Multistage T-shaped microstructure array

Abstract

The utility model discloses a multistage T-shaped microstructure array which is used in the technical field of material surface microstructure preparation. The structure array comprises a substrate body and a plurality of T-shaped microstructures arranged on the substrate body in an array mode. The T-shaped microstructure comprises a base body and a plurality of sheet bodies; a plurality of sheet bodies are arranged at the top of the base body, the side walls of the sheet bodies are located outside the side wall of the base body, and gaps are reserved among the sheet bodies. The plurality of sheet bodies are arranged at the top of the base body, and the gaps are reserved among the plurality of sheet bodies, so that a plurality of gaps are formed on a single T-shaped microstructure, the surface area of the whole multistage T-shaped microstructure array is increased, and the hydrophilic and hydrophobic properties are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to material surface microstructure preparation technical field especially, relates to a multistage T type microstructure array. BACKGROUND

[0002] In nature, the surfaces of animals and plants such as Collembolan, gecko and pitcher plant have concave-angled structures (that is, T type microstructure) to realize superhydrophobic function. In the past few decades, a large number of controllable wetness bionic T type microstructure has been developed for practical application, such as self-cleaning window, drag reduction, surface treatment of medical devices, waterproof clothing and textiles, corrosion prevention, anti-freezing, heat transfer enhancement, micro-nano scale fluid device, anti-biofouling surface and transparent self-cleaning surface for photovoltaics. In addition, in the application of microfluidics, anti-fogging, liquid separation or heat transfer, material surface with hydrophilic property is also needed.

[0003] However, the multistage T type microstructure array in the prior art has the problem of small surface area, which is specifically manifested in that the T type microstructure is usually composed of a base body and a sheet body to form a T type structure, and the T type structure forms a pore with the substrate, and even if the height of the T type structure is high, it is difficult to form a large number of pores inside the T type structure to increase the surface area. SUMMARY

[0004] The utility model provides a multistage T type microstructure array, aims at solving the problem of small surface area in prior art.

[0005] The utility model provides a multistage T type microstructure array prepared according to the first aspect, comprising a substrate body and a plurality of T type microstructures arranged on the substrate body.

[0006] The T type microstructure comprises a base body and a plurality of sheet bodies; the top of the base body is provided with a plurality of sheet bodies, the side wall of the sheet body is located outside the side wall of the base body, and a gap is left between a plurality of sheet bodies.

[0007] In some embodiments, a plurality of sheet bodies are arranged along the height direction of the base body.

[0008] In some embodiments, a plurality of sheet bodies are arranged on the top end face of the base body.

[0009] In some embodiments, the side wall surface of the sheet body is an inclined surface, and the inclined surface is inclined upward.

[0010] In some embodiments, the length of a plurality of sheet bodies gradually decreases in the direction from the substrate body to the T type microstructure.

[0011] In some embodiments, at least one of the pieces is arranged at the top end of the base body, and at least one of the pieces is arranged in the base body.

[0012] In some embodiments, the base body is provided with grooves between adjacent T-shaped microstructures.

[0013] In some embodiments, the groove wall surface is inclined towards the middle.

[0014] In some embodiments, the side wall surface of the piece and the surface of the groove are provided with a plurality of holes, and the aperture of the plurality of holes is 0.001-10 microns.

[0015] In some embodiments, the multi-stage T-shaped microstructure array is integrally formed.

[0016] In some embodiments, the distance between adjacent T-shaped microstructures is 120-240 microns.

[0017] The base body is a cylindrical structure or a conical structure, the side length or diameter of the base body is 400-1000 microns, the height of the base is 300-1000 microns, and the distance between adjacent bases is 0-500 microns.

[0018] The length of the piece is 400-1000 microns.

[0019] The gap distance between adjacent pieces is 100-400 microns.

[0020] From the above technical solution, the utility model has the following advantages:

[0021] The embodiment provides a multi-stage T-shaped microstructure array, which comprises a substrate body and a plurality of T-shaped microstructures arranged on the substrate body, wherein the top of the base body is provided with a plurality of pieces, and a gap is left between the plurality of pieces, so that a plurality of gaps are formed on a single T-shaped microstructure, the surface area of the entire multi-stage T-shaped microstructure array is increased, and the hydrophilic and hydrophobic properties are improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to the drawings without creative labor.

[0023] Figure 1A flow chart of a method for customizing a multi-stage T-shaped microstructure array is provided in the embodiments of the present application.

[0024] Figure 2 An entity model structure schematic diagram is provided in the embodiments of the present application.

[0025] Figure 3 An entity model structure partial enlarged schematic diagram is provided in the embodiments of the present application.

[0026] Figure 4 A process schematic diagram of a method for customizing a multi-stage T-shaped microstructure array is provided in the embodiments of the present application.

[0027] Figure 5 A cross-sectional structure schematic diagram of a multi-stage T-shaped microstructure array is provided in the embodiments of the present application.

