High-precision semiconductor packaging punch forming die positioning tool

Abstract

The utility model discloses a high-precision semiconductor packaging punch forming die positioning tool, which relates to the technical field of semiconductor packaging dies and comprises a die pressing table and a die pressing top arranged right above the die pressing table. The mold pressing table is provided with a bottom column, and the bottom column penetrates through the mold pressing top and is in sliding fit with the mold pressing top; the bottom die assembly comprises a bottom die. Positioning plates are arranged at the two ends and the side face of the bottom die. According to the utility model, the transverse frame and the longitudinal frame are used for carrying the bottom die to randomly adjust the position on the X axis and the Y axis, high-precision positioning can be realized by matching with the fine adjustment mechanism, the semiconductor packaging quality is effectively improved, meanwhile, the height adjusting assembly and the replaceable positioning clamp enable the tool to adapt to various dies with different sizes and shapes, the universality of the tool is improved, and the production efficiency is improved. And the time cost for replacing the tool is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging mould, specifically is a high accuracy semiconductor packaging punch forming die positioning frock. BACKGROUND

[0002] In the semiconductor packaging process, the accurate positioning of the punch forming die is crucial. The existing positioning frock has the problem of insufficient positioning accuracy, which leads to deviation during semiconductor packaging, affecting product quality, and the existing frock has poor flexibility when adapting to different size bottom mold requirements, requiring frequent replacement of positioning components, which is cumbersome and time-consuming. UTILITY MODEL CONTENTS

[0003] The utility model provides a kind of high accuracy semiconductor packaging punch forming die positioning frock, with the advantages of improving positioning accuracy and enhancing frock flexibility, to solve the problems of insufficient positioning accuracy of existing equipment and poor adaptability to different size bottom mold packaging requirements.

[0004] To achieve the above object, the utility model provides the following technical scheme: a kind of high accuracy semiconductor packaging punch forming die positioning frock, including pressure mould table and the pressure mould top being set at the pressure mould table directly above, characterized by further comprising bottom mold assembly, top die assembly, height adjusting assembly, horizontal positioning assembly and longitudinal positioning assembly, wherein:

[0005] The pressure mould table is provided with a bottom column, and the bottom column penetrates the pressure mould top and is slidingly fitted;

[0006] The bottom mold assembly includes a bottom mold, and the bottom mold is provided with a positioning plate at both ends and the side surface; the horizontal positioning assembly includes a base, the base is provided with a plurality of horizontal grooves, the horizontal grooves are embedded with horizontal frames, and the horizontal frames are embedded with sliding blocks and are slidingly fitted;

[0007] The sliding block is penetrated by the calibration knob and is screw-rotatingly fitted, one end of the calibration knob is locked by a threaded mounting sleeve, the mounting sleeve penetrates the positioning clamp and is rotatingly fitted, and the longitudinal positioning assembly includes a longitudinal frame, which is embedded with a horizontal frame and is slidingly fitted.

[0008] As a preferred technical scheme of the utility model, the longitudinal frame is provided with an adjusting rod in the middle, the adjusting rod is embedded with a support plate at both ends and is slidingly fitted, and the adjusting rod is penetrated by the calibration knob and is screw-rotatingly fitted.

[0009] As a preferred technical scheme of the utility model, the top surface of the bottom mold is provided with a plurality of equally spaced mold grooves, one side of the mold groove is provided with a groove, the groove is embedded with a semiconductor chip, and the positioning clamp and the positioning plate are penetrated by the positioning rod.

[0010] As a preferred technical scheme of the utility model, the bottom die top surface is equipped with a plurality of limiting holes and limiting cylinders, the die grooves are communicated by the through grooves, the top die assembly comprises a top die, the top die top surface is fixed on the hanger through bolts, and the hanger is welded on the press die top.

[0011] As a preferred technical scheme of the utility model, the press die top bottom surface is fixed with a hydraulic cylinder through screws, one end of the hydraulic cylinder is embedded and transferred with the tank and is in sliding fit, the tank bottom end is communicated with one end of the pouring gate, and the other end of the pouring gate is communicated with the through groove.

