape of the chip to be polished is rectangular. That is, after the chip is made by a semiconductor process, the chip needs to be polished, and then the chip to be polished is fixed on the substrate 10 as the chip to be polished 20.

[0043] The dummy chip 30 is arranged to avoid uneven stress on the chip to be polished 20 during polishing. The arrangement of the dummy chip 30 can increase the stress area during polishing to reduce the difficulty of polishing. The dummy chip 30 can be made of a material resistant to polishing, such as ceramic, metal or silicon wafer. In a preferred embodiment, the material of the dummy chip 30 is silicon, that is, the dummy chip 30 is a silicon column, to ensure that the polishing rate of the dummy chip 30 is close to that of the chip to be polished 20.

[0044] The fixing glue 40 is used to fix the chip to be polished 20 and the dummy chip 30 on the substrate 10. The material of the fixing glue 40 is paraffin wax, which is melted by heating and solidified by stopping heating and standing. The chip to be polished 20 and the dummy chip 30 are fixed on the substrate 10. Of course, the fixing glue 40 can also be epoxy glue or acrylic glue or any other suitable material.

[0045] The substrate 10 is used to fix the chip to be polished 20 and the dummy chip 30. The substrate 10 can be a square silicon wafer, for example, the substrate 10 is a square of 1cm*1cm.

[0046] The utility model discloses a plurality of imitative chips 30 are arranged in the four around of the chip to be ground 20, thereby effectively increased the area of grinding contact surface, reduced the problem that the chip to be ground 20 grinds unevenly due to the operation of operator, greatly reduced the grinding difficulty of the chip to be ground 20. Meanwhile imitative chip 30 is cylinder, and the axis of the cylinder is parallel with the horizontal plane of substrate 10, namely the side wall of the cylinder is fixed on substrate 10, compared with the imitative chip 30 of cuboid in prior art, the corner of the curved surface of the cylinder is easy to clean, and it is difficult to have particle and organic matter residue, thus can be combined with other delaminating mode (for example using chemical reagent delaminating), namely the chip grinding structure can be suitable for grinding delaminating and other delaminating mode simultaneously, thereby improving delaminating efficiency.

[0047] In addition, the height of the imitative chip 30 can be greater than the height of the chip to be ground 20, or less than the height of the chip to be ground 20. When the height of the imitative chip 30 is greater than the height of the chip to be ground 20, the grinding process will grind the imitative chip 30 first. Compared with the cuboid, the cylinder has less grinding amount, which can greatly save the grinding time. When the height of the imitative chip 30 is less than the height of the chip to be ground 20, the grinding process will grind the chip to be ground 20 first. Compared with the cuboid, the cylinder has better corner cutting, which can greatly improve the uniformity of grinding. Thus, the imitative chip with different height can be selected at will, and the limitation of the selectable imitative chip is reduced.

[0048] Correspondingly, the utility model also provides a kind of manufacturing method of chip grinding structure, for manufacturing the chip grinding structure as described above. Figure 5 It is the flow chart of the manufacturing method of chip grinding structure provided in an embodiment of the utility model, please refer to Figure 5 The manufacturing method of chip grinding structure provided in the embodiment of the utility model includes the following steps:

[0049] S1: provide substrate, form fixing glue on the substrate;

[0050] S2: fix the chip to be ground on the substrate by the fixing glue, and fix a plurality of imitative chips on the substrate around the chip to be ground.

[0051] Please refer to Figure 1 and Figure 2 In step S1, provide substrate 10, and form fixing glue 40 on substrate 10. In step S2, fix the chip to be ground 20 on substrate 10 by fixing glue 40, and fix a plurality of imitative chips 30 on substrate 10 around chip to be ground 30.

[0052] In an embodiment, the substrate 10 is a square silicon wafer, the fixing glue 40 is paraffin wax, and the dummy chip 30 is a silicon column. For example, the size of the substrate is 1cm*1cm, and the length of the silicon column is 0.5cm, but the present application is not limited to this.

[0053] For example, in step S1, a 1cm*1cm square silicon wafer is prepared first, the silicon wafer is placed on a heating table, the temperature of the heating table is set to about 140℃, then a solidified paraffin wax is taken and placed at the center of the silicon wafer, the paraffin wax is heated from solid to molten state, then the paraffin wax is evenly coated on the surface of the silicon wafer along the center of the silicon wafer, for example, a toothpick can be used to evenly coat the paraffin wax.