[0028] Figure 6 A structure schematic diagram of a multi-stage T-shaped microstructure array is provided in the embodiments of the present application.

[0029] Reference signs:

[0030] I, entity model; I1, base; I2, base; I3, filament; I4, interval; I5, gap; I6, groove; I7, pulsed laser;

[0031] II, multi-stage T-shaped microstructure array; II1, base plate body; II10, groove; II2, T-shaped microstructure; II20, base body; II21, sheet body. DETAILED DESCRIPTION

[0032] The embodiments of the present application provide a multi-stage T-shaped microstructure array, which is used to solve the technical problem of small T-shaped microstructure surface area in the prior art.

[0033] In order to make the utility model purposes, features, advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the following described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] Please refer to Figure 4 and Figure 5 The embodiments of the present application provide a multi-stage T-shaped microstructure array II, which comprises:

[0035] The base plate body II1;

[0036] T-shaped microstructure II2, a plurality of T-shaped microstructure arrays are arranged on the substrate body II1, the T-shaped microstructure II2 comprises a base body II20 and a plurality of sheet bodies II21; the top of the base body II20 is provided with a plurality of sheet bodies II21, the side wall of the sheet body II21 is located outside the side wall of the base body II20, and a gap is left between the plurality of sheet bodies II21.

[0037] In the embodiment, the plurality of sheet bodies II21 are located at the top of the base body II20, and the side wall of the sheet body II21 is located outside the side wall of the base body II20 to form the T-shaped microstructure II2; and a plurality of gaps are formed between the plurality of sheet bodies II21 to form a multilayer structure, the surface area of the multilayer structure can be exposed as much as possible, and the surface area of the multistage T-shaped microstructure array II is effectively increased for hydrophilic application or hydrophobic application.

[0038] In a hydrophilic application process, a plurality of capillary channels are formed between the multilayer structure formed by the plurality of sheet bodies II21, the capillary effect of the entire T-shaped microstructure array is strong, and after water contacts the T-shaped microstructure II2, the water will rapidly and uniformly spread under the capillary effect of the capillary channel, and the hydrophilic performance is good.

[0039] In a hydrophobic application process, the gap formed between the multilayer structure formed by the plurality of sheet bodies II21 can trap air to form a multilayer air barrier, and the water contacts the air barrier first when falling, effectively increasing the contact angle, and the hydrophobic performance is good.

[0040] As can be seen from the above process, the plurality of sheet bodies II21 form a multilayer structure with a gap on the base body II20, the surface of the plurality of sheet bodies II21 can be fully exposed, and the surface area of the multistage T-shaped microstructure array II is effectively increased. Compared with the T-shaped microstructure array with only a single-layer head structure in the prior art, the surface area is larger, and the hydrophilic and hydrophobic effects are better.

[0041] As an example, as shown in Figure 4 and Figure 5 Further provided is an implementation manner of the substrate body II1, which is one of a rectangular body, a cylindrical body and a prism.

[0042] In a specific embodiment, as shown in Figure 4 In order to further increase the surface area of the substrate body II1, grooves II10 are arranged between adjacent T-shaped microstructures II2, and the existence of the grooves II10 can further increase the surface area of the multistage T-shaped microstructure array II in specific implementation.

[0043] In an embodiment, as shown in Figure 4 and Figure 5As shown, the groove wall of the groove II 10 is inclined towards the middle, for example, the groove II 10 can be a V-shaped groove, and the groove II 10 can also be an arc-shaped groove II 10. In actual implementation, compared with a common constant-diameter groove II 10, the groove II 10 with an inclined surface inclined towards the middle has a larger surface area.

[0044] As an example, as shown in Figure 4 and Figure 5 Further provided is an implementation manner of the T-shaped microstructure II 2, which includes a base body II 20 and a plurality of sheet bodies II 21, at least one sheet body II 21 is arranged at the top end of the base body II 20, and at least one sheet body II 21 is inserted into the base body II 20. For example, the number of sheet bodies II 21 is three, two sheet bodies II 21 are inserted into the base body II 20, and one sheet body II 21 is arranged at the top end of the base body II 20. In actual implementation, the structure of the sheet body II 21 and the base body II 20 is more compact.

[0045] In an embodiment, as shown in Figure 4 and Figure 5 The plurality of sheet bodies II 21 are arranged along the height direction of the base body II 20, that is, a plurality of layers of sheet body II 21 structures are formed on the vertical section of the base body II 20. In actual implementation, the plurality of sheet bodies II 21 increase the surface area of the base body II 20 in the height direction.

[0046] In an embodiment, the plurality of sheet bodies II 21 are arranged on the top end surface of the base body II 20, that is, a plurality of parallel filaments I 3 are arranged on the top end surface of the base body II 20. In actual implementation, the plurality of sheet bodies II 21 arranged on the top end surface can increase the surface area in the horizontal direction.