[0012] As a preferred technical scheme of the utility model, the top die is equipped with a plurality of limiting columns and limiting grooves.

[0013] As a preferred technical scheme of the utility model, the height adjusting assembly comprises an adjusting column, the adjusting column upper end penetrates the base and is in rotary fit, the adjusting column lower end is embedded with a threaded cylinder and is in spiral rotary fit, and the threaded cylinder is welded on the press die table.

[0014] Compared with the prior art, the utility model provides a high-precision semiconductor packaging punch forming die positioning tool, has the following beneficial effects: the utility model utilizes the horizontal frame and the vertical frame to carry the bottom die to adjust the position at X, Y axis at will, cooperates with the fine adjustment mechanism to realize high-precision positioning, effectively improves the semiconductor packaging quality, the height adjusting assembly and the replaceable positioning clamp make the tooling adapt to various molds of different sizes and shapes, improve the tooling versatility, and reduce the time cost of replacing tooling. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the whole structure schematic view of the utility model;

[0016] Figure 2 It is the height adjusting assembly structure diagram of the utility model;

[0017] Figure 3 It is the bottom die assembly structure schematic view of the utility model;

[0018] Figure 4 It is the top die assembly structure diagram of the utility model;

[0019] Figure 5 It is the vertical frame structure schematic view of the utility model;

[0020] Figure 6 It is the horizontal positioning assembly structure diagram of the utility model.

[0021] In the figure: 1, the die table; 11, the bottom column; 2, the die top; 21, the hanger; 3, the bottom die assembly; 31, the bottom die; 32, the positioning plate; 33, the die groove; 34, the recess; 35, the limiting hole; 36, the limiting cylinder; 37, the through groove; 4, the top die assembly; 41, the top die; 42, the hydraulic cylinder; 43, the transfer tank; 44, the sprue; 45, the limiting column; 46, the limiting groove; 5, the height adjusting assembly; 51, the adjusting column; 52, the threaded cylinder; 6, the transverse positioning assembly; 61, the base; 611, the horizontal groove; 62, the transverse frame; 711, the adjusting rod; 712, the support plate; 63, the sliding block; 64, the calibration knob; 65, the mounting sleeve; 66, the positioning clamp; 67, the positioning rod; 7, the longitudinal positioning assembly; 71, the longitudinal frame; 8, the semiconductor chip. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model. Embodiment one

[0023] Please refer to Figures 1-6 The utility model discloses a high accuracy semiconductor package stamping forming die positioning frock, including die table 1 and being located at the die table 1 upside die top 2, its characterized in that still including bottom die assembly 3, top die assembly 4, height adjusting assembly 5, transverse positioning assembly 6 and longitudinal positioning assembly 7, wherein:

[0024] Die table 1 is equipped with bottom column 11, and bottom column 11 penetrates die top 2 and is slidably fitted, specifically, die top 2 is lifted along bottom column 11 up and down when packaging;

[0025] Please refer to the attached Figure 6 Bottom die assembly 3 includes bottom die 31, and bottom die 31 is equipped with positioning plate 32 at both ends and side surface, transverse positioning assembly 6 includes base 61, base 61 is equipped with a plurality of horizontal grooves 611, horizontal grooves 611 are embedded with transverse frame 62, and transverse frame 62 is embedded with sliding block 63 and is slidably fitted;

[0026] Sliding block 63 is penetrated by calibration knob 64 and is screw rotationally fitted, one end of calibration knob 64 is locked with mounting sleeve 65 through thread, mounting sleeve 65 penetrates positioning clamp 66 and is rotationally fitted, longitudinal positioning assembly 7 includes longitudinal frame 71, longitudinal frame 71 is embedded with transverse frame 62 and is slidably fitted, specifically, positioning clamp 66 can be disassembled and replaced by rotating mounting sleeve 65 with transverse frame 62 and longitudinal frame 71.

[0027] Please refer to the attachedFigure 5 The middle part of the longitudinal frame 71 is provided with an adjusting rod 711, the two ends of the adjusting rod 711 are embedded in the support plate 712 and are slidingly matched, the adjusting rod 711 is penetrated by the calibration knob 64 and is screw rotationally matched.