[0054] In step S2, the chip to be ground is placed at the center of the silicon wafer, one silicon column is placed in each of the four directions above, below, left and right based on the position of the chip to be ground, then the heating table is turned off, and the chip grinding structure is completed after the temperature of the silicon wafer returns to room temperature.

[0055] The chip grinding structure manufactured by the manufacturing method of the chip grinding structure provided by the present application increases the area of the grinding contact surface by the setting of the dummy chip 30, reduces the problem of uneven grinding of the chip caused by the operation of the operator, and greatly reduces the grinding difficulty of the chip to be ground 20. At the same time, the dummy chip 30 is a silicon column, the sidewall of the silicon column is fixed on the substrate 10, compared with the dummy chip in the prior art which is a cuboid, the corners of the cylindrical surface with curvature are easy to clean, and it is difficult to have particles and organic matter residues, so it can be used in combination with other delayering methods (such as using chemical reagents for delayering), that is, the chip grinding structure can be used for grinding delayering and other delayering methods at the same time, thereby improving the delayering efficiency.

[0056] In summary, the chip grinding structure provided by the utility model, including: substrate, the chip to be ground located on the substrate, multiple imitation chips located on the substrate and around the chip to be ground, the chip to be ground and the imitation chip are fixed on the substrate through fixing glue, the imitation chip is a cylinder, the axis of the cylinder is parallel to the horizontal plane of the substrate. The utility model sets multiple imitation chips around the chip to be ground, thereby effectively increasing the area of the grinding contact surface, reducing the problem of uneven grinding of the chip to be ground caused by the operation of the operator, and greatly reducing the grinding difficulty of the chip to be ground. At the same time, the imitation chip is a cylinder, and the axis of the cylinder is parallel to the horizontal plane of the substrate, that is, the side wall of the cylinder is fixed on the substrate. Compared with the imitation chip in the prior art which is a cuboid, the curved corner of the surface of the cylinder is easy to clean, and it is difficult for particles and organic matter to remain, so that it can be used in combination with other delayering methods (for example, delayering by using chemical reagents), that is, the chip grinding structure can be used for grinding and delayering and other delayering methods at the same time, thereby improving the delayering efficiency.

[0057] In addition, the height of the imitation chip can be greater than the height of the chip to be ground, or less than the height of the chip to be ground. When the height of the imitation chip is greater than the height of the chip to be ground, the grinding process will preferentially grind the imitation chip. Compared with the cuboid, the cylinder has less grinding amount, and the grinding time can be greatly saved. When the height of the imitation chip is less than the height of the chip to be ground, the grinding process will preferentially grind the chip to be ground. Compared with the cuboid, the chamfering phenomenon is much better, and the grinding uniformity can be greatly improved.

[0058] The above description is only a description of the preferred embodiments of the utility model, and does not limit the scope of the utility model in any way. Any person skilled in the art can make possible changes and modifications to the technical solutions of the utility model by using the disclosed methods and technical contents without departing from the spirit and scope of the utility model. Therefore, any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the utility model, which does not deviate from the technical solutions of the utility model, belongs to the protection scope of the technical solutions of the utility model.

Claims

1. A chip grinding structure, characterized in that, include: The substrate, the chip to be polished on the substrate, and a plurality of replica chips on the substrate and surrounding the chip to be polished, wherein the chip to be polished and the replica chips are fixed to the substrate by adhesive; the replica chips are cylindrical and the axis of the cylinder is parallel to the horizontal plane of the substrate.

2. The chip grinding structure according to claim 1, characterized in that, The four replica chips are located around the chip to be polished.

3. The chip grinding structure according to claim 2, characterized in that, The four replica chips are connected end to end.

4. The chip grinding structure according to claim 2, characterized in that, There is a gap between adjacent replica chips.

5. The chip grinding structure according to claim 1, characterized in that, The chip to be polished is located in the central region of the substrate.

6. The chip grinding structure according to claim 1, characterized in that, The height of the replica chip is greater than the height of the chip to be polished, or the height of the replica chip is less than the height of the chip to be polished.

7. The chip grinding structure according to claim 1, characterized in that, The side of the chip to be polished that is furthest from the substrate is the polishing surface.

8. The chip grinding structure according to any one of claims 1 to 7, characterized in that, The chip to be polished is a chip manufactured using semiconductor technology, and the chip to be polished is rectangular in shape.

9. The chip grinding structure according to any one of claims 1 to 7, characterized in that, The material of the imitation chip is ceramic, metal or silicon; the material of the fixing adhesive is paraffin wax.

10. The chip grinding structure according to any one of claims 1 to 7, characterized in that, The substrate is a square silicon wafer.

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