[0047] In a specific embodiment, as shown in Figure 4 and Figure 5 In order to further increase the surface area of the sheet body II 21, the side wall surface of the sheet body II 21 is an inclined surface, which is inclined upward. In actual implementation, the side wall surface of the sheet body II 21 with an inclined surface has a larger surface area than a common vertical wall surface.

[0048] Based on the above embodiments, as shown in Figure 4 and Figure 5 In order to increase the porosity of the sheet body II 21, the length of the plurality of sheet bodies II 21 gradually decreases in the direction from the base body II 1 to the T-shaped microstructure II 2. In actual implementation, the plurality of sheet bodies II 21 form a stepped structure, which helps to increase the porosity of the microstructure, thereby increasing the capillary effect or increasing the volume of the air barrier.

[0049] In a specific embodiment, in order to further increase the surface area of the sheet body 211, the side wall surface of the sheet body 211 and the surface of the groove 110 are provided with a plurality of holes, the diameter of the plurality of holes is 0.001-10 microns, and in specific implementation, femtosecond pulse laser 107 can form micro-nano holes to further increase the surface area, so as to provide more attachment sites and contact areas for functional groups and hydrophilic groups formed on the surface of the three-dimensional microstructure model by reactive ion etching, thereby achieving better wetting effect.

[0050] In an embodiment, the multi-stage T-shaped microstructure array is integrally formed, that is, integrally formed by 3D printing, without the need for separate connection, maintaining the integrity of the structure and improving the hydrophobic and hydrophilic performance.

[0051] In an embodiment, the distance between adjacent T-shaped microstructures 212 is 120-240 microns; the base body 220 is a column structure or a cone structure, the side length or diameter of the base body 220 is 400-1000 microns, the height of the base 212 is 300-1000 microns, and the distance between adjacent bases 212 is 0-500 microns; the length of the sheet body 211 is 400-1000 microns; and the gap 215 between adjacent sheet bodies 211 is 100-400 microns.

[0052] Please refer to Figures 1 to 6 , based on the above multi-stage T-shaped microstructure array 212, the embodiment provides a method for customizing the multi-stage T-shaped microstructure array, which comprises the following steps:

[0053] S1, constructing a virtual three-dimensional microstructure model, and 3D printing the three-dimensional microstructure model into a physical model 1;

[0054] The physical model 1 comprises a substrate 11, a plurality of bases 12 and a plurality of filaments 13; the plurality of bases 12 are arranged in an array on the substrate 11, and there is a gap 14 between adjacent bases 12; the plurality of filaments 13 are arranged along the same axis direction, and each filament 13 is connected with a plurality of bases 12;

[0055] S2, based on the physical model 1, using pulse laser 17 to ablate and remove the part of the filament 13 located in the gap 14, to obtain a multi-stage T-shaped microstructure array 2.

[0056] In this embodiment, a three-dimensional microstructure model is constructed according to the customized size on a three-dimensional software, and then the three-dimensional microstructure model is 3D printed into a physical model 1 containing a microstructure with a customized size (see Figure 2 and Figure 5), in the entity model I, a plurality of filaments I3 are arranged in parallel on the arrayed base I2, so that each column (row) of a plurality of bases I2 is connected by the same filament I3 to form a bridge-like structure, that is, the base I2 is the "pier", and the filament I3 is the "bridge deck"; based on the entity model I, all the parts of the filaments I3 located in the interval I4 are removed by ablation using the pulsed laser I7, that is, the filaments I3 between adjacent bases I2 on the same bridge-like structure are ablated and removed, and a multi-stage T-shaped microstructure array II is obtained.

[0057] As can be seen from the above, the entity model I can be customized, and the size of the multi-stage T-shaped microstructure array II finally prepared can be personalized. The microstructure array of multiple sizes is prepared, and better hydrophobic three-dimensional microstructure model is obtained by size regulation; and the entity model I is a plurality of bridge-like structures formed by a plurality of filaments I3 and arrayed bases I2, so that the pulsed laser I7 with precise positioning and micron-level fine processing capability is positioned to ablate and remove the filaments I3 between adjacent bases I2, and a multi-stage T-shaped microstructure array II surface with high precision can be prepared.

[0058] Compared with the prior art, first, the entity model I before laser ablation is simple to make, which only needs to build a virtual three-dimensional microstructure model through software, and then 3D print the three-dimensional microstructure model to complete the structure making before laser ablation, without the need for laser heat-induced microstructure shrinkage autogrowth as in the prior art, or the need for structure formation by photolithography combined with etching as in the prior art, so the making process is simple and the making period is short; second, the cutting process based on laser ablation is simple, since the entity model I is a plurality of bridge-like structures formed by a plurality of filaments I3 and arrayed bases I2, so in the cutting process based on laser ablation, only the pulsed laser I7 with micron-level fine processing capability is used to ablate and remove the filaments I3 between adjacent bases I2, to complete the making of the T-shaped microstructure array, without the need for a series of procedures such as casting, transferring and bonding as in the prior art, or the need for advance setting of laser control trajectory as in the prior art, so that each T-shaped microstructure is cut in a circular trajectory, the cutting process based on laser ablation is very simple, and thus it can be seen that the entity model I before laser ablation is simple to make, the cutting process based on laser ablation is also simple, and the T-shaped microstructure array does not need a template for assistance, the process flow is simple, and the manufacturing efficiency is high.