[0028] In this embodiment, the horizontal frame 62 is pushed to slide in the horizontal groove 611, the longitudinal frame 71 is carried on the horizontal frame 62 to adjust the position of the bottom die 31, so that the bottom die 31 is located in the positioning area corresponding to the top die 41, and the position of the bottom die 31 can be finely adjusted by rotating the calibration knob 64. Embodiment two

[0029] Based on the above-mentioned embodiment 1, please refer to the accompanying drawings Figure 2 , Figure 3 and Figure 4 The top surface of the bottom die 31 is provided with a plurality of equidistantly arranged die grooves 33, one side of the die groove 33 is provided with a recess 34, the recess 34 is embedded with a semiconductor chip 8, the positioning clamp 66 and the positioning plate 32 are penetrated by the positioning rod 67, specifically, the positioning plate 32 is fixed on the positioning clamp 66 through the positioning rod 67, and stable triangular fixing of the bottom die 31 is realized.

[0030] The top surface of the bottom die 31 is provided with a plurality of limiting holes 35 and limiting cylinders 36, the die grooves 33 are connected by through grooves 37, and the top die assembly 4 comprises a top die 41, the top surface of the top die 41 is fixed on the hanging bracket 21 through bolts, and the hanging bracket 21 is welded on the mold top 2.

[0031] The bottom surface of the mold top 2 is fixed with a hydraulic cylinder 42 through a screw, one end of the hydraulic cylinder 42 is embedded in the transfer tank 43 and is slidingly matched, the bottom end of the transfer tank 43 is connected with one end of the sprue 44, and the other end of the sprue 44 is connected with the through groove 37.

[0032] The top die 41 is provided with a plurality of limiting columns 45 and limiting grooves 46, specifically, the limiting columns 45 and the limiting grooves 46 of the top die 41 are embedded with the limiting holes 35 and the limiting cylinders 36 of the bottom die 31, high-precision fitting of the top die 41 and the bottom die 31 is realized, and leakage of plastic sealing material during packaging is avoided.

[0033] The height adjusting assembly 5 comprises an adjusting column 51, the upper end of the adjusting column 51 penetrates the base 61 and is rotationally matched, the lower end of the adjusting column 51 is embedded in the threaded cylinder 52 and is screw rotationally matched, the threaded cylinder 52 is welded on the mold table 1, specifically, rotating the adjusting column 51 can interact with the threaded cylinder 52 to produce relative displacement, thereby driving the base 61 to rise and fall, so that the bottom die 31 is at a suitable working height.

[0034] In this embodiment, the hydraulic cylinder 42 drives the piston to extrude the plastic sealing material in the transfer tank 43 to pass through the sprue 44 into the through groove 37, and finally flows into the mold cavity formed by the upper and lower die grooves 33 to seal the semiconductor chip 8, and the plastic sealing material is quickly solidified to complete the plastic sealing.

[0035] The working principle and use process of the utility model are as follows: firstly, the frame strip on which the semiconductor chip 8 is pasted and lead bonding is completed is placed in the groove 34 of the bottom die 31, then the positioning plate 32 on the outer side of the bottom die 31 is fixed on the positioning clamp 66 through the positioning rod 67, and stable triangular fixing of the bottom die 31 is realized;

[0036] Then the horizontal frame 62 and the longitudinal frame 71 are respectively pushed in the horizontal direction and the longitudinal direction, the horizontal frame 62 slides in the horizontal groove 611, the longitudinal frame 71 slides on the horizontal frame 62 to carry the bottom die 31 to adjust the position, so that the bottom die 31 is located in the positioning area corresponding to the top die 41, the position of the bottom die 31 in the X and Y directions is preliminarily positioned, then the position of the bottom die 31 is finely adjusted by respectively rotating the calibration knob 64 in the horizontal direction and the longitudinal direction, and high-precision positioning of the bottom die 31 is realized;

[0037] Meanwhile, the adjusting column 51 is rotated according to the height of the bottom die 31, the adjusting column 51 and the threaded cylinder 52 interact to produce relative displacement, and then the base 61 is lifted and lowered, so that the bottom die 31 is at a suitable working height;