[0059] As an example, as shown in Figure 4 Further provided is an implementation manner in step S1, which specifically includes the following steps:

[0060] S10, a virtual three-dimensional microstructure model is built by software, that is, a three-dimensional microstructure model is built according to the structure of the entity model I.

[0061] S11, slice the three-dimensional microstructure model and set the parameters of 3D printing.

[0062] In an embodiment, the parameters of 3D printing include: preset printing speed of 10 mm / s - 60 mm / s, preset filling density of 80% - 100%, preset printing accuracy of 100 μm - 250 μm, preset filling pattern of concentric circle or straight line, and preset printing material of high polymer polymer material.

[0063] The selection of the high polymer polymer material includes any one or a combination of polyether ether ketone, polyether ketone ketone, acrylonitrile-butadiene-styrene (ABS), polylactic acid, high impact polystyrene (HIPS), thermoplastic polyurethane, polyamide, carbon fiber reinforced polyether ether ketone composite (CF / PEEK), carbon fiber reinforced polylactic acid composite (CF / PLA), and hydroxyapatite reinforced polyether ether ketone composite (HA / PEEK).

[0064] S12, 3D printing the three-dimensional microstructure model into a solid model I according to the set parameters (see Figure 2 and Figure 5 ).

[0065] In an embodiment, as shown in Figure 2 and Figure 4 , a plurality of filaments 13 are arranged on the same base 12, and gaps 15 are arranged between the plurality of filaments 13 on the same base 12. After forming the T-shaped microstructure 12, a plurality of sheet bodies 121 composed of a plurality of parallel filaments 13 are arranged at the head of the same T-shaped microstructure 12, which increases the surface area of the subsequently manufactured T-shaped microstructure array, improves the overall structural stability, and optimizes the stress distribution. Moreover, the multi-layer structure solid model I is 3D printed, and the multi-layer structure solid model I is simple in structure preparation method and does not need to be manufactured by a complex process as in the prior art.

[0066] The plurality of filaments 13 can be arranged along the height direction of the base body 120, i.e., a plurality of layers of filament 13 structures are formed on the vertical cross-section of the base body 120; or the plurality of filaments 13 can be arranged on the top end of the base body 120, i.e., a plurality of parallel filaments 13 are formed on the top end surface of the base body 120.

[0067] Based on the above embodiment, as shown in Figure 2 and Figure 4 , the positional relationship between the plurality of filaments 13 and the base 12 can be that the filaments 13 are inserted into and extend out of the base 12, or the filaments 13 are connected to the top end surface of the base 12. In specific implementation, the plurality of filaments 13 are partially inserted into the base 12 and partially connected to the top end surface of the base 12, so that the entire T-shaped microstructure array structure manufactured subsequently is more compact.

[0068] wherein the number of filaments 13 inserted through each base 12 is 1-5; the interval 14 between every two adjacent filaments 13 inserted through a base 12 is 100 μm-400 μm.

[0069] In an embodiment, the base 11 of the physical model 1 is one of a rectangular body, a cylinder, and a prism.

[0070] wherein the side length of the rectangular body is 10 mm-100 mm, and the height is 0 mm-10 mm; the diameter of the cylinder is 10 mm-100 mm, and the height is 0 mm-10 mm; the side length of the upper and lower faces of the prism is 10 mm-100 mm, and the height is 0 mm-10 mm.

[0071] In an embodiment, the base 12 of the physical model 1 is a column structure or a cone structure, i.e., the base 12 of the physical model 1 is one of a prism, a cylinder, a quadrangular pyramid, a circular cone, and a rectangular body, the side length or diameter of the base 12 is 400 μm-1000 μm, the height of the base 12 is 300 μm-1000 μm, and the distance between adjacent bases 12 is 0 μm-500 μm.

[0072] wherein the side length of the upper and lower faces of the prism and the rectangular body is 400 μm-1000 μm, and the height is 300 μm-1000 μm; the diameter of the cylinder is 400 μm-1000 μm, and the height is 300 μm-1000 μm; the side length of the base of the quadrangular pyramid is 400 μm-1000 μm, and the height is 300 μm-1000 μm; the diameter of the base of the circular cone is 400 μm-1000 μm, and the height is 300 μm-1000 μm.

[0073] In an embodiment, the length of the filament 13 matches the side length or diameter of the base 11, the radial length of the filament 13 is 100 μm-1000 μm, and the filament 13 is one of a cylinder and a cuboid.

[0074] wherein the diameter of the cylindrical filament 13 is 400 μm-1000 μm, and the length matches the side length of the base 11; the short side length of the cuboid filament 13 is 400 μm-1000 μm, the length is 10 μm-100 μm longer than the side length of the base 11, and the height is 100 μm-1000 μm.

[0075] As an example, as shown in FIG. 1, further provided is an implementation manner in step S2, which is specifically: Figure 4 ​

[0076] S20, based on solid model I, align pulsed laser I7 with substrate I1.

[0077] In one embodiment, the center of the laser spot is aligned with the left boundary of the solid model I.

[0078] S21, as Figure 4 As shown, along the direction of filament I3, the pulsed laser I7 is moved to the adjacent termination point, where the termination point is a point on a straight line perpendicular to filament I3 at interval I4.

[0079] In one embodiment, the point where the movement ends is a point on the straight line between the center of two adjacent bases I2 on the same filament I3. For example, starting from the left boundary, the center between the first base I2 and the second base I2 on a straight line of filament I3 is the point where the movement ends. The other points where the movement ends are similar, and will not be described in detail here.

[0080] S22, as Figure 4 As shown, laser ablation is performed along the direction perpendicular to filament I3 to ablate and remove multiple filaments I3 on ​​the same straight line.

[0081] In practice, since each base I2 is arranged in an array and the filaments I3 are arranged in parallel on these bases I2, during laser ablation, the separation of multiple filaments I3 can be completed simply by following a straight trajectory, that is, by cutting along a straight line. There is no need to control multiple circular trajectories. The cutting trajectory based on laser ablation and the cutting control process based on laser ablation are both very simple.

[0082] In one embodiment, the pulsed laser I7 moves back and forth on opposite sides of the substrate I1. That is, the pulsed laser I7 performs multiple laser etchings on a straight line perpendicular to the direction of the filament I3, with one side of the substrate I1 as the starting point and the ending point. This ablates and removes the filaments I3 that intersect between adjacent bases I2 in this column (row) at the center, so that multiple filaments I3 are broken at the interval I4 between the two bases I2, so as to simultaneously form multiple T-shaped microstructures II2, avoiding the processing error when only one T-shaped microstructure II2 is processed at a time.

[0083] In one embodiment, such as Figure 4As shown, in order to increase the surface area of the multi-stage T-shaped microstructure array II, when the pulsed laser I7 ablates and removes the part of the filament I3 located in the gap I4, the pulsed laser I7 ablates a groove I6 on the substrate I1, that is, a groove I6 is formed below the ablation removal part of the filament I3, and an inclined surface is formed by ablation of the filament I3, wherein the groove wall of the groove I6 is inclined to the middle. In specific implementation, on the one hand, the inclined surface with the head of the T-shaped microstructure II2 and the groove I6 of the substrate I1 are only one step away, and do not need to be operated separately, so the process is less and simple. On the other hand, the surface area of the multi-stage T-shaped microstructure array II prepared finally is increased, which provides more attachment sites and contact areas for the subsequent reactive ion etching on the multi-stage T-shaped microstructure array II to form functional functional groups and hydrophilic groups.

[0084] Based on the above embodiment, as Figure 4 As shown, the groove I6 is a V-shaped groove, and the ablation removal surface of the filament I3 forms an inclined upward surface, that is, from the cross-sectional view, the ablation removal part of the filament I3 and the V-shaped groove form a V-shaped structure, and after forming the V-shaped structure, the surface area of the multi-stage T-shaped microstructure array II can be further increased.

[0085] In an embodiment, the depth of laser ablation is 100 μm -1000 μm from the top of the filament I3 to the bottom of the base V-shaped groove, and the spacing of the broken filament I3 after laser ablation is 0 μm -500 μm, that is, the spacing between every two adjacent multi-stage T-shaped microstructures II2 is 0 μm -500 μm. Further, the length of the ablation removal part of the filament I3 is 120 μm -240 μm. In specific implementation, the ablation removal position forms the spacing between adjacent T-shaped microstructures II2, and the spacing is 120 μm -240 μm, which can improve the hydrophobicity in the spacing range.

[0086] In an embodiment, the pulsed laser I7 is a femtosecond pulsed laser I7, which has a micron-level fine processing capability, and the place ablated by the femtosecond pulsed laser I7 forms micro-nano-sized holes, which further increase the surface area. These holes exist in the V-shaped groove and the side of the broken filament I3, and the surface area is further increased, which provides more attachment sites and contact areas for the reactive ion etching on the surface of the three-dimensional structure model to form functional functional groups and hydrophilic groups, thereby achieving better wetting effect.

[0087] The laser parameters are as follows: pulse energy density 10.35 J / cm2, scanning times 8-24, preferably 24 times, focal length is the parameter of field lens, that is, the distance between the galvanometer and the workpiece surface is 300 mm, laser wavelength 1030 nm, pulse width 500 fs, frequency 1 kHz, and scanning speed 800 mm / s.