[0038] Finally, the external lifting system is used to drive the press mold top 2 to descend, so that the limiting column 45 and the limiting groove 46 of the top die 41 are embedded with the limiting hole 35 and the limiting cylinder 36 of the bottom die 31, high-precision fitting of the top die 41 and the bottom die 31 is realized, leakage of plastic sealing material during packaging is avoided, and when plastic sealing, the hydraulic cylinder 42 drives the piston to extrude the plastic sealing material in the transfer tank 43 to pass through the sprue 44 into the through groove 37, and finally flows into the mold cavity formed by the upper and lower mold grooves 33, so that the semiconductor chip 8 is plastic sealed, and the plastic sealing material is quickly solidified to complete the plastic sealing.

Claims

1. A high-precision semiconductor package punch forming die positioning tool, comprising a die table (1) and a die top (2) arranged directly above the die table (1), characterized in that, Also include the bottom die assembly (3), top die assembly (4), height adjustment assembly (5), transverse positioning assembly (6) and longitudinal positioning assembly (7), wherein: The die table (1) is provided with a bottom column (11), the bottom column (11) penetrates the die top (2) and is slidingly fitted; The bottom die assembly (3) includes a bottom die (31), the bottom die (31) is provided with a positioning plate (32) at both ends and side, the transverse positioning assembly (6) includes a base (61), the base (61) is provided with a plurality of transverse slots (611), the transverse slots (611) are embedded with a transverse frame (62), the transverse frame (62) is embedded with a sliding block (63) and is slidingly fitted; The sliding block (63) is penetrated by the calibration knob (64) and is screw rotationally fitted, one end of the calibration knob (64) is locked by a threaded mounting sleeve (65), the mounting sleeve (65) penetrates a positioning clamp (66) and is rotationally fitted, the longitudinal positioning assembly (7) includes a longitudinal frame (71), the longitudinal frame (71) is embedded with a transverse frame (62) and is slidingly fitted.

2. The high-precision semiconductor package punch forming die positioning tooling of claim 1, wherein: The longitudinal frame (71) is provided with an adjusting rod (711) in the middle, the adjusting rod (711) is embedded with a support plate (712) at both ends and is slidingly fitted, the adjusting rod (711) is penetrated by the calibration knob (64) and is screw rotationally fitted.

3. The positioning tool for high-precision semiconductor packaging punch forming die according to claim 2, characterized in that: The bottom die (31) is provided with a plurality of mold grooves (33) arranged at equal intervals on the top surface, one side of the mold groove (33) is provided with a groove (34), the groove (34) is embedded with a semiconductor chip (8), the positioning clamp (66) and the positioning plate (32) are penetrated by a positioning rod (67).

4. The high-precision semiconductor package punch forming die positioning tooling of claim 3, wherein: The bottom die (31) is provided with a plurality of limiting holes (35) and limiting cylinders (36) on the top surface, the mold grooves (33) are connected by a through groove (37), the top die assembly (4) includes a top die (41), the top die (41) is fixed on the hanger (21) by bolts on the top surface, the hanger (21) is welded on the die top (2).

5. The high-precision semiconductor package punch forming die positioning tooling of claim 4, wherein: The die top (2) is fixed with a hydraulic cylinder (42) on the bottom surface by screws, one end of the hydraulic cylinder (42) is embedded with a transfer tank (43) and is slidingly fitted, the bottom end of the transfer tank (43) is connected with one end of the sprue (44), the other end of the sprue (44) is connected with the through groove (37).

6. The high-precision semiconductor package punch forming die positioning tooling of claim 5, wherein: The top die (41) is provided with a plurality of limiting columns (45) and limiting grooves (46).

7. The high-precision semiconductor package punch forming die positioning tooling of claim 1, wherein: The height adjustment assembly (5) includes an adjustment column (51), the upper end of the adjustment column (51) penetrates the base (61) and is rotationally fitted, the lower end of the adjustment column (51) is embedded with a threaded cylinder (52) and is screw rotationally fitted, the threaded cylinder (52) is welded on the die table (1).

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