[0088] S23, as shown, the pulsed laser I7 is moved to the next stop moving place, repeating steps S22 and S23 until the pulsed laser I7 ablation removes all long filament I3 located in the interval I4. Figure 4

[0089] In the implementation, since each base I2 is arranged in an array and the long filament I3 is arranged in parallel on the base I2, the separation of all long filaments I3 can be completed by repeating the linear trajectory during laser ablation, and the cutting trajectory based on laser ablation and the cutting control process based on laser ablation are simple.

[0090] In an embodiment, the laser spot is offset by a preset distance to the next stop moving place for the second time, the preset distance is the length of the base I2 bottom edge plus the interval between adjacent base I2 bottom edges, and after the second offset, the center of the laser spot reaches the middle position between the second base I2 and the third base I2; the third offset distance is consistent with the second offset distance, and after the offset, it reaches the middle position between the third base I2 and the fourth base I2; in this way, the subsequent offset distances all repeat the second offset distance, and finally the femtosecond laser ablation is completed on the three-dimensional structure model, and the required multi-stage T-shaped microstructure array II surface is obtained.

[0091] As an example, in order to improve the surface quality and precision of the T-shaped microstructure array, the following steps are further included between step S1 and step S2: placing the solid model I into an ultrasonic cleaning instrument for ultrasonic cleaning, and then placing the solid model I into an oven for drying.

[0092] In this embodiment, after implementation, the surface powder, surface residues and some surface defects in the 3D printed solid model I can be cleaned by ultrasonic cleaning, so that the surface of the solid model I reaches a better smoothness, which is beneficial to subsequent processing.

[0093] In an embodiment, the solid model I is placed into an ultrasonic cleaning instrument, and ultrasonic cleaning is performed in deionized water for 15 min, and then the three-dimensional structure model is placed into an oven for drying at 60-120 °C for 2-12 h.

[0094] As an example, in order to change the T-shaped microstructure array from a hydrophobic structure to a hydrophilic structure, the following steps are further included after step S2: treating the multi-stage T-shaped microstructure array II by using a reactive ion etching device to obtain a hydrophilic multi-stage T-shaped microstructure array II, wherein the gas of the reactive ion etching is air, the flow rate of the gas of the reactive ion etching is 1 sccm, the radio frequency power is 1 W, and the reaction time is 0-99 min.

[0095] ​In the present embodiment, when implemented, the multi-stage T-shaped microstructure array II is processed by reactive ion etching. The surface of the multi-stage T-shaped microstructure array II changes. On the one hand, under the action of radio frequency, plasma is formed by ionizing gas in a closed chamber, which bombards the surface of the object at high speed, so that the hydrophilic group can adhere to the surface of the object to change the surface into a hydrophilic surface, thereby achieving the wetting effect. On the other hand, the reactive ion etching can further increase the roughness of the surface, so as to increase the surface energy, which is beneficial to the adsorption and spreading of water molecules on the surface, and thus improves the hydrophilicity. Compared with the prior art, the process of changing the T-shaped microstructure array from hydrophobic to hydrophilic is very short, and the complete wetting effect can be achieved without high radio frequency and high gas flow.

[0096] In the above embodiment, a multi-stage T-shaped microstructure array II capable of realizing the transition from a hydrophobic state to a hydrophilic state and adjusting the wetting is given. The multi-stage T-shaped microstructure array II with hydrophobicity is obtained by steps S1 and S2, and the multi-stage T-shaped microstructure array II with hydrophilicity is obtained by steps S1, S2 and reactive ion etching after step S2.

[0097] In some applications of hydrophobic structures, the hydrophobic multi-stage T-shaped microstructure array II prepared by the above method can be used as a self-cleaning window, a hydrophobic surface of a photovoltaic transparent shield, so that water droplets form spherical water beads on the surface. Due to the low adhesion of the surface, the water beads will roll under the action of gravity or wind force, and carry away dust and other pollutants during the rolling process, thereby achieving the effect of self-cleaning. It can also be used as a drag reduction surface of a ship or a submarine. When an object moves in a fluid, the hydrophobic surface can reduce the contact area between the object and the fluid, thereby effectively reducing the viscous resistance of the fluid. It can also be used as a clothing surface of waterproof clothing and textiles. The hydrophobic surface can make water droplets form water beads on the surface of the clothing and roll off, without penetrating into the fabric, thereby achieving the effect of waterproof. It can also be used as a ship bottom, a steel structure of a bridge, a corrosion-resistant surface of a chemical equipment, a frost-proof surface of outdoor equipment, a power transmission line and other devices. Water droplets are difficult to stay and freeze on the surface, thereby reducing the formation of ice layers. It can also be used as a hydrophobic surface of a heat exchanger, a radiator, a heat pipe and other heat exchange equipment, which can change the flow state and heat transfer mode of the fluid, thereby increasing the convective heat transfer coefficient between the fluid and the surface. It can also be used as a surface of a micro-nano scale fluid device to regulate the flow behavior of the fluid. It can also be used as an anti-biofouling surface of marine vessels, aquaculture facilities and other devices to reduce the adsorption of biological molecules and the adhesion of biological cells.

[0098] In some applications of hydrophilic structures, the hydrophilic multi-stage T-shaped microstructure array II prepared by the above method can be used as a hydrophilic microchannel of a microfluidic chip or a microchannel reactor, so that the fluid flows more uniformly and reduces fluid retention and blockage; it can also be used as an anti-fog surface of car glass, glasses and bathroom mirrors, water vapor will form a uniform water film on the hydrophilic surface instead of condensing into water droplets to prevent fogging; it can also be used as the surface of a water filtration membrane, an oil-water separation membrane and a hemodialysis membrane to separate liquids; it can also be used as a heat exchange surface of a heat pipe or a heat exchanger to enhance the heat exchange performance of the workpiece.

[0099] Example one

[0100] Example one proposes a multi-stage T-shaped microstructure array II, which is prepared by the above personalized customization molding method of multi-stage T-shaped microstructure array II, which specifically includes the following steps:

[0101] A1, a virtual three-dimensional microstructure model is constructed, and the three-dimensional microstructure model 3D is printed into a physical model I.

[0102] The shape of the base I1 of the physical model I is a rectangular body, the size of the rectangular body is 20 mm x 20 mm x 2 mm, the shape of the base I2 is a prism, the lower base of the prism is a rectangle with a side length of 800 μm, the upper top surface is a rectangle with a side length of 400 μm, the height is 400 μm, the distance between the bottom edges of every two adjacent bases I2 is 300 μm, and the shape of the filament I3 is a cuboid; the short side length of the cuboid filament I3 is 400 μm, the length of the base I1 is 20 mm, and the height is 100 μm; the number of filaments I3 inserted into each base I2 is 3; the upper and lower interval I4 of the filament I3 inserted into each base I2 is 100 μm, and the printing parameters include: printing accuracy is 100 μm, filling density is 100%, printing speed is 60 mm / s, filling pattern is concentric circle, and printing consumables is selected as polyether ether ketone.

[0103] A2, the physical model I is placed in an ultrasonic cleaning instrument, ultrasonic cleaning in deionized water for 15 min, the physical model I is placed in an oven, dried at 120℃, and the drying time is 6 h.

[0104] A3, the femtosecond pulse laser I7 first locates the laser path, and the center of the laser spot is aligned with the base I1. The laser spot is offset to the right along the direction of the filament I3. The starting point of the offset distance is at the left boundary marked along the direction of the filament I3, and the ending point is at the center between the first and second pedestals I2 along the direction of the filament I3. The laser ablation is performed repeatedly in the direction perpendicular to the filament I3. The filament I3 between the adjacent pedestals I2 is ablated at the center, so that the filament I3 is disconnected at the interval I4 between the two pedestals I2, and a V-shaped groove is formed on the surface of the model. The depth of the laser ablation is 900 μm from the top of the filament I3 to the bottom of the V-shaped groove. The interval of the disconnected filament I3 after laser ablation is 120 μm, i.e. the interval between every two adjacent multi-stage T-shaped microstructures I2 is 120 μm. The laser spot is offset by a certain distance to the right for the second time, and the distance is the length of the bottom edge of the pedestal I2 plus the interval between the bottom edges of the adjacent pedestals I2. After the second offset, the center of the laser spot reaches the middle position between the second and third pedestals I2. The third offset distance is the same as the second offset distance, and after the offset, the laser spot center reaches the middle position between the third and fourth pedestals I2. In this way, the subsequent offset distances are repeated with the second offset distance. Finally, the femtosecond laser ablation is completed on the solid model I, and the required multi-stage T-shaped microstructure array II surface is obtained.

[0105] Example Two

[0106] Example Two proposes a multi-stage T-shaped microstructure array II, which has basically the same structure and preparation method as Example One. The difference is that the interval of the disconnected filament I3 after laser ablation is not 120 μm, i.e. the interval between every two adjacent multi-stage T-shaped microstructures I2 is not 120 μm, but the interval of the disconnected filament I3 after laser ablation is 240 μm, i.e. the interval between every two adjacent multi-stage T-shaped microstructures I2 is 240 μm.

[0107] Comparative Example One

[0108] Comparative Example One proposes a microstructure-free surface sample prepared by a molding machine. The molding temperature is 380℃, the preheating time is 30 min, and the material used to prepare the microstructure-free surface is polyether ether ketone.

[0109] The reaction ion etching process is performed on Example One, Example Two and Comparative Example One. The reaction ion etching gas is air, the gas flow is 1 sccm, the radio frequency power is 1 W, and the reaction time is 5 s, 180 s, 540 s and 1080 s. The static contact angle of Example One, Example Two and Comparative Example One is measured, and the results are shown in Table 1.

[0110] Table 1 Static contact angle of Example One, Example Two and Comparative Example One under different reaction ion etching times

[0111]

[0112] From Table 1, it can be seen that the contact angle of the multi-stage T-shaped microstructure array II of Example One before the reactive ion etching is 130.9°, and the multi-stage T-shaped microstructure array II has turned into a completely wetted hydrophilic surface after the reactive ion etching for 5s; the contact angle of the multi-stage T-shaped microstructure array II of Example Two before the reactive ion etching is 138.9°, and the multi-stage T-shaped microstructure array II has turned into a completely wetted hydrophilic surface after the reactive ion etching for 5s; the contact angle of the sample without microstructure surface of the comparative example before the reactive ion etching is 95.8°, and the contact angle of the sample without microstructure surface after the reactive ion etching for 5s is 89.0°, which is only reduced by 6.8° compared with that before the reactive ion etching; the contact angle of the sample without microstructure surface after the reactive ion etching for 180s is 35.7°, the contact angle of the sample without microstructure surface after the reactive ion etching for 540s and 1080s is 19.9°, and the contact angle of the sample without microstructure surface after the reactive ion etching for 2160s is 16.3°, which is only reduced by 3.6°. Although the time of the reactive ion etching is further increased, the hydrophilicity of the sample without microstructure surface does not significantly improve, and it is difficult to achieve a completely wetted state, i.e., it is difficult to completely transform into a super-hydrophilic surface.

[0113] The static contact angle of the surface of Comparative Example One without reactive ion etching is 95.8°; the static contact angle of the surface of Comparative Example One with reactive ion etching (5s) is 89.0°; the static contact angle of the surface of Comparative Example One with reactive ion etching (2160s) is 16.3°; the static contact angle of the surface of Example One without reactive ion etching is 130.9°; the static contact angle of the surface of Example One with reactive ion etching (5s) is 0°.

[0114] The summary is as follows:

[0115] I. The static contact angle (138.9°) of Example Two is 8° higher than that (130.9°) of Example One. The difference between the preparation of the two is that the spacing of the broken filaments I3 after laser ablation is different, so that the spacing of each adjacent two multi-stage T-shaped microstructures II2 is different. The laser ablation spacing (240 μm) of Example Two is twice that (120 μm) of Example One. Therefore, a moderate increase in the spacing of the T-shaped microstructure II2 under 120 μm-240 μm can improve the hydrophobicity.

[0116] II. The contact angle of the multi-stage T-shaped microstructure array prepared in Example 1 and Example 2 is significantly improved compared with the surface without microstructure, and the time for changing from hydrophobicity to hydrophilicity is short, the required radio frequency power and gas flow are low, and the change from hydrophobicity to hydrophilicity does not need high frequency, high flow and long time as in the prior art.

[0117] The above examples are only used to illustrate the technical solutions of the present application, but not to limit the same; although the present application has been described in detail with reference to the foregoing examples, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing examples can still be modified, or some of the technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

[0118] Finally, it should also be noted that in this document, relational terms such as first and second and the like can only be used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations.

Claims

1. A multi-stage T-shaped microstructure array, comprising a substrate body, and a plurality of T-shaped microstructures arranged on the substrate body; characterized in that: the T-shaped microstructure comprises a base body and a plurality of sheet bodies; the top of the base body is provided with a plurality of sheet bodies, the side wall of the sheet body is located outside the side wall of the base body, and a gap is left between the plurality of sheet bodies. Each of the plurality of sheet bodies is arranged on the top end face of the base body. The plurality of sheet bodies are arranged along the height direction of the base body.

2. The multi-stage T-shaped microstructure array of claim 1, wherein, The length of the plurality of sheet bodies gradually decreases in the direction from the substrate body to the T-shaped microstructure.

3. The multi-stage T-shaped microstructure array of claim 1, wherein, At least one sheet body is arranged at the top end of the base body, and at least one sheet body is inserted into the base body.

4. The multi-stage T-shaped microstructure array of claim 3, wherein, The side wall surface of the sheet body is an inclined surface, which is inclined upward.

5. The multi-stage T-shaped microstructure array of claim 3, wherein, The substrate body is provided with a groove between adjacent T-shaped microstructures.

6. The multistage T-shaped microstructure array according to any one of claims 1 to 5, wherein, The groove wall surface is inclined toward the middle.

7. The multi-tiered T-shaped microstructure array of claim 1, wherein, The side wall surface of the sheet body and the surface of the groove are provided with a plurality of holes, and the aperture of the plurality of holes is 0.001 μm-10 μm.

8. The multi-stage T-shaped microstructure array of claim 7, wherein, The multi-stage T-shaped microstructure array is integrally formed.

9. The multi-stage T-shaped microstructure array of claim 7, wherein, ​ 10. The multi-tiered T-shaped microstructure array of claim 1, wherein, ​

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